CN216234502U - Silicon wafer conveying device, drying system and solar cell production line - Google Patents
Silicon wafer conveying device, drying system and solar cell production line Download PDFInfo
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- CN216234502U CN216234502U CN202122836785.4U CN202122836785U CN216234502U CN 216234502 U CN216234502 U CN 216234502U CN 202122836785 U CN202122836785 U CN 202122836785U CN 216234502 U CN216234502 U CN 216234502U
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Abstract
The application provides a silicon chip conveyer, drying system and solar cell production line relates to battery preparation technical field. The silicon wafer conveying device comprises a first conveying assembly, a first conveying belt and a first jacking piece, wherein the first conveying assembly is used for longitudinally conveying silicon wafers; the first conveying belt is arranged on one side of the first conveying assembly and used for conveying silicon wafers, the first jacking piece comprises a base, a baffle connected with the base and a jacking table capable of lifting relative to the base, the baffle is arranged at one end of the first conveying belt in the conveying direction, and the base is spaced from a lower dead point of the first conveying assembly in longitudinal transmission; the first conveying belt can convey the silicon wafer to the base, and the baffle can prevent the silicon wafer from continuing to advance; the jacking table can jack the silicon wafer on the base so that the first conveying assembly bears the silicon wafer to carry out longitudinal transmission. The problem that the silicon wafer is broken when the silicon wafer is transferred upwards due to position offset can be solved.
Description
Technical Field
The application relates to the technical field of battery preparation, in particular to a silicon wafer conveying device, a drying system and a solar battery production line.
Background
The drying oven is the main process equipment of the screen printing production line, and after each screen printing, the printing silver electrodes on the silicon chip are heated and dried in the drying oven, so that the surface of the printed silver paste is changed from a liquid state to a solid state. In a conventional drying method, silicon wafers are conveyed in a flat manner, or a support is adopted to support the silicon wafers, and the silicon wafers are obliquely placed for conveying.
However, when the silicon wafers are conveyed and dried in the drying furnace by adopting the modes, the silicon wafers are generally discharged in a row-by-row mode during discharging, then the silicon wafers are dried in a multi-row mode, the next process printing needs to combine multiple rows into one row, the plane position occupied by the drying furnace is large, and the temperature control of the multi-row conveying mode is difficult.
In order to improve the problems, in the prior art, the silicon wafers are conveyed from bottom to top and from top to bottom through two conveying devices and are dried in a drying furnace, and then the silicon wafers on the two conveying devices are transferred through a carrying device.
SUMMERY OF THE UTILITY MODEL
The application provides a silicon chip conveyer, drying system and solar cell production line, it can improve and take place broken problem because of silicon chip offset when upwards shifting.
In a first aspect, an embodiment of the present application provides a silicon wafer conveying apparatus, including:
the first conveying assembly is used for longitudinally conveying the silicon wafers;
the first conveying belt is arranged on one side of the first conveying assembly and is used for conveying the silicon wafers; and
the first jacking piece comprises a base, a baffle connected with the base and a jacking table capable of lifting relative to the base, the baffle is arranged at one end of the first conveying belt in the conveying direction, and the base is away from a lower dead point of the first conveying assembly in the longitudinal conveying direction;
the first conveying belt can convey the silicon wafer to the base, and the baffle can prevent the silicon wafer from continuing to advance; the jacking table can jack the silicon wafer on the base so that the first conveying assembly bears the silicon wafer to carry out longitudinal transmission.
In the technical scheme, the silicon wafer is conveyed to the base of the first jacking piece through the first conveying belt, and the position of the silicon wafer on the base cannot deviate due to the fact that the silicon wafer continues to advance because the baffle can block the silicon wafer from continuing to advance. The base has the distance with the lower dead center of first conveyor assembly's vertical transmission, then first conveyor assembly transmission silicon chip and first conveyer belt transmit the silicon chip to the base and can not interfere with each other, and the back is got up the silicon chip jacking on the base to the jacking platform, and first conveyor assembly accepts the silicon chip and carries out vertical transmission, because the position of silicon chip on the base does not take place the skew, then the jacking platform is difficult to take place the breakage when accepting by first conveyor assembly after getting up the silicon chip jacking.
In a possible embodiment, the silicon wafer conveying device further comprises a second conveying assembly, a carrying mechanism and a second conveying belt arranged on one side of the second conveying assembly; the second conveying assembly is used for longitudinally conveying the silicon wafers and is opposite to the conveying direction of the first conveying assembly, and the carrying mechanism is used for transferring the silicon wafers between the first conveying assembly and the second conveying assembly.
In above-mentioned technical scheme, transfer the silicon chip of first conveying component transmission to second conveying component through transport mechanism, the silicon chip is dried at first conveying component and second conveying component, and the silicon chip after the stoving can be gone out through the transmission of second conveyer belt. Because first conveying assembly and second conveying assembly are vertical transport silicon chip, consequently can practice thrift and take up an area of the space, and conveniently carry out warm area control.
In a possible embodiment, the first conveying assembly and the second conveying assembly each comprise two conveying assemblies which are opposite and arranged at intervals, each conveying assembly comprises a support, a chain, a driving wheel, a driven wheel and a first driving piece, the driving wheel, the driven wheel and the first driving piece are mounted on the supports, the chain is wound around the driving wheel and the driven wheel, the driving wheel and the driven wheel are rotatably connected with the supports, and the first driving piece is used for driving the driving wheel to rotate; a plurality of supporting pieces capable of supporting the silicon wafers are arranged on the chain at intervals, and the first jacking piece is arranged between the two transmission assemblies of the first conveying assembly.
In above-mentioned technical scheme, rotate through first driving piece drive action wheel to drive the chain motion and drive and rotate from the driving wheel, the silicon chip is supported jointly to the support on the chain through two transmission assembly to the chain of two transmission assembly conveys towards opposite direction, thereby realizes from the top down or from the bottom up transmission silicon chip. In addition, when the supporting part of the first conveying assembly moves to the bottom dead center, the distance between the supporting parts of the two conveying assemblies is wide, the jacking table can jack the silicon wafer to a target position, and when the supporting part moves upwards, the distance between the supporting parts of the two conveying assemblies is narrow, so that the silicon wafer on the jacking table is received and conveyed upwards.
In one possible embodiment, one of the transport assemblies of the first conveyor assembly and one of the transport assemblies of the second conveyor assembly are both located on the first side, and the other transport assembly of the first conveyor assembly and the other transport assembly of the second conveyor assembly are both located on the second side.
In the technical scheme, the first conveying assembly and the second conveying assembly are arranged as above, so that the silicon wafer can be conveniently transferred between the first conveying assembly and the second conveying assembly.
In a possible implementation scheme, the first conveying belt and the second conveying belt are located at the same height, the bottom dead centers of the longitudinal transmission of the first conveying assembly and the second conveying assembly are located at the same height, the silicon wafer conveying device is further provided with a second jacking piece, and the second jacking piece can complete the transfer of the silicon wafer between the second conveying assembly and the second conveying belt through lifting.
In above-mentioned technical scheme, first conveyer belt and second conveyer belt are located same height, and the lower dead center of first conveying component and the vertical transmission of second conveying component is at same height, but makes second conveyer belt and second conveying component's lower dead center between have the distance like this, accomplishes the transfer of silicon chip between second conveying component and second conveyer belt through the lift of second jacking piece, and the silicon chip is difficult to the card during the unloading and dies.
In a possible embodiment, the carrying mechanism comprises a first carrying assembly and a second carrying assembly which are used for supporting two opposite ends of a first direction of the silicon wafer, the first conveying assembly and the second conveying assembly can bear two opposite ends of a second direction of the silicon wafer, the first direction is vertical to the second direction, the first carrying assembly and the second carrying assembly can move along the arrangement direction of the first conveying assembly and the second conveying assembly, and the distance between the first carrying assembly and the second carrying assembly is adjustable.
In the technical scheme, the distance between the first carrying assembly and the second carrying assembly is adjusted by moving the first carrying assembly and/or the second carrying assembly along the arrangement direction of the first conveying assembly and the second conveying assembly, so that the silicon wafer can be conveniently carried and stably carried. Because the first carrying assembly and the second carrying assembly support the two opposite ends of the first direction of the silicon wafer, the first conveying assembly and the second conveying assembly can bear the two opposite ends of the second direction of the silicon wafer, and the first direction is perpendicular to the second direction, the conveying mechanism can not interfere with the transmission of the first conveying assembly and the second conveying assembly to the silicon wafer when the silicon wafer is carried.
In a possible embodiment, each of the first and second transfer assemblies includes at least one support member, and the support member includes a first support portion and a second support portion connected to each other, and the first support portion and the second support portion are disposed in an L shape and respectively used for supporting the bottom surface and the side surface of the silicon wafer.
In the technical scheme, the bottom surface and the side surface of the silicon wafer are supported by the first supporting part and the second supporting part, so that the falling probability of the silicon wafer in the transferring process can be reduced.
In a possible embodiment, the silicon wafer conveying device further comprises a guide rail arranged on one side of the first conveying assembly and the second conveying assembly, the first conveying assembly and the second conveying assembly respectively comprise a conveying part and a second driving part, one end of the conveying part extends to the upper side of the first conveying assembly and the second conveying assembly and is connected with the second supporting part, the conveying part is connected with the guide rail in a sliding mode, and the second driving part is used for driving the conveying part to reciprocate along the guide rail.
In above-mentioned technical scheme, through second driving piece drive transport part along guide rail reciprocating motion, stability when can improve the transport part motion, and through the motion of the second driving piece drive transport part of first transport subassembly, and/or through the motion of the second driving piece drive transport part of second transport subassembly, can conveniently adjust the distance between first transport subassembly and the transport subassembly.
In a second aspect, an embodiment of the present application provides a drying system, including the silicon wafer conveying device and the drying box of the first aspect, a first conveying assembly and a first jacking piece are all arranged in the drying box.
In a third aspect, an embodiment of the present application provides a solar cell production line, including the drying system of the embodiment of the second aspect.
Drawings
In order to more clearly illustrate the technical solutions of the embodiments of the present application, the drawings that are required to be used in the embodiments will be briefly described below, it should be understood that the following drawings only illustrate some embodiments of the present application and therefore should not be considered as limiting the scope, and for those skilled in the art, other related drawings can be obtained from the drawings without inventive effort.
Fig. 1 is a schematic structural diagram of a silicon wafer conveying apparatus at a first viewing angle in embodiment 1 of the present application;
FIG. 2 is a schematic structural diagram of a silicon wafer conveying apparatus at a second viewing angle in embodiment 1 of the present application;
FIG. 3 is a schematic structural diagram of a first conveying assembly in embodiment 1 of the present application;
FIG. 4 is a schematic view of the first conveyor assembly and the conveyor mechanism of embodiment 1 of the present application in combination;
fig. 5 is a schematic view of a conveying mechanism according to embodiment 1 of the present application;
figure 6 is an exploded view of the first jacking member of figure 3.
Icon: 10-a silicon wafer conveying device; 11-a first transport assembly; 111-a transmission component; 1111-a bracket; 1112-a chain; 1113-driving wheel; 1114-a driven wheel; 1115 — a first drive member; 1116-a support; 12-a second transport assembly; 13-a first conveyor belt; 14-a second conveyor belt; 15-a first jacking member; 151-a base; 152-a baffle; 153-a jacking table; 16-a second jacking member; 17-a handling mechanism; 171-a first handling assembly; 172-a second handling assembly; 173-a support; 1731-a first support; 1732-a second support; 174-a handling member; 1741-a carrier; 175-a connector; 176-a roller; 177-a third drive member; 18-guide rail.
Detailed Description
In order to make the objects, technical solutions and advantages of the embodiments of the present application clearer, the technical solutions in the embodiments of the present application will be clearly and completely described below with reference to the drawings in the embodiments of the present application, and it is obvious that the described embodiments are some embodiments of the present application, but not all embodiments. The components of the embodiments of the present application, generally described and illustrated in the figures herein, can be arranged and designed in a wide variety of different configurations.
Thus, the following detailed description of the embodiments of the present application, presented in the accompanying drawings, is not intended to limit the scope of the claimed application, but is merely representative of selected embodiments of the application. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present application.
It should be noted that: like reference numbers and letters refer to like items in the following figures, and thus, once an item is defined in one figure, it need not be further defined and explained in subsequent figures.
In the description of the present application, it should be noted that the terms "upper", "lower", "left", "right", "longitudinal", "horizontal", "inner", and the like indicate orientations or positional relationships based on the orientations or positional relationships shown in the drawings or orientations or positional relationships that are conventionally placed when products of the application are used, and are used only for convenience in describing the application and simplifying the description, but do not indicate or imply that the referred devices or elements must have a specific orientation, be constructed in a specific orientation, and be operated, and thus should not be construed as limiting the application. Furthermore, the terms "first," "second," "third," and the like are used solely to distinguish one from another and are not to be construed as indicating or implying relative importance.
In the description of the present application, it is further noted that, unless expressly stated or limited otherwise, the terms "disposed," "mounted," and "connected" are to be construed broadly, e.g., as meaning fixedly connected, detachably connected, or integrally connected; they may be connected directly or indirectly through intervening media, or they may be interconnected between two elements. The specific meaning of the above terms in the present application can be understood in a specific case by those of ordinary skill in the art.
Example 1
Referring to fig. 1 and 2, a silicon wafer transferring apparatus 10 of the present embodiment includes a first conveying assembly 11, a second conveying assembly 12, a first conveying belt 13, a second conveying belt 14, a first lifting member 15, a second lifting member 16, and a carrying mechanism 17.
Wherein, first transport assembly 11 and second transport assembly 12 all vertically carry the silicon chip, and wherein, first transport assembly 11 can be followed from upwards carrying the silicon chip, and second transport assembly 12 can be followed from the top downwards carrying the silicon chip. The transfer of the silicon wafer between the first transfer unit 11 and the second transfer unit 12 is performed by the transfer mechanism 17.
The first conveyer belt 13 is arranged at one side of the first conveyer assembly 11, and the first conveyer belt 13 is used for conveying silicon wafers. The second conveyor belt 14 is disposed at one side of the second conveyor assembly 12, and the second conveyor belt 14 is used for conveying silicon wafers. Illustratively, the first conveyor belt 13 and the second conveyor belt 14 are each transported in a horizontal direction.
The arrangement direction of the first conveyor belt 13, the first conveyor assembly 11, the second conveyor assembly 12, and the second conveyor belt 14 may be the same as the transmission direction of the first conveyor belt 13 and the second conveyor belt 14, and the arrangement direction is a linear arrangement mode, or the arrangement direction of the first conveyor belt 13, the first conveyor assembly 11, the second conveyor assembly 12, and the second conveyor belt 14 may be an L-shaped arrangement mode, which is not limited in the embodiment of the present application.
The first lifting member 15 includes a base 151, a baffle 152 connected to the base 151, and a lifting table 153 (see fig. 3 and 6) capable of lifting relative to the base 151, the baffle 152 is disposed at one end of the first conveying belt 13 in the conveying direction, and the base 151 is spaced from a bottom dead center of the first conveying assembly 11 in the longitudinal direction. It should be noted that the bottom dead center in the embodiment of the present application refers to a position at which the silicon wafer can reach the lowest end when the first conveying assembly 11 and the second conveying assembly 12 convey the silicon wafer in the longitudinal direction.
The first conveyor belt 13 can convey the silicon wafer to the base 151, and the baffle 152 can prevent the silicon wafer from continuing to advance; the jacking table 153 can jack the silicon wafer on the base 151 so that the first conveying assembly 11 receives the silicon wafer for longitudinal conveying.
In the using process, the silicon wafer is conveyed to the base 151 of the first jacking piece 15 through the first conveying belt 13, and the position of the silicon wafer on the base 151 cannot be deviated due to the fact that the silicon wafer continues to advance because the baffle 152 can block the silicon wafer from continuing to advance. Base 151 has the distance with the lower dead center of the vertical transmission of first conveyor assembly 11, then first conveyor assembly 11 transmission silicon chip and first conveyer belt 13 transmit the silicon chip to base 151 and can not interfere with each other, jacking platform 153 back of getting up the silicon chip on base 151, first conveyor assembly 11 accepts the silicon chip and carries out vertical transmission, because the position of silicon chip on base 151 has not taken place the skew, then jacking platform 153 is difficult to take place the breakage when accepting by first conveyor assembly 11 after getting up the silicon chip jacking.
In addition, the silicon wafers conveyed by the first conveying assembly 11 can be transferred to the second conveying assembly 12 through the conveying mechanism 17, the silicon wafers are dried by the first conveying assembly 11 and the second conveying assembly 12, and the dried silicon wafers can be conveyed out by the second conveying belt 14. Because the first conveying assembly 11 and the second conveying assembly 12 are used for longitudinally conveying the silicon wafers, the occupied space can be saved, and the temperature zone control is convenient to carry out.
Optionally, in order to adapt to other apparatuses, the embodiment of the present application sets the first conveyor belt 13 and the second conveyor belt 14 to be at the same height, and the bottom dead center of the longitudinal transmission of the first conveyor assembly 11 and the second conveyor assembly 12 is at the same height. However, the inventor of the present application finds that such an arrangement may cause the second conveying belt 14 to have a distance from the bottom dead center of the second conveying assembly 12, and silicon wafers are easily jammed when being fed from the second conveying assembly 12 to the second conveying belt 14. In order to improve the situation, further, the silicon wafer conveying device 10 is further provided with a second jacking piece 16, the second jacking piece 16 can complete the transfer of the silicon wafers between the second conveying assembly 12 and the second conveying belt 14 through lifting, and the silicon wafers are not easy to be blocked during blanking.
Referring to fig. 1, 2 and 5, the carrying mechanism 17 further includes a first carrying assembly 171 and a second carrying assembly 172 for supporting opposite ends of a first direction of the silicon wafer, and the first carrying assembly 11 and the second carrying assembly 12 are capable of carrying opposite ends of a second direction of the silicon wafer, wherein the first direction (the direction indicated by the arrow B in fig. 2) is perpendicular to the second direction (the direction indicated by the arrow C in fig. 2). With such an arrangement, the transfer mechanism 17 does not interfere with the transfer of the silicon wafer by the first transfer unit 11 and the second transfer unit 12 when transferring the silicon wafer.
In addition, each of the first and second handling assemblies 171 and 172 is capable of reciprocating in the direction of laying of the first and second conveyor assemblies 11 and 12 (the direction indicated by arrow a in fig. 2), and the distance between the first and second handling assemblies 171 and 172 is adjustable.
The distance between the first carrying assembly 171 and the second carrying assembly 172 is adjusted by moving the first carrying assembly 171 and/or the second carrying assembly 172 along the arrangement direction of the first conveying assembly 11 and the second conveying assembly 12, when the silicon wafer needs to be carried, the distance between the first carrying assembly 171 and the second carrying assembly 172 is widened, the silicon wafer can be conveniently carried, then the distance between the first carrying assembly 171 and the second carrying assembly 172 is narrowed, and the silicon wafer can be stably carried. In other embodiments, a transfer robot or the like may be used as the transfer mechanism 17.
Illustratively, each of the first and second carrying assemblies 171 and 172 includes a carrying member 174, a second driving member, and at least one support 173, the support 173 includes a first support 1731 and a second support 1732 connected to each other, and the first support 1731 and the second support 1732 are disposed in an L shape to support the bottom and the side of the silicon wafer, respectively. Wherein the carrying member 174 is connected to the second supporting portion 1732, and the second driving member is used for driving the carrying member 174 to move along the arrangement direction of the first conveying assembly 11 and the second conveying assembly 12 (as indicated by arrow a in fig. 2).
The conveying component 174 is driven by the second driving component to move along the arrangement direction of the first conveying component 11 and the second conveying component 12, the distance between the first conveying component 171 and the second conveying component 172 can be adjusted, the bottom surface and the side surface of the silicon wafer are supported by the first supporting part 1731 and the second supporting part 1732, and the probability that the silicon wafer falls in the transferring process can be reduced.
Optionally, the drying system further includes a guide rail 18, the guide rail 18 is disposed at one side of the first conveyor assembly 11 and the second conveyor assembly 12 and extends along the arrangement direction of the first conveyor assembly 11 and the second conveyor assembly 12, and the carrying member 174 is slidably connected with the guide rail 18, and the second driving member is used for driving the carrying member 174 to reciprocate along the guide rail 18. By driving the conveying member 174 to reciprocate along the guide rail 18 by the second driving member, the stability of the conveying member 174 during movement can be improved.
Further, in order to more conveniently receive the silicon wafers, the carrying member 174 includes a carrying member 1741 and a third driving member 177, one end of the carrying member 1741 extends above the first conveying assembly 11 and the second conveying assembly 12 and is connected to the second supporting portion 1732, the third driving member 177 is used for driving the carrying member 1741 to ascend and descend, and the third driving member 177 is slidably connected to the guide rail 18 and is in transmission connection with the second driving member. For example, the second driving element and the third driving element 177 may be an air cylinder or a hydraulic cylinder, and the specific structure of the third driving element 177 is not limited in this application, as long as the lifting can be achieved.
The third driving member 177 drives the carrying member 1741 to ascend and descend so as to drive the supporting member 173 to ascend and descend, so that the silicon wafer can be more conveniently received and transferred between the first conveying assembly 11 and the second conveying assembly 12. For example, when a silicon wafer needs to be transferred from the first conveying assembly 11 to the second conveying assembly 12, the third driving member 177 drives the conveying member 1741 to descend through the support 173 to receive the silicon wafer, then the third driving member 177 drives the conveying member 1741 to ascend to avoid interference on the conveying of the silicon wafer by the first conveying assembly 11, and then the second driving member drives the conveying member 174 to move along the guide rail 18 to one side of the second conveying assembly 12 to transfer the silicon wafer to the second conveying assembly 12.
Wherein, carrier 1741 is including the first transport section and the second transport section of connecting, and first transport section and second transport section are the setting of L type, and first transport section is connected with the power take off end of third driving piece 177, and the second transport section is connected with second supporting part 1732. The first conveying section is movable above the first conveyor assembly 11 and the second conveyor assembly 12, and the second conveying section is located on one side of the first conveyor assembly 11 and the second conveyor assembly 12.
Illustratively, the third driving member 177 is slidably connected with the guide rail 18 through a connecting member 175, the third driving member 177 is fixed to the connecting member 175, the connecting member 175 is provided with a roller 176, the guide rail 18 is provided with a sliding slot, and the roller 176 is limited to slide in the sliding slot.
The movement track of the roller 176 is defined by the sliding groove, so that the movement stability of the connecting member 175 can be improved, and the roller 176 is more favorable for sliding.
Referring to fig. 3 and 4, the first conveying assembly 11 and the second conveying assembly 12 are exemplarily described as including two conveying assemblies 111 disposed opposite to and spaced apart from each other, each conveying assembly 111 includes a bracket 1111, a chain 1112, a driving wheel 1113 mounted on the bracket 1111, a driven wheel 1114 and a first driving member 1115, the chain 1112 is disposed around the driving wheel 1113 and the driven wheel 1114, the driving wheel 1113 and the driven wheel 1114 are rotatably connected to the bracket, and the first driving member 1115 is configured to drive the driving wheel 1113 to rotate; a plurality of supports 1116 capable of supporting silicon wafers are spaced apart from each other on the chain 1112. The first jacking piece 15 is arranged between the two transmission assemblies 111 of the first conveying assembly 11, and the second jacking piece 16 is arranged between the two transmission assemblies 111 of the second conveying assembly 12.
The driving wheel 1113 is driven to rotate by the first driving member 1115, so as to drive the chain 1112 to move and drive the driven wheel 1114 to rotate. The two transmission assemblies 111 are arranged oppositely and at intervals, so that the chains 1112 of the two transmission assemblies 111 transmit in opposite directions, and the silicon wafers are supported by the supporting members 1116 on the chains 1112 of the two transmission assemblies 111 together, thereby realizing the transmission of the silicon wafers from top to bottom or from bottom to top.
Referring to fig. 2 and 3, the chain 1112 of the left transmission assembly 111 of the first conveying assembly 11 rotates counterclockwise, and the chain 1112 of the right transmission assembly 111 rotates clockwise, so that the silicon wafers can be transmitted from bottom to top. The chain 1112 of the left transmission assembly 111 of the second conveying assembly 12 rotates clockwise, and the chain 1112 of the right transmission assembly 111 rotates counterclockwise, so that silicon wafers can be transmitted from top to bottom. In addition, when the support 1116 moves to the bottom dead center, the distance between the supports 1116 of the two transfer assemblies 111 is wide, the lift-up table 153 can lift up the silicon wafer to a target position, and when the supports 1116 move upward, the distance between the supports 1116 of the two transfer assemblies 111 is narrowed, so that the silicon wafer on the lift-up table 153 is received and transferred upward.
Illustratively, one of the transport assemblies 111 of the first transport assembly 11 and one of the transport assemblies 111 of the second transport assembly 12 are both located on a first side, and the other transport assembly 111 of the first transport assembly 11 and the other transport assembly 111 of the second transport assembly 12 are both located on a second side. By the arrangement, the silicon wafer can be conveniently transferred between the silicon wafer and the silicon wafer.
Example 2
The present embodiment provides a drying system (not shown in the drawings), which includes the silicon wafer conveying apparatus 10 of embodiment 1 and a drying box, wherein the first conveying assembly 11, the second conveying assembly 12, the first lifting member 15, the second lifting member 16 and the carrying mechanism 17 are all disposed in the drying box.
Example 3
The present embodiment provides a solar cell production line including the drying system of embodiment 2.
The above description is only a preferred embodiment of the present application and is not intended to limit the present application, and various modifications and changes may be made by those skilled in the art. Any modification, equivalent replacement, improvement and the like made within the spirit and principle of the present application shall be included in the protection scope of the present application.
Claims (10)
1. A silicon wafer transfer apparatus, comprising:
the first conveying assembly is used for longitudinally conveying the silicon wafers;
the first conveying belt is arranged on one side of the first conveying assembly and used for conveying the silicon wafers; and
the first jacking piece comprises a base, a baffle connected with the base and a jacking table capable of lifting relative to the base, the baffle is arranged at one end of the first conveying belt in the conveying direction, and the base is away from a lower dead point of the first conveying assembly in longitudinal conveying;
the first conveying belt can convey the silicon wafer to the base, and the baffle can block the silicon wafer from continuing to advance; the jacking table can jack the silicon wafer on the base so that the first conveying assembly bears the silicon wafer to carry out longitudinal transmission.
2. The silicon wafer conveying device according to claim 1, further comprising a second conveying assembly, a carrying mechanism, and a second conveyor belt provided at one side of the second conveying assembly; the second conveying assembly is used for longitudinally conveying the silicon wafers and is opposite to the conveying direction of the first conveying assembly, and the carrying mechanism is used for transferring the silicon wafers between the first conveying assembly and the second conveying assembly.
3. The silicon wafer conveying device according to claim 2, wherein the first conveying assembly and the second conveying assembly each comprise two conveying assemblies which are arranged oppositely and at intervals, each conveying assembly comprises a support, a chain, a driving wheel, a driven wheel and a first driving member, the driving wheel, the driven wheel and the first driving member are mounted on the support, the chain is wound around the driving wheel and the driven wheel, the driving wheel and the driven wheel are rotatably connected with the support, and the first driving member is used for driving the driving wheel to rotate; a plurality of supporting pieces capable of supporting the silicon wafers are arranged on the chain at intervals; the first jacking piece is arranged between the two transmission assemblies of the first conveying assembly.
4. The wafer transfer apparatus according to claim 3, wherein one of the transport assemblies of the first transport assembly and one of the transport assemblies of the second transport assembly are located on a first side, and the other of the transport assemblies of the first transport assembly and the other of the transport assemblies of the second transport assembly are located on a second side.
5. The silicon wafer conveying device according to any one of claims 2 to 4, wherein the first conveying belt and the second conveying belt are located at the same height, the bottom dead centers of the longitudinal transmission of the first conveying assembly and the second conveying assembly are located at the same height, and the silicon wafer conveying device further comprises a second jacking member, and the second jacking member can complete the transfer of the silicon wafer between the second conveying assembly and the second conveying belt by lifting.
6. The wafer conveying apparatus according to any one of claims 2 to 4, wherein the conveying mechanism comprises a first conveying assembly and a second conveying assembly for supporting opposite ends of the wafer in a first direction, the first conveying assembly and the second conveying assembly are capable of carrying opposite ends of the wafer in a second direction, the first direction is perpendicular to the second direction, the first conveying assembly and the second conveying assembly are capable of moving in the arrangement direction of the first conveying assembly and the second conveying assembly, and the distance between the first conveying assembly and the second conveying assembly is adjustable.
7. The wafer transfer apparatus of claim 6, wherein the first and second transfer assemblies each comprise at least one support member comprising a first support portion and a second support portion connected to each other, the first and second support portions being arranged in an L-shape to support the bottom and side surfaces of the wafer, respectively.
8. The silicon wafer conveying apparatus according to claim 7, further comprising a guide rail provided at one side of the first and second conveying assemblies, wherein each of the first and second conveying assemblies comprises a conveying member having one end extending above the first and second conveying assemblies and connected to the second support portion, and a second driving member for driving the conveying member to reciprocate along the guide rail.
9. A drying system is characterized by comprising the silicon wafer conveying device and the drying box body according to any one of claims 1 to 8, wherein the first conveying assembly and the first jacking piece are arranged in the drying box body.
10. A solar cell production line, characterized by comprising the drying system of claim 9.
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| CN202122836785.4U CN216234502U (en) | 2021-11-18 | 2021-11-18 | Silicon wafer conveying device, drying system and solar cell production line |
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| CN202122836785.4U CN216234502U (en) | 2021-11-18 | 2021-11-18 | Silicon wafer conveying device, drying system and solar cell production line |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN115069585A (en) * | 2022-08-22 | 2022-09-20 | 无锡京运通科技有限公司 | Sorting feeding table fragment removing device for monocrystalline silicon preparation |
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| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN115069585A (en) * | 2022-08-22 | 2022-09-20 | 无锡京运通科技有限公司 | Sorting feeding table fragment removing device for monocrystalline silicon preparation |
| CN115069585B (en) * | 2022-08-22 | 2022-10-25 | 无锡京运通科技有限公司 | Sorting feeding table fragment removing device for monocrystalline silicon preparation |
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