CN216955801U

CN216955801U - Modularization back scattering imager

Info

Publication number: CN216955801U
Application number: CN202123125236.2U
Authority: CN
Inventors: 朱伟平; 黄翌敏; 王晓丹
Original assignee: Yirui Image Technology Chengdu Co ltd
Current assignee: Yirui Image Technology Chengdu Co ltd
Priority date: 2021-12-13
Filing date: 2021-12-13
Publication date: 2022-07-12
Anticipated expiration: 2031-12-13

Abstract

The utility model provides a modular backscatter imager, comprising a handheld backscatter imager and a plurality of modular detectors; the handheld backscatter imager comprises a first shell, and an X-ray machine, a chopping mechanism, a backscatter detector, a power module, a first power board, a central control board and a display screen which are arranged in the first shell; a plurality of modularization detectors are installed in the outside of first shell through fixed mounting structure respectively, and still are provided with the hardware interface between modularization detector and the first shell, and the modularization detector passes through the hardware interface and is connected with central control panel communication. According to the utility model, the modular detector array is spliced on the handheld backscatter imager through the fixed mounting structure and the communication interface, so that the imaging area of the backscatter detector is expanded, the receiving rate of a scattered signal is improved, the sensitivity and the imaging resolution of the backscatter imager are further improved, and the accuracy of backscatter imaging detection is greatly improved.

Description

Modularization back scattering imager

Technical Field

The utility model belongs to the technical field of radiation imaging safety inspection, and particularly relates to a modular backscatter imager.

Background

The X-ray back scattering imaging technology is an imaging technology for obtaining a substance image in a certain depth on the surface of a detected target by detecting the intensity of X-ray scattering of different substances, and is characterized in that: the radiation source and the detector are arranged at the same side of the detected object, the back scattering signal is related to the atomic number and density/electron density of the substance, the signal can highlight the organic matters, and the method is very suitable for imaging and checking of the organic matters such as explosives, drugs and the like. Therefore, vehicle-mounted imaging equipment, container fixed backscatter imaging scanners, human security backscatter imaging scanners and the like based on the backscatter imaging principle are heavily equipped by customs and public security frontiers.

In recent years, with the advancement of radiation source technology, miniaturized high-energy ray tubes have been developed, making it possible to make backscatter imagers portable and hand-held. The handheld back scattering imager has the advantages of small volume, light weight, portability and capability of being close to the target in-situ inspection, and great convenience is brought to security personnel and public security frontier personnel for favouring. However, when the backscatter imaging instrument is miniaturized, the detection area of the detector is greatly reduced, and the receiving intensity of the backscatter signal is reduced, so that the imaging resolution and the signal-to-noise ratio of the backscatter imaging instrument are reduced.

In the technical scheme of the handheld backscatter imaging, the volume and the shape of a backscatter imaging detector are solidified in the development process, and the photosensitive area of a detection system is small, so that the imaging resolution and the signal-to-noise ratio of the handheld backscatter imaging instrument are limited, the accuracy of backscatter imaging inspection is further influenced, and even forbidden targets are missed to be inspected under certain special disguised detection conditions.

Therefore, there is a need to provide an improved solution to the above-mentioned deficiencies of the prior art.

SUMMERY OF THE UTILITY MODEL

In view of the above drawbacks of the prior art, an object of the present invention is to provide a modular backscatter imager, which is used to solve the problems that the backscatter imager in the prior art is miniaturized, and meanwhile, the detection area of a backscatter detector is greatly reduced, the receiving intensity of a backscatter signal is reduced, so that the imaging resolution and the signal-to-noise ratio of the backscatter imager are limited, and the accuracy of backscatter imaging inspection is affected.

To achieve the above and other related objects, the present invention provides a modular backscatter imager comprising a handheld backscatter imager and a plurality of modular detectors;

the handheld backscatter imager comprises a first shell, and an X-ray machine, a chopping mechanism, a backscatter detector, a power module, a first power board, a central control board and a display screen which are arranged in the first shell;

wherein the X-ray machine is used for generating ray beams; the chopping mechanism is arranged in front of the X-ray machine; the back scattering detector is positioned in front of the chopping mechanism and used for receiving a scattering signal of the surface of the measured object; the power supply module is connected with the first power supply board and provides power for the X-ray machine, the chopping mechanism, the back scattering detector and the central control panel through the first power supply board; the central control panel is respectively connected with the X-ray machine, the chopping mechanism and the back scattering detector; the display screen is used for providing a human-computer interaction interface, and the display screen is connected with the central control panel and used for receiving and displaying the image reconstructed by the central control panel.

The modularized detectors are respectively installed outside the first shell through fixed installation structures, a hardware interface is further arranged between each modularized detector and the first shell, and the modularized detectors are in communication connection with the central control panel through the hardware interfaces.

Preferably, the backscatter detector comprises a plurality of first scintillators, a plurality of first photoelectric conversion devices, a first amplification conditioning circuit and a first sampling ADC circuit which are arranged in sequence;

wherein, it is a plurality of first photoelectric conversion device respectively with a plurality of first scintillation body corresponds the connection setting, first enlarged conditioning circuit and first sampling ADC circuit all pass through first power strip with power module connects, first sampling ADC circuit with central control panel communication is connected, central control panel is used for carrying out data preprocessing and figure reconstruction to the process digital signal after first sampling ADC circuit analog-to-digital conversion.

Preferably, the power module includes a first power supply battery and a charge and discharge management circuit, the charge and discharge management circuit is connected to the first power supply battery, and the charge and discharge management circuit is used for protecting overvoltage and overcurrent protection during charge and discharge of the first power supply battery.

Preferably, the modular detector comprises a second shell, and a second scintillator, a second photoelectric conversion device, a second amplification conditioning circuit, a second sampling ADC circuit, a second power panel and a second power supply battery which are sequentially arranged in the second shell;

the second power supply battery is connected with the second power supply board and supplies power to the second photoelectric conversion device, the second amplification conditioning circuit and the second sampling ADC circuit through the second power supply board; the second sampling ADC circuit is in communication connection with the central control panel through the hardware interface and transmits the digital signals after analog-to-digital conversion to the central control panel.

Preferably, the modular detector further comprises a status indicating circuit for indicating the operating status of the modular detector and the communication status of the modular detector with the central control panel.

Preferably, the handheld backscatter imager further comprises a motion sensor, a camera assembly and a contour indicator light, wherein the motion sensor, the camera assembly and the contour indicator light are all connected with the first power panel and the central control panel;

the motion sensor comprises an acceleration sensor and a gyroscope, the acceleration sensor is used for measuring the speed and the acceleration of the handheld backscatter imager in the scanning process, and the gyroscope is used for measuring the angle and the direction of the handheld backscatter imager when the handheld backscatter imager moves in a three-dimensional space;

the camera shooting assembly comprises a camera and a flash lamp and is used for shooting a measured object to obtain evidence;

the contour indicator lights are distributed on two sides of the back scattering detector and used for displaying or assisting in judging the area information of the measured object.

Preferably, the chopping mechanism comprises a sector collimator, a driving motor and a chopping collimator which are sequentially arranged, wherein a collimating slit is arranged on the sector collimator, a plurality of chopping slits are arranged on the chopping collimator, the driving motor is used for driving the chopping collimator, and a ray bundle sequentially passes through the collimating slit and the chopping collimator to form flying spots;

the fan-shaped collimator and the chopping collimator are made of Pb, Cu or W, and the width of the collimating slit and the width of the chopping slit are 0.1-0.5 mm.

Preferably, the hardware interface is an LVDS signaling interface.

Preferably, the angle between the plane of the modular detector and the plane of the backscatter detector is 0 ° to 90 °.

Preferably, the handheld backscatter imager further comprises a WiFi module and a bluetooth transmission module.

As described above, the modular backscatter imager of the present invention has the following advantages:

the utility model provides a modularized backscatter imager, which comprises a handheld backscatter imager and a plurality of modularized detectors, wherein the plurality of modularized detectors are respectively arranged on the periphery of the handheld backscatter imager through fixed mounting structures, the modularized detectors are in communication connection with a central control panel in the handheld backscatter imager through hardware interfaces, and the modularized detector arrays are spliced on the handheld backscatter imager through the fixed mounting structures and the communication interfaces, so that the imaging area of the backscatter detectors is expanded, the receiving rate of scattered signals is improved, the sensitivity and the imaging resolution of the backscatter imager are improved, and the accuracy of backscatter imaging detection is greatly improved.

A power supply module in the handheld backscatter imaging instrument is connected with a first power supply board, and the arrangement of the first power supply board can provide corresponding working voltage for each element in an orderly controlled manner; the arrangement of the speed sensor, the camera assembly and the contour indicator lamp further assists and corrects the inspection image; a plurality of modular detectors are expanded on the handheld backscatter imager, signals generated by the modular detectors are rapidly transmitted to a central control panel in real time in a lossless manner through an LVDS signal transmission interface and are superposed with signals of the backscatter detectors, and then the central control panel performs preprocessing and image reconstruction on the signals, so that the inspection accuracy of the imager is improved; the materials of the sector collimator and the chopping collimator are Pb, Cu or W, so that the X-ray can be effectively shielded under a lower thickness, and a higher image resolution and a lower radiation dose rate can be obtained; the included angle between the plane of the modular detector and the plane of the back scattering detector can be freely adjusted, so that the detection range of the modular back scattering imager is greatly improved; in addition, due to the arrangement of the WiFi module and the Bluetooth transmission module, uploading and interaction of detection images of a detected object are facilitated.

Drawings

Fig. 1 shows a schematic structural diagram of a modular detector according to an embodiment of the present invention.

Fig. 2 is a schematic diagram of a schematic structure of a handheld backscatter imager in an embodiment of the utility model.

Fig. 3 is a schematic diagram of a schematic structure of a modular backscatter imager in an embodiment of the utility model.

Fig. 4 is a schematic diagram illustrating a first perspective structure of the handheld backscatter imager in an embodiment of the utility model.

Fig. 5 is a schematic diagram illustrating a second viewing angle of the handheld backscatter imager in an embodiment of the utility model.

Fig. 6 is a schematic diagram of a modular backscatter imager in accordance with an embodiment of the utility model.

Fig. 7 is a schematic diagram of another configuration of a modular backscatter imager in an embodiment of the utility model.

Description of the element reference numerals

100 modular probe

101 second scintillator

102 second photoelectric conversion device

103 second amplifying and conditioning circuit

104 second sampling ADC circuit

105 second power supply board

106 second power supply battery

107 second housing

200 hand-held backscatter imager

201X-ray machine

202 chopping mechanism

2021 sector collimator

2022 drive motor

2023 chopping collimator

203 backscatter detector

2031A first scintillator

2032 first photoelectric conversion device

2033 first amplifying and conditioning circuit

2034 first sampling ADC circuit

204 power supply module

2041 first power supply battery

2042 charging and discharging management circuit

205 central control panel

206 first power supply board

207 display screen

208 first housing

209 motion sensor

210 camera assembly

211 outline indicating lamp

Detailed Description

The following description of the embodiments of the present invention is provided for illustrative purposes, and other advantages and effects of the present invention will become apparent to those skilled in the art from the present disclosure.

Please refer to fig. 1 to 7. It should be understood that the structures, ratios, sizes, and the like shown in the drawings and described in the specification are only used for matching with the disclosure of the specification, so as to be understood and read by those skilled in the art, and are not used to limit the conditions under which the present invention can be implemented, so that the present invention has no technical significance, and any structural modification, ratio relationship change, or size adjustment should still fall within the scope of the present invention without affecting the efficacy and the achievable purpose of the present invention. In addition, the terms "upper", "lower", "left", "right", "middle" and "one" used in the present specification are for clarity of description, and are not intended to limit the scope of the present invention, and the relative relationship between the terms and the terms is not to be construed as a scope of the present invention.

It should be noted that the drawings provided in the present embodiment are only for illustrating the basic idea of the present invention, and the drawings only show the components related to the present invention rather than being drawn according to the number, shape and size of the components in actual implementation, and the type, quantity and proportion of each component in actual implementation may be changed freely, and the layout of the components may be more complicated.

The utility model provides a modularized backscatter imager, which comprises a handheld backscatter imager and a plurality of modularized detectors, wherein the plurality of modularized detectors are respectively arranged on the periphery of the handheld backscatter imager through fixed mounting structures and are in communication connection with a central control panel in the handheld backscatter imager through hardware interfaces; a power supply module in the handheld backscatter imaging instrument is connected with a first power supply board, and the arrangement of the first power supply board can provide corresponding working voltage for each element in an orderly controlled manner; the arrangement of the speed sensor, the camera assembly and the contour indicator lamp further assists and corrects the inspection image; a plurality of modular detectors are expanded on the handheld backscatter imager, signals generated by the modular detectors are rapidly transmitted to a central control panel in real time in a lossless manner through an LVDS signal transmission interface and are superposed with signals of the backscatter detectors, and then the central control panel performs preprocessing and image reconstruction on the signals, so that the inspection accuracy of the imager is improved; the materials of the sector collimator and the chopping collimator are Pb, Cu or W, so that the X-ray can be effectively shielded under a lower thickness, and a higher image resolution and a lower radiation dose rate can be obtained; the included angle between the plane of the modular detector and the plane of the back scattering detector can be freely adjusted, so that the detection range of the modular back scattering imager is greatly improved; in addition, due to the arrangement of the WiFi module and the Bluetooth transmission module, uploading and interaction of detection images of a detected object are facilitated.

Referring to fig. 1-7, the present invention provides a modular backscatter imager comprising a handheld backscatter imager 200 and a plurality of modular detectors 100; the handheld backscatter imager 200 comprises a first housing 208, and an X-ray machine 201, a chopping mechanism 202, a backscatter detector 203, a power module 204, a first power board 206, a central control board 205 and a display screen 207 which are arranged in the first housing 208; wherein, the X-ray machine 201 is used for generating ray beams; the chopper mechanism 202 is provided in front of the X-ray machine 201; the back scattering detector 203 is positioned in front of the chopping mechanism 202 and is used for receiving the scattering signal of the surface of the measured object; the power module 204 is connected with the first power board 206 and supplies power to the X-ray machine 201, the chopper mechanism 202, the backscatter detector 203 and the central control board 205 through the first power board 206; the central control board 205 is respectively connected with the X-ray machine 201, the chopping mechanism 202 and the back scattering detector 203; the display screen 207 is used for providing a human-computer interaction interface, and the display screen 207 is connected with the central control panel 205 and used for receiving and displaying the image reconstructed by the central control panel 205.

The plurality of modular detectors 100 are respectively mounted outside the first housing 208 through a fixed mounting structure, a hardware interface is further arranged between the modular detectors 100 and the first housing 208, and the modular detectors 100 are in communication connection with the central control board 205 through the hardware interface.

Specifically, the central control board 205 controls the X-ray machine 201 to generate a conical or fan-shaped X-ray beam, and controls the chopper mechanism 202 to rotate at a high speed or reciprocate, the X-ray beam passes through the chopper mechanism 202 to form continuous flying spots, when the flying spots are projected onto the surface of the object to be measured, the flying spots generate compton backscattering with electrons in the object to be measured, the scattered photons are received by the backscattering detector 203, photon signals are converted into voltage signals, and the voltage signals are transmitted to the central control board 205 after signal processing.

In the present embodiment, the receiving surface of the backscatter detector 203 is located at the foremost end of the handheld backscatter imager 200, and is configured to receive a scattered signal of the surface of the object to be measured; the central control board 205 is used for controlling and executing data communication, data preprocessing and image reconstruction of the X-ray machine 201, the chopper motor and the backscatter detector 203.

Specifically, the conventional size of the backscatter detector 203 is generally within 20cm × 20cm, but for the shortage of the detection space, the resolution and the detection sensitivity of the backscatter detector 203 of the conventional size for compton imaging cannot achieve a good detection effect, and for improving the imaging index of the handheld backscatter imager 200, the compton imaging is realized by increasing the area of the compton scatter detector, that is, in this embodiment, a plurality of modular detectors 100 are extended on the handheld backscatter imager 200, signals generated by the modular detectors 100 need to be rapidly transmitted to the central control board 205 in real time, and signals of the backscatter detector 203 are superimposed, and then preprocessing and graphic reconstruction are performed, and finally, an image is displayed on the display screen 207.

Specifically, the first housing 208 and the modular probe 100 are provided with fixed mounting structures for mounting and fixing each other, and further provided with hardware interfaces for data and signal transmission between data of the modular probe 100 and the central control board 205, and the number and mounting positions of the modular probes 100 mounted on the first housing 208 may be adjusted according to practical applications, which is not limited herein; preferably, the first housing 208 is a plastic-bonded sheet metal structure that facilitates mounting and fixing the modular probe 100 and the various components disposed within the first housing 208.

As an example, the backscatter detector 203 includes a plurality of first scintillators 2031, a plurality of first photoelectric conversion devices 2032, a first amplification conditioning circuit 2033, and a first sampling ADC circuit 2034, which are arranged in this order; the plurality of first photoelectric conversion devices 2032 are respectively connected to the plurality of first scintillators 2031, the first amplification conditioning circuit 2033 and the first sampling ADC circuit 2034 are both connected to the power supply module 204 via the first power board 206, the first sampling ADC circuit 2034 is in communication connection with the central control board 205, and the central control board 205 is configured to perform data preprocessing and image reconstruction on the digital signal analog-to-digital converted by the first sampling ADC circuit 2034.

Specifically, the pencil beam impinging on the object to be measured and the extra-nuclear electrons inside the object to be measured generate a reverse compton scattering effect, so that the photon movement direction and the original incident direction are deflected by more than 90 °, the deflected scattered photons are received by the first scintillator 2031 in the backscatter detector 203 to generate fluorescence or phosphorescence, the generated fluorescence or phosphorescence is reflected by the reflective layer, received by the first photoelectric conversion device 2032 and converted into a current signal, and then filtered, shaped and processed by the first amplification conditioning circuit 2033 connected to the first photoelectric conversion device 2032, and then analog-to-digital converted by the first sampling ADC circuit 2034 and transmitted to the central control board 205, and corresponding data preprocessing and graphic reconstruction are performed in the central control board 205, and finally an image is presented on the display screen 207.

Preferably, the first scintillator 2031 is CaWO₄One or a combination of GOS and CsI, the first photoelectric conversion device 2032 is a photomultiplier tube (PMT) or a silicon photomultiplier tube (SiPM); the first amplification conditioning circuit 2033 is used for shaping, filtering and amplifying the voltage signal output by the photoelectric conversion device; the ADC is a common Analog-to-Digital Converter (ADC) or Analog-to-Digital Converter, and the ADC can convert a continuous variable Analog signal into a discrete Digital signal, such as temperature, pressure, sound or image, and convert the discrete Digital signal into a Digital signal which can be stored, processed or transmitted more easily.

As an example, the power module 204 includes a first power supply battery 2041 and a charging and discharging management circuit 2042, the charging and discharging management circuit 2042 is connected to the first power supply battery 2041, and the charging and discharging management circuit 2042 is configured to protect overvoltage and overcurrent protection during charging and discharging of the first power supply battery 2041.

Specifically, a charging input end of the charging and discharging management circuit 2042 is provided with a charging port, a charging output end of the charging and discharging management circuit 2042 is connected with the first power supply battery 2041, the charging port is connected with a power supply, and the first power supply battery 2041 is charged through the charging and discharging management circuit 2042; the discharge output end of the first power supply battery 2041 is connected with the discharge input end of the charge and discharge management circuit 2042, and the discharge output end of the charge and discharge management circuit 2042 is connected with the first power board 206, and provides corresponding working voltages for the X-ray machine 201, the chopper mechanism 202, the backscatter detector 203 and the central control board 205 in order and controlled by the first power board 206; in this embodiment, preferably, the first power supply battery 2041 is a lithium battery.

As an example, referring to fig. 1, the modular detector 100 includes a second housing 107, and a second scintillator 101, a second photoelectric conversion device 102, a second amplification conditioning circuit 103, a second sampling ADC circuit 104, a second power board 105, and a second power supply battery 106 sequentially disposed in the second housing 107; the second power supply battery 106 is connected to the second power supply board 105, and supplies power to the second photoelectric conversion device 102, the second amplification and conditioning circuit 103, and the second sampling ADC circuit 104 through the second power supply board 105; the second sampling ADC circuit 104 is in communication connection with the central control board 205 through a hardware interface, and transmits the digital signal after analog-to-digital conversion to the central control board 205.

Specifically, the pencil-shaped ray beam impinging on the object to be measured and the extra-nuclear electrons inside the object to be measured generate a reverse compton scattering effect, so that the photon movement direction and the original incident direction generate deflection of more than 90 degrees, the deflected scattered photons are received by the second scintillator 101 to generate fluorescence or phosphorescence, the generated fluorescence or phosphorescence is reflected by the reflecting layer, received by the second photoelectric conversion device 102 and converted into a current signal, then the current signal is filtered, shaped and processed by the second amplification conditioning circuit 103 connected with the second photoelectric conversion device 102, then the analog-to-digital conversion is performed by the second sampling ADC circuit 104, and then the current signal is transmitted to the central control board 205, and the signal transmitted to the central control board 205 by the backscatter detector 203 is superimposed, and then preprocessing and graph reconstruction are performed. Preferably, the second scintillator 101 is CaWO₄One or a combination of GOS and CsI, and the second photoelectric conversion device 102 is a photomultiplier tube (PMT) or a silicon photomultiplier tube (SiPM).

Illustratively, the modular probe 100 further includes status indicating circuitry for indicating the operational status of the modular probe 100 and the communication status of the modular probe 100 with the central control board 205.

As an example, referring to fig. 2, the handheld backscatter imager 200 further includes a motion sensor 209, a camera assembly 210, a contour indicator 211 and a display screen 207, wherein the motion sensor 209, the camera assembly 210 and the contour indicator 211 are all connected to the first power board 206 and the central control board 205; the motion sensor 209 includes an acceleration sensor and a gyroscope, the acceleration sensor is used for measuring the speed and the acceleration of the handheld backscatter imager 200 during the scanning process, and the gyroscope is used for measuring the angle and the direction of the handheld backscatter imager 200 during the movement in the three-dimensional space; the camera assembly 210 comprises a camera and a flash lamp and is used for taking a picture of a measured object to obtain evidence; the contour indicator 211 is disposed on both sides of the backscatter detector 203 for displaying or assisting in determining the area information of the object to be measured.

Specifically, the position of the handheld backscatter imager 200 in a three-dimensional space at any time in the scanning process and the motion trajectory information can be obtained through cooperative recording of the acceleration sensor and the gyroscope, so that the scanning angle of the receiving surface of the backscatter detector facing the surface of the object to be detected at each time is determined, and meanwhile, the finally presented inspection image is corrected by using the scanning acceleration and the angle direction recorded by the acceleration sensor and the gyroscope.

Specifically, the pictures obtained by the camera assembly 210 for taking a picture of the object to be measured and obtaining evidence are transmitted to the central control board 205, and are correlated with the images reconstructed by the handheld backscatter imager 200, but the specific structure and the number of the camera assembly 210 are not limited herein, and preferably, the camera assembly 210 is disposed in front of the backscatter detector 203.

As an example, the chopping mechanism 202 includes a sector collimator 2021, a drive motor 2022, and a chopping collimator 2023, which are arranged in this order; a collimating slit is formed in the fan-shaped collimator 2021, a plurality of chopping slits are formed in the chopping collimator 2023, the driving motor 2022 is used for driving the chopping collimator 2023, and the ray bundles sequentially penetrate through the collimating slit and the chopping slits to form flying spots; the material of the fan-shaped collimator 2021 and the chopping collimator 2023 is Pb, Cu or W, and the widths of the collimating slits and the chopping slits are 0.1-0.5 mm, such as 0.1mm, 0.2mm, 0.3mm, 0.4mm and 0.5 mm.

Specifically, a conical X-ray beam generated by the X-ray machine 201 passes through a fan-shaped collimator 2021 to form a 0.1-0.5 mm sheet-shaped fan-shaped X-ray beam, in order to obtain a periodically scanned pencil-shaped X-ray beam, a chopping collimator 2023 is arranged right in front of the fan-shaped X-ray beam, and the movement mode of the chopping collimator 2023 can be a flywheel structure in which a plurality of chopping slits are arranged at equal angles on the circumference, or a shielding plate structure in which the chopping slits are arranged at equal intervals and driven by a high-speed electric cylinder; the chopping collimator 2023 forms a periodically reciprocating intersection point with the chopping slit in the periodic motion process, and transmits a periodically moving pencil-shaped ray beam; but is not overly limited herein with respect to the number of chopping slits; preferably, the driving motor 2022 in this embodiment is a dc brushless motor, and is used for driving the chopping collimator 2023 at a constant speed.

Specifically, the material of the sector collimator 2021 and the chopper collimator 2023 is Pb, Cu, or W, which can effectively shield X-rays at a low thickness; preferably, the collimating slit of the fan collimator 2021 is vertically disposed right in front of the focal point of the radiation source to obtain higher image resolution and low radiation dose rate, although in other embodiments, the collimating slit of the fan collimator 2021 may be disposed at other positions, but the presented image resolution and radiation dose rate may be affected, and no limitation is made herein regarding the positional relationship between the collimating slit and the radiation source.

Specifically, the pencil beam impinging on the object to be measured and the extra-nuclear electrons inside the object to be measured generate a reverse compton scattering effect, so that the photon movement direction and the original incident direction are deflected by more than 90 °, the deflected X-rays are received by the first scintillator 2031 in the backscatter detector 203 to generate fluorescence or phosphorescence, the generated fluorescence or phosphorescence is reflected by the reflective layer, received by the first photoelectric conversion device 2032, converted into a current signal, filtered, shaped and processed by the first amplification conditioning circuit 2033 connected to the first photoelectric conversion device 2032, analog-to-digital converted by the first sampling ADC circuit 2034, and transmitted to the central control board 205, and the central control board 205 performs corresponding data preprocessing and graphic reconstruction, and finally presents an image on the display screen 207.

As an example, the hardware interface is an LVDS signaling interface.

Specifically, the signal transmission between the modular detector 100 and the central control board 205 is performed through an LVDS signal transmission interface, so that the signal generated by the expanded modular detector 100 can be quickly transmitted to the central control board 205 in real time without loss, and can be superimposed with the signal output by the backscatter detector 203.

As an example, the angle between the plane of the modular detector 100 and the plane of the backscatter detector 203 is 0 ° to 90 °, such as 0 °, 30 °, 45 °, 60 °, 90 °.

As an example, the handheld backscatter imager 200 also includes a WiFi module and a bluetooth transmission module.

Specifically, due to the arrangement of the WiFi module and the Bluetooth transmission module, the detected image of the detected object can be uploaded and interacted conveniently.

In summary, the utility model provides a modular backscatter imager, which comprises a handheld backscatter imager and a plurality of modular detectors, wherein the plurality of modular detectors are respectively installed around the handheld backscatter imager through a fixed installation structure, are in communication connection with a central control panel in the handheld backscatter imager through hardware interfaces, and realize splicing of modular detector arrays on the handheld backscatter imager through the fixed installation structure and the communication interfaces, so that the imaging area of the backscatter detector is expanded, the receiving rate of a scattered signal is improved, the sensitivity and the imaging resolution of the backscatter imager are improved, and the accuracy of backscatter imaging detection is greatly improved; a power supply module in the handheld backscatter imaging instrument is connected with a first power supply board, and the arrangement of the first power supply board can provide corresponding working voltage for each element in an orderly controlled manner; the arrangement of the speed sensor, the camera assembly and the contour indicator lamp further assists and corrects the inspection image; a plurality of modular detectors are expanded on the handheld backscatter imager, signals generated by the modular detectors are rapidly transmitted to a central control panel in real time in a lossless manner through an LVDS signal transmission interface and are superposed with signals of the backscatter detectors, and then the central control panel performs preprocessing and image reconstruction on the signals, so that the inspection accuracy of the imager is improved; the materials of the sector collimator and the chopping collimator are Pb, Cu or W, so that the X-ray can be effectively shielded under a lower thickness, and a higher image resolution and a lower radiation dose rate can be obtained; the included angle between the plane of the modular detector and the plane of the back scattering detector can be freely adjusted, so that the detection range of the modular back scattering imager is greatly improved; in addition, due to the arrangement of the WiFi module and the Bluetooth transmission module, uploading and interaction of detection images of a detected object are facilitated. Therefore, the utility model effectively overcomes various defects in the prior art and has high industrial utilization value.

The foregoing embodiments are merely illustrative of the principles and utilities of the present invention and are not intended to limit the utility model. Any person skilled in the art can modify or change the above-mentioned embodiments without departing from the spirit and scope of the present invention. Accordingly, it is intended that all equivalent modifications or changes which can be made by those skilled in the art without departing from the spirit and technical spirit of the present invention be covered by the claims of the present invention.

Claims

1. A modular backscatter imager, wherein the modular backscatter imager comprises a handheld backscatter imager and a plurality of modular detectors;

wherein, the X-ray machine is used for generating ray beams; the chopping mechanism is arranged in front of the X-ray machine; the back scattering detector is positioned in front of the chopping mechanism and used for receiving a scattering signal of the surface of the measured object; the power supply module is connected with the first power supply board and provides power for the X-ray machine, the chopping mechanism, the back scattering detector and the central control panel through the first power supply board; the central control panel is respectively connected with the X-ray machine, the chopping mechanism and the back scattering detector; the display screen is used for providing a human-computer interaction interface, is connected with the central control panel and is used for receiving and displaying the image reconstructed by the central control panel;

2. The modular backscatter imager of claim 1, wherein: the backscatter detector comprises a plurality of first scintillators, a plurality of first photoelectric conversion devices, a first amplification conditioning circuit and a first sampling ADC circuit which are sequentially arranged;

3. The modular backscatter imager of claim 1, wherein: the power module comprises a first power supply battery and a charge and discharge management circuit, the charge and discharge management circuit is connected with the first power supply battery, and the charge and discharge management circuit is used for protecting overvoltage and overcurrent protection in the charge and discharge process of the first power supply battery.

4. The modular backscatter imager of claim 1, wherein: the modularized detector comprises a second shell, and a second scintillator, a second photoelectric conversion device, a second amplification conditioning circuit, a second sampling ADC circuit, a second power panel and a second power supply battery which are sequentially arranged in the second shell;

the second power supply battery is connected with the second power supply board and supplies power to the second photoelectric conversion device, the second amplification conditioning circuit and the second sampling ADC circuit through the second power supply board; the second sampling ADC circuit is in communication connection with the central control panel through the hardware interface and transmits digital signals after analog-to-digital conversion to the central control panel.

5. The modular backscatter imager of claim 4, wherein: the modularized detector also comprises a state indicating circuit, and the state indicating circuit is used for indicating the working state of the modularized detector and the communication state of the modularized detector and the central control panel.

6. The modular backscatter imager of claim 1, wherein: the handheld backscatter imager further comprises a motion sensor, a camera assembly and a contour indicator light, wherein the motion sensor, the camera assembly and the contour indicator light are all connected with the first power panel and the central control panel;

7. The modular backscatter imager of claim 1, wherein: the chopping mechanism comprises a sector collimator, a driving motor and a chopping collimator which are sequentially arranged, wherein a collimating slit is arranged on the sector collimator, a plurality of chopping slits are arranged on the chopping collimator, the driving motor is used for driving the chopping collimator, and a ray bundle sequentially penetrates through the collimating slit and the chopping collimator to form flying spots;

the material of the fan-shaped collimator and the chopping collimator is Pb, Cu or W, and the width of the collimating slit and the width of the chopping slit are 0.1-0.5 mm.

8. The modular backscatter imager of claim 1, wherein: the hardware interface is an LVDS signal transmission interface.

9. The modular backscatter imager of claim 1, wherein: the included angle between the plane of the modularized detector and the plane of the back scattering detector is 0-90 degrees.

10. The modular backscatter imager of any of claims 1-9, wherein: the handheld backscatter imager further comprises a WiFi module and a Bluetooth transmission module.