CN216960370U - Automatic spot welding device of high-speed chip mounter - Google Patents
Automatic spot welding device of high-speed chip mounter Download PDFInfo
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- CN216960370U CN216960370U CN202123423302.4U CN202123423302U CN216960370U CN 216960370 U CN216960370 U CN 216960370U CN 202123423302 U CN202123423302 U CN 202123423302U CN 216960370 U CN216960370 U CN 216960370U
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Abstract
The utility model discloses an automatic spot welding device of a high-speed chip mounter, which comprises a supporting top plate, wherein the middle part of the supporting top plate is rotatably connected with a rotating shaft, the surface of the top end of the rotating shaft is fixedly connected with a rotating belt gear, the surface of the rotating belt gear is meshed with a triangular belt, the triangular belt is driven by a DD direct drive motor, and the surface of the rotating shaft, which is close to the bottom of the supporting top plate, is fixedly connected with a welding wire bundling plate. This high-speed chip mounter automatic spot welding device, through the surface of axis of rotation and be close to in the bottom fixedly connected with welding wire bundling plate of roof support, the bottom fixedly connected with melting welding iron pan of axis of rotation has solved current automatic spot welding device when using, can not realize the automatic spot welding of efficient, and the efficiency of electric welding is lower, and the time of processing circuit board is than longer, and current spot welding device can not a plurality of and welder welded problem simultaneously.
Description
Technical Field
The utility model relates to the technical field of automatic spot welding, in particular to an automatic spot welding device of a high-speed chip mounter.
Background
The domestic research on the automatic detection system of the printed circuit board starts from about the early and middle of the 90 s and is just started. The research institutes for this research are also relatively few, and the research on the automatic optical inspection system for the defects of the printed circuit board is still relatively early due to the influence of various factors. Since the price of the foreign automatic detection system of the printed circuit board is too expensive, and no automatic detection equipment of the printed circuit board is developed at home, most of the domestic circuit board manufacturers still adopt a method of manually checking the printed circuit board by using a magnifying glass or a projector for side detection. Because the labor intensity of manual inspection is high, the eyes are easy to be tired, and the missing inspection rate is very high. And with the development of miniaturization and digitalization of electronic products, the printed circuit board also develops high density and high precision, and the manual inspection method is basically not realized. For a circuit board with higher density and precision (0.12-0.10 mm), the inspection cannot be carried out at all. The detection means is lagged behind, so that the product percent of pass of domestic multilayer boards (8-12 layers) is only 50-60%.
When using, the existing automatic spot welding device can not realize efficient automatic spot welding, the efficiency of electric welding is lower, the time for processing a circuit board is longer, and the existing spot welding device can not be simultaneously welded with a welding gun, so that the automatic spot welding device for simultaneously welding multiple spot positions is urgently needed.
SUMMERY OF THE UTILITY MODEL
Aiming at the defects of the prior art, the utility model provides an automatic spot welding device of a high-speed chip mounter, which solves the problems that the existing automatic spot welding device cannot realize efficient automatic spot welding, the electric welding efficiency is low, the time for processing a circuit board is long, and a plurality of spot welding devices cannot be simultaneously welded with welding guns in use.
In order to achieve the purpose, the utility model is realized by the following technical scheme: the utility model provides a high-speed chip mounter automatic spot welding device, includes the roof support, the middle part of roof support rotates and is connected with the axis of rotation, the fixed surface on axis of rotation top is connected with and rotates belt gear, the meshing of surface that rotates belt gear has the V-belt, the V-belt directly drives motor drive by the DD, the surface of axis of rotation just is close to in the bottom fixedly connected with welding wire bundling plate of roof support, the bottom fixedly connected with fusion welding iron plate of axis of rotation, be equipped with the welding wire between the upper surface of fusion welding iron plate and the bottom of welding wire bundling plate, a plurality of soldered connections of a week fixedly connected with of the lower surface of fusion welding iron plate, and every the equal fixedly connected with in left side of soldered connection is apart from the inductor, the bottom fixedly connected with circuit board support frame of roof support.
Preferably, the top of circuit board support frame is fixedly connected with a plurality of electromagnetism telescopic links, and is a plurality of the equal fixedly connected with sucking disc in top of electromagnetism telescopic link.
Preferably, the welding head comprises a fixed block, the top of the fixed block is fixedly connected with the bottom of the fusion welding electrocautery plate, and a surface leather sleeve is fixed at the bottom of the fixed block.
Preferably, the bottom of the surface leather sheath is connected with a telescopic cylinder in a sliding mode, and the bottom of the telescopic cylinder is fixedly connected with a welding wire heating ring.
Preferably, the DD direct drive motor drive and the electromagnetic telescopic rod are controlled by the existing control assembly.
Preferably, the sucker is driven by an air pump, and the telescopic cylinder and the welding wire heating ring are controlled by a logic controller.
Advantageous effects
The utility model provides an automatic spot welding device of a high-speed chip mounter. Compared with the prior art, the method has the following beneficial effects:
(1) the automatic spot welding device of the high-speed chip mounter is characterized in that a rotating belt gear is fixedly connected to the surface of the top end of a rotating shaft, a triangular belt is meshed to the surface of the rotating belt gear and driven by a DD direct drive motor, a welding wire bundling plate is fixedly connected to the surface of the rotating shaft and close to the bottom of a supporting top plate, a fusion welding electric iron disc is fixedly connected to the bottom end of the rotating shaft, welding wires are arranged between the upper surface of the fusion welding electric iron disc and the bottom of the welding wire bundling plate, and a plurality of welding heads are fixedly connected to the periphery of the lower surface of the fusion welding electric iron disc, and the left side of each welding head is fixedly connected with a distance sensor, and the bottom of the supporting top plate is fixedly connected with a circuit board supporting frame, so that the problems that when the existing automatic spot welding device is used, the automatic spot welding device has the advantages that efficient automatic spot welding cannot be achieved, the efficiency of electric welding is low, the time for processing a circuit board is long, and the existing spot welding device cannot be used for simultaneously welding a plurality of spot welding devices and a welding gun.
Drawings
FIG. 1 is a schematic structural view of the present invention;
fig. 2 is a schematic structural diagram of the welding head of the present invention.
In the figure: 1-supporting top plate, 2-rotating shaft, 3-rotating belt gear, 4-triangular belt, 5-welding wire bundling plate, 6-welding wire, 7-fusion welding iron plate, 8-welding head, 801-fixing block, 802-surface leather sleeve, 803-telescopic cylinder, 804-welding wire heating ring, 9-distance inductor, 10-circuit board support frame, 11-electromagnetic telescopic rod and 12-sucking disc.
Detailed Description
The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
Referring to fig. 1-2, the present invention provides a technical solution: an automatic spot welding device of a high-speed chip mounter comprises a supporting top plate 1, wherein the middle part of the supporting top plate 1 is rotatably connected with a rotating shaft 2, the surface of the top end of the rotating shaft 2 is fixedly connected with a rotating belt gear 3, the surface of the rotating belt gear 3 is meshed with a triangular belt 4, the triangular belt 4 is driven by a DD direct drive motor, the surface of the rotating shaft 2 close to the bottom of the supporting top plate 1 is fixedly connected with a welding wire bundling plate 5, the bottom end of the rotating shaft 2 is fixedly connected with a fusion welding iron disc 7, a welding wire 6 is arranged between the upper surface of the fusion welding iron disc 7 and the bottom of the welding wire bundling plate 5, a plurality of welding heads 8 are fixedly connected to the periphery of the lower surface of the fusion welding iron disc 7, a distance inductor 9 is fixedly connected to the left side of each welding head 8, a circuit board supporting frame 10 is fixedly connected to the bottom of the supporting top plate 1, and the problem that when the existing automatic spot welding device is used is solved, the automatic spot welding device has the advantages that efficient automatic spot welding cannot be achieved, the efficiency of electric welding is low, the time for processing a circuit board is long, and the existing spot welding device cannot be used for simultaneously welding a plurality of spot welding guns.
The top fixedly connected with a plurality of electromagnetism telescopic links 11 of circuit board support frame 10, the equal fixedly connected with sucking disc 12 in top of a plurality of electromagnetism telescopic links 11.
The welding head 8 comprises a fixing block 801, the top of the fixing block 801 is fixedly connected with the bottom of the fusion welding electric iron plate 7, and a skin sleeve 802 is fixed at the bottom of the fixing block 801.
The bottom of the surface leather sheath 802 is connected with a telescopic cylinder 803 in a sliding way, and the bottom of the telescopic cylinder 803 is fixedly connected with a welding wire heating ring 804.
The DD direct drive motor drive and the electromagnetic telescopic rod 11 are controlled by the existing control assembly.
The suction cup 12 is driven by an air pump, and the telescopic cylinder 803 and the welding wire heating ring 804 are controlled by a logic controller.
During the use, use DD to directly drive motor drive V belt 4, the motion and the stop motion through the V belt rotate the motion of belt gear 3 and stop, thereby drive the rotational position of axis of rotation 2, reach the solder joint position of control fusion welding iron plate 7, judge the position apart from soldered connection 8 apart from the circuit board through distance inductor 9, make welding wire heating coil 804 be close to the circuit board solder joint through soldered connection 8 middle part expansion cylinder 803, it welds alright to making the solder joint weld through welding wire heating coil 804 heating welding wire 6, through a plurality of electromagnetic telescopic handle 11 supporting circuit boards on the circuit board support frame 10, the top of a plurality of electromagnetic telescopic handle 11 is through sucking disc 12 absorption fixed circuit board alright.
It is noted that, herein, relational terms such as first and second, and the like may be used solely to distinguish one entity or action from another entity or action without necessarily requiring or implying any actual such relationship or order between such entities or actions. Also, the terms "comprises," "comprising," or any other variation thereof, are intended to cover a non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements does not include only those elements but may include other elements not expressly listed or inherent to such process, method, article, or apparatus.
Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that changes, modifications, substitutions and alterations can be made in these embodiments without departing from the principles and spirit of the utility model, the scope of which is defined in the appended claims and their equivalents.
Claims (6)
1. The utility model provides a high-speed chip mounter automatic spot welding device, includes roof support (1), its characterized in that: the middle part of the supporting roof plate (1) is rotatably connected with a rotating shaft (2), the surface fixed on the top end of the rotating shaft (2) is connected with a rotating belt gear (3), the surface of the rotating belt gear (3) is meshed with a triangular belt (4), the triangular belt (4) is directly driven by a DD (direct drive) motor, the surface of the rotating shaft (2) is close to the bottom of the supporting roof plate (1) and is fixedly connected with a welding wire bundling plate (5), the bottom of the rotating shaft (2) is fixedly connected with a fusion welding iron disc (7), a welding wire (6) is arranged between the upper surface of the fusion welding iron disc (7) and the bottom of the welding wire bundling plate (5), a circle of the lower surface of the fusion welding iron disc (7) is fixedly connected with a plurality of welding heads (8), and each welding head (8) is fixedly connected with a distance sensor (9) on the left side, the bottom of the supporting top plate (1) is fixedly connected with a circuit board supporting frame (10).
2. The automatic spot welding device of the high-speed chip mounter according to claim 1, wherein: the top fixedly connected with a plurality of electromagnetism telescopic links (11) of circuit board support frame (10), it is a plurality of the equal fixedly connected with sucking disc (12) in top of electromagnetism telescopic link (11).
3. The automatic spot welding device of the high-speed chip mounter according to claim 1, wherein: the welding head (8) comprises a fixing block (801), the top of the fixing block (801) is fixedly connected with the bottom of the fusion welding electrocautery disc (7), and a surface leather sleeve (802) is fixed at the bottom of the fixing block (801).
4. The automatic spot welding device of the high-speed chip mounter according to claim 3, wherein: the bottom of the surface leather sheath (802) is connected with a telescopic cylinder (803) in a sliding mode, and the bottom of the telescopic cylinder (803) is fixedly connected with a welding wire heating ring (804).
5. The automatic spot welding device of the high-speed chip mounter according to claim 1 or 2, wherein: the DD direct drive motor drive and the electromagnetic telescopic rod (11) are controlled by the existing control assembly.
6. The automatic spot welding device of the high-speed chip mounter according to claim 2, wherein: the sucker (12) is driven by an air pump.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202123423302.4U CN216960370U (en) | 2021-12-31 | 2021-12-31 | Automatic spot welding device of high-speed chip mounter |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202123423302.4U CN216960370U (en) | 2021-12-31 | 2021-12-31 | Automatic spot welding device of high-speed chip mounter |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN216960370U true CN216960370U (en) | 2022-07-12 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202123423302.4U Active CN216960370U (en) | 2021-12-31 | 2021-12-31 | Automatic spot welding device of high-speed chip mounter |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN216960370U (en) |
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2021
- 2021-12-31 CN CN202123423302.4U patent/CN216960370U/en active Active
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