CN216983970U - Rescue bag for field survival - Google Patents
Rescue bag for field survival Download PDFInfo
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- CN216983970U CN216983970U CN202122543781.7U CN202122543781U CN216983970U CN 216983970 U CN216983970 U CN 216983970U CN 202122543781 U CN202122543781 U CN 202122543781U CN 216983970 U CN216983970 U CN 216983970U
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Abstract
The utility model provides a field survival rescue bag which comprises a bag body, a light-induced power supply part and a semiconductor temperature difference part, wherein at least one inner cavity is arranged in the bag body, part or all of the inner cavities are heat preservation cavities, the light-induced power supply part is arranged on the bag body, and the light-induced power supply part is directly or indirectly connected to the semiconductor temperature difference part to supply power to the semiconductor temperature difference part; the light-induced power supply part and the semiconductor temperature difference part are both arranged on the bag body; the first side of semiconductor difference in temperature portion can with the heat preservation chamber takes place the heat exchange, the second side of semiconductor difference in temperature portion can directly or indirectly take place the heat exchange with the exterior space, semiconductor difference in temperature portion can also form the temperature difference between its first side and second side when receiving the power supply.
Description
Technical Field
The utility model relates to the field of emergency rescue, in particular to a field survival rescue bag.
Background
The field survival rescue bag can provide daily needed articles for a user and also can provide medicines or tools to help the user get rid of difficulties in emergency.
The traditional box sealing mode is generally adopted in the field survival rescue bag in the prior art, the field environment is severe, the normal state is achieved when the temperature is too high or too low, and the change of the external temperature in the inner cavity of the traditional field survival rescue bag cannot be changed, so that the deterioration of articles in the bag, such as medicines and foods, is caused; the number of the inner cavities of the traditional field survival rescue package is small, and the provided functions are relatively single.
SUMMERY OF THE UTILITY MODEL
The utility model provides a field survival rescue bag, which aims to solve the problems that the materials in the bag are easy to deteriorate and the functions are relatively single.
The utility model provides a field survival rescue bag which comprises a bag body, a light-induced power supply part and a semiconductor temperature difference part, wherein at least one inner cavity is arranged in the bag body, part or all of the inner cavities are heat preservation cavities, the light-induced power supply part is arranged on the bag body, and the light-induced power supply part is directly or indirectly connected to the semiconductor temperature difference part to supply power to the semiconductor temperature difference part; the light-induced power supply part and the semiconductor temperature difference part are both arranged on the bag body; the first side of semiconductor difference in temperature portion can with the heat preservation chamber takes place the heat exchange, the second side of semiconductor difference in temperature portion can directly or indirectly take place the heat exchange with the exterior space, semiconductor difference in temperature portion can also form the temperature difference between its first side and second side when receiving the power supply.
Optionally, the temperature sensor further comprises a power supply control circuit, the light-sensing power supply part is connected to the semiconductor temperature difference part through the power supply control circuit, and the power supply control circuit comprises a switching part;
when the switching part is in a first state, the light-sensing power supply part supplies power to the semiconductor temperature difference part, and the temperature of the first side of the semiconductor temperature difference part is lower than that of the second side of the semiconductor temperature difference part;
when the switching part is in a second state, the light-induced power supply part supplies power to the semiconductor temperature difference part, and the temperature of the first side of the semiconductor temperature difference part is higher than that of the second side of the semiconductor temperature difference part;
when the switching part is in a third state, the light-sensing power supply part stops supplying power to the semiconductor temperature difference part.
Optionally, the power supply control circuit includes at least one of:
a first manipulation part for determining whether to implement the power supply;
a second manipulation part for determining whether the temperature of the first side is higher than the temperature of the second side;
a second manipulation part for determining whether the temperature of the first side is lower than the temperature of the second side; the first manipulation part and the second manipulation part are electrically connected to the semiconductor device.
Optionally, the power supply control circuit further includes a control unit configured to control a state of the switching unit.
Optionally, the power supply control circuit includes at least one control part, and the at least one control part includes at least one of:
a first manipulation part for instructing whether the switching part implements the power supply;
a second manipulation part for indicating whether the temperature of the first side of the switching part is higher than the temperature of the second side.
Optionally, the first manipulation part includes at least one button, and the second manipulation part includes at least one button.
Optionally, the light-sensing power supply portion includes a sensing sub-portion and a power storage sub-portion, the sensing sub-portion is connected to the power storage sub-portion, the sensing sub-portion can sense light to generate electric energy and store the electric energy in the power storage sub-portion, and the power storage sub-portion is connected to the semiconductor temperature difference portion through the power supply control circuit.
Optionally, the sensing sub-portion comprises at least one solar panel, and the energy storage sub-portion comprises a capacitor or a rechargeable battery;
if the number of the solar panels is at least two, the at least two solar panels are connected in series.
Optionally, the heat dissipation portion includes a heat dissipation fan, a heat dissipation fin and a temperature equalization plate, the heat dissipation fin is disposed on the second side of the semiconductor temperature difference portion, the heat dissipation fan is disposed on one side of the heat dissipation fin far away from the semiconductor temperature difference portion, and the temperature equalization plate is connected with the heat dissipation fin.
Optionally, the field survival rescue package comprises at least one inner cavity including at least one of:
a survival escape cavity for accommodating a weapon;
a wound emergency cavity for containing emergency medicine;
an energy charging cavity for receiving food;
the survival escaping cavity, the wound emergency cavity and the energy supplementing cavity independently exist in the bag body.
The first-aid kit for field survival provided by the utility model has the advantages that the temperature of the heat-insulating cavity in the kit body can be controlled due to the semiconductor temperature difference part, and the effect of preventing the deterioration of articles in the kit, such as medicines and food, is achieved.
In the alternative scheme of the utility model, as the survival escape cavity, the wound emergency cavity and the energy supplement cavity are arranged, the functions of the rescue package are enriched.
Drawings
In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings used in the description of the embodiments or the prior art will be briefly described below, and it is obvious that the drawings in the following description are only some embodiments of the present invention, and for those skilled in the art, other drawings can be obtained according to these drawings without creative efforts.
FIG. 1 is a first schematic diagram of an internal module of a rescue package for field survival according to an embodiment of the present invention;
FIG. 2 is a schematic diagram of an internal module of a rescue package for field survival according to an embodiment of the present invention;
FIG. 3 is a third schematic diagram of an internal module of a rescue package for field survival according to an embodiment of the present invention;
FIG. 4 is a fourth schematic diagram illustrating an internal module of a rescue package for field survival according to an embodiment of the present invention;
FIG. 5 is a schematic diagram of the semiconductor thermoelectric unit of the rescue pack for field survival according to an embodiment of the present invention;
FIG. 6 is a schematic structural diagram of a rescue package for field survival according to an embodiment of the present invention;
description of the reference numerals:
1-a bag body;
2-semiconductor temperature difference part;
3-a power supply control circuit;
4-a light-induced power supply portion;
101-heat preservation cavity;
102-a temperature-uniforming plate;
103-a heat sink;
104 a heat radiation fan;
201-a semiconductor material;
202-insulating ceramic sheet;
203-a metal conductor;
301-control buttons;
302-temperature control plate;
303-a switching section;
401-a sensing portion;
402-an energy storage portion;
403-direct current power supply.
Detailed Description
The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
In the description of the present invention, it is to be understood that the terms "upper", "lower", "upper surface", and the like indicate orientations or positional relationships based on those shown in the drawings, and are only for convenience of description and simplicity of description, and do not indicate or imply that the device or element referred to must have a particular orientation, be constructed in a particular orientation, and be operated, and thus, are not to be construed as limiting the present invention.
In the description of the present invention, the terms "first" and "second" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance or implying any number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of that feature.
In the description of the present invention, "plurality" means a plurality, e.g., two, three, four, etc., unless explicitly specified otherwise.
In the description of the present invention, unless otherwise explicitly specified or limited, the terms "connected" and the like are to be construed broadly, e.g., as meaning fixedly attached, detachably attached, or integrally formed; can be mechanically connected, electrically connected or can communicate with each other; they may be directly connected or indirectly connected through intervening media, or may be connected through the use of two elements or the interaction of two elements. The specific meanings of the above terms in the present invention can be understood by those skilled in the art according to specific situations.
The technical solution of the present invention will be described in detail below with specific examples. The following several specific embodiments may be combined with each other, and details of the same or similar concepts or processes may not be repeated in some embodiments.
Referring to fig. 1, an embodiment of the present invention provides a rescue bag for field survival, including a bag body, a light-induced power supply portion and a semiconductor temperature difference portion, where at least one inner cavity is disposed in the bag body, a part or all of the inner cavities are heat preservation cavities, the light-induced power supply portion is disposed in the bag body, and the light-induced power supply portion is directly or indirectly connected to the semiconductor temperature difference portion to supply power to the semiconductor temperature difference portion; the light-induced power supply part and the semiconductor temperature difference part are both arranged on the bag body; the first side of semiconductor difference in temperature portion can with the heat preservation chamber takes place the heat exchange, the second side of semiconductor difference in temperature portion can directly or indirectly take place the heat exchange with exterior space, semiconductor difference in temperature portion can also form the temperature difference between its first side and second side when receiving the power supply.
Referring to fig. 6, a first side of the semiconductor thermoelectric portion 2 can exchange heat with the space inside the heat-preserving chamber 101, a second side of the semiconductor thermoelectric portion 2 can directly or indirectly exchange heat with the external space, and the semiconductor thermoelectric portion 2 can form a temperature difference between the first side and the second side when receiving power supply;
the semiconductor temperature difference part 2 is a semiconductor temperature difference part 2 which can enable temperature differences to be formed on two sides of the semiconductor temperature difference part 2, a first side of the semiconductor temperature difference part 2 is a side close to the heat preservation cavity 101, and a second side of the semiconductor temperature difference part 2 is a side far away from the heat preservation cavity 101;
in a specific example, referring to fig. 5, the semiconductor thermoelectric portion 2 includes a semiconductor material 201, such as an N-type semiconductor material and a P-type semiconductor material, and may further include a metal conductor 203 and an insulating ceramic sheet 202; when the dc power supply 403 passes through the thermocouple formed by connecting two different semiconductor materials (N-type semiconductor and P-type semiconductor) in series, heat transfer occurs between the two ends, and the two ends of the thermocouple absorb heat and emit heat respectively, thereby generating temperature difference, forming a cold end and a hot end, and realizing refrigeration and heating. The dc power supply 403 may be implemented based on the photo-sensing power supply 4;
the semiconductor material 201 may also be understood as a semiconductor cooling plate (or a semiconductor heating plate), and the key core technology of the semiconductor cooling plate (or the semiconductor heating plate) is to utilize the semiconductor 'peltier' effect, and the applications of the semiconductor cooling plate and the semiconductor heating plate in the embodiment of the present invention may be, for example: under low temperature environment, can heat and unfreeze the medicine that receives to freeze, can realize the refrigeration function at high temperature environment, refrigerate the storage to the medicine.
Referring to fig. 3 and 4, the power supply control circuit includes at least one control unit 301 and a switching unit 303, where the at least one control unit 301 includes at least one of:
a first manipulation unit for instructing the switching unit 303 whether or not to perform the power supply;
a second manipulation unit for indicating whether the temperature of the first side of the switching unit 303 is higher than the temperature of the second side (which can also be understood as indicating whether the temperature of the second side of the switching unit 303 is higher than the temperature of the first side).
In a specific example, the first control part includes at least one button, and the second control part may include at least one control button, and may also include a state switch (e.g., a knob switch or a dial switch);
in a specific example, the function of the button of the first control unit may be, for example, on/off control of a power supply (i.e., control of whether power supply occurs between the light-induced power supply unit 4 and the semiconductor temperature difference unit 2), and the second control unit may realize control of cooling and heating.
During refrigeration, when the switching part 303 is in one state under the control of the second control part, current flows from the first end to the second end of the semiconductor temperature difference part 2, and the first side of the semiconductor temperature difference part 2 starts to refrigerate; when the switching unit 303 is in another state (i.e., the second state) under the control of the second control unit, the current flows from the second end to the first end, and the first side of the semiconductor thermoelectric unit 2 starts heating; when the switching part 303 is not supplying power to the semiconductor thermoelectric part 2 due to the control of the first manipulation part (i.e., a third state mentioned later), the semiconductor thermoelectric part 2 is not operated (i.e., a temperature difference is not formed between both sides thereof);
it can be seen that: when the switching part 303 is in the first state, the light-sensing power supply part 4 supplies power to the semiconductor thermoelectric part, and the temperature of the first side of the semiconductor thermoelectric part 2 is lower than that of the second side of the semiconductor thermoelectric part 2;
when the switching part 303 is in the second state, the light-sensing power supply part 4 supplies power to the semiconductor temperature difference part, and the temperature of the first side of the semiconductor temperature difference part 2 is higher than that of the second side of the semiconductor temperature difference part 2;
when the switching unit 303 is in the third state, the light-sensing power supply unit stops supplying power to the semiconductor temperature difference unit, so that a temperature difference is not formed.
In a further example, the power supply control circuit 3 further includes a control portion, which is configured to control a state of the switching portion. The control unit can be controlled in response to the operation of the operation unit, and can also be controlled by receiving a wired or wireless control signal. For example, it may be a bluetooth control unit, and further, the terminal (e.g., a mobile phone) may transmit a control signal to the bluetooth control unit, and the bluetooth control unit may control the state of the switching unit based on the control signal.
In a specific example, the switching unit 303 may have four terminals, which are a first terminal, a second terminal, a third terminal, and a fourth terminal; a first end of the switching part 303 may be connected to a positive electrode of the light-sensing power supply part 4 (for example, connected to a positive electrode of the energy storage sub-part 402 therein), a second end of the switching part 303 may be connected to a negative electrode of the light-sensing power supply part 4 (for example, connected to a negative electrode of the energy storage sub-part 402 therein), a third end of the switching part 303 may be connected to a first end of the temperature difference semiconductor part 2, and a fourth end of the switching part 303 may be connected to a second end of the temperature difference semiconductor part 2.
In one example, in the first state, the first end of the switching part 303 is connected to the third end of the switching part 303, and the second end of the switching part 303 is connected to the fourth end of the switching part 303, at this time, the first end of the semiconductor temperature difference part 2 is used as a positive electrode to receive current, the second end of the semiconductor temperature difference part 2 is used as a negative electrode to receive current, and the current flows from the first end to the second end of the semiconductor temperature difference part 2, so that the temperature of the first side of the semiconductor temperature difference part 2 is lower than that of the second side of the thermal insulation cavity;
in a second state, the first end of the switching part 303 is connected with the fourth end of the switching part 303, the second end of the switching part 303 is connected with the third end of the switching part 303, at this time, the second end of the semiconductor temperature difference part 2 is used as a positive electrode to connect in current, the first end of the semiconductor temperature difference part 2 is used as a negative electrode to connect out current, the current flows from the second end to the first end of the semiconductor temperature difference part 2, and the temperature of the first side of the semiconductor temperature difference part 2 is higher than that of the second side of the heat preservation cavity;
in another example, in the first state, the first terminal of the switching unit 303 and the fourth terminal of the switching unit 303 are connected, and the second terminal of the switching unit 303 and the third terminal of the switching unit 303 are connected, and in the second state, the first terminal of the switching unit 303 and the third terminal of the switching unit 303 are connected, and the second terminal of the switching unit 303 and the fourth terminal of the switching unit 303 are connected. In one example, the switching unit 303 may include four switching devices, a first switching device is connected between the first terminal and the third terminal of the switching unit 303, a second switching device is connected between the first terminal and the fourth terminal of the switching unit 303, a third switching device is connected between the second terminal and the third terminal of the switching unit 303, and a fourth switching device is connected between the second terminal and the fourth terminal of the switching unit 303; the required connection relation can be realized by controlling the on-off of the corresponding switch devices, the first state and the second state are achieved, and the power supply can be stopped by controlling the on-off of all the switch devices.
Referring to fig. 4, the photo-sensing power supply portion 4 includes a sensing sub-portion 401 and a storage sub-portion 402, wherein the sensing sub-portion 401 is connected to the storage sub-portion 402;
the sensing sub-section 401 can sense light to generate electric energy and store the electric energy in the energy storage sub-section 402, and the energy storage sub-section 402 is connected with the semiconductor temperature difference section through the power supply control circuit.
By way of further example, the sensing sub-section 401 may include at least one solar cell panel, and the energy storage sub-section may include a capacitor or a rechargeable battery, two ends of which may be understood as two ends of the light-sensing power supply section 4, which may be connected to the power supply control circuit (e.g., connected to the switching section thereof), and if the number of the solar cell panels is at least two, at least two solar cell panels are connected in series. In a specific example, the sensing part converts and stores the collected energy in a capacitor through a solar panel, thereby forming a direct current power supply.
However, since the semiconductor material 201 has resistance, heat is generated when current passes through the semiconductor material, so that heat transfer is affected, and heat between the insulating ceramic plates 202 at the two ends is reversely transferred through other media (air and the like) and the semiconductor, when the two heat transfer amounts are equal to each other and reach a balanced state, the two heat transfers are mutually offset, the temperature of the cold end and the hot end cannot be continuously changed, and in order to reach a lower temperature, the heat is usually realized by reducing the temperature of the hot end in a good heat dissipation manner, so that a heat dissipation part can be introduced in a specific scheme.
The heat dissipation part comprises a heat dissipation fan 104, a heat dissipation fin 103 and a temperature equalization plate 102, the heat dissipation fin is arranged on the second side of the semiconductor temperature difference part, the heat dissipation fan 104 is arranged on one side, away from the semiconductor temperature difference part, of the heat dissipation fin 103, and the temperature equalization plate 102 is connected with the heat dissipation fin 103, wherein the heat dissipation fin is made of a heat conductive material, such as aluminum.
This can be achieved, for example, by the following process:
the field survival rescue package adopts a semiconductor device for refrigeration/heating, and the power supply of the field survival rescue package is provided by a solar panel attached to the outer surface of the rescue package.
When the refrigeration mode is started, the cold end face of the semiconductor device refrigeration is attached to the heat insulation box, the hot end of the semiconductor device refrigeration is attached to the temperature equalizing plate 102, the temperature equalizing plate 102 is extremely good in heat conductivity, heat can be transferred out quickly, the radiating fins 103 and the temperature equalizing plate 102 are connected into a whole, the radiating area is further increased, and the radiating fan 104 blows air circulation to achieve a better radiating effect. When the heat dissipation efficiency of the hot end is good, the cooling effect of the cold end is better, the temperature control board 302 can accurately detect and display the temperature of the heat preservation cavity 101, and the temperature in the heat preservation cavity 101 can be accurately controlled;
when the heating mode is started, the power supply control circuit reversely connects the positive electrode and the negative electrode of the direct-current power supply 403, so that the surface, attached to one side of the heat insulation box 101, of the semiconductor device 2 is changed from the cold end to the hot end, and the surface, attached to the temperature equalizing plate 102, of the semiconductor device is changed from the hot end to the cold end, and the heating function is achieved.
In the description herein, reference to the terms "an implementation," "an embodiment," "a specific implementation," "an example" or the like means that a particular feature, structure, material, or characteristic described in connection with the embodiment or example is included in at least one embodiment or example of the utility model. In this specification, the schematic representations of the terms used above do not necessarily refer to the same embodiment or example. Furthermore, the particular features, structures, materials, or characteristics described may be combined in any suitable manner in any one or more embodiments or examples.
Finally, it should be noted that: the above embodiments are only used to illustrate the technical solution of the present invention, and not to limit the same; while the utility model has been described in detail and with reference to the foregoing embodiments, it will be understood by those skilled in the art that: the technical solutions described in the foregoing embodiments may still be modified, or some or all of the technical features may be equivalently replaced; and the modifications or the substitutions do not make the essence of the corresponding technical solutions depart from the scope of the technical solutions of the embodiments of the present invention.
Claims (10)
1. A field survival rescue bag is characterized by comprising a bag body, a light-induced power supply part and a semiconductor temperature difference part, wherein at least one inner cavity is arranged in the bag body, part or all of the inner cavities are heat preservation cavities, the light-induced power supply part is arranged on the bag body, and the light-induced power supply part is directly or indirectly connected to the semiconductor temperature difference part to supply power to the semiconductor temperature difference part; the light-induced power supply part and the semiconductor temperature difference part are both arranged on the bag body;
the first side of semiconductor difference in temperature portion can with the heat preservation chamber takes place the heat exchange, the second side of semiconductor difference in temperature portion can directly or indirectly take place the heat exchange with exterior space, semiconductor difference in temperature portion can also form the temperature difference between its first side and second side when receiving the power supply.
2. The field survival rescue package of claim 1, further comprising a power supply control circuit, wherein the light-induced power supply part is connected to the semiconductor temperature difference part through the power supply control circuit, and the power supply control circuit comprises a switching part;
when the switching part is in a first state, the light-sensing power supply part supplies power to the semiconductor temperature difference part, and the temperature of the first side of the semiconductor temperature difference part is lower than that of the second side of the semiconductor temperature difference part;
when the switching part is in a second state, the light sensing power supply part supplies power to the semiconductor temperature difference part, and the temperature of the first side of the semiconductor temperature difference part is higher than that of the second side of the semiconductor temperature difference part;
when the switching part is in a third state, the light-sensing power supply part stops supplying power to the semiconductor temperature difference part.
3. The field survival rescue package of claim 2, wherein the power supply control circuit further comprises a control part for controlling the state of the switching part.
4. The field survival rescue package of claim 2, wherein the power supply control circuit comprises at least one control, the at least one control comprising at least one of:
a first manipulation part for instructing whether the switching part implements the power supply;
a second manipulation part for indicating whether the temperature of the first side of the switching part is higher than the temperature of the second side.
5. The field survival rescue package of claim 4, wherein the first control comprises at least one button and the second control comprises at least one button.
6. The field survival and rescue package according to any one of claims 2 to 5, wherein the light-sensing power supply part comprises a sensing sub-part and a power storage sub-part, the sensing sub-part is connected to the power storage sub-part, the sensing sub-part can sense light to generate electric energy and store the electric energy in the power storage sub-part, and the power storage sub-part is connected to the semiconductor temperature difference part through the power supply control circuit.
7. The wilderness survival rescue package of claim 6, wherein the sensor subsection includes at least one solar panel and the energy storage subsection includes a capacitor or a rechargeable battery;
if the number of the solar panels is at least two, the at least two solar panels are connected in series.
8. The field survival rescue package of any one of claims 1 to 5, further comprising a heat dissipation portion disposed on the package body.
9. The field survival and rescue package of claim 8, wherein the heat dissipation portion comprises a heat dissipation fan, a heat dissipation fin and a temperature equalization plate, the heat dissipation fin is disposed on the second side of the semiconductor temperature difference portion, the heat dissipation fan is disposed on a side of the heat dissipation fin away from the semiconductor temperature difference portion, and the temperature equalization plate is connected to the heat dissipation fin.
10. A field survival rescue pack according to any one of claims 1 to 5, wherein the at least one interior chamber comprises at least one of:
a survival escape cavity for accommodating a weapon;
a wound emergency cavity for containing emergency medicine;
an energy charging cavity for receiving food;
the survival escaping cavity, the wound emergency cavity and the energy supplementing cavity independently exist in the bag body.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202122543781.7U CN216983970U (en) | 2021-10-21 | 2021-10-21 | Rescue bag for field survival |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202122543781.7U CN216983970U (en) | 2021-10-21 | 2021-10-21 | Rescue bag for field survival |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN216983970U true CN216983970U (en) | 2022-07-19 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202122543781.7U Active CN216983970U (en) | 2021-10-21 | 2021-10-21 | Rescue bag for field survival |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN216983970U (en) |
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2021
- 2021-10-21 CN CN202122543781.7U patent/CN216983970U/en active Active
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