CN217638781U - Handheld backscatter imaging detector and handheld backscatter imager - Google Patents

Handheld backscatter imaging detector and handheld backscatter imager Download PDF

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Publication number
CN217638781U
CN217638781U CN202123144670.5U CN202123144670U CN217638781U CN 217638781 U CN217638781 U CN 217638781U CN 202123144670 U CN202123144670 U CN 202123144670U CN 217638781 U CN217638781 U CN 217638781U
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detector
sipm
handheld
imaging detector
backscatter imaging
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朱伟平
李建
黄翌敏
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Yirui Image Technology Chengdu Co ltd
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Yirui Image Technology Chengdu Co ltd
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Abstract

The utility model provides a hand-held type backscatter imaging detector and hand-held backscatter imager, wherein, hand-held type backscatter imaging detector includes: the detector comprises a scintillator module, a PCB (printed circuit board) mounting plate, a SiPM (silicon particulate matter) and supporting circuits, a sealing gasket, a detector box and a detector cover plate; siPM welds on the PCB mounting panel with the form of matrix, under diffuse reflection layer's the adding is held, can be effectual collect after once or multiple reflection with the fluorescence that scintillation body module produced, diffuse reflection layer's reflection efficiency is up to 98%, for further improvement fluorescence collection efficiency, set up hemisphere condensing lens at the SiPM front end, reflection light gathers through hemisphere condensing lens more easily, thereby can effectively improve the formation efficiency of the photosensitive district's of SiPM signal of telecommunication, also easily miniaturize on the volume, also can satisfy the demand of high performance-price ratio on the cost of manufacture, help application and the popularization of handheld back scattering imaging detector and handheld back scattering imager.

Description

Handheld backscatter imaging detector and handheld backscatter imager
Technical Field
The utility model relates to a radiation imaging technology field especially relates to a hand-held type backscatter imaging detector and hand-held type backscatter imager.
Background
The X-ray inspection system can effectively acquire the internal image of the detected target object, can detect whether metal and organic contraband are hidden in the detected object and is equipped by units such as airports, customs, ports, public security frontier defense and the like in a large quantity. Compared with the traditional X-ray transmission imaging technology, the X-ray back scattering imaging technology has the characteristics that the ray source and the detector are arranged on the same side of the detected object, and back scattering signals can highlight organic matters, so that the X-ray back scattering imaging technology is very suitable for imaging and checking organic substances such as explosives and drugs and large objects. With the advancement of radiation source technology, miniaturized high energy (120-160 keV) tubes have emerged to make portability and hand-held back-scatter imagers possible. The handheld back scattering imager has the advantages of small volume, light weight, portability and capability of being close to the target in-situ inspection, greatly facilitates security personnel and public security frontier personnel, and is popular.
At present, the detector of the handheld back scattering imager is mainly based on a scheme of combining a scintillator and a Photomultiplier Tube (PMT), and in recent years, since a Silicon Photomultiplier Tube (SiPM) has the characteristics of small volume and high gain, a scheme of combining the scintillator and the face array SiPM is also proposed and applied. However, in the two schemes, the thickness of the PMT is greater than 3cm, the anti-seismic performance is poor, further miniaturization of the handheld backscatter imager is limited, and the application requirement of a severe detection environment is difficult to meet, while the planar SiPM scheme greatly increases the cost of the detector and is not favorable for the handheld backscatter imager.
In view of the above, there is a need to provide a handheld backscatter imaging detector and a handheld backscatter imager, which meet the application requirement in a severe detection environment, and are easy to miniaturize in volume and meet the requirement of high cost performance in manufacturing cost on the premise of high fluorescence collection efficiency.
SUMMERY OF THE UTILITY MODEL
In view of the above shortcomings of the prior art, an object of the present invention is to provide a handheld backscatter imaging detector and a handheld backscatter imager for solving the problems of the prior art, such as large volume, difficulty in portability, high cost and heavy weight.
To achieve the foregoing and other related objectives, the present invention provides a hand-held backscatter imaging detector, comprising: the detector comprises a scintillator module, a PCB (printed circuit board) mounting plate, an SiPM (silicon germanium particulate matter) and supporting circuits, a sealing gasket, a detector box and a detector cover plate, wherein the scintillator module is positioned at the foremost end of the handheld back scattering imaging detector, the PCB mounting plate is positioned behind the scintillator module, the SiPM and the supporting circuits are positioned on the PCB mounting plate, and the sealing gasket, the detector box and the detector cover plate have a synergistic effect and are used for supporting and fixing the scintillator module, the PCB mounting plate, the SiPM and the supporting circuits in installation and grounding;
the scintillator module is used for absorbing X rays and converting the energy of the absorbed X rays into visible light signals; the SiPM and the matched circuit are used for converting visible light signals emitted by the scintillator module into electric signals and amplifying the electric signals; an SiPM window is further arranged on the PCB mounting plate, the size of the SiPM window is larger than that of the SiPM, and the SiPM is exposed out of the SiPM window; the PCB mounting panel is close to the one side of scintillator module is provided with the diffuse reflection layer, detector box inner chamber is provided with the diffuse reflection layer all around, the scintillator module is close to the one side of detector box is provided with the specular reflection layer, is used for the reflection jointly the fluorescence that the scintillator module produced.
Optionally, the SiPM front end is provided with a hemispherical condenser lens.
Optionally, the number of scintillator modules is 2; the number of the PCB mounting plates is 2; two cavities are arranged in the detector box, and each cavity is used for placing one scintillator module and one PCB (printed circuit board) mounting plate.
Optionally, the imaging area of the handheld back scatter detector is (15 cm-18 cm) × (16 cm-20 cm); the area of the photosensitive region of the SiPM is 3mm to 3mm or 6mm to 6mm, the number of the photosensitive region is 16-52, and the photosensitive region is welded on the PCB mounting plate in a matrix mode.
Optionally, a spacing between the SiPM and the scintillator module ranges from 5mm to 12mm, inclusive.
Optionally, the scintillator module is in a sheet shape, the thickness of the scintillator module is not more than 2mm, and the material of the scintillator module is GOS, csI, caWO 4 Or an organic plastic.
Optionally, the material of the sealing gasket is dark-color light-tight fluorine rubber, silicon rubber or nitrile rubber.
Optionally, the diffuse reflection layer material arranged on the side of the PCB mounting board close to the scintillator module is MgO or TiO 2 (ii) a The diffuse reflection layer arranged around the inner cavity of the detector box is made of MgO or TiO 2
Optionally, the probe cover plate material is an Al alloy or a Mg alloy; the detector box is made of Al alloy or Mg alloy.
The utility model also provides a handheld back scattering imager, include: the handheld backscatter imaging detector, the X-ray source, the sector collimator, the chopping mechanism, the data acquisition control board circuit and the display terminal of any one of the above;
the receiving surface of the handheld backscatter imaging detector is positioned at the foremost end of the handheld backscatter imaging instrument and used for receiving the scattered signal data of the surface of the detected object to form a two-dimensional image; the fan-shaped collimator is positioned right in front of the X-ray source; the chopping mechanism is located right in front of the fan-shaped collimator, the data acquisition control circuit is used for controlling communication control of the X-ray source and the chopping mechanism and processing of detector signals, and the display terminal is used for providing a human-computer interaction interface and displaying of a back scattering spliced image.
As above, the utility model discloses a handheld back scattering imaging detector and handheld back scattering imager can satisfy abominable measuring environment's application demand through the structural design who improves, under the efficient prerequisite of fluorescence collection, also easily miniaturize on the volume, also can satisfy the demand of high performance price ratio in the cost of manufacture, help the application and the popularization of handheld back scattering imaging detector and handheld back scattering imager.
Drawings
Fig. 1 shows the schematic diagram of the explosion structure of the handheld backscatter imaging detector of the present invention.
Fig. 2 shows a schematic cross-sectional view of the handheld backscatter imaging detector of the present invention.
Fig. 3 is a schematic diagram showing the relationship between the distance between SiPM and scintillator module and the collection efficiency of the handheld backscatter imaging detector of the present invention.
Description of the element reference numerals
101. Scintillator module
102 SiPM and matching circuit
103. Hemispherical condensing lens
104 PCB mounting plate
105. Sealing gasket
106. Detector cover plate
107. Detector box
Detailed Description
The following description is provided for illustrative purposes, and other advantages and features of the present invention will become apparent to those skilled in the art from the following detailed description.
Please refer to fig. 1 to 3. It should be understood that the structure, ratio, size and the like shown in the drawings attached to the present specification are only used for matching with the content disclosed in the specification, so as to be known and read by those skilled in the art, and are not used for limiting the limit conditions that the present invention can be implemented, so that the present invention has no technical essential meaning, and any structure modification, ratio relationship change or size adjustment should still fall within the scope that the technical content disclosed in the present invention can cover without affecting the function that the present invention can produce and the purpose that the present invention can achieve. In addition, the terms such as "upper", "lower", "left", "right", "middle" and "one" used in the present specification are used for clarity of description only, and are not used to limit the scope of the present invention, and the relative relationship between the terms may be changed or adjusted without substantial technical changes.
As shown in fig. 1-2, the utility model provides a hand-held type backscatter imaging detector, include: the handheld backscatter imaging detector comprises a scintillator module 101, a PCB mounting board 104, an SiPM and supporting circuit 102, a sealing gasket 105, a detector box 107 and a detector cover plate 106, wherein the scintillator module 101 is located at the foremost end of the handheld backscatter imaging detector, the PCB mounting board 104 is located behind the scintillator module 101, the SiPM and supporting circuit 102 are located on the PCB mounting board 104, and the sealing gasket 105, the detector box 107 and the detector cover plate 106 cooperate to support and fix the scintillator module 101, the PCB mounting board 104 and the SiPM and supporting circuit 102 for installation and grounding; the scintillator module 101 is configured to absorb X-rays and convert the absorbed X-ray energy into visible light signals; the SiPM and supporting circuit 102 is configured to convert the visible light signal emitted by the scintillator module 101 into an electrical signal and amplify the electrical signal; an SiPM window is also disposed on the PCB mounting board 104, the SiPM window being larger than the SiPM in size, the SiPM being exposed from the SiPM window; PCB mounting panel 104 is close to scintillator module 101's one side is provided with the diffuse reflection layer, detector box 107 inner chamber is provided with the diffuse reflection layer all around, scintillator module 101 is close to detector box 107's one side is provided with the specular reflection layer, is used for the reflection jointly the fluorescence that scintillator module 101 produced.
As shown in fig. 1 to 2, the sealing gasket 105, the detector box 107 and the detector cover 106 cooperate to support and fix the scintillator module 101, the SiPM and the supporting circuit 102, and provide a dry and stable operating environment for the scintillator module 101, a light-shielding environment for the SiPM, and a shielding environment for the front-end amplification circuit. The scintillator module 101 absorbs X-rays and converts the absorbed X-ray energy into a fluorescent signal, the fluorescent signal is weak, and the scintillator module 101 and the cavity corresponding to the PCB mounting plate 104 enter the SiPM photosensitive area through one or more reflections to form an electric signal and amplify and output the electric signal.
The middle positions of the sealing pad 105, the detector box 107 and the detector cover plate 106 are also respectively provided with a first X-ray window, a second X-ray window and a third X-ray window, and flying spot X-ray beams can conveniently pass through the two detector units without damage on the same central axis; the supporting circuit of the SiPM and supporting circuit 102 comprises an amplifying circuit and a power circuit; still be provided with the electric wire export in the middle of the cavity of detector apron 106, amplifier circuit with power supply circuit's electric wire is followed the electric wire export is drawn forth, the size of electric wire export is the better the less, can set up according to actual need, does not do the restriction here, as long as can satisfy above-mentioned electric wire and can draw forth, and do not destroy the environment of above-mentioned creation.
As shown in fig. 1, the SiPM front end is provided with a hemispherical condenser lens 103, as an example. In order to further improve the fluorescence collection efficiency, the reflected light is easier to be collected by the hemispherical condenser lens 103, so that the formation efficiency of the electrical signal of the SiPM photosensitive area can be effectively improved.
As shown in fig. 1, the number of the scintillator modules 101 is 2 as an example; the number of the PCB mounting boards 104 is 2; two cavities are arranged in the detector box 107, and each cavity is used for accommodating one scintillator module 101 and one PCB mounting board 104.
As shown in fig. 1, as an example, the imaging area of the handheld back scatter detector is (15 cm-18 cm) × (16 cm-20 cm); the area of the photosensitive area of the SiPM is 3mm or 6mm, the number of the photosensitive area is 16-52, and the photosensitive area is welded on the PCB mounting plate 104 in a matrix mode.
As shown in fig. 1-3, the spacing between the sipms and the scintillator module 101 ranges from 5mm to 12mm, inclusive, by way of example.
In the prior art, the planar array SiPM scheme may greatly increase the cost of the handheld backscatter imaging detector, which is not favorable for its popularization and application, and in consideration of cost and analog calculation, in this embodiment, it is preferable to use 16 sipms, which are respectively disposed on the two PCB mounting boards 104 and are disposed opposite to the two scintillator modules 101, and one scintillator module 101 and one PCB mounting board 104 are respectively disposed in two cavities disposed in the detector box 107; the first X-ray window, the second X-ray window and the third X-ray window which are positioned on the same axis are arranged in the middle of the handheld backscatter imaging detector to transmit signals, so that the output signals are the strongest, and the handheld backscatter imaging detector is favorable for being connected with the outside; in addition, the X-ray source and the radiation source are matched and arranged on the same side of the detected object, X-ray beams generated by the radiation source reach the detected object through the first X-ray window, the second X-ray window and the third X-ray window, and the detected object is scanned.
In this embodiment, 16 sipms are used in the detection area where the scintillator module 101 is located, and TracePro optical simulation is performed, so that it can be calculated that the optimal distance range between the sipms and the scintillator module 101 in this embodiment is reached when the distance range is 5mm to 12mm (as shown in fig. 3), and increasing or decreasing the distance between the sipms and the scintillator module 101 both reduces the light collection efficiency of the handheld backscatter imaging detector, and the thickness of the handheld backscatter imaging detector is greatly reduced by the distance range of 5mm to 12mm, which is beneficial to the miniaturization of the detector, and as can be known from simulation data, when the distance is 10mm, the light collection efficiency is the highest.
As shown in fig. 1 to 2, the scintillator module 101 is in a sheet shape, the thickness of the scintillator module 101 is not more than 2mm, and the material of the scintillator module 101 is GOS, csI, caWO 4 Or an organic plastic.
It should be noted here that, in order to miniaturize the handheld backscatter imaging detector, the thickness of the scintillator module 101 in a sheet shape can be reduced, and in this embodiment, the thickness of the scintillator module 101 is preferably 0.5mm to 0.6mm. In addition, the whole thickness range of hand-held type back scattering imaging detector is 12mm ~ 17mm, and for this reason the inner space also need compress as far as possible, reduces unnecessary space, the cavity depth of detector box 107 satisfies to lay the demand, does not do the specific restriction here, can set up according to actual need.
As shown in fig. 1 to 2, the material of the seal gasket 105 is, for example, dark-colored light-impermeable fluorine rubber, silicone rubber, or nitrile rubber.
It should be noted that the sealing pad 105 is made of a dark opaque material to provide a light-shielding environment in cooperation with the detector box 107 and the detector cover 106, so as to concentrate diffuse emission and signal conversion in the cavity between the scintillator module 101 and the PCB mounting board 104, which is beneficial to enhancing the signal.
As shown in fig. 1 to 2, the diffuse reflection layer material disposed on one side of the PCB mounting board 104 close to the scintillator module 101 is MgO or TiO, as an example 2 (ii) a The diffuse reflection layer arranged around the inner cavity of the detector box 107 is made of MgO or TiO 2
It should be noted here that the reflection efficiency of the diffuse reflection layer reaches 98%, and the fluorescence generated by the scintillator module 101 can be effectively reflected once or multiple times, and then enters the SiPM photosensitive region to form an electrical signal and is amplified and output, so that unnecessary energy loss is reduced.
As shown in fig. 1 to 2, the material of the probe cover plate is, for example, an Al alloy or a Mg alloy; the detector box is made of Al alloy or Mg alloy.
In order to realize the light weight of the handheld backscatter imaging detector, preferably, the detector cover plate 106 and the detector box 107 of this embodiment are made of Mg alloy, the density of the Mg alloy is smaller than that of Al alloy, and the weight of the Mg alloy is one third smaller than that of the Al alloy, which is beneficial to realizing the portability of the backscatter imaging detector.
The utility model also provides a handheld back scattering imager includes: the handheld backscatter imaging detector, the X-ray source, the sector collimator, the chopping mechanism, the data acquisition control circuit and the display terminal are all arranged in the handheld backscatter imaging device; the receiving surface of the handheld backscatter imaging detector is positioned at the foremost end of the handheld backscatter imaging instrument and is used for receiving the scattered signal data of the surface of the detected object to form a two-dimensional image; the fan-shaped collimator is positioned right in front of the X-ray source; the chopping mechanism is located right in front of the fan-shaped collimator, the data acquisition control circuit is used for controlling communication control of the X-ray source and the chopping mechanism and processing of detector signals, and the display terminal is used for providing a human-computer interaction interface and displaying of a back scattering spliced image.
In this embodiment, the SiPM in the handheld backscatter imaging detector and the supporting circuit 102 are used to shape, filter and amplify the output voltage signal; the chopping mechanism is used for enabling the fan-shaped X-ray beams emitted from the fan-shaped collimator to generate point X-rays which periodically and sequentially move under the action of the chopping flywheel.
When back scattering imaging is carried out, the control panel controls the X-ray source to generate a conical or fan-shaped X-ray beam and controls a motor on the chopping mechanism to drive at a high speed, so that the chopping mechanism rotates at a high speed or reciprocates. In order to obtain higher image resolution and low radiation dose rate, the front end of the X-ray tube is provided with the fan-shaped collimator, and a conical or fan-shaped X-ray beam emitted by the X-ray tube is collimated by the fan-shaped collimator to form a sheet-shaped fan-shaped X-ray beam. In order to obtain a periodically scanned pencil-shaped X-ray beam, the chopping mechanism is arranged right in front of the fan-shaped X-ray beam, and the movement mode of the chopping mechanism can be a traditional chopping flywheel structure with slits arranged at an equal angle in a circle, or a shielding plate structure with slits arranged at equal intervals and driven by a high-speed electric cylinder; and in the periodic motion process of the chopping mechanism, a slit and a slit of the fan-shaped collimator form a periodically reciprocating intersection point to form the pencil-shaped X-ray beam which transmits out periodic motion. And realizing the imaging detection of the detected target by uniform movement of the operator of the handheld backscatter imaging instrument in the orthogonal direction of the periodically moving pencil-shaped X-ray beam.
To sum up, the utility model provides a hand-held type backscatter imaging detector and hand-held backscatter imager, wherein, hand-held type backscatter imaging detector includes: the detector comprises a scintillator module, a PCB (printed circuit board) mounting plate, a SiPM (silicon particulate matter) and supporting circuits, a sealing gasket, a detector box and a detector cover plate; siPM welds on the PCB mounting panel with the form of matrix, under the adding of diffuse reflection layer holds, can be effectual fluorescence that produces the scintillation module through once or multiple reflection, diffuse reflection efficiency reaches up to 98%, for further improvement fluorescence collection efficiency, set up hemisphere condenser lens at the SiPM front end, diffuse reflection gathers through hemisphere condenser lens more easily, thereby can effectively improve the formation efficiency of the photosensitive district's of SiPM signal of telecommunication, also easily miniaturize on the volume, also can satisfy the demand of high performance-price ratio in the cost of manufacture, help application and the popularization of handheld back scattering imaging detector and handheld back scattering imager. Therefore, the utility model effectively overcomes various defects in the prior art and has high industrial utilization value.
The above embodiments are merely illustrative of the principles and effects of the present invention, and are not to be construed as limiting the invention. Modifications and variations can be made to the above-described embodiments by those skilled in the art without departing from the spirit and scope of the present invention. Accordingly, it is intended that all equivalent modifications or changes which may be made by those skilled in the art without departing from the spirit and technical spirit of the present invention be covered by the claims of the present invention.

Claims (10)

1. A handheld backscatter imaging detector, characterized in that the handheld backscatter imaging detector comprises: the handheld backscatter imaging detector comprises a scintillator module, a PCB (printed circuit board) mounting plate, an SiPM (silicon oxide semiconductor) and supporting circuit, a sealing gasket, a detector box and a detector cover plate, wherein the scintillator module is positioned at the foremost end of the handheld backscatter imaging detector, the PCB mounting plate is positioned behind the scintillator module, and the SiPM and the supporting circuit are positioned on the PCB mounting plate; the sealing gasket, the detector box and the detector cover plate are used for supporting and fixing the scintillator, the PCB mounting plate, the SiPM and the matching circuit to be mounted and grounded;
the scintillator module is used for absorbing X rays and converting the energy of the absorbed X rays into visible light signals; the SiPM and the matched circuit are used for converting visible light signals emitted by the scintillator module into electric signals and amplifying the electric signals; an SiPM window is further arranged on the PCB mounting plate, the size of the SiPM window is larger than that of the SiPM, and the SiPM is exposed out of the SiPM window; the PCB mounting panel is close to the one side of scintillator module is provided with the diffuse reflection layer, detector box inner chamber is provided with the diffuse reflection layer all around, the scintillator module is close to the one side of detector box is provided with the specular reflection layer, is used for reflecting jointly the fluorescence that scintillator module produced.
2. The hand-held backscatter imaging detector of claim 1, wherein: and a hemispherical condenser lens is arranged at the front end of the SiPM.
3. The handheld backscatter imaging detector of claim 1, wherein: the number of the scintillator modules is 2; the number of the PCB mounting plates is 2; two cavities are arranged in the detector box, and each cavity is used for placing one scintillator module and one PCB mounting plate.
4. The handheld backscatter imaging detector of claim 1, wherein: the imaging area of the handheld back scattering detector is (15 cm-18 cm) to (16 cm-20 cm); the area of the photosensitive region of the SiPM is 3mm to 3mm or 6mm to 6mm, the number of the photosensitive region is 16-52, and the photosensitive region is welded on the PCB mounting plate in a matrix mode.
5. The handheld backscatter imaging detector of claim 1, wherein: the spacing between the SiPM and the scintillator module ranges from 5mm to 12mm, inclusive.
6. The handheld backscatter imaging detector of claim 1, wherein: the scintillator module is in a sheet shape, the thickness of the scintillator module is not more than 2mm, and the scintillator module is made of GOS, csI and CaWO materials 4 Or an organic plastic.
7. The hand-held backscatter imaging detector of claim 1, wherein: the sealing gasket is made of dark-color opaque fluororubber, silicon rubber or nitrile rubber.
8. The hand-held backscatter imaging detector of claim 1, wherein: the diffuse reflection layer arranged on one surface of the PCB mounting plate close to the scintillator module is made of MgO or TiO 2 (ii) a The diffuse reflection layer arranged around the inner cavity of the detector box is made of MgO or TiO 2
9. The handheld backscatter imaging detector of claim 1, wherein: the detector cover plate material is Al alloy or Mg alloy; the detector box is made of Al alloy or Mg alloy.
10. A handheld backscatter imager, the handheld backscatter imager comprising: the hand-held backscatter imaging detector of any one of claims 1-9, an X-ray source, a sector collimator, a chopping mechanism, a data acquisition control circuit, and a display terminal;
the receiving surface of the handheld backscatter imaging detector is positioned at the foremost end of the handheld backscatter imaging instrument and is used for receiving the scattered signal data of the surface of the detected object to form a two-dimensional image; the fan-shaped collimator is positioned right in front of the X-ray source; the chopping mechanism is located right in front of the fan-shaped collimator, the data acquisition control circuit is used for controlling communication control of the X-ray source and the chopping mechanism and processing of detector signals, and the display terminal is used for displaying a human-computer interaction interface and a back scattering spliced image.
CN202123144670.5U 2021-12-14 2021-12-14 Handheld backscatter imaging detector and handheld backscatter imager Active CN217638781U (en)

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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN117635614A (en) * 2024-01-25 2024-03-01 南京航空航天大学 Ultrafast X-ray imaging nondestructive testing method and system

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN117635614A (en) * 2024-01-25 2024-03-01 南京航空航天大学 Ultrafast X-ray imaging nondestructive testing method and system
CN117635614B (en) * 2024-01-25 2024-04-02 南京航空航天大学 Ultrafast X-ray imaging nondestructive testing method and system

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