CN216950917U - External rotor fan with stepless speed regulation device - Google Patents
External rotor fan with stepless speed regulation device Download PDFInfo
- Publication number
- CN216950917U CN216950917U CN202123378982.2U CN202123378982U CN216950917U CN 216950917 U CN216950917 U CN 216950917U CN 202123378982 U CN202123378982 U CN 202123378982U CN 216950917 U CN216950917 U CN 216950917U
- Authority
- CN
- China
- Prior art keywords
- heat dissipation
- fan
- plates
- cavity
- cover plate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Active
Links
Images
Classifications
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02B—CLIMATE CHANGE MITIGATION TECHNOLOGIES RELATED TO BUILDINGS, e.g. HOUSING, HOUSE APPLIANCES OR RELATED END-USER APPLICATIONS
- Y02B30/00—Energy efficient heating, ventilation or air conditioning [HVAC]
- Y02B30/70—Efficient control or regulation technologies, e.g. for control of refrigerant flow, motor or heating
Landscapes
- Cooling Or The Like Of Electrical Apparatus (AREA)
Abstract
The utility model relates to an external rotor fan with a stepless speed regulation device, wherein a fan body is provided with a power supply circuit, a knob switch and a fan coil, the input end of the power supply circuit is used for being connected with a power supply, the output end of the power supply circuit is used for outputting the working voltage of the fan coil, the knob switch is electrically connected between the output end of the power supply circuit and the fan coil, and the knob switch is used for changing the current at the fan coil through the change of the resistance value of the knob switch; the fan body comprises a shell, a power supply circuit is integrated at an integrated circuit board, a fan coil and the integrated circuit board are both arranged in the shell, a cover plate is arranged at the shell, and a heat dissipation cavity is formed at the inner side of the cover plate; the cover plate is provided with a first heat dissipation assembly and a second heat dissipation assembly, the second heat dissipation assembly is provided with a heat dissipation channel which is communicated with the heat dissipation cavity and the outside, and the first heat dissipation assembly is used for plugging a gap formed between the second heat dissipation assembly and the cover plate. The utility model can better realize the stepless speed regulation of the rotating speed of the fan and has better heat dissipation performance.
Description
Technical Field
The utility model relates to the technical field of fans, in particular to an outer rotor fan with a stepless speed regulating device.
Background
The outer rotor fan is a fan with a stator in the middle of the motor and a rotor outside. The outer rotor fan adopts the design that the outer rotor motor directly drives the impeller, and has the characteristics of high efficiency, low noise, light weight, compact structure, convenient installation and maintenance and the like.
At present, the speed regulation of the external rotor fan is generally realized by an external frequency converter, and the speed regulation mode can not realize the smooth speed regulation of various rotating speeds of the external rotor fan except the complicated wiring.
SUMMERY OF THE UTILITY MODEL
The present invention provides an external rotor fan with a stepless speed regulating device that overcomes some or some of the disadvantages of the prior art.
The outer rotor fan with the stepless speed regulating device comprises a fan body, wherein the fan body is provided with a power supply circuit, a knob switch and a fan coil, the input end of the power supply circuit is used for being connected with a power supply, the output end of the power supply circuit is used for outputting the working voltage of the fan coil, the knob switch is electrically connected between the output end of the power supply circuit and the fan coil, and the knob switch is used for changing the current at the fan coil through the change of the resistance value of the knob switch;
the fan body comprises a shell, and an installation cavity with an opening at one end is formed in the shell; the power supply circuit is integrated at an integrated circuit board, the fan coil and the integrated circuit board are both arranged in the mounting cavity, and the integrated circuit board is positioned outside the fan coil; the fan body also comprises a cover plate arranged at the opening of the installation cavity, and the cover plate is used for forming a heat dissipation cavity at one side matched with the opening of the installation cavity; the cover plate is provided with a first radiating assembly and a second radiating assembly, the second radiating assembly is provided with a radiating channel which is communicated with the radiating cavity and the outside, and the first radiating assembly is used for plugging a gap formed between the second radiating assembly and the cover plate.
According to the utility model, by adding the power supply circuit and the knob switch, smooth regulation of working voltage or working current at the coil of the fan can be preferably realized, namely stepless regulation of the rotating speed of the fan can be preferably realized. Wherein, because power supply circuit can integrate in integrated circuit board department and can locate inside the casing, so only need to draw knob switch from integrated circuit board department through the control line, the realization that can be comparatively convenient is to the infinitely variable control of fan rotational speed.
On the other hand, because the integrated circuit board is arranged in the shell, the heat in the fan body needs to be technically evacuated when the fan body works actually. In the utility model, the heat dissipation cavity is formed at the cover plate, so that heat generated at the integrated circuit board can be timely transmitted to the heat dissipation cavity, and the local overheating at the integrated circuit board can be better avoided. Meanwhile, due to the arrangement of the first heat dissipation assembly and the second heat dissipation assembly, the heat at the heat dissipation cavity can be better transferred to the outside, and the overhigh integral temperature at the heat dissipation cavity can be better avoided.
More importantly, the heat dissipation channel formed at the second heat dissipation assembly can better realize the direct transmission of the heat at the heat dissipation cavity to the outside, so the heat dissipation efficiency can be better improved; and the clearance formed between the second heat dissipation component and the cover plate is sealed and blocked by the first heat dissipation component, so that the second heat dissipation component and the cover plate can be better matched in a sealing way, and the integrated circuit board can be better protected.
Preferably, the cover plate is provided with heat dissipation assembly mounting holes formed in the bottom wall and the side wall of the heat dissipation cavity, and the first heat dissipation assembly and the second heat dissipation assembly are arranged at the heat dissipation assembly mounting holes;
the first heat dissipation assembly is provided with a first substrate, a plurality of first heat dissipation plates are arranged on the front side of the first substrate at intervals, and inserting grooves are formed between every two adjacent first heat dissipation plates; the upper sides of the plurality of first heat dissipation plates are positioned at the opening of the heat dissipation assembly mounting hole at the bottom wall of the heat dissipation cavity, the upper parts of the front sides of the plurality of first heat dissipation plates are positioned at the opening of the heat dissipation assembly mounting hole at the side wall of the heat dissipation cavity, and arc-shaped gaps are formed between the lower parts of the front sides of the plurality of first heat dissipation plates and the corresponding side walls of the heat dissipation cavity;
the second heat dissipation assembly is provided with a second substrate, a plurality of second heat dissipation plates are arranged on the upper side of the second substrate at intervals, and the second heat dissipation plates are used for being in splicing fit with the corresponding splicing grooves; the front sides of the second heat dissipation plates form arc plates connected with the second substrate at the same time, and the arc plates are used for being matched with the arc gaps.
Through the above, each second heat dissipation plate can preferably form a heat dissipation channel at the corresponding insertion groove, so that the heat at the heat dissipation cavity can be preferably and directly transferred to the outside; the structure such as the first substrate, the second substrate, the arc-shaped plate and the like can better realize the sealing of the mounting hole of the heat dissipation assembly, so that the integrated circuit board can be better protected.
Preferably, fixing plates are arranged at the left side and the right side of the radiating component mounting hole in the radiating cavity, and the fixing plates are connected with the bottom wall and the side wall of the radiating cavity corresponding to the radiating component mounting hole; different fixed plates are used for being respectively matched with the left side and the right side of the first radiating assembly, the left side and the right side of the second substrate are respectively provided with a fixed lug matched with the corresponding fixed plate, and the corresponding fixed lugs are connected with the fixed plates through connecting pieces. Therefore, the first radiating assembly and the second radiating assembly can be installed better, and the fixing plate can better seal the mounting hole of the radiating assembly.
Preferably, the upper side of the first substrate is retracted to the upper sides of the plurality of first heat dissipation plates to form a first stepped groove for cooperating with the cover plate, and the depth of the first stepped groove is consistent with the thickness of the bottom wall of the heat dissipation cavity. Therefore, the first heat dissipation assembly can be better matched with the cover plate at the mounting hole of the heat dissipation assembly.
Preferably, the lower side of the first substrate is extended out of the lower sides of the plurality of first heat dissipation plates to form a second stepped groove for the second substrate to be fitted, and the depth of the second stepped groove is identical to the thickness of the second substrate. Therefore, the first heat dissipation assembly can be better matched with the second heat dissipation assembly.
Preferably, the upper sides of the plurality of second heat dissipation plates are flush with the inner walls of the heat dissipation assembly mounting holes formed at the side walls of the heat dissipation cavity, and the parts of the insertion grooves, which are not inserted by the second heat dissipation plates, form heat dissipation air channels. Through the structure of the heat dissipation air duct, the heat of the exposed parts of the first heat dissipation plate and the second heat dissipation plate can be better taken away by external air flow, so that the heat dissipation efficiency can be better improved, and particularly, the effective heat dissipation area can be better increased.
Preferably, the first heat dissipation assembly is made of aluminum alloy, and the second heat dissipation assembly is made of copper. Therefore, the first heat dissipation assembly can provide a heat dissipation function and also can better provide a function of supporting the framework, and the second heat dissipation assembly can more efficiently dissipate heat.
Preferably, a power line mounting block is arranged at the cover plate and used for leading out a power line from the integrated circuit board. Thus facilitating the sealing of the cover plate.
Preferably, the fan body further has an impeller for cooperating with the housing.
Drawings
Fig. 1 is an exploded schematic view of a blower body in embodiment 1;
FIG. 2 is a schematic view of a cover plate in embodiment 1;
FIG. 3 is a schematic view of another perspective of the cover plate in embodiment 1;
fig. 4 is a schematic view of a first heat dissipation assembly in embodiment 1;
fig. 5 is a schematic view of a second heat dissipation assembly in embodiment 1;
fig. 6 is a schematic wiring diagram of the power supply circuit, the rotary switch, and the fan coil in embodiment 1.
Detailed Description
For a further understanding of the utility model, reference should be made to the following detailed description taken in conjunction with the accompanying drawings and examples. It is to be understood that the examples are illustrative of the utility model and not restrictive.
Example 1
As shown in fig. 1 to 6, the present embodiment provides an external rotor fan with a stepless speed regulation device, which is characterized in that: the fan comprises a fan body 100, wherein the fan body 100 is provided with a power supply circuit, a knob switch and a fan coil 113, the input end of the power supply circuit is used for being connected with a power supply, the output end of the power supply circuit is used for outputting the working voltage of the fan coil 113, the knob switch is electrically connected between the output end of the power supply circuit and the fan coil 113, and the knob switch is used for changing the current at the fan coil 113 through the change of the resistance value of the knob switch;
the blower body 100 comprises a shell 112, wherein a mounting cavity with an opening at one end is formed in the shell 112; the power supply circuit is integrated at an integrated circuit board 114, the fan coil 113 and the integrated circuit board 114 are both arranged in the mounting cavity, and the integrated circuit board 114 is positioned at the outer side of the fan coil 113; the blower body 100 further comprises a cover plate 120 arranged at the opening of the installation cavity, and a heat dissipation cavity 210 is formed on one side of the cover plate 120, which is matched with the opening of the installation cavity; the cover plate 120 is provided with a first heat dissipation assembly 130 and a second heat dissipation assembly 140, the second heat dissipation assembly 140 forms a heat dissipation channel for communicating the heat dissipation cavity 210 with the outside, and the first heat dissipation assembly 130 is used for plugging a gap formed between the second heat dissipation assembly 140 and the cover plate 120.
In this embodiment, by adding the power supply circuit and the knob switch, the smooth adjustment of the working voltage or the working current at the fan coil 113 can be preferably realized, that is, the stepless adjustment of the rotation speed of the fan can be preferably realized. Because the power supply circuit can be integrated at the position of the integrated circuit board 114 and can be arranged inside the shell 112, the stepless regulation of the rotating speed of the fan can be conveniently realized only by leading the knob switch out from the position of the integrated circuit board 114 through a control line.
It can be understood by those skilled in the art that the power supply circuit and the access resistance value adjustable knob switch are mature prior art, and therefore are not described in detail herein. In the scheme of this embodiment, the common technique or fitting is adopted, so that the outer rotor fan in this embodiment can have a lower cost.
On the other hand, since the integrated circuit board 114 is embedded in the casing 112, the heat inside the blower body 100 needs to be technically dissipated during actual operation. In the embodiment, the heat dissipation cavity 210 is configured at the cover plate 120, so that heat generated at the integrated circuit board 114 can be timely transmitted to the heat dissipation cavity 210, and local overheating at the integrated circuit board 114 can be preferably avoided. Meanwhile, due to the arrangement of the first heat dissipation assembly 130 and the second heat dissipation assembly 140, the heat at the heat dissipation cavity 210 can be better transferred to the outside, so that the over-high temperature of the whole heat dissipation cavity 210 can be better avoided.
More importantly, because the heat dissipation channel is formed at the second heat dissipation assembly 140, the heat at the heat dissipation cavity 210 can be directly transferred to the outside, and the heat dissipation efficiency can be improved; the gap formed between the second heat dissipation assembly 140 and the cover plate 120 is sealed by the first heat dissipation assembly 130, so that the second heat dissipation assembly 140 and the cover plate 120 can be better matched in a sealing manner, and the integrated circuit board 114 can be better protected.
In addition, the cover plate 120 is provided with heat sink mounting holes 121 formed at the bottom wall and the side wall of the heat dissipation chamber 210, and the first heat sink 130 and the second heat sink 140 are provided at the heat sink mounting holes 121;
the first heat sink assembly 130 has a first substrate 410, a plurality of first heat sinks 420 are arranged at intervals on the front side of the first substrate 410, and a plugging groove 421 is formed between adjacent first heat sinks 420; the upper sides of the plurality of first heat dissipation plates 420 are positioned at the opening of the heat dissipation assembly mounting hole 121 at the bottom wall of the heat dissipation cavity 210, the upper parts of the front sides of the plurality of first heat dissipation plates 420 are positioned at the opening of the heat dissipation assembly mounting hole 121 at the side wall of the heat dissipation cavity 210, and arc-shaped gaps are formed between the lower parts of the front sides of the plurality of first heat dissipation plates 420 and the corresponding side walls of the heat dissipation cavity 210;
the second heat dissipation assembly 140 has a second substrate 510, a plurality of second heat dissipation plates 520 are disposed at intervals on the upper side of the second substrate 510, and the second heat dissipation plates 520 are used for being inserted into and matched with the corresponding insertion grooves 421; the front sides of the plurality of second heat dissipation plates 520 form an arc-shaped plate 530 simultaneously connected with the second base plate 510, and the arc-shaped plate 530 is adapted to fit the arc-shaped gap.
Through the above, each second heat dissipation plate 520 can preferably form a heat dissipation channel at the corresponding insertion groove 421, so that the heat at the heat dissipation cavity 210 can be preferably directly transferred to the outside; the first substrate 410, the second substrate 510, the arc-shaped plate 530, and the like can preferably seal the heat sink mounting hole 121, and thus can preferably protect the integrated circuit board 114.
In this embodiment, the fixing plates 220 are disposed at the left and right sides of the heat dissipation assembly mounting hole 121 in the heat dissipation cavity 210, and the fixing plates 220 are connected to the bottom wall and the side wall of the heat dissipation cavity 210 corresponding to the heat dissipation assembly mounting hole 121; different fixing plates 220 are used for being respectively matched with the left side and the right side of the first heat dissipation assembly 130, fixing lugs 511 used for being matched with the corresponding fixing plates 220 are arranged on the left side and the right side of the second substrate 510, and the corresponding fixing lugs 511 are connected with the fixing plates 220 through connecting pieces. Therefore, the first heat sink 130 and the second heat sink 140 can be preferably mounted, and the fixing plate 220 can preferably seal the heat sink mounting hole 121.
The connector in this embodiment can be a screw.
In this embodiment, the upper side of the first substrate 410 is retracted to the upper sides of the plurality of first heat-dissipating plates 420 to form a first stepped groove 411 for cooperation with the cap plate 120, and the depth of the first stepped groove 411 is identical to the thickness of the bottom wall of the heat-dissipating chamber 210. Therefore, the first heat sink 130 can be better matched with the cover plate 120 at the heat sink mounting hole 121.
In this embodiment, the lower side of the first substrate 410 protrudes from the lower sides of the plurality of first heat dissipation plates 420 to form a second stepped groove for the second substrate 510 to fit, and the depth of the second stepped groove is identical to the thickness of the second substrate 510. Therefore, the first heat sink 130 and the second heat sink 140 can be better matched.
In this embodiment, the upper sides of the second heat dissipation plates 520 are flush with the inner walls of the heat dissipation assembly mounting holes 121 formed at the side walls of the heat dissipation cavity 210, and the portions of the insertion grooves 421, into which the second heat dissipation plates 520 are not inserted, form heat dissipation air channels. Through the structure of the heat dissipation air duct, the heat of the exposed portions of the first heat dissipation plate 420 and the second heat dissipation plate 520 can be better taken away by the external air flow, so that the heat dissipation efficiency can be better improved, and particularly, the effective heat dissipation area can be better improved.
In this embodiment, the first heat dissipation assembly 130 is made of aluminum alloy, and the second heat dissipation assembly 140 is made of copper. Therefore, the first heat dissipation assembly 130 can provide a heat dissipation function, and can also provide a function of supporting the framework, and the second heat dissipation assembly 140 can dissipate heat more efficiently.
In this embodiment, a power line mounting block 122 is disposed at the cover plate 120, and the power line mounting block 122 is used for leading out a power line from the integrated circuit board 114. Sealing at the cover plate 120 is facilitated.
It is understood that the control wires at the knob switch can also be led out from the power line mounting block 122, and the material of the power line mounting block 122 can be rubber.
In this embodiment, the blower body 100 further has an impeller 111 for cooperating with the housing 112.
The present invention and its embodiments have been described above schematically, and the description is not intended to be limiting, and what is shown in the drawings is only one of the embodiments of the present invention, and the actual structure is not limited thereto. Therefore, if the person skilled in the art receives the teaching, without departing from the spirit of the utility model, the person skilled in the art shall not inventively design the similar structural modes and embodiments to the technical solution, but shall fall within the scope of the utility model.
Claims (9)
1. The utility model provides an outer rotor fan with stepless speed adjusting device which characterized in that: the fan comprises a fan body (100), wherein the fan body (100) is provided with a power supply circuit, a knob switch and a fan coil (113), the input end of the power supply circuit is used for being connected with a power supply, the output end of the power supply circuit is used for outputting the working voltage of the fan coil (113), the knob switch is electrically connected between the output end of the power supply circuit and the fan coil (113), and the knob switch is used for changing the current at the fan coil (113) through the change of the resistance value of the knob switch;
the fan body (100) comprises a shell (112), and an installation cavity with an opening at one end is formed in the shell (112); the power supply circuit is integrated at an integrated circuit board (114), the fan coil (113) and the integrated circuit board (114) are both arranged in the mounting cavity, and the integrated circuit board (114) is positioned at the outer side of the fan coil (113); the fan body (100) further comprises a cover plate (120) arranged at the opening of the installation cavity, and the cover plate (120) is used for forming a heat dissipation cavity (210) at one side matched with the opening of the installation cavity; a first heat dissipation assembly (130) and a second heat dissipation assembly (140) are arranged on the cover plate (120), a heat dissipation channel for communicating the heat dissipation cavity (210) with the outside is formed on the second heat dissipation assembly (140), and the first heat dissipation assembly (130) is used for plugging a gap formed between the second heat dissipation assembly (140) and the cover plate (120).
2. The external rotor fan with a stepless speed regulating device according to claim 1 is characterized in that: the cover plate (120) is provided with a radiating component mounting hole (121) formed in the bottom wall and the side wall of the radiating cavity (210), and the first radiating component (130) and the second radiating component (140) are arranged in the radiating component mounting hole (121);
the first heat dissipation assembly (130) is provided with a first substrate (410), a plurality of first heat dissipation plates (420) are arranged on the front side of the first substrate (410) at intervals, and inserting grooves (421) are formed between the adjacent first heat dissipation plates (420); the upper sides of the first heat dissipation plates (420) are positioned at the opening of the heat dissipation assembly mounting hole (121) at the bottom wall of the heat dissipation cavity (210), the upper parts of the front sides of the first heat dissipation plates (420) are positioned at the opening of the heat dissipation assembly mounting hole (121) at the side wall of the heat dissipation cavity (210), and arc-shaped gaps are formed between the lower parts of the front sides of the first heat dissipation plates (420) and the corresponding side walls of the heat dissipation cavity (210);
the second heat dissipation assembly (140) is provided with a second substrate (510), a plurality of second heat dissipation plates (520) are arranged on the upper side of the second substrate (510) at intervals, and the second heat dissipation plates (520) are used for being in plug-in fit with the corresponding plug-in grooves (421); the front sides of the plurality of second heat dissipation plates (520) form arc-shaped plates (530) simultaneously connected with the second base plate (510), and the arc-shaped plates (530) are used for being matched with the arc-shaped gaps.
3. The external rotor fan with a stepless speed regulation device according to claim 2, characterized in that: fixing plates (220) are arranged at the left side and the right side of the radiating component mounting hole (121) in the radiating cavity (210), and the fixing plates (220) are simultaneously connected with the bottom wall and the side wall of the radiating cavity (210) corresponding to the radiating component mounting hole (121); different fixing plates (220) are used for being respectively matched with the left side and the right side of the first heat dissipation assembly (130), the left side and the right side of the second base plate (510) are respectively provided with a fixing lug (511) used for being matched with the corresponding fixing plate (220), and the corresponding fixing lug (511) is connected with the fixing plate (220) through a connecting piece.
4. The external rotor fan with a stepless speed regulation device according to claim 3 is characterized in that: the upper side of the first substrate (410) is retracted to the upper sides of the plurality of first heat dissipation plates (420) to form a first stepped groove (411) for cooperation with the cover plate (120), and the depth of the first stepped groove (411) is consistent with the thickness of the bottom wall of the heat dissipation chamber (210).
5. The external rotor fan with stepless speed regulation device of claim 4, wherein: the lower side of the first substrate (410) protrudes from the lower sides of the plurality of first heat dissipation plates (420) to form a second stepped groove for the second substrate (510) to fit, and the depth of the second stepped groove is identical to the thickness of the second substrate (510).
6. The external rotor fan with a stepless speed regulating device according to claim 5 is characterized in that: the upper sides of the second heat dissipation plates (520) are flush with the inner walls of the heat dissipation assembly mounting holes (121) formed on the side walls of the heat dissipation cavity (210), and heat dissipation air channels are formed at the parts, which are not inserted by the second heat dissipation plates (520), of the insertion grooves (421).
7. The external rotor fan with stepless speed regulation device of claim 6, wherein: the first heat dissipation assembly (130) is made of aluminum alloy, and the second heat dissipation assembly (140) is made of copper.
8. The external rotor fan with stepless speed regulation device of claim 1, wherein: and a power line mounting block (122) is arranged at the cover plate (120), and the power line mounting block (122) is used for leading out a power line from the integrated circuit board (114).
9. The external rotor fan with stepless speed regulation device of claim 1, wherein: the blower body (100) also has an impeller (111) for mating with the housing (112).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202123378982.2U CN216950917U (en) | 2021-12-29 | 2021-12-29 | External rotor fan with stepless speed regulation device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202123378982.2U CN216950917U (en) | 2021-12-29 | 2021-12-29 | External rotor fan with stepless speed regulation device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN216950917U true CN216950917U (en) | 2022-07-12 |
Family
ID=82313204
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202123378982.2U Active CN216950917U (en) | 2021-12-29 | 2021-12-29 | External rotor fan with stepless speed regulation device |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN216950917U (en) |
-
2021
- 2021-12-29 CN CN202123378982.2U patent/CN216950917U/en active Active
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| JPWO2013069129A1 (en) | Rotating electric machine | |
| JP2013027181A (en) | Rotary electric machine | |
| US11125250B2 (en) | Fan device and use of such a fan device | |
| JP2009050062A (en) | Self-cooling back-connect driver motor assembly | |
| JP2008131792A (en) | Inverter-integrated electric compressor | |
| CN216950917U (en) | External rotor fan with stepless speed regulation device | |
| CN111418984A (en) | Dual-drive electric hair drier | |
| AU2012201818B2 (en) | Indoor equipment of air-conditioner | |
| CN217849909U (en) | Heat radiation structure and high-protection driver comprising same | |
| CN113038781A (en) | Servo driver with independent air duct structure | |
| CN211128745U (en) | Motor controller | |
| CN213402017U (en) | High-protection base for phase-loss protector | |
| CN114449841A (en) | Radiator cabinet | |
| CN210168394U (en) | Refrigerator case | |
| CN216721122U (en) | Motor easy to radiate heat | |
| CN217388410U (en) | Automatically controlled integral type motor | |
| CN107394969B (en) | Novel motor for washing machine | |
| CN216291907U (en) | Heat dissipation structure for charging pile module | |
| CN210075871U (en) | Casing and high-power converter | |
| CN113162154B (en) | Charger with heat dissipation function | |
| CN211152596U (en) | Semiconductor microwave device | |
| CN215216152U (en) | High-efficient radiating laser stage lamp | |
| CN216599246U (en) | Drive device | |
| CN212744402U (en) | Centrifugal fan and cooking utensil | |
| CN212660461U (en) | Shell for power supply equipment |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant |