CN217011627U

CN217011627U - Chip repairing device

Info

Publication number: CN217011627U
Application number: CN202220407880.4U
Authority: CN
Inventors: 王星
Original assignee: Dongguan Hongcai Machinery Equipment Co ltd
Current assignee: Dongguan Hongcai Machinery Equipment Co ltd
Priority date: 2022-02-25
Filing date: 2022-02-25
Publication date: 2022-07-19
Anticipated expiration: 2032-02-25

Abstract

The utility model relates to a chip repairing device, comprising: a machine platform; the moving assembly comprises a linear motor and a moving seat, the linear motor is arranged on the machine table along a second preset direction, the moving end of the linear motor is connected with the moving seat, and a chip placing jig is arranged on the moving seat; the disassembling assembly comprises a driving cylinder, a movable supporting plate and a disassembling mechanism, the driving cylinder is arranged on one side of the linear motor, a cylinder shaft of the driving cylinder is connected with the movable supporting plate, and the disassembling mechanism is fixed on the movable supporting plate. This chip reprocesses device simple structure can replace the manual work to carry out tin solder ball shovel light operation, and is swift convenient, easy operation, effectively promotes chip and reprocesses efficiency, practices thrift the hand labor cost.

Description

Chip repairing device

Technical Field

The utility model relates to the technical field of chip maintenance, in particular to a chip repairing device.

Background

With the continuous development of electronic technology, electronic products are developed toward miniaturization and portability. The chip is the most core component in electronic products and is widely applied to various electronic products.

In the process of producing chips, defective products of the chips are inevitably produced, and if the defective products of the chips are required to be repaired, workers are required to shovel tin solder balls on the chips.

SUMMERY OF THE UTILITY MODEL

In view of the above, it is necessary to provide a chip repair apparatus for solving the above technical problems.

In order to achieve the above object, the present invention provides a device for repairing a chip, comprising:

a machine platform;

the moving assembly comprises a linear motor and a moving seat, the linear motor is arranged on the machine table along a second preset direction, the moving end of the linear motor is connected with the moving seat, and a chip placing jig is arranged on the moving seat;

the disassembling component comprises a driving cylinder, a movable supporting plate and a disassembling mechanism, wherein the driving cylinder is arranged on one side of the linear motor, a cylinder shaft of the driving cylinder is connected with the movable supporting plate, and the disassembling mechanism is fixed on the movable supporting plate.

Preferably, the movable supporting plate is provided with a fixing groove, and the dismounting mechanism is fixed in the fixing groove.

Preferably, the disassembly mechanism includes the connecting piece, supports and leans on piece and dismouting piece, and the connecting piece is fixed in the fixed slot, and the slope runs through on the connecting piece and is provided with the holding tank, supports to lean on the piece to be fixed in on the connecting piece and shelter from an opening of holding tank, and the dismouting piece is fixed in the holding tank and supports and lean on to support and lean on the piece.

Preferably, the detachable member is provided with a tip portion, and the tip portion extends out of the accommodating groove.

Preferably, the disassembling component comprises a support, the driving cylinder is arranged on the support, and the support is provided with a detection probe.

Preferably, move the material subassembly and still include the guide rail, the guide rail sets up in linear electric motor both sides side by side, moves and is provided with the slider with guide rail sliding fit on the material seat.

Preferably, the material moving seat is provided with a first mounting hole, and the sliding block is provided with a second mounting hole corresponding to the first mounting hole.

One or more technical solutions of the forming apparatus provided by the embodiment of the present invention have at least one of the following technical effects: this chip reprocesses device simple structure can replace the manual work to carry out tin solder ball shovel light operation, and is swift convenient, easy operation, effectively promotes chip and reprocesses efficiency, practices thrift the hand labor cost.

The utility model is further described with reference to the following figures and examples.

Drawings

In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings used in the embodiments or the prior art will be briefly described below, and it is obvious that the drawings in the following description are only some embodiments of the present invention, and it is obvious for those skilled in the art that other drawings can be obtained based on these drawings without creative efforts.

Fig. 1 is a schematic structural diagram of a chip repair apparatus according to an embodiment of the present invention;

FIG. 2 is an exploded view of a detachment assembly provided in accordance with an embodiment of the present invention;

FIG. 3 is an exploded view of the material moving seat and the sliding block according to the embodiment of the present invention;

Detailed Description

In order to make the aforementioned objects, features and advantages of the present invention comprehensible, embodiments accompanied with figures are described in detail below. In the following description, numerous specific details are set forth in order to provide a thorough understanding of the present invention. This invention may, however, be embodied in many different forms and should not be construed as limited to the embodiments set forth herein.

In the description of the present invention, it is to be understood that the terms "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", etc., indicate orientations or positional relationships based on those shown in the drawings, and are only for convenience of description and simplicity of description, but do not indicate or imply that the referenced devices or elements must have a particular orientation, be constructed and operated in a particular orientation, and thus, are not to be construed as limiting the present invention.

In the description of the present invention, it is to be understood that the terms "first", "second" and the like are used for descriptive purposes only and are not to be construed as indicating or implying relative importance or implying any number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include at least one such feature. In the description of the present invention, "a plurality" means at least two, e.g., two, three, etc., unless specifically limited otherwise.

In the embodiments of the present invention, unless otherwise explicitly specified or limited, the terms "mounted," "connected," "fixed," and the like are to be construed broadly, e.g., as being fixedly connected, detachably connected, or integrated; can be mechanically or electrically connected; either directly or indirectly through intervening media, either internally or in any other relationship. Specific meanings of the above terms in the embodiments of the present invention can be understood by those of ordinary skill in the art according to specific situations.

In an embodiment of the present invention, the first preset direction corresponds to an X-axis direction of a spatial coordinate axis, the second preset direction corresponds to a Y-axis direction of the spatial coordinate axis, and the third preset direction corresponds to a Z-axis direction of the spatial coordinate axis. The movement along the first predetermined direction is a reciprocating movement along the X-axis, and similarly, the movement along the second predetermined direction is a reciprocating movement along the Y-axis, and the movement along the third predetermined direction is a reciprocating movement along the Z-axis.

As shown in fig. 1 to 3, an embodiment of the utility model provides a chip repairing apparatus, which includes a machine 100, a moving assembly 200 and a detaching assembly 300.

The machine 100, the machine 100 is integrated with a control module, a button electrically connected to the control module, and a display screen, wherein the button is used to control the moving assembly 200 and the detaching assembly 300 to start, and the display screen is electrically connected to the detection probe for observing the chip condition.

The moving assembly 200 comprises a linear motor 210 and a moving seat 220, the linear motor 210 is arranged on the machine table 100 along a second preset direction, the moving end of the linear motor 210 is connected with the moving seat 220, and a chip placing jig 221 is arranged on the moving seat 220;

when the repairing jig is used, a chip to be repaired is placed on the chip placing jig 221, the linear motor 210 is started, and the linear motor 210 drives the material moving seat 220 to move towards the direction of the disassembling assembly 300. Thus, the chip placing jig 221 is used for fixing the chip, so that the chip is fixed in position when being repaired, and the linear motor 210 is used for conveniently driving the chip to move towards the detaching assembly 300 and realize the removal of the soldering balls by matching with the detaching assembly 300.

The disassembling assembly 300 comprises a driving cylinder 310, a movable supporting plate 320 and a disassembling mechanism 330, wherein the driving cylinder 310 is arranged on one side of the linear motor 210, a cylinder shaft of the driving cylinder 310 is connected with the movable supporting plate 320, and the disassembling mechanism 330 is fixed on the movable supporting plate 320.

When the chip placing jig 221 is used, the driving cylinder 310 drives the movable supporting plate 320 to move along the third predetermined direction, and further drives the detaching mechanism 330 to move, so that the detaching mechanism 330 gradually contacts with the chip surface in the chip placing jig 221. The linear motor 210 continuously drives the material moving base 220 to move toward the detaching assembly 300, so that the detaching mechanism 330 can smoothly shovel off the solder balls on the chip surface. Therefore, the whole shoveling process can be completed without manual intervention, and the shoveling efficiency of the soldering ball is high.

This device is reprocessed to chip simple structure can replace the manual work to carry out the operation of tin solder ball shovel light, and is swift convenient, and easy operation effectively promotes the chip and reprocesses efficiency, practices thrift the hand labor cost.

As shown in fig. 1 to 3, the movable supporting plate 320 is provided with a fixing groove 321, and the detaching mechanism 330 is fixed in the fixing groove 321.

Specifically, the fixing groove 321 is square, and the fixing groove 321 is an open groove, so that the detachment mechanism 330 can be easily inserted into the fixing groove 321 from both ends of the fixing groove 321, and the detachment mechanism is easy to mount. In addition, the groove pitch of the fixing groove 321 is the same as the width of the connecting member, and when the connecting member is inserted into the fixing groove 321, the connecting member cannot move or loosen along the third predetermined direction, so that the degree of freedom of the connecting member is limited, and the connection stability and reliability of the detaching mechanism 330 are effectively improved.

As shown in fig. 1 to 3, the detaching mechanism 330 includes a connecting member 331, a supporting member 332 and a detaching member 333, the connecting member 331 is fixed in the fixing groove 321, the receiving groove 3311 is disposed on the connecting member 331 in an inclined manner, the supporting member 332 is fixed on the connecting member 331 and covers an opening of the receiving groove 3311, and the detaching member 333 is fixed in the receiving groove 3311 and supports on the supporting member 332.

Specifically, the detachable member 333 is mainly used for removing solder balls on the chip surface. The abutting member 332 is mainly used for providing a force for the assembling and disassembling member 333 so that the assembling member 333 can smoothly shovel off the solder balls.

In addition, the connecting member 331, the abutting member 332 and the dismounting member 333 are all detachably assembled and connected. If one of them has wearing and tearing in the use, can change the dismantlement that has wearing and tearing, convenient and fast, easy maintenance.

The connecting member 331 has a locking hole 3312, and the locking hole 3312 is connected to the receiving groove 3311. A locking screw is screwed in from the locking hole 3312 and fixes the detachable member 333 in the accommodation groove 3311, so that fixation is achieved, and the stability of connection between the detachable member 333 and the bracket of the connection member 331 is improved.

As shown in fig. 1 to 3, the detachable member 333 is provided with a tip portion 3331, and the tip portion 3331 extends out of the accommodation groove 3311.

Specifically, the tip portion 3331 can contact with the surface of the chip and remove the solder balls on the surface of the chip, so that the removed chip can be subjected to soldering again for recycling, thereby saving the production cost.

As shown in fig. 1 to 3, the detaching assembly 300 includes a bracket 340, the driving cylinder 310 is disposed on the bracket 340, and the bracket 340 is provided with a detecting probe. Specifically, the detection probe can observe the condition of the surface of the chip in real time.

As shown in fig. 1 to 3, the moving assembly further includes a guide rail 230, the guide rail 230 is disposed on two sides of the linear motor 210 in parallel, and the moving base 220 is provided with a sliding block 222 slidably engaged with the guide rail 230. Specifically, the number of the guide rails 230 is two, and the two guide rails are respectively disposed at both sides of the linear motor 210. Thus, the material moving base 220 can move smoothly by the sliding fit of the sliding block 222 and the guide rail 230.

As shown in fig. 1 to 3, a first mounting hole 2201 is formed on the material moving base 220, and a second mounting hole 2221 is formed on the slider 222 corresponding to the first mounting hole 2201.

Specifically, the fixing screw is screwed from the first mounting hole 2201 and finally placed in the second mounting hole 2221, thereby connecting the material moving base 220 with the slider 222. Therefore, the connection stability and reliability between the material moving seat 220 and the sliding block 222 are improved. In addition, move material seat 220 and slider 222 detachable connection, the convenience is assembled.

The foregoing is merely exemplary of the utility model and is not to be construed as limiting the utility model in any manner. Those skilled in the art can make numerous possible variations and modifications to the present teachings, or modify equivalent embodiments to equivalent variations, without departing from the scope of the present teachings, using the methods and techniques disclosed above. Therefore, all equivalent changes made according to the shape, structure and principle of the present invention without departing from the technical scheme of the present invention shall be covered by the protection scope of the present invention.

Claims

1. A device is reprocessed to chip which characterized in that includes:

a machine platform;

the disassembling assembly comprises a driving cylinder, a movable supporting plate and a disassembling mechanism, the driving cylinder is arranged on one side of the linear motor, a cylinder shaft of the driving cylinder is connected with the movable supporting plate, and the disassembling mechanism is fixed on the movable supporting plate.

2. The device of claim 1, wherein the movable supporting plate has a fixing groove formed therein, and the detaching mechanism is fixed to the fixing groove.

3. The device of claim 2, wherein the detaching mechanism includes a connecting member, a supporting member and a detaching member, the connecting member is fixed in the fixing groove, the connecting member is provided with an accommodating groove in an inclined manner, the supporting member is fixed on the connecting member and covers an opening of the accommodating groove, and the detaching member is fixed in the accommodating groove and abuts against the supporting member.

4. The chip rework device of claim 3, wherein the removal member is provided with a tip portion, the tip portion extending out of the receiving groove.

5. The chip reworking apparatus according to claim 1, wherein the removal assembly includes a support, the actuating cylinder is disposed on the support, and the support is provided with a detection probe.

6. The chip reworking apparatus according to claim 1, wherein the moving assembly further comprises guide rails, the guide rails are arranged in parallel on two sides of the linear motor, and a slider slidably engaged with the guide rails is arranged on the material moving base.

7. The device of claim 6, wherein the material moving base is provided with a first mounting hole, and the slide block is provided with a second mounting hole corresponding to the first mounting hole.