CN217011334U

CN217011334U - Circuit board production system, lamp area production system and lamp area

Info

Publication number: CN217011334U
Application number: CN202220650791.2U
Authority: CN
Inventors: 朱兴浪
Original assignee: Opple Lighting Co Ltd
Current assignee: Opple Lighting Co Ltd
Priority date: 2022-03-24
Filing date: 2022-03-24
Publication date: 2022-07-19
Anticipated expiration: 2032-03-24

Abstract

The utility model provides a circuit board production system, a lamp strip production system and a lamp strip, and belongs to the field of lamp strip production. The circuit board production system comprises a feeding machine, a printing machine, chip mounter and backflow welder, the feeding machine is configured to carry the base plate to the printing machine, chip mounter and backflow welder, in order to make the circuit board, backflow welder includes first stove courage, the first mobile device who is connected with first stove courage, the second mobile device that second stove courage and be connected with the second stove courage, first mobile device is configured to can drive first stove courage along being close to or keeping away from the direction removal of base plate, the second mobile device is configured to can drive the second stove courage along being close to or keeping away from the direction removal of base plate. According to the utility model, the first moving device and the second moving device are arranged in the reflow soldering machine, so that when the chip mounter or the printing machine is abnormal, the first furnace and the second furnace can be driven by the first moving device and the second moving device to be far away from the chip substrate, and the chip substrate is prevented from being damaged by heating.

Description

Circuit board production system, lamp area production system and lamp area

Technical Field

The utility model relates to a circuit board production system, a lamp strip production system and a lamp strip, and belongs to the field of lamp strip production.

Background

At present, the circuit board can be made to the base plate through printing, paster and reflow soldering in proper order, and the lamp area is made to the circuit board after inspection and maintenance, artifical wrong board concatenation welding divide board and extrusion molding. As shown in fig. 1, in the current production process, because the shutdown maintenance of the chip mounter is very easy to occur, and the substrate after the chip mounting is damaged due to the fact that the substrate after the chip mounting stays in the reflow soldering machine for a long time, the reflow soldering is usually performed after the whole substrate or a part of the whole substrate is mounted, and therefore a long section of conveyor belt (generally 25 meters) needs to be arranged between the chip mounter and the reflow soldering machine to store the substrate after the chip mounting is completed. When the length of the whole patch substrate exceeds the length of a conveyor belt (generally 25 meters), the substrate needs to be manually cut off and then subjected to reflow soldering, and after the circuit board which is subjected to reflow soldering is rolled up, the circuit board is manually detected, maintained and spliced and separated (namely, one end of a first board of the circuit board is connected with one end of a second board, and the other end of the second board is connected with one end of a third board …) so as to obtain the circuit board with the target length. Due to the arrangement, on one hand, the production system is very long, so that the serious waste of field space and low production efficiency are caused; on the other hand, the wrong plate splicing is carried out for a plurality of times through manpower, so that the hidden danger of the product quality is easily caused and the production cost is increased.

In view of the above, it is necessary to provide a circuit board production system to solve the above problems.

SUMMERY OF THE UTILITY MODEL

The utility model aims to provide a circuit board production system to solve at least one problem that a substrate is easy to damage in a reflow soldering machine, a production system wastes a lot of fields seriously and hidden danger of product quality is increased due to manual soldering in the prior art.

In order to achieve the above object, the present invention provides a circuit board production system, which includes a feeding machine, a printing machine, a chip mounter, and a reflow soldering machine, wherein the feeding machine is configured to convey a substrate to the printing machine, the chip mounter, and the reflow soldering machine to manufacture a circuit board, the reflow soldering machine includes a first furnace, a first moving device connected to the first furnace, a second furnace, and a second moving device connected to the second furnace, the first moving device is configured to be able to drive the first furnace to move in a direction close to or away from the substrate, and the second moving device is configured to be able to drive the second furnace to move in a direction close to or away from the substrate.

As a further improvement of the present invention, the first moving device includes a lifting device and a translating device, the lifting device is configured to drive the first furnace to move upwards or downwards, and the translating device is configured to drive the first furnace to translate towards a direction close to or away from the substrate; the second moving device is used for driving the second furnace pipe to move in a translation mode towards the direction close to or far away from the substrate.

As a further improvement of the present invention, the reflow soldering machine includes a housing, one end of the first moving device is connected to the top of the housing, the other end of the first moving device is connected to the first furnace, one end of the second moving device is connected to the bottom of the housing, and the other end of the second moving device is connected to the second furnace.

As a further improvement of the present invention, a signal transmitter is disposed on the chip mounter, a signal receiver and a processor are correspondingly disposed on the reflow soldering machine, the signal receiver is connected to the processor, and the processor is configured to control the first moving device and the second moving device to move according to a signal received by the signal receiver.

As a further improvement of the present invention, the substrate passes through the chip mounter to form a chip substrate, a buffer area is provided between the chip mounter and the reflow soldering machine, and a part of the chip substrate is accommodated in the buffer area, so as to reserve a part of the chip substrate between the chip mounter and the reflow soldering machine.

As a further improvement of the utility model, the reflow soldering machine further comprises a conveying belt for supporting and conveying the chip substrate, a plurality of conveying belts are arranged between the chip mounter and the conveying belt, and the buffer area is arranged between the chip mounter and the conveying belt and/or between two adjacent conveying belts.

As a further improvement of the present invention, the distance between the mounter and the reflow soldering machine is less than 10 meters.

As a further improvement of the utility model, the printer is configured to print solder paste on the substrate, and the placement machine is configured to place the lamp beads and the resistor on the surface of the substrate.

In order to achieve the purpose, the utility model further provides a lamp strip production system which comprises the circuit board production system, the detection device, the extrusion molding device and the packaging device, wherein the substrate sequentially passes through the circuit board production system, the detection device, the extrusion molding device and the packaging device to form the lamp strip.

In order to achieve the purpose, the utility model further provides a lamp strip which is manufactured by the lamp strip production system.

The beneficial effects of the utility model are: according to the utility model, the first moving device and the second moving device are arranged in the reflow welding machine, so that when the chip mounter or the printer is abnormal, the first furnace and the second furnace can be driven to be far away from the chip substrate by using the first moving device and the second moving device, and the chip substrate is prevented from being damaged by heating in the reflow welding machine.

Drawings

Fig. 1 is a schematic diagram of a prior art circuit board production system.

Fig. 2 is a schematic diagram of a circuit board production system in accordance with a preferred embodiment of the present invention.

Fig. 3 is a cross-sectional view of the circuit board production system of fig. 2.

Fig. 4 is a cross-sectional view of the reflow soldering machine of fig. 3 in a first state.

Fig. 5 is a cross-sectional view of the reflow soldering machine of fig. 3 in a second state.

Fig. 6 is a flow chart of a circuit board production process in accordance with a preferred embodiment of the present invention.

Fig. 7 is a flow chart of the shift out mode of fig. 6.

Fig. 8 is a flowchart of the move-in mode of fig. 6.

Fig. 9 is a schematic view of a light strip production system according to a preferred embodiment of the present invention.

Description of reference numerals: 100-a lamp strip production system, 200-a circuit board production system, 1-a feeding machine, 11-a substrate, 2-a printing machine, 3-a chip mounter, 31-a chip substrate, 4-a conveyor belt, 5-a reflow soldering machine, 51-a shell, 52-a furnace, 521-a first furnace, 522-a second furnace, 53-a first moving device, 531-a lifting device, 532-a translation device, 54-a second moving device, 55-a conveyor belt, 6-a material receiving machine, 62-a circuit board, 7-a buffer zone, 8-a detection device, 9-an extrusion molding device and 10-a packaging device.

Detailed Description

In order to make the objects, technical solutions and advantages of the present invention more apparent, the present invention will be described in detail with reference to the accompanying drawings and specific embodiments.

Referring to fig. 2, the present invention discloses a circuit board production process for a circuit board production system 200 to prevent the chip substrate 31 from being damaged in the reflow soldering machine and to improve the production efficiency of the circuit board 62. The circuit board production system 200 comprises a feeding machine 1, a printing machine 2, a chip mounter 3, a conveying belt 4, a reflow soldering machine 5 and a material receiving machine 6 which are arranged in sequence. Preferably, the feeding machine 1, the printing machine 2, the chip mounter 3, the reflow soldering machine 5 and the material receiving machine 6 in the circuit board production system 200 are all provided one and arranged in a straight line to form a production line.

The feeding machine 1 conveys the substrate 11 to the printing machine 2, the printing machine 2 prints solder paste on the substrate 11, the surface mounting machine 3 pastes lamp beads (not shown) and resistors (not shown) on the surface of the substrate 11 to obtain a surface mounting substrate 31, the reflow soldering machine 5 is used for reflow soldering the surface mounting substrate 31 to obtain a circuit board 62, and the material receiving machine 6 is used for rolling the circuit board 62. Of course, when the circuit board production system 200 is applied to produce the light strip, the material receiving machine 6 may not be provided.

In this embodiment, two conveyor belts 4 are provided and are both provided between the chip mounter 3 and the reflow soldering machine 5 for conveying the substrate 11, and of course, in other embodiments, the conveyor belt 4 may not be provided between the chip mounter 3 and the reflow soldering machine 5, or a plurality of conveyor belts 4 may be provided, which is not limited here.

In the utility model, the distance between the chip mounter 3 and the reflow soldering machine 5 is less than 10 meters, preferably, the distance between the chip mounter 3 and the reflow soldering machine 5 is 5 meters, and compared with the distance of 25 meters between the chip mounter 3 and the reflow soldering machine 5 in the traditional production line, the utilization rate of a field is greatly improved.

Because the speed between each production component is difficult to keep stable, the circuit board production system 200 further comprises a plurality of buffer areas 7, so that the substrate 11 can be accommodated in the buffer areas 7 to regulate and control the overall production speed of the production system, and the substrate 11 is prevented from being pulled between two adjacent components to damage the substrate 11.

Specifically, a buffer area 7 is arranged between the feeding machine 1 and the printing machine 2, the substrate 11 is partially accommodated in the buffer area 7, when the substrate 11 in the buffer area 7 is consumed, the feeding machine 1 needs to be controlled to accelerate the speed of discharging the substrate 11, and when the substrate 11 is filled in the buffer area 7, the discharging machine can discharge the substrate 11 at a constant speed at the current speed.

A buffer area 7 is also arranged between the printer 2 and the chip mounter 3 and is used for adjusting the production speed between the printer 2 and the chip mounter 3, when the substrate 11 is filled with the buffer area 7, the running speed of the chip mounter 3 can be properly increased or the production speed of the printer 2 can be reduced according to actual needs, and certainly, the chip mounter 3 and the printer 2 can also be controlled to work at a constant speed at the current speed; when the substrate 11 in the buffer area 7 is consumed, it is necessary to properly increase the running speed of the printer 2 or decrease the production speed of the chip mounter 3 to ensure that the substrate 11 is not pulled. Preferably, the speeds of the printer 2 and the placement machine 3 may be adjusted so that the substrate 11 fills half of the buffer 7.

A buffer area 7 is also arranged between the chip mounter 3 and the conveyor belts 4, and a buffer area 7 is also arranged between two adjacent conveyor belts 4. Of course, in embodiments where the conveyor belt 4 is not provided, buffer zones 7 may also be provided between the chip mounter 3 and the reflow soldering machine 5, and each buffer zone 7 functions in the same way as the buffer zone 7 between the printer 2 and the chip mounter 3, and will not be described in detail here.

In the present invention, the complete consumption of the material in the buffer 7 is explained as follows: there is no excess material stored in the buffer zone 7, i.e. the material is approximately linear between two adjacent parts, but not in a tensioned state. The material filling the buffer zone 7 is interpreted as: the material is in a suspended curve shape in the buffer area 7 and is not contacted with other parts. The material here comprises the substrate 11 and the chip substrate 31.

Referring to fig. 3 to 5, the reflow soldering machine 5 includes a housing 51, a furnace 52 accommodated in the housing 51, and a first moving device 53 and a second moving device 54 disposed between the furnace 52 and the housing 51, wherein a hollow structure is provided in the furnace 52 for the chip substrate 31 to pass through, and the furnace 52 is heated in the hollow structure, so that the chip substrate 31 can be reflowed when passing through the hollow structure. In this embodiment, the furnace pipe 52 is provided with twelve temperature zones, and the reflow soldering machine 5 can control the temperature of each temperature zone to improve the soldering process of the reflow soldering machine 5, of course, in other embodiments, the furnace pipe 52 may also be set as nine temperature zones or other number of temperature zones.

Reflow soldering machine 5 is still including being used for supporting paster base plate 31 and drive paster base plate 31 and pass reflow soldering machine 5's conveyer belt 55, and stove courage 52 is including relative setting and first stove courage 521 and the second stove courage 522 that can mutual butt, and first stove courage 521 and second stove courage 522 all can be towards being close to conveyer belt 55 and keeping away from the direction removal of conveyer belt 55.

Specifically, the first moving device 53 is connected to the first furnace pipe 521, and one end of the first moving device 53 is connected to the top of the first furnace pipe 521, and the other end of the first moving device 53 is connected to the top of the casing 51, so that the first moving device 53 can drive the first furnace pipe 521 to move; the second moving device 54 is connected to the second furnace pipe 522, and one end of the second moving device 54 is connected to the bottom of the second furnace pipe 522, and the other end is connected to the bottom of the casing 51, so that the second moving device 54 can drive the second furnace pipe 522 to move. With this arrangement, it is possible to move the first furnace pipe 521 and/or the second furnace pipe 522 in a direction away from the conveyor belt 55 or toward the conveyor belt 55 by the first moving device 53 and the second moving device 54.

The first moving device 53 includes a lifting device 531 and a translating device 532, the lifting device 531 is configured to drive the first furnace pipe 521 to move upwards or downwards, the translating device 532 is configured to drive the first furnace pipe 521 to move laterally, and the second moving device 54 is configured to drive the second furnace pipe 522 to move laterally. In this embodiment, the lifting device 531 only needs to move the first furnace pipe 521 upward or downward, and the specific structure of the lifting device 531 is not limited; the translation device 532 only needs to drive the first furnace pipe 521 to move laterally, and the specific structure of the translation device 532 is not limited; the second moving device 54 may be a translation device 532.

Of course, in other embodiments, the first moving device 53, the first furnace pipe 521, the second moving device 54 and the second furnace pipe 522 may be disposed at the left and right sides of the conveyor belt 55, and the first furnace pipe 521 and the second furnace pipe 522 are moved to the left or right to move the first furnace pipe 521 and the second furnace pipe 522 away from or close to the conveyor belt 55.

In this embodiment, when the reflow soldering machine 5 performs soldering, the conveyor belt 55 is positioned in the space of the first furnace pipe 521. When the conveying belt 55 stops moving and the patch substrate 31 does not need to be heated, the first moving device 53 drives the first furnace pipe 521 to be lifted upwards firstly and then to move to the side, so that the first furnace pipe 521 is far away from the conveying belt 55, the second moving device 54 drives the second furnace pipe 522 to move to the side, so that the second furnace pipe 522 is far away from the conveying belt 55, the patch substrate 31 on the conveying belt 55 is prevented from being damaged by continuous high temperature, and meanwhile, the first furnace pipe 521 and the second furnace pipe 522 are prevented from contacting the conveying belt 55 when moving. The first furnace pipe 521 and the second furnace pipe 522 after moving are arranged oppositely, and then the first moving device 53 drives the first furnace pipe 521 to descend, so that the first furnace pipe 521 and the second furnace pipe 522 are mutually abutted, and the heat preservation of the space enclosed by the first furnace pipe 521 and the second furnace pipe 522 can be realized. The moved first furnace pipe 521 and the second furnace pipe 522 are located at the side of the conveyor belt 55, and the temperature outside the furnace pipe 52 is far lower than the temperature inside the furnace pipe 52, so as to avoid heating the chip substrate 31 on the conveyor belt 55.

In this embodiment, the elevation height of the first furnace 521, the translation size of the first furnace 521, and the translation size of the second furnace 522 are not limited as long as the first furnace 521 and the second furnace 522 do not contact the conveyor belt 55 and the patch substrate 31 during the movement.

When the conveyor belt 55 needs to be heated, the first moving device 53 and the second moving device 54 move in opposite directions again to move the first furnace 521 and the second furnace 522 above and below the conveyor belt 55, so that the chip substrate 31 on the conveyor belt 55 can be soldered.

Of course, in other embodiments, when the second furnace 522 is far away from the conveyor belt 55, only the first furnace 521 may be moved, and the heat preservation effect between the first furnace 521 and the second furnace 522 is not considered; or, when the reflow soldering machine 5 performs soldering, the conveyor belt 55 may also be located in the second furnace 522, at this time, the second moving device 54 drives the second furnace 522 to move downward and then move in a translation manner, and the first moving device 53 directly moves in a translation manner, of course, if the first furnace 521 is far away from the conveyor belt 55, only the second furnace 522 may be moved, and at this time, the heat preservation effect between the first furnace 521 and the second furnace 522 is not considered; alternatively, the conveyor belt 55 may be positioned at the contact portion between the first furnace 521 and the second furnace 522, and in this case, the first moving device 53 drives the first furnace 521 to move upward and then to the side, and the second moving device 54 drives the second furnace 522 to move downward and then to the side, so that the first furnace 521 and the second furnace 522 do not contact the conveyor belt 55 during movement.

In short, the position of the conveyor belt 55 between the first furnace 521 and the second furnace 522 may be variously set, as long as it is possible to control the first furnace 521 and the second furnace 522 not to heat the conveyor belt 55 when an abnormality occurs, and the first furnace 521 and the second furnace 522 can resume heating and welding of the conveyor belt 55 after the abnormality disappears.

The mounter 3 is provided with a signal transmitter (not shown), the reflow soldering machine 5 is correspondingly provided with a signal receiver (not shown) and a processor (not shown) connected with the signal receiver, and the processor can control the first moving device 53 and the second moving device 54 to perform corresponding moving actions.

Specifically, when the chip mounter 3 is abnormal, the signal transmitter can send a signal to the signal receiver, so that the processor controls the first moving device 53 and the second moving device 54 to move out the first furnace pipe 521 and the second furnace pipe 522 respectively, and the chip mounter 31 on the conveyor belt 55 is prevented from being damaged due to continuous high temperature; after the abnormality of the chip mounter 3 is eliminated, the signal transmitter can transmit a signal to the signal receiver, so that the processor controls the first moving device 53 and the second moving device 54 to move the first furnace 521 and the second furnace 522 in, respectively, to continue welding the chip substrate 31 on the conveyor belt 55.

Of course, in other embodiments, the signal emitter may be disposed on the printing machine 2, and may also be disposed on the conveying belt 55, so as to move the first furnace 521 and the second furnace 522 out of the oven when the patch substrate 31 on the conveying belt 55 stays in the reflow soldering machine 5, thereby preventing the patch substrate 31 from being damaged.

Referring to fig. 6 to 8, the steps of the circuit board production process will be described in detail below, and the circuit board production process mainly includes the following steps:

s1, preprocessing the substrate 11;

s2, carrying out surface mounting on the pretreated substrate 11 by using the surface mounting machine 3 to obtain a surface mounted substrate 31;

s3, performing reflow soldering on the chip substrate 31 by using a reflow soldering machine 5 to obtain a circuit board 62;

and S4, rolling the circuit board 62.

Here, the preprocessing in step S1 includes feeding the printing press 2 by the feeder 1, that is, conveying the substrate 11 in the feeder 1 to the printing press 2.

The pre-processing further includes performing solder paste printing on the substrate 11 using the printer 2, that is, printing solder paste on the surface of the substrate 11, and conveying the substrate 11 on which the solder paste is printed to the mounter 3.

In step S2, the chip mounter 3 is configured to attach the lamp beads and the resistor to the surface of the pretreated substrate 11 to obtain the chip substrate 31, and then convey the chip substrate 31 to the conveyor belt 4. Of course, in the embodiment where the conveyor belt 4 is not provided, the mounter 3 directly conveys the chip substrate 31 into the reflow soldering machine 5.

In step S3, the reflow soldering machine 5 includes a furnace 52, and the chip substrate 31 passes through the furnace 52 to perform reflow soldering. The reflow soldering machine 5 is provided with a moving-out mode and a moving-in mode, when the step S1 and/or S2 is abnormal, the reflow soldering machine 5 starts the moving-out mode, moves the furnace pipe 52 out to be far away from the chip substrate 31, stops heating and soldering the chip substrate 31, and avoids the chip substrate 31 from being damaged; after the abnormality is eliminated, the reflow soldering machine 5 starts the shift-in mode, and moves the furnace pipe 52 to the chip substrate 31 to continue heating and soldering the chip substrate 31, so as to obtain the circuit board 62.

Specifically, during normal soldering, the conveyor belt 55 supports and drives the chip substrate 31 to pass through between the first furnace pipe 521 and the second furnace pipe 522, and the chip substrate 31 is heated through the first furnace pipe 521 and the second furnace pipe 522, so that reflow soldering of the chip substrate 31 is realized. When abnormality occurs in step S1 and/or S2, the signal transmitter disposed on the chip mounter 3 or the printer 2 transmits a shift-out signal to the signal receiver disposed on the reflow soldering machine 5, and at this time, the processor starts a shift-out mode to move the first furnace 521 and/or the second furnace 522 in a direction away from the chip substrate 31, so as to avoid damage to the chip substrate 31 due to continuous heating.

When the abnormality in step S1 and/or S2 is eliminated, the signal transmitter provided in the chip mounter 3 or the printer 2 transmits the move-in signal to the signal receiver provided in the reflow soldering machine 5, and at this time, the processor starts the move-in mode to move the first furnace 521 and/or the second furnace 522 toward the direction close to the chip substrate 31, so that the chip substrate 31 is placed between the first furnace 521 and the second furnace 522 again, and the soldering is continued. Of course, in other embodiments, the signal transmitter and the signal receiver may not be provided, and the reflow machine 5 may be controlled to start the move-out mode and the move-in mode directly by manual observation. That is, the first moving device 53 can move the first furnace pipe 521 upward, downward and translate, and the second moving device 54 can move the second furnace pipe 522 upward, downward and translate.

In the present invention, during normal welding, the conveyor belt 55 is located in the first furnace pipe 521, and as a first implementation of the moving-out mode, the moving-out mode (a) mainly includes the following steps after being started:

s31, the first liner 521 is lifted upwards by the first moving device 53, and then the first liner 521 is driven to translate towards the side;

s32, the second moving device 54 drives the second furnace pipe 522 to move horizontally towards the side direction, and the first furnace pipe 521 and the second furnace pipe 522 are oppositely arranged;

s33, the first moving device 53 drives the first furnace 521 to move downward, so that the first furnace 521 and the second furnace 522 are at least partially in contact with each other, and at this time, the first furnace 521 and the second furnace 522 are both far away from the chip substrate 31.

Correspondingly, the method mainly comprises the following steps after the shift-in mode (a) is started:

s34, the first moving device 53 lifts the first furnace 521 upward, and then drives the first furnace 521 to translate toward the side to the upper side of the chip substrate 31;

s35, the second moving device 54 drives the second furnace 522 to move laterally to the lower side of the chip substrate 31, and the first furnace 521 and the second furnace 522 are arranged oppositely;

s36, the first moving device 53 drives the first furnace 521 to move downward, so that the first furnace 521 and the second furnace 522 at least partially contact with each other, so as to continue heating and welding the chip substrate 31.

Of course, in other embodiments, the conveyor belt 55 may be located inside the second furnace pipe 522 during normal welding, or at the connection between the first furnace pipe 521 and the second furnace pipe 522.

When the conveyor belt 55 is located in the second furnace pipe 522, as a second embodiment of the removing mode, the removing mode (b) mainly includes the following steps after being started:

s31', the second moving device 54 drives the second furnace pipe 522 to move downward, and then drives the second furnace pipe 522 to move laterally;

s32', the first moving device 53 drives the first furnace pipe 521 to translate laterally, and the first furnace pipe 521 and the second furnace pipe 522 are oppositely arranged;

s33', the second moving device 54 drives the second furnace 522 to move upward, so that the first furnace 521 and the second furnace 522 are at least partially in contact with each other, and at this time, the first furnace 521 and the second furnace 522 are both far away from the patch substrate 31.

Correspondingly, the step of starting the shift-in mode (b) mainly comprises the following steps:

s34', the second moving device 54 drives the second furnace 522 to move downward, and then translate to the side below the patch substrate 31;

s35', the first moving device 53 drives the first furnace 521 to translate laterally to above the chip substrate 31, and the first furnace 521 and the second furnace 522 are oppositely disposed;

s36', the second moving device 54 drives the second furnace 522 to move upward, so that the first furnace 521 and the second furnace 522 at least partially contact each other to continue heating and welding the patch substrate 31.

When the conveyor belt 55 is located at the joint of the first furnace pipe 521 and the second furnace pipe 522, as a third embodiment of the moving-out mode, the moving-out mode (c) mainly includes the following steps after being started;

s31', the first furnace pipe 521 is lifted upwards by the first moving device 53, and then the first furnace pipe 521 is driven to translate laterally;

s32 ″, the second moving device 54 drives the second furnace pipe 522 to move downwards, and then drives the second furnace pipe 522 to translate towards the side direction, so that the first furnace pipe 521 and the second furnace pipe 522 are oppositely arranged;

s33 ″, the first moving device 53 drives the first furnace pipe 521 to move downward, and the second moving device 54 drives the second furnace pipe 522 to move upward, so that the first furnace pipe 521 and the second furnace pipe 522 are at least partially in contact, and at this time, both the first furnace pipe 521 and the second furnace pipe 522 are far away from the patch substrate 31;

correspondingly, the method mainly comprises the following steps after the shift-in mode (c) is started:

s34 ″, the first moving device 53 lifts the first furnace 521 upward, and then drives the first furnace 521 to translate toward the side to the upper side of the chip substrate 31;

s35 ″, the second moving device 54 drives the second furnace 522 to move downward, and then drives the second furnace 522 to translate to the lower side of the patch substrate 31 toward the lateral side, so that the first furnace 521 and the second furnace 522 are arranged oppositely;

s36 ″, the first moving device 53 drives the first furnace 521 to move downward, and the second moving device 54 drives the second furnace 522 to move upward, so that the first furnace 521 and the second furnace 522 at least partially contact with each other, so as to continue heating and welding the chip substrate 31.

In this embodiment, the first furnace 521 is located above the conveyor belt 55, and the second furnace 522 is located below the conveyor belt 55. Of course, when the first furnace 521 and the second furnace 522 are disposed at the left and right sides of the conveyor belt 55, the moving directions of the moving-out mode and the moving-in mode may be adjusted accordingly, and will not be described in detail herein.

In the utility model, the buffer area 7 is arranged between the chip mounter 3 and the reflow soldering machine 5, and part of the chip substrate 31 is accommodated in the buffer area 7, so that the chip substrate 31 flows out of the chip mounter 3, then passes through the buffer area 7 and then enters the reflow soldering machine 5. That is, in the normal welding process, a part of the chip substrate 31 is reserved between the chip mounter 3 and the reflow soldering machine 5, so that the length of the chip substrate 31 between the chip mounter 3 and the reflow soldering machine 5 is greater than the linear distance between the chip mounter 3 and the reflow soldering machine 5, when the chip mounter 3 or the printer 2 is abnormal, the reflow soldering machine 5 does not immediately start the shift-out mode, but the conveyor belt 55 stops running after the chip substrate 31 in the buffer area 7 is consumed, and the reflow soldering machine 5 starts the shift-out mode. That is, when the reflow soldering machine 5 starts the shift-out mode, the length of the chip substrate 31 between the chip mounter 3 and the reflow soldering machine 5 is slightly longer than the distance between the chip mounter 3 and the reflow soldering machine 5, and the conveyor belt 55 stops running. By the arrangement, when the printer 2 and/or the chip mounter 3 are/is in short-term abnormity, the reflow soldering machine 5 is not started to move out immediately, the production efficiency of the production system is improved, and program waste during production is reduced.

Preferably, the time interval between the conveyor belt 55 stopping and the reflow soldering machine 5 initiating the removal mode is less than 150 seconds.

In this embodiment, the length of the chip substrate 31 in the buffer 7 and the operating speed of the reflow soldering machine 5 can be measured to calculate how long the chip mounter 3 is stopped, and the signal emitter emits a signal to start the reflow soldering machine 5 to move out of the mode. Since the difference between the length of the patch substrate 31 in the buffer area 7 and the speed of the reflow machine 5 is large in the case of different production strengths, the time period is not limited here.

In the utility model, after the abnormality of the chip mounter 3 and the printer 2 is eliminated, the reflow soldering machine 5 starts the moving-in mode, and after the moving-in step is completed, the conveyer belt 55 is started in a delayed manner, that is, when the first furnace pipe 521 and the second furnace pipe 522 are close to the chip substrate 31, the conveyer belt 55 is started in a delayed manner for a period of time, so that the chip substrate 31 staying on the conveyer belt 55 can be ensured to be welded, and on the other hand, the chip substrate 31 can be reserved in the buffer area 7 between the chip mounter 3 and the reflow soldering machine 5, and the chip substrate 31 between the chip mounter 3 and the reflow soldering machine 5 is prevented from being strained, and the chip substrate 31 is prevented from being damaged.

In step S4, the circuit board 62 obtained by welding is wound up by the material receiving machine 6, so as to prepare the lamp strip.

Referring to fig. 9, the present invention further provides a system 100 for producing a light strip (not shown). The lamp strip production system 100 comprises the circuit board production system 200, the detection device 8, the extrusion molding device 9 and the packaging device 10, wherein the detection device 8 is arranged at the tail end of the circuit board production system 200, namely, the detection device 8 is arranged at the rear end of the reflow soldering machine 5, and the substrate 11 sequentially penetrates through the circuit board production system 200, the detection device 8, the extrusion molding device 9 and the packaging device 10 to form the lamp strip.

The detection device 8 comprises manual welding, board separation and quality detection, wherein the circuit board 62 after reflow welding comprises a plurality of circuit strips arranged in parallel (not shown), and due to site limitation, when the lamp strip with long specification is required to be produced, a plurality of circuit strips on one circuit board 62 can be subjected to wrong board welding through manual work to manufacture the lamp strip with long specification. For example, if a 100-meter light strip is produced, in the existing production system, the distance between the chip mounter 3 and the reflow soldering machine 5 is 25 meters, four soldered circuit strips need to be subjected to manual board-staggering soldering, that is, the tail end of a first circuit strip and the head end of a second circuit strip are subjected to manual soldering …, and the tail end of the second circuit strip and the head end of a third circuit strip are subjected to manual soldering to form a 100-meter long circuit strip. In the utility model, the first furnace pipe 521 and the second furnace pipe 522 are movably arranged, so that the circuit board production system 200 can directly produce long-specification circuit bars, thereby greatly reducing the quality hidden trouble caused by manual welding and simultaneously reducing the production cost caused by manual welding.

The plate dividing step comprises the following steps: the manually soldered circuit board 62 is separated into a plurality of individual circuit bars. The quality detection step comprises the following steps: the individual circuit strips are energized to detect the quality of the solder connections of each circuit strip to facilitate manual secondary soldering of the poor quality circuit board 62.

The extrusion molding device 9 is used for carrying out extrusion molding and solidification to the circuit strip that passes through the detection device 8, finally forms the lamp area. Finally, the strip is packaged by means of a packaging device 10.

In conclusion, in the circuit board production process of the present invention, the reflow soldering machine 5 is set to have the moving-in mode and the moving-out mode, so that when the chip mounter 3 or the printer 2 is abnormal, the furnace bladder 52 can be controlled to be away from the chip substrate 31, on one hand, the chip substrate 31 can be prevented from being damaged in the reflow soldering machine 5, on the other hand, the number of times of manual soldering is reduced, and the hidden danger of product quality is reduced; the first moving device 53 is arranged on the first furnace pipe 521, and the second moving device 54 is arranged on the second furnace pipe 522, so that the first furnace pipe 521 and the second furnace pipe 522 are moved; by arranging the buffer area 7 between the chip mounter 3 and the reflow soldering machine 5, when the printer 2 and/or the chip mounter 3 are/is in short-term abnormity, the reflow soldering machine 5 cannot start a moving-out mode immediately, the production efficiency of a production system is improved, and meanwhile, the program waste during production is reduced; by shortening the distance between the chip mounter 3 and the reflow soldering machine 5, the space utilization rate of the field is improved.

Although the present invention has been described in detail with reference to the preferred embodiments, it will be understood by those skilled in the art that various changes may be made and equivalents may be substituted for elements thereof without departing from the spirit and scope of the present invention.

Claims

1. The utility model provides a circuit board production system, includes material loading machine (1), printing machine (2), chip mounter (3) and reflow soldering machine (5), material loading machine (1) is configured to be carried base plate (11) extremely printing machine (2), chip mounter (3) and reflow soldering machine (5) to make circuit board (62), its characterized in that: the reflow soldering machine (5) comprises a first furnace pipe (521), a first moving device (53) connected with the first furnace pipe (521), a second furnace pipe (522) and a second moving device (54) connected with the second furnace pipe (522), wherein the first moving device (53) is configured to be capable of driving the first furnace pipe (521) to move along the direction close to or far away from the substrate (11), and the second moving device (54) is configured to be capable of driving the second furnace pipe (522) to move along the direction close to or far away from the substrate (11).

2. The circuit board production system according to claim 1, wherein: the first moving device (53) comprises a lifting device (531) and a translation device (532), the lifting device (531) is used for driving the first furnace pipe (521) to move upwards or downwards, and the translation device (532) is used for driving the first furnace pipe (521) to translate towards a direction close to or far away from the substrate (11); the second moving device (54) is used for driving the second furnace pipe (522) to translate towards the direction close to or far away from the base plate (11).

3. The circuit board production system according to claim 2, wherein: the reflow welding machine (5) comprises a shell (51), one end of the first moving device (53) is connected with the top of the shell (51), the other end of the first moving device is connected with the first furnace pipe (521), one end of the second moving device (54) is connected with the bottom of the shell (51), and the other end of the second moving device is connected with the second furnace pipe (522).

4. The circuit board production system according to claim 1, wherein: the chip mounter (3) is provided with a signal transmitter, the reflow soldering machine (5) is correspondingly provided with a signal receiver and a processor, the signal receiver is connected with the processor, and the processor is configured to be capable of controlling the first moving device (53) and the second moving device (54) to move according to signals received by the signal receiver.

5. The circuit board production system according to claim 1, wherein: the substrate (11) penetrates through a chip mounter (3) to form a chip substrate (31), a buffer area (7) is arranged between the chip mounter (3) and the reflow soldering machine (5), and part of the chip substrate (31) is accommodated in the buffer area (7) so that part of the chip substrate (31) is reserved between the chip mounter (3) and the reflow soldering machine (5).

6. The circuit board production system according to claim 5, wherein: reflow machine (5) still including being used for supporting and carrying conveyer belt (55) of paster base plate (31), chip mounter (3) with be equipped with a plurality of conveyer belts (4) between conveyer belt (55), chip mounter (3) with between conveyer belt (4) and/or adjacent two all be equipped with between conveyer belt (4) buffer (7).

7. The circuit board production system according to claim 6, wherein: the distance between the chip mounter (3) and the reflow soldering machine (5) is less than 10 meters.

8. The circuit board production system according to claim 1, wherein: the printer (2) is configured to perform solder paste printing on the substrate (11), and the chip mounter (3) is configured to attach the lamp beads and the resistors to the surface of the substrate (11).

9. A lamp area production system which characterized in that: comprising a circuit board production system (200) according to any of claims 1-8, a detection device (8), an extrusion device (9) and a packaging device (10), said substrate (11) being formed into a light strip after passing said circuit board production system (200), detection device (8), extrusion device (9) and packaging device (10) in sequence.

10. A light strip, its characterized in that: made by the light strip production system (100) according to claim 9.