CN216980592U - Calibration system of silicon wafer bearing device and solar cell production line - Google Patents

Abstract

The application provides a calibration system of silicon chip bearing device belongs to solar cell and makes technical field. The calibration system comprises a first supporting platform, a detection positioning unit and a calibration mechanism; the first supporting platform is provided with a first supporting surface for bearing the silicon wafer bearing device; the detection positioning unit is configured to be capable of detecting a slide glass groove in the silicon wafer bearing device and positioning the deformed slide glass groove; the calibration mechanism comprises a mounting base body, a calibration piece and a power piece; the power part is arranged on the mounting base body; the power part is connected with the calibration part in a transmission mode, so that the calibration part can do reciprocating motion between a first position and a second position, the first position is the position of the slide groove where the calibration part is in contact with and calibrates deformation, the second position is located on one side, far away from the slide groove, of the first position, the calibration system can solve the problems of silicon wafer deviation, around plating or wafer falling and the like in the production process of a production line, and the yield of the production line is guaranteed. In addition, this application still provides a solar cell production line.

Description

Calibration system of silicon wafer bearing device and solar cell production line

Technical Field

The application relates to the technical field of solar cell manufacturing, in particular to a calibration system of a silicon wafer bearing device and a solar cell production line.

Background

In the prior art, the silicon wafer bearing device is easy to have the problems of silicon wafer deviation, winding plating or wafer falling in the production process of a production line, so that the yield of the production line is reduced.

SUMMERY OF THE UTILITY MODEL

An object of this application is to provide a calibration system and solar cell production line that silicon chip bore device, can discover and repair the silicon chip and bore the interior slide glass groove that warp of device to improve silicon chip skew, around plating or fall the scheduling problem of piece appearing producing the line production process, and then guarantee to produce the line yield.

The embodiment of the application is realized as follows:

in a first aspect, an embodiment of the present application provides a calibration system for a silicon wafer carrying apparatus, including: the device comprises a first supporting platform, a detection positioning unit and a calibration mechanism.

The first supporting platform is provided with a first supporting surface for bearing the silicon wafer bearing device.

The detection positioning unit is configured to be capable of detecting slide grooves in the silicon wafer bearing device and positioning deformed slide grooves.

The calibration mechanism comprises a mounting base body, a calibration piece and a power piece; the power piece is arranged on the mounting base body; the power part is in transmission connection with the calibration part so that the calibration part can reciprocate between a first position and a second position, the first position is a position where the calibration part contacts and calibrates the deformed slide slot, and the second position is located on one side, far away from the slide slot, of the first position.

Among the above-mentioned technical scheme, first holding surface of first supporting platform is used for bearing the weight of the silicon chip and bears the weight of the device, it detects to detect the slide glass groove that the locating element was used for bearing the weight of the silicon chip on the first holding surface in the device, and discern and fix a position the slide glass groove that wherein takes place to warp, among the calibration mechanism power spare and calibration spare come to calibrate the slide glass groove of location through reciprocating motion between primary importance and second place, thereby improve the silicon chip skew that appears in producing the line production process, around plating or fall the piece scheduling problem, thereby guarantee to produce the line yield.

In some optional embodiments, the calibration system further comprises a second support platform having a second support surface for carrying the wafer carrier, and a transport mechanism for transporting the wafer carrier between the first support surface and the second support surface; the calibration piece is used for contacting and calibrating the deformed wafer carrying groove in the silicon wafer carrying device carried on the second supporting surface.

In the technical scheme, the second supporting platform and the transmission mechanism are additionally arranged, so that the detection positioning function and the calibration function can be realized at different positions respectively, the mutual influence of the two functions is avoided, and the operability of the calibration system is enhanced.

In some alternative embodiments, the alignment mechanism is located above the second support platform and the second position is located above the first position.

In the technical scheme, the calibration mechanism is arranged according to the form, so that the occupied area of a field can be saved; meanwhile, the calibration mechanism can directly lift to calibrate the slide glass groove, so that the calibration action is simple.

In some optional embodiments, the calibration mechanism further comprises a connecting member, the connecting member comprises a first connecting member and two second connecting members, the two second connecting members are oppositely distributed at intervals and are connected with the installation base body, the first connecting member is connected between the two second connecting members, and the power member is connected to the first connecting member.

In the technical scheme, the first connecting piece and the two second connecting pieces are installed in a similar I shape, and the installation form has the advantages of simplicity and convenience; in addition, the power part is connected to the first connecting part, so that the calibration part is convenient to correspond to the second supporting surface, and further the slide glass groove in the silicon wafer bearing device is convenient to calibrate.

In some alternative embodiments, the first link has a first rail, the first rail and the first link are slidably connected along a first direction, each of the second links has a second rail, the second rail and the second link are slidably connected along a second direction, and both ends of the first link are fixed to the two second rails; the first direction and the second direction are vertical and are parallel to the second supporting surface.

In the technical scheme, the first guide rail and the second guide rail are additionally arranged, and the first guide rail and the first connecting piece are connected in a sliding manner along the first direction, so that the power piece can do reciprocating motion in the first direction, and correspondingly, the calibration mechanism can perform position adjustment in the direction, and can be well aligned with a deformed slide groove in the direction to perform calibration; the second guide rails and the second connecting pieces are connected in a sliding mode along a second direction, two ends of the first connecting piece are fixed to the two second guide rails, so that the power piece can reciprocate in the second direction, and correspondingly, the calibrating mechanism can adjust the position in the direction, so that the calibrating mechanism can be well aligned with the deformed slide glass groove in the direction to calibrate; furthermore, the arrangement directions of the first guide rail and the second guide rail are perpendicular to each other, so that the calibration mechanism can be ensured to be adjusted in position in two corresponding directions at the same time, and can be well aligned with the deformed slide glass groove in the two corresponding directions for calibration.

In some alternative embodiments, the mounting base is provided in the form of a rectangular frame; and the mounting base body is arranged around the second supporting platform along the orthographic projection vertical to the second supporting surface.

In the technical scheme, in the embodiment, the mounting base body is arranged in a rectangular frame form, so that the mounting base body can be better matched with the appearance of the silicon wafer bearing device, and a calibration mechanism can be conveniently aligned to and calibrate deformed wafer carrying grooves at various positions; in addition, along the orthographic projection perpendicular to the second supporting surface, the mounting base body is arranged outside the second supporting platform in a surrounding mode, and the calibration mechanism can calibrate the slide glass groove located at the edge position of the silicon wafer bearing device conveniently.

In some optional embodiments, the first supporting surface is rectangular, an edge of the first supporting surface, which is used for corresponding to a short side of the silicon wafer carrying device, is a preset short side, and the first supporting platform and the second supporting platform are arranged side by side along an extending direction of the preset short side.

In the technical scheme, the first supporting surface is rectangular and can be matched with the appearance of the silicon wafer bearing device, so that the bearing function of the silicon wafer bearing device is conveniently exerted; furthermore, the first supporting platform and the second supporting platform are arranged side by side according to the form, and the distance between the first supporting platform and the second supporting platform is small, so that the occupied space of relevant equipment of the calibration system is reduced, and the time for conveying the silicon wafer bearing device can be saved, so that the calibration time is saved, and the calibration efficiency is improved.

In some optional embodiments, the detection positioning unit comprises a camera and a positioner, the camera is arranged above the first support platform and is used for detecting the slide groove and identifying the deformed slide groove; the positioner is arranged below the first supporting surface and inside the first supporting platform and used for positioning the deformed slide groove identified by the camera.

In the technical scheme, the camera is arranged above the first supporting platform, so that the slide glass groove can be conveniently detected and identified; the positioner is arranged below the first supporting surface and inside the first supporting platform, so that the recognized slide glass groove is positioned conveniently.

In some alternative embodiments, the first support platform is a glass support platform.

Among the above-mentioned technical scheme, the material of first supporting platform sets up to glass, because glass presents the transparent state, is favorable to the camera to shoot and detects, simultaneously, also makes things convenient for the locator to exert locate function.

In a second aspect, an embodiment of the present application provides a solar cell production line, which includes the calibration system and the silicon wafer carrying device provided in the first aspect.

Among the above-mentioned technical scheme, solar cell production line includes calibration system to can in time detect the slide glass groove that warp among the silicon chip carrier device, and calibrate the deformation slide glass groove that detects, thereby improve silicon chip skew, around plating or fall the scheduling problem of piece appearing producing the line production process, thereby guarantee to produce the line yield.

Drawings

To more clearly illustrate the technical solutions of the embodiments of the present application, the drawings needed in the embodiments will be briefly described below, it should be understood that the following drawings only illustrate some embodiments of the present application and therefore should not be considered as limiting the scope, and those skilled in the art can also obtain other related drawings based on the drawings without inventive efforts.

Fig. 1 is a first view of a calibration system of a silicon wafer carrier according to an embodiment of the present disclosure;

FIG. 2 is a second view of an alignment mechanism of an alignment system of a wafer carrier according to an embodiment of the present disclosure;

FIG. 3 is a first view of another calibration system for a silicon wafer carrier according to an embodiment of the present disclosure;

FIG. 4 is a third view of another calibration system for a silicon wafer carrier according to an embodiment of the present application;

fig. 5 is a partial view of another calibration system for a silicon wafer carrier according to an embodiment of the present application.

Icon: 10-calibrating the system; 100-a first support platform; 110-a first support surface; 111-Preset short sides; 200-detecting a positioning unit; 210-a camera; 220-a locator; 300-a calibration mechanism; 310-mounting a substrate; 320-a calibration piece; 330-a power element; 340-a connector; 3411-a first guide rail; 341-first connector; 3421-second guide rail; 342-a second connector; 400-a second support platform; 410-a second support surface; 500-a transport mechanism;

a-a first direction; b-a second direction.

Detailed Description

In order to make the objects, technical solutions and advantages of the embodiments of the present application clearer, the technical solutions in the embodiments of the present application will be clearly and completely described below with reference to the drawings in the embodiments of the present application, and it is obvious that the described embodiments are some embodiments of the present application, but not all embodiments. The components of the embodiments of the present application, generally described and illustrated in the figures herein, can be arranged and designed in a wide variety of different configurations.

Thus, the following detailed description of the embodiments of the present application, presented in the accompanying drawings, is not intended to limit the scope of the claimed application, but is merely representative of selected embodiments of the application. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present application.

It should be noted that: like reference numbers and letters refer to like items in the following figures, and thus, once an item is defined in one figure, it need not be further defined and explained in subsequent figures.

In the description of the present application, it is to be noted that the terms "upper", "lower", "vertical", "parallel", "inner", "outer", and the like refer to orientations or positional relationships based on orientations or positional relationships shown in the drawings or orientations or positional relationships conventionally found in use of products of the application, and are used for convenience in describing the present application and for simplicity in description, and do not indicate or imply that the referred devices or elements must have a specific orientation, be constructed and operated in a specific orientation, and thus, should not be construed as limiting the present application. Furthermore, the terms "first," "second," and the like are used merely to distinguish one description from another, and are not to be construed as indicating or implying relative importance.

Furthermore, the terms "parallel", "perpendicular", and the like do not imply that the components are required to be absolutely parallel or perpendicular, but rather may be slightly inclined. For example, "parallel" merely means that the directions are more parallel relative to "perpendicular," and does not mean that the structures are necessarily perfectly parallel, but may be slightly tilted.

In the description of the present application, it should also be noted that, unless expressly stated or limited otherwise, the terms "disposed," "mounted," "connected," and "connected" are to be construed broadly and can include, for example, fixed connections, detachable connections, or integral connections; they may be connected directly or indirectly through intervening media, or they may be interconnected between two elements. The specific meaning of the above terms in the present application can be understood in a specific case by those of ordinary skill in the art.

The inventor researches and discovers that in the prior art, due to the influence of different mechanical stresses or high temperatures, a slide glass groove in a silicon wafer bearing device is easy to deform, particularly under the condition of small deformation, the deformation is difficult to find by naked eyes and cannot be repaired in time and perfectly, so that the problems of silicon wafer deviation, plating winding or wafer falling and the like are easy to occur in the subsequent production line production process, and the yield of the production line is reduced.

The inventor also finds that the intelligent detection positioning unit 200 is used for finding out the deformed slide glass groove in time, positioning the deformed slide glass groove, and then the deformed slide glass groove is calibrated through the intelligent calibration mechanism 300, so that the problem of yield reduction in the solar cell production line at the present stage can be solved.

In a first aspect, referring to fig. 1 to fig. 2, an embodiment of the present invention provides a calibration system 10 for a silicon wafer carrying device, which includes a first supporting platform 100, a detecting and positioning unit 200, and a calibration mechanism 300.

It should be noted that in the drawings of the present application, a first view is a front view; a second or side view; the third view is a top view.

The first support platform 100 has a first support surface 110 for supporting a silicon wafer carrier.

The detection positioning unit 200 is configured to detect a slide slot in the silicon wafer carrier and position a deformed slide slot.

The alignment mechanism 300 includes a mounting base 310, an alignment member 320, and a power member 330; the power member 330 is mounted to the mounting base 310; the power member 330 is drivingly connected to the calibration member 320 to enable the calibration member 320 to reciprocate between a first position where the calibration member 320 contacts and calibrates the deformed slide slot and a second position located on a side of the first position remote from the slide slot.

In this application, first supporting surface 110 of first supporting platform 100 is used for bearing the weight of the silicon chip and bears the weight of the device, it detects to detect positioning unit 200 and is used for carrying the slide glass groove in the device to the silicon chip on first supporting surface 110, and discern and fix a position slide glass groove that wherein takes place to warp, power part 330 and calibration part 320 calibrate the slide glass groove of location through reciprocating motion between primary importance and second place in the aligning gear 300, thereby improve the silicon chip skew that appears in producing the line production process, around plating or fall the scheduling problem of piece, thereby guarantee to produce the line yield.

For better understanding of the technical solution, the working principle of the calibration system 10 is specifically explained here. Firstly, a silicon wafer bearing device is placed on a first supporting surface 110 of a first supporting platform 100, then a detection positioning unit 200 is used for identifying and positioning a deformed slide groove in the silicon wafer bearing device, the detection positioning unit 200 is used for transmitting acquired information to a computer terminal, then the computer terminal activates a calibration mechanism 300 through the acquired information, and a power part 330 in the calibration mechanism 300 drives a calibration part 320 to reciprocate between a first position and a second position, so that the deformed slide groove is calibrated until the repairing is completed.

It is understood that the specific form of the power member 330 is not limited, and the power member 330 may be provided in the form of a hydraulic control, and in other possible embodiments, the power member 330 may also be provided in the form of a telescopic cylinder.

It should be noted that the specific positional relationship between the calibration mechanism 300 and the first support platform 100 is not limited, and the calibration mechanism 300 and the first support platform 100 may be arranged side by side along the horizontal direction, and at this time, the calibration mechanism 300 is, for example, a robot arm or a robot, and can move the calibration piece 320 above the first support platform 100 and calibrate the deformed slide slot in the silicon wafer carrying device; in other possible embodiments, the alignment mechanism 300 may also be disposed directly above the first support platform 100. It is understood that the calibration of the deformed slide grooves in the silicon wafer carrier device supported on the first support platform 100 is sufficient.

As an example, referring to fig. 3, the calibration system 10 further includes a second support platform 400 and a transport mechanism 500, the second support platform 400 having a second support surface 410 for carrying the wafer carrier, the transport mechanism 500 for transporting the wafer carrier between the first support surface 110 and the second support surface 410; the alignment member 320 is used to contact and align the deformed wafer slot in the wafer carrier carried on the second support surface 410.

In this embodiment, the calibration system 10 is additionally provided with the second supporting platform 400 and the transmission mechanism 500, so as to implement the detecting and positioning functions and the calibration functions at different positions, thereby avoiding the mutual influence between the two functions, and enhancing the operability of the calibration system 10.

It should be noted that in this arrangement, the first position is a position where the alignment member 320 contacts and aligns a deformed slide slot in a wafer carrier carried on the second support surface 410.

It is understood that the transfer mechanism 500 is not limited in specific form, and may be a gear drive, a belt drive or a chain drive, as long as the silicon wafer carrier can be transferred between the first support surface 110 and the second support surface 410.

On this basis, the specific positional relationship between the calibration mechanism 300 and the second support platform 400 is not limited, and the calibration mechanism 300 and the second support platform 400 may be arranged side by side along the horizontal direction, and at this time, the calibration mechanism 300 is, for example, a robot arm or a robot, and can move the calibration piece 320 above the second support platform 400 and calibrate the deformed slide slot in the silicon wafer carrying device; in other possible embodiments, the alignment mechanism 300 may also be disposed directly above the second support platform 400. It will be appreciated that the calibration may be performed only if the slide grooves deformed in the silicon wafer carrier loaded on the second support platform 400 can be calibrated.

As an example, the alignment mechanism 300 is positioned above the second support platform 400 and the second position is positioned above the first position.

In this embodiment, the calibration mechanism 300 is disposed above the second support platform 400, which can save the floor space; simultaneously, the calibration mechanism is convenient to directly lift to calibrate the slide glass groove, so that the calibration action is simple.

It will be appreciated that adjustments may be made to alignment mechanism 300 to take into account the convenience of alignment mechanism 300 in its actual operation.

As an example, the calibration mechanism 300 further includes a connecting member 340, the connecting member 340 includes a first connecting member 341 and two second connecting members 342, the two second connecting members 342 are spaced apart from each other and are connected to the mounting base 310, the first connecting member 341 is connected between the two second connecting members 342, and the power member 330 is connected to the first connecting member 341.

In this embodiment, the first connection member 341 and the two second connection members 342 are mounted like an i-shape, which has the advantages of simplicity and convenience; in addition, the power member 330 is connected to the first connection member 341, so that the calibration member 320 corresponds to the second supporting surface 410, and thus the slide slot inside the silicon wafer carrier can be calibrated.

On the basis, in order to calibrate the slide grooves at various positions in the silicon wafer bearing device, the structure of the connecting piece 340 can be optimized.

As an example, referring to fig. 4 to 5, the first connector 341 has a first guide rail 3411, the first guide rail 3411 and the first connector 341 are slidably connected along a first direction a, each of the second connectors 342 has a second guide rail 3421, the second guide rail 3421 and the second connector 342 are slidably connected along a second direction b, and both ends of the first connector 341 are fixed to the two second guide rails 3421; the first direction a and the second direction b are perpendicular and parallel to the second supporting surface 410.

In this embodiment, a first guide rail 3411 and a second guide rail 3421 are added, and the first guide rail 3411 and the first connector 341 are slidably connected in the first direction a, so that the power member 330 can reciprocate in the first direction a, and accordingly, the alignment mechanism 300 can be positionally adjusted in this direction, so as to be well aligned with the deformed slide groove in this direction for alignment; the second guide rail 3421 and the second connection member 342 are slidably connected along the second direction b, and both ends of the first connection member 341 are fixed to the two second guide rails 3421, so that the power member 330 can reciprocate in the second direction b, and accordingly, the alignment mechanism 300 can perform position adjustment in this direction, thereby being well aligned with the deformed slide groove in this direction for alignment; further, the first guide rail 3411 and the second guide rail 3421 are disposed in a perpendicular direction, which can ensure that the alignment mechanism 300 can be adjusted in position in two corresponding directions at the same time, so that the alignment mechanism can be aligned with the deformed slide groove in two corresponding directions for alignment.

It should be noted that the specific form of the slidable connection is not limited, and the guide rail may be sleeved on the connecting member 340, the connecting member 340 may be sleeved on the guide rail, or the guide rail and the connecting member 340 may be sleeved with each other. It will be appreciated that the guide rails and the connectors 340 may function slidably.

It will be appreciated that structural adjustments may also be made to the mounting base 310 to enable better calibration functionality.

As an example, the mounting base 310 is provided in the form of a rectangular bezel; the mounting base 310 is enclosed outside the second support platform 400 along an orthogonal projection perpendicular to the second support surface 410.

In this embodiment, the mounting substrate 310 is configured as a rectangular frame, which can better match the outer shape of the silicon wafer carrying device, and facilitates the alignment of the calibration mechanism 300 with the deformed wafer carrying grooves and the calibration thereof; in addition, the mounting base 310 is surrounded outside the second supporting platform 400 along an orthographic projection perpendicular to the second supporting surface 410, so that the calibration mechanism 300 can calibrate the slide glass groove at the edge of the silicon wafer carrying device.

Accordingly, the first support surface 110 and the second support surface 410 may be shaped to better match the shape of the silicon wafer carrier.

As an example, the first support surface 110 and the second support surface 410 are rectangular in shape.

In this embodiment, the first supporting surface 110 and the second supporting surface 410 are rectangular, and can match with the external shape of the silicon wafer bearing device, so as to facilitate the bearing function of the silicon wafer bearing device.

On this basis, the mounting positions of the first and second support platforms 100 and 400 may be adjusted for calibration efficiency and equipment footprint considerations.

As an example, an edge of the first supporting surface 110, which is used to correspond to a short edge of the silicon wafer carrier, is a preset short edge 111, and the first supporting platform 100 and the second supporting platform 400 are arranged side by side along an extending direction of the preset short edge 111.

In this embodiment, the first support platform 100 and the second support platform 400 are arranged side by side according to this form, and the distance between the two is small, so that on one hand, the occupied space of the related equipment of the calibration system 10 is reduced, and on the other hand, the time for conveying the silicon wafer carrying device can be saved, thereby saving the calibration time and improving the calibration efficiency.

In other possible embodiments, the first support platform 100 and the second support platform 400 may also be arranged side by side in the vertical direction.

It should be noted that when the first support platform 100 and the second support platform 400 are arranged side by side in the vertical direction, the transmission direction of the transmission mechanism is adjusted from the horizontal direction to the vertical direction.

It will be appreciated that the position of the detection unit can be adjusted for better detection and location of the slide slots.

As an example, the detection positioning unit 200 includes a camera 210 and a positioner 220, the camera 210 is disposed above the first support platform 100 for detecting a slide slot and identifying a deformed slide slot; the positioner 220 is disposed below the first support surface 110 and inside the first support platform 100, and is used to position the deformed slide slot identified by the camera 210.

In this embodiment, the camera 210 is disposed above the first support platform 100, which facilitates detection of slide slots and identification of deformed slide slots; the locator 220 is positioned within the interior of the first support platform 100 below the first support surface 110 to facilitate locating the identified slide slot.

For better understanding of the technical solution, the working principle of the detecting and positioning unit 200 is further explained here. The camera 210 and the locator 220 are connected to the computer terminal, the camera 210 can move in all directions above the first supporting platform 100, so as to detect all slide slots in the silicon wafer carrying device, after the deformed slide slots are identified, the computer terminal can receive related data information, at this time, the locator 220 can move to the deformed slide slots and transmit the position information to the computer terminal, and then the calibration mechanism 300 is activated by the computer terminal to move to the positioned slide slots for calibration.

On this basis, in order to further increase the convenience of the detecting and positioning unit 200, the material of the first supporting platform 100 may be adjusted.

As an example, the first supporting platform 100 is made of glass.

In this embodiment, the first supporting platform 100 is made of glass, which is transparent, so that the camera 210 can shoot and detect the image and the positioner 220 can perform a positioning function conveniently.

Accordingly, since the second support platform 400 needs to bear a certain pressure when the calibration mechanism 300 calibrates the deformed slide slot, the material of the second support platform 400 may be adjusted in order to better perform the calibration function of the calibration system 10.

As an example, the material of the first supporting platform 100 is diamond, high manganese steel or marble, and it is understood that the material has a hardness high enough to withstand a certain pressure.

In a second aspect, an embodiment of the present application provides a solar cell production line, including the calibration system 10 and a silicon wafer carrying device provided in the first aspect.

In this application, solar cell production line includes calibration system 10 to can in time detect the slide glass groove that warp among the silicon chip bears the weight of the device, and calibrate the deformation slide glass groove that detects, thereby improve the silicon chip skew that appears in producing the line production process, around plating or fall the scheduling problem of piece, thereby guarantee to produce the line yield.

To sum up, the embodiment of the present application provides a calibration system 10 for a silicon wafer bearing device and a solar cell production line, which can find and repair a deformed wafer bearing groove in the silicon wafer bearing device, and repair the deformed wafer bearing groove, thereby improving the problems of silicon wafer offset, around plating, wafer dropping and the like in the production line production process, and further ensuring the yield of the production line.

The above description is only a preferred embodiment of the present application and is not intended to limit the present application, and various modifications and changes may be made by those skilled in the art. Any modification, equivalent replacement, improvement and the like made within the spirit and principle of the present application shall be included in the protection scope of the present application.

Claims (10)

1. A calibration system for a silicon wafer carrier, comprising:

the first supporting platform is provided with a first supporting surface used for bearing the silicon wafer bearing device;

the detection positioning unit is configured to be capable of detecting a slide groove in the silicon wafer bearing device and positioning the deformed slide groove;

the calibration mechanism comprises a mounting base body, a calibration piece and a power piece; the power piece is mounted on the mounting base body; the power part is in transmission connection with the calibration part so that the calibration part can reciprocate between a first position and a second position, the first position is the position where the calibration part contacts and calibrates the deformed slide glass groove, and the second position is located on one side, far away from the slide glass groove, of the first position.

2. The calibration system of claim 1, further comprising a second support platform having a second support surface for carrying the wafer carrier, and a transport mechanism for transporting the wafer carrier between the first support surface and the second support surface; the calibration piece is used for contacting and calibrating the deformed wafer carrying groove in the silicon wafer carrying device carried on the second supporting surface.

3. The alignment system of claim 2, wherein the alignment mechanism is positioned above the second support platform and the second position is positioned above the first position.

4. The alignment system of claim 3 wherein the alignment mechanism further comprises a connector comprising a first connector and two second connectors, the two second connectors being spaced apart from one another and each connected to the mounting base, the first connector being connected between the two second connectors, and the power member being connected to the first connector.

5. The calibration system of claim 4 wherein said first link has a first rail, said first rail and said first link being slidably coupled in a first direction, each said second link having a second rail, said second rail and said second link being slidably coupled in a second direction, said first link being fixed at both ends to both of said second rails; the first direction and the second direction are perpendicular and parallel to the second supporting surface.

6. The calibration system of claim 5, wherein the mounting base is provided in the form of a rectangular frame; and the mounting base body is arranged around the second supporting platform along the orthographic projection perpendicular to the second supporting surface.

7. The calibration system according to any one of claims 2 to 6, wherein the first supporting surface is rectangular, an edge of the first supporting surface corresponding to a short side of the silicon wafer carrier is a preset short side, and the first supporting platform and the second supporting platform are arranged side by side along an extending direction of the preset short side.

8. The calibration system as claimed in any one of claims 1 to 6, wherein the detection and positioning unit comprises a camera and a positioner, the camera being disposed above the first support platform for detecting the slide slot and identifying the deformed slide slot; the positioner is arranged below the first supporting surface and inside the first supporting platform and used for positioning the deformed slide groove identified by the camera.

9. The calibration system of claim 8, wherein the first support platform is a glass support platform.

10. A solar cell production line comprising the calibration system according to any one of claims 1 to 9 and the silicon wafer carrier.

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