CN216942188U - Single-sided flexible copper-clad plate - Google Patents
Single-sided flexible copper-clad plate Download PDFInfo
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- CN216942188U CN216942188U CN202123201890.7U CN202123201890U CN216942188U CN 216942188 U CN216942188 U CN 216942188U CN 202123201890 U CN202123201890 U CN 202123201890U CN 216942188 U CN216942188 U CN 216942188U
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Abstract
The single-sided flexible copper-clad plate comprises a PET layer, a first adhesive layer, a PI layer, a second adhesive layer and a copper layer which are sequentially arranged, wherein the PET layer is bonded to the first adhesive layer, the first adhesive layer is bonded with the PET layer and the PI layer, the second adhesive layer is bonded with the copper layer and the PI layer, the thickness of the PET layer is 50-85 micrometers, the thickness of the first adhesive layer is 5-10 micrometers, and the thickness of the PI layer is 12.5-25 micrometers. Increase the PET layer, glue joint PET layer and PI layer through first glue film, improve the hardness of single face flexible copper-clad plate through newly-increased PET layer, prevent to appear unfavorable condition such as fold, cardboard, distortion when being used for preparing the circuit board with single face flexible copper-clad plate, avoid the product to scrap because of this unfavorable condition, improve the yield.
Description
Technical Field
The utility model belongs to the technical field of flexible copper clad laminates, and particularly relates to a single-sided flexible copper clad laminate.
Background
The Flexible copper clad laminate is called as Flexible copper clad laminate, FCCL for short, and is a substrate for Flexible printed circuit board with excellent comprehensive performance. Most of the existing flexible copper clad laminates are single-sided flexible copper clad laminates, which have the characteristics of outstanding portability, good flexibility, wide temperature tolerance and capability of preparing flexible printed circuit boards (FPCs) in large area by a printed circuit process, and are widely applied to various electronic products.
In the existing manufacturing process of the single-sided flexible copper clad laminate, a PI film is generally directly adopted, a layer of adhesive is coated on the PI film, and then a copper foil is pressed to obtain the single-sided flexible copper clad laminate. However, the existing single-sided flexible copper clad laminate is difficult to provide large supporting force, and when the single-sided flexible copper clad laminate is used for preparing a circuit board, adverse conditions such as wrinkling, clamping, distortion and the like are easy to occur, so that the product is scrapped and the yield is low.
SUMMERY OF THE UTILITY MODEL
The utility model mainly aims to provide a single-sided flexible copper-clad plate capable of avoiding product rejection.
In order to achieve the main purpose, the single-sided flexible copper-clad plate provided by the utility model comprises a PET layer, a first adhesive layer, a PI layer, a second adhesive layer and a copper layer which are sequentially arranged, wherein the PET layer is adhered to the first adhesive layer, the first adhesive layer is adhered to the PET layer and the PI layer, the second adhesive layer is adhered to the copper layer and the PI layer, the thickness of the PET layer is 50-85 micrometers, the thickness of the first adhesive layer is 5-10 micrometers, and the thickness of the PI layer is 12.5-25 micrometers.
It is visible by above-mentioned scheme, increase the PET layer, through first glue film cementing PET layer and PI layer, improve the hardness of single face flexible copper-clad plate through newly-increased PET layer, prevent to appear unfavorable condition such as fold, cardboard, distortion when being used for preparing the circuit board with single face flexible copper-clad plate, avoid the product to scrap because of this unfavorable condition, guarantee the roughness of product, improve the yield.
Preferably, the thickness of the PET layer is 50 μm.
Preferably, the thickness of the PET layer is 75 μm.
Preferably, the thickness of the PET layer is 85 μm.
Preferably, the thickness of the first glue layer is 5 or 6 or 10 μm.
Preferably, the thickness of the PI layer is 12.5 μm.
Preferably, the thickness of the PI layer is 25 μm.
Preferably, the thickness of the second glue layer is 12 to 20 μm.
Preferably, the thickness of the copper layer is 18 μm.
Preferably, the first adhesive layer is made of acrylic adhesive or silica gel, and the second adhesive layer is made of epoxy adhesive.
Drawings
The utility model is further illustrated by means of the attached drawings, but the embodiments in the drawings do not constitute any limitation to the utility model, and for a person skilled in the art, other drawings can be derived on the basis of the following drawings without inventive effort.
FIG. 1 is a schematic structural diagram of an embodiment of a single-sided flexible copper-clad plate of the utility model.
Detailed Description
In order to make the objects, technical solutions and advantages of the present invention more apparent, the present invention is described in further detail below with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are merely illustrative of the utility model and are not intended to limit the utility model.
First embodiment
Referring to fig. 1, the single-sided flexible copper-clad plate 100 provided by the utility model comprises a PET layer 1, a first adhesive layer 2, a PI layer 3, a second adhesive layer 4 and a copper layer 5 which are sequentially arranged, wherein the PET layer 1 is adhered to the first adhesive layer 2, the first adhesive layer 2 is adhered to the PET layer 1 and the PI layer 3, the second adhesive layer 4 is adhered to the copper layer 5 and the PI layer 3, the thickness of the PET layer 1 is 50 to 85 μm, the thickness of the first adhesive layer 2 is 5 to 10 μm, and the thickness of the PI layer 3 is 12.5 to 25 μm.
The thickness of the second glue layer 4 is 12 to 20 μm and the thickness of the copper layer 5 is 18 μm.
The first adhesive layer 2 is made of acrylic adhesive or silica gel, the second adhesive layer 4 is made of epoxy adhesive, and preferably, the first adhesive layer 2 is made of acrylic adhesive.
In the present example, the thickness of the PET layer 1 is 50 μm, the thickness of the first glue layer 2 is 5 μm, the thickness of the PI layer 3 is 25 μm, the thickness of the second glue layer 4 is 20 μm, and the thickness of the copper layer 5 is 18 μm.
The heat resistance, acid and alkali resistance, organic solvent resistance and whether or not there is residual glue foreign matter after stripping of the single-sided flexible copper clad laminate 100 provided in this embodiment are shown in table 1.
TABLE 1
| Performance item | Test specimen |
| Heat resistance | 200℃ |
| Acid and alkali resistance solution test | Qualified |
| Organic solvent resistance test (%) | Qualified |
| Whether residual gum foreign matter exists after stripping | Is free of |
Increase PET layer 1, splice PET layer 1 and PI layer 3 through first glue film 2, improve the hardness of single face flexible copper-clad plate 100 through newly-increased PET layer 1, prevent to appear unfavorable condition such as fold, cardboard, distortion when being used for preparing the circuit board with single face flexible copper-clad plate 100, avoid the product to scrap because of this unfavorable condition, guarantee the roughness of product, improve the yield.
Second embodiment
Referring to fig. 1, the single-sided flexible copper-clad plate 100 provided by the utility model comprises a PET layer 1, a first adhesive layer 2, a PI layer 3, a second adhesive layer 4 and a copper layer 5 which are sequentially arranged, wherein the PET layer 1 is attached to the first adhesive layer 2, the first adhesive layer 2 is bonded to the PET layer 1 and the PI layer 3, the second adhesive layer 4 is bonded to the copper layer 5 and the PI layer 3, the thickness of the PET layer 1 is 50 to 85 μm, the thickness of the first adhesive layer 2 is 5 to 10 μm, and the thickness of the PI layer 3 is 12.5 to 25 μm.
In this embodiment, the thickness of the PET layer 1 is 50 μm, the thickness of the first glue layer 2 is 6 μm, the thickness of the PI layer 3 is 25 μm, the thickness of the second glue layer 4 is 20 μm, the thickness of the copper layer 5 is 18 μm, and the rest of the structure is the same as that of the first embodiment.
The heat resistance, acid and alkali resistance, organic solvent resistance and whether or not there is residual glue foreign matter after stripping of the single-sided flexible copper clad laminate 100 provided in this embodiment are shown in table 2.
TABLE 2
Increase PET layer 1, glue joint PET layer 1 and PI layer 3 through first glue film 2, improve the hardness of single face flexible copper-clad plate 100 through newly-increased PET layer 1, prevent to appear unfavorable condition such as fold, cardboard, distortion when being used for preparing the circuit board with single face flexible copper-clad plate 100, avoid the product to scrap because of this unfavorable condition, improve the yield.
Third embodiment
Referring to fig. 1, the single-sided flexible copper-clad plate 100 provided by the utility model comprises a PET layer 1, a first adhesive layer 2, a PI layer 3, a second adhesive layer 4 and a copper layer 5 which are sequentially arranged, wherein the PET layer 1 is attached to the first adhesive layer 2, the first adhesive layer 2 is bonded to the PET layer 1 and the PI layer 3, the second adhesive layer 4 is bonded to the copper layer 5 and the PI layer 3, the thickness of the PET layer 1 is 50 to 85 μm, the thickness of the first adhesive layer 2 is 5 to 10 μm, and the thickness of the PI layer 3 is 12.5 to 25 μm.
In this embodiment, the thickness of the PET layer 1 is 75 μm, the thickness of the first glue layer 2 is 6 μm, the thickness of the PI layer 3 is 25 μm, the thickness of the second glue layer 4 is 20 μm, the thickness of the copper layer 5 is 18 μm, and the rest of the structure is the same as that of the first embodiment.
The heat resistance, acid and alkali resistance, organic solvent resistance and whether or not there is residual glue foreign matter after stripping of the single-sided flexible copper clad laminate 100 provided in this embodiment are shown in table 3.
TABLE 3
| Performance items | Test specimen |
| Heat resistance | 200℃ |
| Acid and alkali resistance solution test | Qualified |
| Organic solvent resistance test (%) | Qualified |
| Whether residual gum foreign matter exists after stripping | Is free of |
Increase PET layer 1, glue joint PET layer 1 and PI layer 3 through first glue film 2, improve the hardness of single face flexible copper-clad plate 100 through newly-increased PET layer 1, prevent to appear unfavorable condition such as fold, cardboard, distortion when being used for preparing the circuit board with single face flexible copper-clad plate 100, avoid the product to scrap because of this unfavorable condition, improve the yield.
Fourth embodiment
Referring to fig. 1, the single-sided flexible copper-clad plate 100 provided by the utility model comprises a PET layer 1, a first adhesive layer 2, a PI layer 3, a second adhesive layer 4 and a copper layer 5 which are sequentially arranged, wherein the PET layer 1 is attached to the first adhesive layer 2, the first adhesive layer 2 is bonded to the PET layer 1 and the PI layer 3, the second adhesive layer 4 is bonded to the copper layer 5 and the PI layer 3, the thickness of the PET layer 1 is 50 to 85 μm, the thickness of the first adhesive layer 2 is 5 to 10 μm, and the thickness of the PI layer 3 is 12.5 to 25 μm.
In this embodiment, the thickness of the PET layer 1 is 75 μm, the thickness of the first glue layer 2 is 6 μm, the thickness of the PI layer 3 is 12.5 μm, the thickness of the second glue layer 4 is 12 μm, the thickness of the copper layer 5 is 18 μm, and the rest of the structure is the same as that of the first embodiment.
The heat resistance, acid and alkali resistance, organic solvent resistance and the presence of residual gum foreign matters after stripping of the single-sided flexible copper clad laminate 100 provided in this embodiment are shown in table 4.
TABLE 4
| Performance items | Test specimen |
| Heat resistance | 200℃ |
| Acid and alkali resistance solution test | Qualified |
| Organic solvent resistance test (%) | Qualified |
| Whether residual gum foreign matter exists after stripping | Is free of |
Increase PET layer 1, glue joint PET layer 1 and PI layer 3 through first glue film 2, improve the hardness of single face flexible copper-clad plate 100 through newly-increased PET layer 1, prevent to appear unfavorable condition such as fold, cardboard, distortion when being used for preparing the circuit board with single face flexible copper-clad plate 100, avoid the product to scrap because of this unfavorable condition, improve the yield.
Fifth embodiment
Referring to fig. 1, the single-sided flexible copper-clad plate 100 provided by the utility model comprises a PET layer 1, a first adhesive layer 2, a PI layer 3, a second adhesive layer 4 and a copper layer 5 which are sequentially arranged, wherein the PET layer 1 is adhered to the first adhesive layer 2, the first adhesive layer 2 is adhered to the PET layer 1 and the PI layer 3, the second adhesive layer 4 is adhered to the copper layer 5 and the PI layer 3, the thickness of the PET layer 1 is 50 to 85 μm, the thickness of the first adhesive layer 2 is 5 to 10 μm, and the thickness of the PI layer 3 is 12.5 to 25 μm.
In this embodiment, the thickness of the PET layer 1 is 85 μm, the thickness of the first glue layer 2 is 6 μm, the thickness of the PI layer 3 is 12.5 μm, the thickness of the second glue layer 4 is 12 μm, the thickness of the copper layer 5 is 18 μm, and the rest of the structure is the same as that of the first embodiment.
The heat resistance, acid and alkali resistance, organic solvent resistance and whether or not there is residual glue foreign matter after stripping of the single-sided flexible copper clad laminate 100 provided in this embodiment are shown in table 5.
TABLE 5
| Performance items | Test specimen |
| Heat resistance | 200℃ |
| Acid and alkali solution resistance test | Qualified |
| Organic solvent resistance test (%) | Qualified |
| Whether residual gum foreign matter exists after stripping | Is composed of |
Increase PET layer 1, glue joint PET layer 1 and PI layer 3 through first glue film 2, improve the hardness of single face flexible copper-clad plate 100 through newly-increased PET layer 1, prevent to appear unfavorable condition such as fold, cardboard, distortion when being used for preparing the circuit board with single face flexible copper-clad plate 100, avoid the product to scrap because of this unfavorable condition, improve the yield.
Finally, it should be emphasized that the present invention is not limited to the above-described embodiments, but only the preferred embodiments of the utility model have been described above, and the present invention is not limited to the above-described embodiments, and any modifications, equivalent substitutions, improvements, etc. within the spirit and principle of the present invention should be included in the protection scope of the present invention.
Claims (10)
1. A single-sided flexible copper-clad plate is characterized in that:
the single-sided flexible copper-clad plate comprises a PET layer, a first adhesive layer, a PI layer, a second adhesive layer and a copper layer which are sequentially arranged, wherein the PET layer is adhered to the first adhesive layer, the first adhesive layer is adhered to the PET layer and the PI layer, the second adhesive layer is adhered to the copper layer and the PI layer,
the thickness of the PET layer is 50-85 μm, the thickness of the first glue layer is 5-10 μm, and the thickness of the PI layer is 12.5-25 μm.
2. The single-sided flexible copper-clad plate according to claim 1, characterized in that:
the thickness of the PET layer was 50 μm.
3. The single-sided flexible copper-clad plate according to claim 1, characterized in that:
the thickness of the PET layer was 75 μm.
4. The single-sided flexible copper-clad plate according to claim 1, characterized in that:
the thickness of the PET layer was 85 μm.
5. The single-sided flexible copper-clad plate according to claim 1, characterized in that:
the thickness of the first adhesive layer is 5 or 6 or 10 μm.
6. The single-sided flexible copper-clad plate according to claim 1, characterized in that:
the thickness of the PI layer is 12.5 mu m.
7. The single-sided flexible copper-clad plate according to claim 1, characterized in that:
the thickness of the PI layer is 25 μm.
8. The single-sided flexible copper-clad plate according to any one of claims 1 to 7, characterized in that:
the thickness of the second adhesive layer is 12-20 μm.
9. The single-sided flexible copper-clad plate according to any one of claims 1 to 7, characterized in that:
the copper layer has a thickness of 18 μm.
10. The single-sided flexible copper-clad plate according to any one of claims 1 to 7, characterized in that:
the material of first glue film is acrylic glue or silica gel, the material of second glue film is epoxy glue.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202123201890.7U CN216942188U (en) | 2021-12-17 | 2021-12-17 | Single-sided flexible copper-clad plate |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202123201890.7U CN216942188U (en) | 2021-12-17 | 2021-12-17 | Single-sided flexible copper-clad plate |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN216942188U true CN216942188U (en) | 2022-07-12 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202123201890.7U Active CN216942188U (en) | 2021-12-17 | 2021-12-17 | Single-sided flexible copper-clad plate |
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| Country | Link |
|---|---|
| CN (1) | CN216942188U (en) |
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2021
- 2021-12-17 CN CN202123201890.7U patent/CN216942188U/en active Active
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