CN216977799U - Automatic detection device for ceramic disc wafer - Google Patents
Automatic detection device for ceramic disc wafer Download PDFInfo
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- CN216977799U CN216977799U CN202122383619.3U CN202122383619U CN216977799U CN 216977799 U CN216977799 U CN 216977799U CN 202122383619 U CN202122383619 U CN 202122383619U CN 216977799 U CN216977799 U CN 216977799U
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Abstract
The utility model discloses an automatic detection device for a wafer of a ceramic disc, which comprises a rack, wherein a thickness detection mechanism is arranged in the rack, and comprises a marble air floatation platform, a wafer bearing mechanism, an X-axis adjusting mechanism, a Y-axis adjusting mechanism, a Z-axis adjusting mechanism and a thickness measuring lens mechanism; the marble air-floating platform is arranged on the frame; the wafer bearing mechanism is used for placing a wafer to be detected; the thickness measuring lens mechanism realizes the adjustment in the X-axis direction, the Y-axis direction and the Z-axis direction through an X-axis adjusting mechanism, a Y-axis adjusting mechanism and a Z-axis adjusting mechanism respectively; the X-axis adjusting mechanism, the Y-axis adjusting mechanism and the Z-axis adjusting mechanism are all provided with corresponding linear motors and are automatically controlled by the control system according to system software; the bottom of the frame is provided with universal wheels. The utility model has the advantages of high working efficiency, compact and reliable structure, high testing precision, convenient operation, capability of realizing compatible testing of various sizes and styles, and the like.
Description
Technical Field
The utility model relates to the technical field of wafer thickness detection equipment, in particular to an automatic detection device for a ceramic disc wafer.
Background
The existing factory is always subjected to automatic transformation, automatic tests are widely applied, the precision in manual detection is low, the productivity is low in efficiency, fatigue is easy to occur, and the problems of industrial injury and the like are easily caused due to the fact that a carrier ceramic plate is heavy.
The utility model with the application number of CN201920416373.5 discloses a wafer surface quality detection device, which comprises a first base, an upper test mechanism, a lower test fine adjustment mechanism and an X-Y mobile platform for placing a wafer; one side of the upper surface of the first base is connected with a cross beam, the side wall of the cross beam is connected with an upper testing mechanism, an upper measuring head is connected to the upper testing mechanism, and the upper measuring head is positioned above the X-Y moving platform; the X-Y moving platform is connected with the upper surface of the first base, a square hole is formed in the first base below the X-Y moving platform, and the lower testing fine adjustment mechanism is located in the square hole and connected with the first base; the lower test fine adjustment mechanism is connected with a lower measuring head; the bottom of the first base is connected with a shock absorber which is used for being fixed on the rack; the X-Y moving platform is driven by a linear motor and moves through a crossed ball guide rail, and the wafer is placed on the X-Y moving platform, so that 3D track detection in different modes of a shape like a Chinese character 'mi' and a surface scanning mode is realized, and the warping degree, the thickness and the thickness deviation surface quality of the wafer are measured.
However, the detection equipment has the disadvantages of complicated steps, overlong detection time, low detection efficiency, high productivity and stability, poor compatibility of various sizes and various styles, and insufficient adjustability and operability.
Disclosure of Invention
Aiming at the defects of the prior art, the utility model aims to provide the automatic detection device for the ceramic disc wafer, which has the advantages of high working efficiency, compact and reliable structure, high test precision and convenient operation and can realize compatible tests of various sizes and patterns.
The technical scheme adopted by the utility model for solving the technical problem is as follows: an automatic detection device for ceramic disc wafers comprises a rack, wherein a thickness detection mechanism is arranged in the rack and comprises a marble air floatation platform, a wafer bearing mechanism, an X-axis adjusting mechanism, a Y-axis adjusting mechanism, a Z-axis adjusting mechanism and a thickness measuring lens mechanism; the marble air-floating platform is arranged on the rack, and the marble air-floating platform is provided with the rest components of the thickness detection mechanism; the wafer bearing mechanism is used for placing a wafer to be detected; the thickness measuring lens mechanism realizes the adjustment in the X-axis direction, the Y-axis direction and the Z-axis direction through the X-axis adjusting mechanism, the Y-axis adjusting mechanism and the Z-axis adjusting mechanism respectively; the X-axis adjusting mechanism, the Y-axis adjusting mechanism and the Z-axis adjusting mechanism are all provided with corresponding linear motors and are automatically controlled by the control system according to system software; the bottom of the frame is provided with universal wheels.
Further, the wafer bearing mechanism comprises a wafer bearing platform, a bearing platform supporting seat and a bearing platform limiting frame; the lower part of the wafer carrying platform is detachably connected with the carrying platform supporting seat; a carrier adjusting mechanism used for adjusting the wafer carrier in the Z-axis direction is arranged below the carrier supporting seat and comprises an adjusting wheel and an adjusting screw rod; and the adjusting screw rod is connected with the carrying platform supporting seat.
Further, the thickness measuring lens mechanism comprises a thickness measuring lens and a lens fixing plate; the lens fixing plate is connected with the Z-axis adjusting mechanism.
Furthermore, the Z-axis adjusting mechanism comprises a Z-axis fixing plate, a Z-axis connecting plate connected with the Z-axis fixing plate, a Z-axis chute plate connected with the Z-axis connecting plate, and a Z-axis slider which is matched with the Z-axis chute plate and can linearly move along the Z-axis chute plate in the Z-axis direction; the Z-axis sliding block is connected with the thickness measuring lens mechanism and drives the thickness measuring lens mechanism to move in the Z-axis direction; the Z-axis fixing plate is connected with the X-axis adjusting mechanism.
Furthermore, the X-axis adjusting mechanism comprises an X-axis beam, an X-axis slide rail arranged in parallel with the X-axis beam, and an X-axis slide block which is arranged above the X-axis beam and can linearly move on a horizontal plane along the X-axis slide rail; the X-axis beam is connected with the Y-axis adjusting mechanism through an X-axis beam fixing frame; the X-axis sliding block is connected with the Z-axis adjusting mechanism and drives the thickness measuring lens mechanism to move in the X-axis direction.
Furthermore, X-axis limiting blocks are respectively arranged at two ends of the X-axis beam.
Furthermore, the Y-axis adjusting mechanism comprises two Y-axis beams, a Y-axis slide rail arranged in parallel with the Y-axis beams, and a Y-axis slide block which is arranged above the Y-axis beams and can linearly move on a horizontal plane along the Y-axis slide rail; the Y-axis slide rail is connected with the marble air floatation platform; and the Y-axis sliding block is connected with the X-axis adjusting mechanism and drives the thickness measuring lens mechanism to move in the Y-axis direction.
Furthermore, two ends of the Y-axis beam are respectively provided with a Y-axis limiting block.
Furthermore, an illuminating lamp bar and a positioning camera are further arranged in the rack of the automatic detection device.
The automatic detection device has the following working modes: firstly, feeding through an automatic feeding and discharging device (which can be equipped), placing a wafer to be detected on a wafer carrying platform, and adjusting the upper and lower positions of the wafer carrying platform through an adjusting platform adjusting mechanism according to needs; adjusting the Z-axis adjusting mechanism to enable the thickness measuring lens to be at a proper distance from the wafer to be detected; and adjusting the X-axis adjusting mechanism and the Y-axis adjusting mechanism to enable the thickness measuring lens to be aligned to the wafer to be detected, and measuring the thickness parameters of different positions of each wafer.
The utility model has the beneficial effects that: compared with the prior art, the automatic detection device for the ceramic disc wafer provided by the utility model has the following advantages:
1) the detection device can meet the compatible detection requirements of products with various styles and different sizes, ensures the detection accuracy (the precision is as high as 99.99%), is a programmable test, can change the path of the position of the product to be tested, and can adapt to different products;
2) shooting through a positioning camera at the top of the frame for positioning; the three-axis adjusting mechanism (X axis, Y axis and Z axis) is controlled by system control software, the displacement distance is measured by the thickness measuring lens, and then the thickness parameter of the wafer is calculated by self-developed algorithm software;
3) therefore, the thickness of the wafer can be measured completely instead of manually, the stability and the precision are effectively improved, the system is simple and convenient to operate, and manual intervention is not needed.
Drawings
Fig. 1 is a schematic perspective view of a thickness detection mechanism according to the present invention.
Fig. 2 is a schematic top view of the thickness detection mechanism according to the present invention.
Fig. 3 is a schematic front structural view of the thickness detection mechanism provided in the present invention.
Fig. 4 is a schematic structural diagram of a Z-axis adjusting mechanism and a thickness measuring lens mechanism in the thickness detecting mechanism provided by the utility model.
Fig. 5 is a schematic structural diagram of an automatic detection device provided by the present invention.
Wherein, 1-X axis beam; 2-X axis slide rails; 3-Z axis adjusting mechanism; 4-X axis slide block; 5-X axis limiting block; 6-X axis beam fixing frame; 7-Y axis slide block; 8-Y axis beam; 9-Y axis slide rails; a 10-Y axis stop block; 11-a wafer; 12-a wafer stage; 13-a marble air floating platform; 14-a stage limiting frame; 15-adjusting the screw rod; 16-a regulating wheel; 17-carrying platform supporting seat; 18-thickness measuring lens; 19-lens holder plate; 20-Z axis slide; 21-Z axis chute plates; 22-Z axis connection plate; 23-Z axis fixing plate; 24-a frame; 25-universal wheels; 26-thickness detection mechanism.
Detailed Description
The utility model is further illustrated by the following specific examples. These examples are intended to illustrate the utility model and are not intended to limit the scope of the utility model.
Examples
As shown in fig. 1 to 5, an automatic detection device for a ceramic disc wafer comprises a frame 24, wherein a thickness detection mechanism 26 is arranged in the frame 24, and the thickness detection mechanism 26 comprises a marble air floating platform 13, a wafer carrying mechanism, an X-axis adjustment mechanism, a Y-axis adjustment mechanism, a Z-axis adjustment mechanism 3 and a thickness measurement lens mechanism; the marble air-floating platform 13 is arranged on the frame 24, and the marble air-floating platform 13 is provided with the rest components of the thickness detection mechanism 26; the wafer bearing mechanism is used for placing a wafer 11 to be detected; the thickness measuring lens mechanism realizes the adjustment in the X-axis direction, the Y-axis direction and the Z-axis direction through the X-axis adjusting mechanism, the Y-axis adjusting mechanism and the Z-axis adjusting mechanism 3 respectively; the X-axis adjusting mechanism, the Y-axis adjusting mechanism and the Z-axis adjusting mechanism 3 are all provided with corresponding linear motors and are automatically controlled by the control system according to system software; the bottom of the frame 24 is provided with universal wheels 25. An illuminating lamp bar (not shown) and a positioning camera (not shown) are further arranged at the top in the rack 24 of the automatic detection device; the illuminating lamp strip is convenient for better observing products; through the camera is shot in the location, better location is realized.
The wafer bearing mechanism comprises a wafer carrying platform 12, a carrying platform supporting seat 17 and a carrying platform limiting frame 14; the lower part of the wafer carrying platform 12 is connected with the carrying platform supporting seat 17; a stage adjusting mechanism for adjusting the wafer stage 12 in the Z-axis direction is arranged below the stage supporting seat 17, and the stage adjusting mechanism comprises an adjusting wheel 16 and an adjusting screw 15; the adjusting screw rod 15 is connected with the carrier support seat 17. When the adjusting wheel 16 is used, the adjusting screw rod is driven to ascend or descend by rotating the adjusting wheel, so that the purpose of adjusting the height of the wafer carrying platform 12 is achieved; in addition, the wafer stage 12 and the stage support base 17 are detachably connected; in actual detection, the detection requirements of the wafers 11 with different sizes and different shapes can be met.
The thickness measuring lens mechanism comprises a thickness measuring lens 18 and a lens fixing plate 19; the lens fixing plate 19 is connected to the Z-axis adjusting mechanism 3. The lens fixing plate 19 is L-shaped, a lens mounting hole is formed in one panel of the lens fixing plate 19, the thickness measuring lens 18 penetrates through the lens mounting hole, the mounting stability of the thickness measuring lens 18 is improved, and the detection quality is improved.
The Z-axis adjusting mechanism 3 comprises a Z-axis fixing plate 23, a Z-axis connecting plate 22 connected with the Z-axis fixing plate 23, a Z-axis chute plate 21 connected with the Z-axis connecting plate 22, and a Z-axis slider 20 which is matched with the Z-axis chute plate 21 and can linearly move along the Z-axis chute plate 21 in the Z-axis direction; the Z-axis slide block 20 is connected with the thickness measuring lens mechanism and drives the thickness measuring lens mechanism to move in the Z-axis direction; the Z-axis fixing plate 23 is connected with an X-axis sliding block 4 in the X-axis adjusting mechanism.
The X-axis adjusting mechanism comprises an X-axis beam 1, an X-axis slide rail 2 arranged in parallel with the X-axis beam 1, and an X-axis slide block 4 which is arranged above the X-axis beam 1 and can linearly move on a horizontal plane along the X-axis slide rail 2; the X-axis beam 1 is connected with a Y-axis slide block 7 in the Y-axis adjusting mechanism through an X-axis beam fixing frame 6; the X-axis sliding block 4 is connected with a Z-axis fixing plate 23 in the Z-axis adjusting mechanism 3, and drives the thickness measuring lens mechanism to move in the X-axis direction. And two ends of the X-axis beam 1 are respectively provided with an X-axis limiting block 5 for limiting the moving position of the X-axis sliding block 4 on the X-axis beam 1.
The Y-axis adjusting mechanism comprises two Y-axis cross beams 8, Y-axis slide rails 9 arranged in parallel with the Y-axis cross beams 8, and Y-axis slide blocks 7 which are arranged above the Y-axis cross beams 8 and can linearly move on a horizontal plane along the Y-axis slide rails 9; the Y-axis slide rail 9 is connected with the marble air floatation platform 13; and the Y-axis sliding block 7 is connected with an X-axis beam fixing frame 6 in the X-axis adjusting mechanism to drive the thickness measuring lens mechanism to move in the Y-axis direction. And Y-axis limiting blocks 10 are respectively arranged at two ends of the Y-axis beam 8 and used for limiting the moving position of the Y-axis slider 7 on the Y-axis beam 8.
The automatic detection device has the following working modes: firstly, a wafer 11 to be detected is placed on a wafer carrying platform 12 through automatic loading and unloading (can be equipped) loading, and the up-down position of the wafer carrying platform 12 can be adjusted through an adjusting platform adjusting mechanism according to needs; adjusting the Z-axis adjusting mechanism 3 to enable the thickness measuring lens 18 and the wafer 11 to be detected to be in a proper distance; and adjusting the X-axis adjusting mechanism and the Y-axis adjusting mechanism to enable the thickness measuring lens 18 to displace above the wafer 11 to be detected, and calculating the thickness of each wafer 11 through an algorithm.
The above embodiments are only for illustrating the present invention and not for limiting the present invention, and those skilled in the art can make various changes and modifications without departing from the spirit and scope of the present invention, therefore all equivalent technical solutions also belong to the scope of the present invention, and the protection scope of the present invention should be defined by the claims.
Claims (9)
1. The utility model provides a pottery dish wafer automatic checkout device which characterized in that: the automatic detection device comprises a rack, wherein a thickness detection mechanism is arranged in the rack and comprises a marble air floatation platform, a wafer bearing mechanism, an X-axis adjusting mechanism, a Y-axis adjusting mechanism, a Z-axis adjusting mechanism and a thickness measuring lens mechanism; the marble air-floating platform is arranged on the rack, and the marble air-floating platform is provided with the rest components of the thickness detection mechanism; the wafer bearing mechanism is used for placing a wafer to be detected; the thickness measuring lens mechanism realizes the adjustment in the X-axis direction, the Y-axis direction and the Z-axis direction through the X-axis adjusting mechanism, the Y-axis adjusting mechanism and the Z-axis adjusting mechanism respectively; the X-axis adjusting mechanism, the Y-axis adjusting mechanism and the Z-axis adjusting mechanism are all provided with corresponding linear motors and are automatically controlled by the control system according to system software; the bottom of the frame is provided with universal wheels.
2. The apparatus of claim 1, wherein: the wafer bearing mechanism comprises a wafer carrying platform, a carrying platform supporting seat and a carrying platform limiting frame; the lower part of the wafer carrying platform is detachably connected with the carrying platform supporting seat; a stage adjusting mechanism for adjusting the wafer stage in the Z-axis direction is arranged below the stage supporting seat, and the stage adjusting mechanism comprises an adjusting wheel and an adjusting screw rod; and the adjusting screw rod is connected with the carrying platform supporting seat.
3. The apparatus of claim 1, wherein: the thickness measuring lens mechanism comprises a thickness measuring lens and a lens fixing plate; the lens fixing plate is connected with the Z-axis adjusting mechanism.
4. The apparatus for automatically inspecting a ceramic disk wafer as set forth in claim 1, wherein: the Z-axis adjusting mechanism comprises a Z-axis fixing plate, a Z-axis connecting plate connected with the Z-axis fixing plate, a Z-axis chute plate connected with the Z-axis connecting plate, and a Z-axis sliding block which is matched with the Z-axis chute plate and can linearly move along the Z-axis chute plate in the Z-axis direction; the Z-axis sliding block is connected with the thickness measuring lens mechanism and drives the thickness measuring lens mechanism to move in the Z-axis direction; and the Z-axis fixing plate is connected with the X-axis adjusting mechanism.
5. The apparatus of claim 1, wherein: the X-axis adjusting mechanism comprises an X-axis beam, an X-axis slide rail arranged in parallel with the X-axis beam, and an X-axis slide block which is arranged above the X-axis beam and can linearly move on a horizontal plane along the X-axis slide rail; the X-axis beam is connected with the Y-axis adjusting mechanism through an X-axis beam fixing frame; the X-axis sliding block is connected with the Z-axis adjusting mechanism and drives the thickness measuring lens mechanism to move in the X-axis direction.
6. The apparatus of claim 5, wherein: and X-axis limiting blocks are respectively arranged at two ends of the X-axis beam.
7. The apparatus of claim 1, wherein: the Y-axis adjusting mechanism comprises two Y-axis cross beams, a Y-axis slide rail arranged in parallel with the Y-axis cross beams, and a Y-axis slide block which is arranged above the Y-axis cross beams and can linearly move on a horizontal plane along the Y-axis slide rail; the Y-axis slide rail is connected with the marble air floatation platform; and the Y-axis sliding block is connected with the X-axis adjusting mechanism and drives the thickness measuring lens mechanism to move in the Y-axis direction.
8. The apparatus of claim 7, wherein: and Y-axis limiting blocks are respectively arranged at two ends of the Y-axis beam.
9. The apparatus for automatically inspecting a ceramic disk wafer as set forth in claim 1, wherein: and an illuminating lamp bar and a positioning camera are also arranged in the rack of the automatic detection device.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202122383619.3U CN216977799U (en) | 2021-09-29 | 2021-09-29 | Automatic detection device for ceramic disc wafer |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202122383619.3U CN216977799U (en) | 2021-09-29 | 2021-09-29 | Automatic detection device for ceramic disc wafer |
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| CN216977799U true CN216977799U (en) | 2022-07-15 |
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| CN202122383619.3U Active CN216977799U (en) | 2021-09-29 | 2021-09-29 | Automatic detection device for ceramic disc wafer |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN116448027A (en) * | 2023-06-16 | 2023-07-18 | 浙江晶盛机电股份有限公司 | Wafer measurement system and wafer measurement method |
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- 2021-09-29 CN CN202122383619.3U patent/CN216977799U/en active Active
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN116448027A (en) * | 2023-06-16 | 2023-07-18 | 浙江晶盛机电股份有限公司 | Wafer measurement system and wafer measurement method |
| CN116448027B (en) * | 2023-06-16 | 2023-10-13 | 浙江晶盛机电股份有限公司 | Wafer measurement system and wafer measurement method |
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