CN217009167U

CN217009167U - Wafer adsorption manipulator and wafer adsorption device

Info

Publication number: CN217009167U
Application number: CN202220104458.1U
Authority: CN
Inventors: 罗顺松; 陈旋宇; 王怀超
Original assignee: Chongqing Kangjia Photoelectric Technology Research Institute Co Ltd
Current assignee: Chongqing Kangjia Optoelectronic Technology Co ltd
Priority date: 2022-01-14
Filing date: 2022-01-14
Publication date: 2022-07-19
Anticipated expiration: 2032-01-14

Abstract

The application relates to a wafer adsorbs manipulator, and it includes mounting, a plurality of centre gripping arm and locating part, every at least one mounting groove has been seted up on the centre gripping arm. Wafer adsorbs manipulator still including installing a plurality of wafer adsorption apparatus in the mounting groove, and wafer adsorption apparatus includes suction tube, elastic component, adsorption element and sealed lid, and the suction tube is installed in the bottom of mounting groove, and the elastic component encloses the week side of locating the suction tube, and the elastic component centre gripping has predetermined clearance between the bottom of mounting groove and adsorption element between adsorption element and the suction tube, and with the suction tube intercommunication, adsorption element is used for adsorbing the wafer, and sealed lid is established in order to restrict adsorption element in the mounting groove on the mounting groove, has seted up spacing hole on the sealed lid, adsorption element passes spacing hole and exposes sealed lid in order to adsorb the wafer under the elastic force of elastic component. The wafer adsorption manipulator realizes the adsorption of the warped wafer. The application also provides a wafer adsorption device with the wafer adsorption manipulator.

Description

Wafer adsorption manipulator and wafer adsorption device

Technical Field

The application relates to the technical field of chip manufacturing, in particular to a wafer adsorption manipulator and a wafer adsorption device with the same.

Background

Wafers (wafers) are widely used in the field of electronic devices as a basic material for manufacturing chips. During the processing of the wafer, it is usually necessary to hold the wafer by a robot and transfer the wafer to a designated processing position. The manipulator of centre gripping wafer in the industry is mostly rigid manipulator, and it mainly includes adsorption apparatus and manipulator body, and wherein, the manipulator body is used for placing the wafer, and adsorption apparatus utilizes suction to adsorb firmly the wafer.

However, during the production of chips, the epitaxial wafer may be deformed due to the stress of the production process, which may cause the wafer to warp. At this time, a gap exists between the wafer and the adsorption mechanism, and the adsorption mechanism cannot be attached to the surface of the wafer, so that the adsorption mechanism cannot clamp the warped wafer.

SUMMERY OF THE UTILITY MODEL

In view of the above defects of the prior art, an object of the present application is to provide a wafer suction robot and a wafer suction device having the same, which are capable of sucking a warped wafer by the wafer suction robot and increasing the application range and application scenario of the wafer suction robot.

The utility model provides a wafer adsorbs manipulator, wafer adsorbs manipulator includes mounting, a plurality of centre gripping arm and locating part, and is a plurality of the centre gripping arm with the locating part interval sets up and install in one side of mounting, every at least one mounting groove has been seted up on the centre gripping arm. The wafer adsorbs the manipulator still includes a plurality ofly install in the wafer adsorption device in the mounting groove, every wafer adsorption device includes suction tube, elastic component, adsorbs piece and sealed lid. The suction tube install in the bottom of mounting groove for provide suction, the elastic component encloses and locates week side of suction tube, just the elastic component centre gripping in the bottom of mounting groove with between the adsorption component, the adsorption component with predetermined clearance has between the suction tube, and with the suction tube intercommunication, the adsorption component is used for adsorbing the wafer. The sealing cover is covered on the mounting groove so as to limit the adsorption piece in the mounting groove, a limiting hole is formed in the sealing cover, and the adsorption piece penetrates through the limiting hole under the elastic action of the elastic piece and is exposed out of the sealing cover so as to adsorb the wafer.

To sum up, this application provides wafer adsorption equipment hand includes suction tube, elastic component, absorption piece and sealed lid. The elastic component centre gripping in the bottom of mounting groove with adsorb between the piece, adsorb the piece with predetermined clearance has between the suction tube, be convenient for take place warping wafer and press when adsorbing on the piece, adsorb the piece and can realize fine motion and adjust, and then with take place warping wafer and closely laminate, make wafer adsorption manipulator not only can adsorb the horizontal wafer in surface, also can adsorb the wafer that takes place warping, increased wafer adsorption manipulator's application scope and application scene.

Optionally, the suction pipe includes an adsorption surface and an outer wall intersecting with the adsorption surface, and the adsorption surface is located at one end of the suction pipe facing the adsorption member.

Optionally, an adsorption hole penetrating through the adsorption member is formed in the adsorption member, the adsorption hole is located on the inner side of the outer wall, the adsorption hole is communicated with the suction tube, and the suction force provided by the suction tube enables vacuum to be formed in the adsorption hole so that the adsorption member adsorbs the wafer.

Optionally, the size of the limiting hole is smaller than that of the adsorption piece, and the size of the limiting hole is larger than that of the adsorption hole.

Optionally, the adsorption piece includes the surface and with the surface crossing adsorption end face, the adsorption face with the surface keeps predetermined clearance, the radian of adsorption face with the radian of surface is unanimous, the elastic component centre gripping in the bottom of mounting groove with the surface of adsorption piece between.

Optionally, the sealing cover comprises a limiting curved surface and an upper surface, the upper surface is intersected with the limiting curved surface, the limiting curved surface is located at one end, facing the adsorption part, of the sealing cover, and the radian of the limiting curved surface is consistent with that of the outer surface.

Optionally, the wafer adsorption mechanism further includes a sealing member, the sealing member is disposed between the clamping arm and the sealing cover and surrounds the mounting groove, and the sealing member seals a gap between the clamping arm and the sealing cover.

Optionally, the adsorption piece is a spherical suction nozzle, the adsorption surface is a spherical surface, and the radius of the adsorption piece is the same as the spherical radius of the adsorption surface of the suction pipe.

To sum up, the application provides wafer adsorbs manipulator includes suction tube, elastic component, adsorption component and sealed lid. The elastic component centre gripping in the bottom of mounting groove with adsorb between the piece, adsorb the piece with predetermined clearance has between the suction tube, be convenient for take place warping wafer and press when adsorbing on the piece, adsorb the piece and can realize fine motion and adjust, and then with take place warping wafer and closely laminate, make wafer adsorption manipulator not only can adsorb the horizontal wafer in surface, also can adsorb the wafer that takes place warping, increased wafer adsorption manipulator's application scope and application scene. In addition, suction tube, elastic component, absorption piece and the sealed lid of wafer absorption manipulator can form alone, work as when certain component of wafer absorption manipulator damages, only need change the component that damages can, and need not to change whole wafer absorption manipulator, and then reduced the maintenance cost.

Based on same utility model conceive, this application still provides a wafer adsorption equipment, wafer adsorption equipment includes wafer transmission device, box and foretell wafer adsorption manipulator, wafer transmission device with box sliding connection, wafer transmission device with wafer adsorption manipulator fixed connection, wafer transmission device will adsorb in wafer adsorption manipulator is last wafer transmission to appointed processing position.

Optionally, a driving motor and a suction motor are fixedly installed in the box body, the driving motor is connected with the wafer transmission device through a transmission mechanism, the driving motor drives the wafer transmission device to move or rotate, the suction motor is communicated with a suction pipe in the wafer adsorption manipulator, and the suction motor provides suction force to enable vacuum to be formed in the adsorption piece.

In summary, in the wafer suction device provided in the present application, the wafer suction robot includes a suction pipe, an elastic member, a suction member, and a sealing cover. The elastic component centre gripping in the bottom of mounting groove with adsorb between the piece, adsorb the piece with predetermined clearance has between the suction tube, be convenient for take place warping wafer and press when adsorbing on the piece, adsorb the piece and can realize fine motion and adjust, and then with take place warping wafer and closely laminate, make wafer adsorption manipulator not only can adsorb the horizontal wafer in surface, also can adsorb the wafer that takes place warping, increased wafer adsorption manipulator's application scope and application scene. In addition, suction tube, elastic component, absorption piece and the sealed lid of wafer absorption manipulator can form alone, work as when certain component of wafer absorption manipulator damages, only need change the component that damages can, and need not to change whole wafer absorption manipulator, and then reduced the maintenance cost.

Drawings

Fig. 1 is a schematic top view of a wafer adsorption robot according to an embodiment of the present disclosure;

fig. 2 is a schematic front view of a wafer adsorption robot according to an embodiment of the present disclosure;

FIG. 3 is a schematic cross-sectional view of the wafer adsorption robot shown in FIG. 1 taken along the direction I-I;

FIG. 4 is an enlarged view of structure IV of the wafer chuck robot shown in FIG. 3;

fig. 5 is a schematic top view of a wafer chuck robot and a wafer according to an embodiment of the present disclosure;

FIG. 6 is a schematic cross-sectional view of the wafer adsorption robot and the wafer shown in FIG. 5 along direction II-II;

FIG. 7 is an enlarged view of the wafer chuck robot shown in FIG. 6 and a structure VII in the wafer;

fig. 8 is a schematic structural diagram of a wafer adsorbing device disclosed in the embodiment of the present application.

Description of reference numerals:

10-a manipulator body;

11-a fixing member;

12-a gripper arm;

13-a stop;

14-mounting grooves;

20-a wafer adsorption mechanism;

21-a suction tube;

21 a-inner wall;

21 b-an adsorption face;

21 c-outer wall;

22-a resilient member;

23-an adsorbing member;

23 a-an outer surface;

23 b-an adsorption end face;

24-a sealing cover;

24 a-a limit curved surface;

24 b-an upper surface;

25-a seal;

31-adsorption pores;

31 a-inner wall of hole;

32-a limiting hole;

100-a wafer adsorption robot;

150-a wafer transfer device;

200-a wafer;

300-a box body;

400-a base;

1000-wafer adsorption apparatus.

Detailed Description

To facilitate an understanding of the present application, the present application will now be described more fully with reference to the accompanying drawings. Preferred embodiments of the present application are given in the accompanying drawings. This application may, however, be embodied in many different forms and should not be construed as limited to the embodiments set forth herein. Rather, these embodiments are provided so that this disclosure will be thorough and complete.

Unless defined otherwise, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this application belongs. The terminology used herein in the description of the present application is for the purpose of describing particular embodiments only and is not intended to be limiting of the application.

Wafers (wafers) are widely used in the field of electronic devices as a basic material for manufacturing chips. During the processing of the wafer, it is usually necessary to hold the wafer by a robot and transfer the wafer to a designated processing position. The manipulator of centre gripping wafer in the industry is mostly rigid manipulator, and it mainly includes adsorption apparatus and manipulator body, and wherein, the manipulator body is used for placing the wafer, and adsorption apparatus utilizes suction to adsorb and live the wafer. However, during the production of chips, the epitaxial wafer may be deformed due to the stress of the production process, which may cause the wafer to warp. At this time, a gap exists between the wafer and the adsorption mechanism, and the adsorption mechanism cannot be attached to the surface of the wafer, so that the adsorption mechanism cannot clamp the warped wafer.

Based on this, the present application is expected to provide a solution to the above technical problem, which can solve the problem that the adsorption mechanism cannot adsorb the warped wafer, and increase the application scope and application scenario of the wafer adsorption robot, and the details of which will be described in the following embodiments.

The detailed description of the scheme of the application provides a wafer adsorption mechanical arm and a wafer adsorption device with the same.

Referring to fig. 1 and 2, fig. 1 is a schematic top view of a wafer adsorption robot according to an embodiment of the present disclosure, and fig. 2 is a schematic front view of the wafer adsorption robot according to the embodiment of the present disclosure. The wafer adsorption robot 100 provided by the embodiment of the present application includes a robot body 10 and a plurality of wafer adsorption mechanisms 20 mounted on the robot body 10. The robot body 10 is used for placing a wafer 200 (as shown in fig. 5) and installing and fixing the wafer suction mechanisms 20, and the plurality of wafer suction mechanisms 20 are used for sucking the wafer 200 by suction.

In the embodiment of the present application, the robot body 10 includes a fixing member 11, a plurality of gripping arms 12, and a stopper 13. The plurality of clamping arms 12 and the limiting members 13 are installed and fixed on the same side of the fixing member 11, the clamping arms 12 and the limiting members 13 are arranged oppositely and keep a distance, specifically, the clamping arms 12 and the limiting members 13 are arranged in parallel and at intervals. The surfaces of the clamping arms 12 facing the stoppers 13 are used for placing the wafer 200 and fixing the wafer adsorption mechanism 20. The position limiting element 13 is configured to limit the position of the wafer 200 on the clamping arm 12, that is, the position limiting element 13 is configured to position the position of the wafer 200 on the clamping arm 12, so as to avoid the edge of the wafer from touching the fixing element 11, thereby damaging the wafer. The length of the stopper 13 (arrow 001 direction in fig. 2) is smaller than the length of the clamp arm 12, so that the wafer 200 can be placed on the clamp arm 12 and the stopper 13 is exposed, and the wafer can be conveniently taken from the clamp arm 12.

In the embodiment of the present application, the wafer suction robot 100 does not additionally increase the size of the robot body, and the structural rigidity of the robot body is not changed, so that the transfer accuracy is not affected.

In an exemplary embodiment, the number of gripping arms 12 is between 2 and 10, for example, 2, 5, 7, 10, or other numbers. In the present embodiment, the example that the robot body 10 includes two clamping arms 12 is specifically described, and the present application is not limited to this.

Referring to fig. 3, fig. 3 is a schematic cross-sectional view of the wafer adsorption robot shown in fig. 1 along the direction I-I. In the embodiment of the present application, each of the clamping arms 12 has at least one mounting groove 14 formed on a surface facing the limiting member 13, and the wafer adsorbing mechanism 20 is detachably mounted and fixed in the mounting groove 14.

In an exemplary embodiment, the number of mounting slots 14 is between 1 and 10, for example, 1, 3, 5, 7, 10, or other number. In this embodiment, it is specifically described that each of the clamping arms 12 has one mounting groove 14 formed on a surface facing the limiting member 13, the opening direction of the mounting groove 14 faces the limiting member 13, and the wafer adsorbing mechanism 20 is detachably mounted and fixed in the corresponding mounting groove 14, which is not limited in this application.

Referring to fig. 4, fig. 4 is an enlarged schematic view of the structure IV of the wafer chuck robot shown in fig. 3. In the present embodiment, each of the wafer suction mechanisms 20 includes a suction pipe 21, an elastic member 22, a suction member 23, and a sealing cover 24. The suction pipe 21 is fixedly installed at the bottom of the installation groove 14 for providing suction force. Elastic component 22 encloses the week side of locating suction tube 21, just the one end of elastic component 22 with the bottom of mounting groove 14 is connected, elastic component 22 back to the other end of mounting groove 14 bottom with adsorb 23 and be connected, promptly elastic component 22 elasticity centre gripping in the bottom of mounting groove 14 with adsorb between the piece 23. The absorption piece 23 and the suction pipe 21 have a predetermined gap therebetween, so that when the warped wafer is pressed on the absorption piece 23, the absorption piece 23 can realize micro motion, and the warped wafer is tightly attached to the absorption piece 23. The suction member 23 is communicated with the suction pipe 21, and the suction force provided by the suction pipe 21 makes a vacuum formed in the suction member 23, so that the suction member 23 can suck the wafer 200 conveniently. The sealing cover 24 covers the mounting groove 14, a limiting hole 32 is formed in the sealing cover 24, and the sealing cover 24 is used for limiting the adsorbing member 23 in the mounting groove 14 and exposing one end of the adsorbing member 23 opposite to the suction tube 21 on one side of the clamping arm 12 facing the limiting member 13, so that the adsorbing member 23 adsorbs a wafer. The sealing cover 24 is also detachably mounted and connected with the clamping arm 12, and the sealing cover 24 is used for limiting the adsorption piece 23 in the mounting groove 14. The absorption member 23 passes through the limiting hole 32 under the elastic force of the elastic member 22 and exposes out of the sealing cover 24 to absorb the wafer 200.

In summary, the wafer suction mechanism 20 provided by the present application includes a suction pipe 21, an elastic member 22, a suction member 23, and a sealing cover 24. The elastic part 22 is clamped between the bottom of the mounting groove 14 and the adsorption part 23, a preset gap is formed between the adsorption part 23 and the suction pipe 21, so that when a warped wafer is pressed on the adsorption part 23, the adsorption part 23 can realize micro-adjustment and is tightly attached to the warped wafer, the wafer adsorption mechanism 20 can adsorb the wafer with the horizontal surface and the warped wafer, and the application range and the application scene of the wafer adsorption mechanism 20 are enlarged. In addition, the suction pipe 21, the elastic member 22, the suction member 23, and the sealing cap 24 of the wafer suction mechanism 20 may be formed by separate processes, and when a component of the wafer suction mechanism 20 is damaged, only the damaged component needs to be replaced, and the entire wafer suction robot 100 does not need to be replaced, thereby reducing the maintenance cost.

As shown in fig. 4, in the present embodiment, the suction pipe 21 may be a hollow pipe including an inner wall 21a, a suction surface 21b intersecting the inner wall 21a, and an outer wall 21 c. The suction surface 21b is located at an end of the suction pipe 21 opposite to the bottom of the mounting groove 14, and specifically, the suction surface 21b is a curved surface, and may be a spherical surface, so that the suction member 23 can keep good contact with the suction surface 21b and can rotate relative to the suction surface 21 b. The outer wall 21c may intersect the suction surface 21b, and the outer wall 21c may be disposed opposite and parallel to the inner wall 21 a.

In an exemplary embodiment, the elastic member 22 may be a coil spring, which is located on the peripheral side of the outer wall 21c and is clamped between the bottom of the mounting groove 14 and the suction member 23. In other embodiments, the elastic member 22 may include any elastic element having an elastic function, such as a leaf spring, a pressure spring tube, a bellows, and an elastic pad.

Referring to fig. 3 and 4, in the embodiment of the present application, the shape of the suction member 23 may be a sphere, that is, the suction member 23 may be a spherical suction nozzle. Specifically, if the spherical radius of the suction member 23 is the same as the spherical radius of the suction surface 21b at the nozzle of the suction pipe 21, the suction member 23 can rotate relative to the suction surface 21b while maintaining good contact with the suction surface 21 b.

In the embodiment of the present application, the absorption member 23 is provided with an absorption hole 31 penetrating through the absorption member 23, and the absorption hole 31 is located inside the outer wall 21 c. The suction holes 31 are communicated with the suction pipes 21, and the suction force provided by the suction pipes 21 enables the suction holes 31 to form vacuum, so that the suction pieces 23 can suck the wafer 200 conveniently. The adsorbing member 23 includes an outer surface 23a and an adsorbing end surface 23b intersecting with the outer surface 23a, the adsorbing hole 31 includes a hole inner wall 31a, the outer surface 23a may be a spherical surface as a whole, and the adsorbing end surface 23b may intersect with the hole inner wall 31a perpendicularly. The hole inner wall 31a is an inner surface of the suction member 23, which is located inside the outer wall 21 c. The adsorption surface 21b and the outer surface 23a have a predetermined gap, so that when the warped wafer 200 is pressed on the adsorption end surface 23b of the adsorption piece 23, the adsorption piece 23 can adaptively realize fine motion and adjust an adsorption angle according to the warping degree of the wafer 200, and further, the wafer is tightly attached to the warped wafer. The outer surface 23a is fixedly connected to an end of the elastic member 22 opposite to the bottom of the mounting groove 14, that is, the elastic member 22 is sandwiched between the bottom of the mounting groove 14 and the outer surface 23a of the absorbing member 23.

In this application embodiment, the radian of adsorption plane 21b with the radian of surface 23a is unanimous, works as adsorption plane 21b with surface 23a when laminating together, can realize adsorption plane 21b with the sealed of surface 23a laminating department, and then guarantee to be in realize the vacuum in the adsorption hole 31.

In an exemplary embodiment, the bore inner wall 31a may be coplanar with the inner wall 21 a.

In the embodiment of the present application, the sealing cover 24 may be a plate shape as a whole, and is installed on a side of the clamping arm 12 facing the limiting member 13. The sealing cover 24 is provided with the limiting hole 32, and the sealing cover 24 is used for limiting the adsorbing member 23 in the mounting groove 14 and exposing one end of the adsorbing member 23, which is opposite to the suction pipe 21, out of the sealing cover 24, so that the adsorbing member 23 can adsorb the wafer. The diameter of the limiting hole 32 is smaller than that of the suction member 23 and larger than that of the suction hole 31, so that part of the suction member 23 can be located in the mounting groove 14, and one end of the suction member 23, which is opposite to the suction pipe 21, can be exposed on one side of the clamping arm 12, which faces the limiting member 13, so that the suction member 23 is not separated from the mounting groove 14.

In the embodiment of the present application, the sealing cover 24 includes a curved limiting surface 24a and an upper surface 24b intersecting the curved limiting surface 24a, where the curved limiting surface 24a is located at one end of the sealing cover 24 facing the adsorbing member 23, that is, the curved limiting surface 24a is an end surface of the sealing cover 24 contacting the outer surface 23a of the adsorbing member 23. The radian of the limit curved surface 24a is consistent with that of the outer surface 23a, so that the limit curved surface 24a can be better attached to the outer surface 23a, and meanwhile, the sealing cover 24 and the attaching part of the adsorption piece 23 are prevented from being collided to cause damage to the sealing cover 24 or/and the adsorption piece 23.

In the embodiment of the present application, the upper surface 24b is flush with the surface of the clamping arm 12 facing the limiting member 13, and the surface of the clamping arm 12 facing the limiting member 13 may be parallel to the suction end surface 23 b.

In an exemplary embodiment, the sealing cover 24 may be fixedly connected to the clamping arm 12 by a fixing member (not shown), which may be a bolt, and maintain the surface of the sealing cover 24 and the clamping arm 12 facing the limiting member 13 horizontal. The sealing cover 24 may also be fixedly connected to the holding arm 12 by means of a snap connection, welding, bonding, rivets, etc., and maintain the surfaces of the sealing cover 24 and the holding arm 12 facing the limiting member 13 horizontal. In the embodiment of the present application, the sealing cover 24 can be fastened by a countersunk bolt or other means without adding an additional surface protrusion to install the ball-shaped suction nozzle in the installation groove 14.

As shown in fig. 4, the wafer adsorbing mechanism 20 further includes a sealing member 25, wherein the sealing member 25 is disposed between the clamping arm 12 and the sealing cover 24 and surrounds the periphery of the mounting groove 14, and is used for sealing a gap between the clamping arm 12 and the sealing cover 24 to prevent impurities such as moisture and dust from entering the mounting groove 14.

In an exemplary embodiment, the seal 25 may be a gasket. In other embodiments, the sealing member 25 may comprise any sealing element or material having a resilient function, such as a gasket or sealant.

Referring to fig. 5 to 7, fig. 5 is a schematic top view illustrating a wafer adsorption robot and a wafer according to an embodiment of the present disclosure, fig. 6 is a schematic cross-sectional view of the wafer adsorption robot and the wafer shown in fig. 5 along a direction II-II, and fig. 7 is an enlarged schematic view illustrating a structure VII in the wafer adsorption robot and the wafer shown in fig. 6. In the embodiment of the present application, the wafer 200 is placed on the clamping arm 12, and the wafer 200 is kept at a certain distance from the stopper 13. Due to the influence of the production process stress, the wafer 200 is a warped wafer 200.

Referring to fig. 1 to 7, the wafer chucking robot 100 of the present application is used for holding the wafer 200 and transferring the wafer 200 to a designated processing position. Specifically, the wafer 200 is pressed against the suction end face 23b of the suction member 23, and the elastic member 22 is compressed by the gravity of the wafer. Since the predetermined gap is formed between the suction pipe 21 and the suction member 23, the suction member 23 is moved slightly and the suction end surface 23b of the suction member 23 is attached to the wafer 200, and the predetermined gap between the suction surface 21b of the suction pipe 21 and the outer surface 23a of the suction member 23 is gradually reduced until the suction surface 21b and the outer surface 23a are closely attached to each other. A gap is formed between the limit curved surface 24a of the sealing cover 24 and the outer surface 23a of the suction member 23 and gradually increases until the suction curved surface 21b is attached to the outer surface 23 a. The suction pipe 21 provides a suction force to make the inside of the suction hole 31 in a vacuum state, and under the action of the suction force, the suction end surface 23b of the suction member 23 is closely attached to the wafer 200, so that the suction member 23 sucks the wafer 200. When the wafer 200 needs to be taken from the suction member 23, the suction pipe 21 no longer provides suction force, and the wafer 200 can be easily taken from the suction member 23, so that the wafer 200 is completely clamped and the wafer 200 is transferred to a designated processing position by the wafer suction robot 100. When the wafer 200 is taken away, the elastic member 22 rebounds, and the absorption member 23 is also moved toward the bottom direction away from the mounting groove 14 by the driving of the elastic member 22. A gap is gradually formed between the suction surface 21b of the suction pipe 21 and the outer surface 23a of the suction member 23 until the gap is increased to the predetermined gap, the limit curved surface 24a of the sealing cover 24 is again attached to the outer surface 23a of the suction member 23, and the limit member 23 is limited in the mounting groove 14.

In summary, the wafer suction mechanism 20 provided by the present application includes a suction pipe 21, an elastic member 22, a suction member 23, a sealing cover 24, and a sealing member 25. The elastic member 22 is fixedly connected with the outer surface 23a of the adsorption member 23, a predetermined gap is formed between the outer surface 23a of the adsorption member 23 and the adsorption surface 21b of the suction tube 21, so that when the warped wafer 200 is pressed on the adsorption end surface 23b of the adsorption member 23, the adsorption member 23 can adaptively realize micro motion and adjust an adsorption angle according to the warping degree of the wafer 200, and further is tightly attached to the warped wafer, so that the wafer adsorption mechanism 20 can adsorb not only horizontal wafers but also warped wafers, and the application range and use scene of the wafer adsorption mechanism 20 are enlarged. In addition, the suction pipe 21, the elastic member 22, the suction member 23, the sealing cover 24 and the sealing member 25 of the wafer suction mechanism 20 can be formed by processing separately, and when a certain element of the wafer suction mechanism 20 is damaged, only the damaged element needs to be replaced, and the whole wafer suction robot 100 does not need to be replaced, so that the maintenance cost and the production cost are reduced.

Referring to fig. 8, fig. 8 is a schematic structural diagram of a wafer adsorbing device according to an embodiment of the disclosure. The embodiment of the present application further provides a wafer adsorbing device 1000, wherein the wafer adsorbing device 1000 includes a wafer transmission device 150, a box 300, a base 400 and the wafer adsorbing robot 100 in the above embodiments. The box 300 is fixedly mounted on the base 400, the wafer transmission device 150 is located on the peripheral side of the box 300 and is slidably connected to the box 300, the wafer transmission device 150 is fixedly connected to the wafer adsorption robot 100, and the wafer transmission device 150 is used for transmitting the wafer 200 adsorbed on the wafer adsorption robot 100 to a designated processing position.

In the embodiment of the present invention, a driving motor (not shown) and a suction motor (not shown) are installed and fixed in the box 300, the driving motor is connected to the wafer transfer device 150 through a transmission mechanism, and the driving motor is used for providing power and driving the wafer transfer device 150 to move or rotate, so as to transfer the wafer 200 clamped on the wafer adsorption robot 100. The suction motor is communicated with a suction pipe 21 in the wafer suction manipulator 100, and the suction motor is used for providing suction force to enable vacuum to be formed in the suction piece 23, so that the suction piece 23 can conveniently suck the wafer 200.

It should be understood that the application of the present application is not limited to the above examples, and that modifications or changes may be made by those skilled in the art based on the above description, and all such modifications and changes are intended to fall within the scope of the appended claims.

Claims

1. A wafer adsorption manipulator comprises a fixing part, a plurality of clamping arms and a limiting part, wherein the clamping arms and the limiting part are arranged at intervals and are installed on one side of the fixing part, each clamping arm is provided with at least one installation groove, the wafer adsorption manipulator is characterized by further comprising a plurality of wafer adsorption mechanisms installed in the installation grooves, each wafer adsorption mechanism comprises a suction pipe, an elastic part, an adsorption part and a sealing cover, the suction pipe is installed at the bottom of the installation groove and used for providing suction, the elastic part is arranged around the periphery of the suction pipe and clamped between the bottom of the installation groove and the adsorption part, a preset gap is formed between the adsorption part and the suction pipe and communicated with the suction pipe, and the adsorption part is used for adsorbing wafers, the sealing cover is covered on the mounting groove so as to limit the adsorption piece in the mounting groove, a limiting hole is formed in the sealing cover, and the adsorption piece penetrates through the limiting hole under the elastic action of the elastic piece and is exposed out of the sealing cover so as to adsorb the wafer.

2. The wafer suction robot of claim 1, wherein the suction tube includes a suction surface and an outer wall intersecting the suction surface, the suction surface being located at an end of the suction tube facing the suction member.

3. The wafer suction robot as claimed in claim 2, wherein the suction member has a suction hole formed therethrough, the suction hole is located inside the outer wall, the suction hole is communicated with the suction tube, and the suction force provided by the suction tube causes the suction hole to form a vacuum therein so that the suction member sucks the wafer.

4. The wafer suction robot as claimed in claim 3, wherein the size of the stopper hole is smaller than the size of the suction member, and the size of the stopper hole is larger than the size of the suction hole.

5. The wafer suction robot as claimed in claim 3, wherein the suction member includes an outer surface and a suction end surface intersecting the outer surface, the suction surface maintains the predetermined gap with the outer surface, a curvature of the suction surface coincides with a curvature of the outer surface, and the elastic member is clamped between a bottom of the mounting groove and the outer surface of the suction member.

6. The wafer suction robot as claimed in claim 5, wherein the sealing cover includes a limiting curved surface and an upper surface, the upper surface intersects the limiting curved surface, the limiting curved surface is located at an end of the sealing cover facing the suction member, and an arc of the limiting curved surface is identical to an arc of the outer surface.

7. The wafer suction robot as recited in any one of claims 1 to 6, wherein the wafer suction mechanism further comprises a sealing member disposed between the clamp arm and the sealing cover and surrounding the mounting groove, the sealing member sealing a gap between the clamp arm and the sealing cover.

8. The wafer suction robot as claimed in any one of claims 2 to 6, wherein the suction member is a spherical suction nozzle, the suction surface is a spherical surface, and a radius of the suction member is the same as a radius of the spherical surface of the suction pipe.

9. A wafer adsorption device, characterized in that, the wafer adsorption device comprises a wafer transmission device, a box body and a wafer adsorption mechanical arm according to any one of claims 1-8, the wafer transmission device is connected with the box body in a sliding mode, the wafer transmission device is fixedly connected with the wafer adsorption mechanical arm, and the wafer transmission device transmits the wafer adsorbed on the wafer adsorption mechanical arm to a designated processing position.

10. The wafer adsorption device of claim 9, wherein a driving motor and a suction motor are fixedly installed in the box body, the driving motor is connected with the wafer transmission device through a transmission mechanism, the driving motor drives the wafer transmission device to move or rotate, the suction motor is communicated with a suction pipe in the wafer adsorption manipulator, and the suction motor provides suction force to enable vacuum to be formed in the adsorption piece.