CN216930645U

CN216930645U - BMS shell structure integrating heat dissipation function into shell

Info

Publication number: CN216930645U
Application number: CN202123381631.7U
Authority: CN
Inventors: 徐美松; 徐鑫; 沈礼恒
Original assignee: Hefei Bimais New Energy Technology Co ltd
Current assignee: Hefei Bimais New Energy Technology Co ltd
Priority date: 2021-12-29
Filing date: 2021-12-29
Publication date: 2022-07-08
Anticipated expiration: 2031-12-29

Abstract

The utility model discloses a BMS shell structure integrating a heat dissipation function into a shell, and particularly relates to the technical field of BMS shells. The structure for heat dissipation is completely arranged outside the BMS shell, the space inside the BMS shell is not occupied, so that sufficient space is formed inside the BMS shell for mounting BMS system components, the large space is easy for heat dissipation inside the BMS shell, and the heat dissipation effect of the BMS system can be improved.

Description

BMS shell structure integrating heat dissipation function into shell

Technical Field

The present invention relates to the field of BMS housing technology, and more particularly, to a BMS housing structure integrating a heat dissipation function into a housing.

Background

The BMS battery system is commonly called a battery caregiver or a battery manager and mainly aims to intelligently manage and maintain each battery unit, prevent overcharge and overdischarge of the battery, prolong the service life of the battery, and monitor the state of the battery. The battery management system usually includes BMS casing and the PCBA who embeds wherein, and current BMS casing usually exists the heat dissipation not good, causes battery management system in the use serious, influences PCBA's performance. In order to promote its radiating effect, the producer can be inside to set up a large amount of heat-dissipating parts and be used for promoting its radiating effect of BMS casing. However, the space available inside the housing is reduced due to the arrangement of a large number of heat dissipation components, which is not favorable for the installation of other components.

SUMMERY OF THE UTILITY MODEL

In order to solve the technical problems, the utility model provides a BMS shell structure integrating a heat dissipation function into a shell, wherein a bent heat dissipation pipeline mechanism is embedded in a BMS shell, heat conduction oil for absorbing heat in the BMS shell flows in the heat dissipation pipeline mechanism in a circulating manner, a heat dissipation base is fixedly installed at the bottom end of the BMS shell, a heat absorption mechanism connected with the heat dissipation pipeline mechanism is arranged in the heat dissipation base and used for receiving the heat conduction oil circulating in the heat dissipation pipeline mechanism and dissipating the heat in the heat conduction oil, and supporting rods for supporting are installed at four corners of the bottom end of the heat dissipation base.

In a preferred embodiment, a plurality of vacuum chamber heat equalizing plates are attached to the inner wall of the BMS case.

In a preferred embodiment, the heat dissipation pipe mechanism includes two heat dissipation pipes arranged in a shape of 'hui', the two ends of the heat dissipation pipes are not connected together and form a gap, two the heat dissipation pipes are connected with a drainage pipe between the upper ends of the gap, the length of the drainage pipe is the same as the width of the BMS housing, one of the heat dissipation pipes is connected with a discharge pipe at the lower end of the gap, and the other heat dissipation pipe is connected with an inlet pipe at the lower end of the gap.

In a preferred embodiment, a cavity is formed inside the heat dissipation base, the heat absorption mechanism comprises a circulating pump installed inside the cavity and a semiconductor refrigeration piece embedded on the heat dissipation base, the refrigeration end of the semiconductor refrigeration piece is located inside the cavity, and the heat dissipation end of the semiconductor refrigeration piece penetrates through the heat dissipation base and extends to the position below the heat dissipation base.

In a preferred embodiment, a metal outer cover used for water proofing is wrapped outside the refrigerating end of the semiconductor refrigerating sheet.

In a preferred embodiment, the discharge tube has a bottom end extending through the BMS housing and the heat dissipation base to the inside of the cavity, and the suction tube has a bottom end extending through the BMS housing and the heat dissipation base to the inside of the cavity and is further connected to the circulation pump.

The utility model has the technical effects and advantages that:

be used for radiating structure in whole BMS casing to all arrange the outside of BMS casing in, do not occupy BMS casing inner space for BMS casing is inside to have sufficient space to carry out the installation of BMS system component, and the inside heat dissipation of BMS casing is easily in great space, so circulate, promote the radiating effect of BMS system.

Drawings

FIG. 1 is a schematic view of the overall structure of the present invention;

fig. 2 is a schematic structural diagram of a heat dissipation pipeline mechanism of the present invention.

Description of reference numerals: the heat dissipation device comprises a BMS shell 1, a heat dissipation pipeline mechanism 2, a heat dissipation base 3, a heat absorption mechanism 4, a support rod 5, a vacuum cavity vapor chamber 6, a heat dissipation pipe 7, a drainage pipe 8, a discharge pipe 9, an inlet pipe 10, a cavity 11, a circulating pump 12, a semiconductor refrigeration sheet 13 and a metal outer cover 14.

Detailed Description

The present invention will be described in further detail with reference to the accompanying drawings and specific embodiments. The embodiments of the present invention have been presented for purposes of illustration and description, and are not intended to be exhaustive or limited to the utility model in the form disclosed. Many modifications and variations will be apparent to those of ordinary skill in the art. The embodiment was chosen and described in order to best explain the principles of the utility model and the practical application, and to enable others of ordinary skill in the art to understand the utility model for various embodiments with various modifications as are suited to the particular use contemplated.

As shown in fig. 1-2, in the BMS housing structure integrating the heat dissipation function into the housing, a bent heat dissipation pipeline mechanism 2 is embedded in the BMS housing 1, heat conduction oil for absorbing heat inside the BMS housing 1 flows in the heat dissipation pipeline mechanism 2 in a circulating manner, a heat dissipation base 3 is fixedly installed at the bottom end of the BMS housing 1, and a heat absorption mechanism 4 connected with the heat dissipation pipeline mechanism 2 is arranged inside the heat dissipation base 3 and used for receiving the heat conduction oil circulating in the heat dissipation pipeline mechanism 2 and dissipating the heat in the heat conduction oil;

in the use, the heat that the inside PCBA of BMS casing 1 produced in the course of the work can absorb through the conduction oil that flows in the heat dissipation pipeline mechanism 2, when the conduction oil flows back to the heat absorption mechanism 4 in the heat dissipation base 3, shifts and gives off the heat that the conduction oil absorbed, realizes carrying out radiating effect to BMS casing 1.

On foretell basis, be used for radiating structure in whole BMS casing 1 and all arrange the outside of BMS casing 1 in for BMS casing 1 inner space does not have the occupation for BMS casing 1 is inside to have sufficient space to carry out the installation of BMS system component, and the inside heat dissipation of BMS casing 1 is easily in great space, so circulate, promote the radiating effect of BMS system.

The bracing piece 5 that is used for the support is installed to the four corners department in heat dissipation base 3 bottom, utilizes bracing piece 5 to prop up heat dissipation base 3, and leaves the clearance between the face of placing, makes things convenient for gaseous circulation, is favorable to the heat dissipation.

The inner wall of the BMS shell 1 is attached with a plurality of vacuum cavity vapor chambers 6, the thickness of each vacuum cavity vapor chamber 6 is thin and the vacuum cavity vapor chambers are attached to the inner wall, and heat can be effectively conducted to the heat dissipation pipeline mechanism 2 in the BMS shell 1.

The heat dissipation pipeline mechanism 2 comprises two heat dissipation pipes 7 which are arranged in a shape like a Chinese character 'hui', the two ends of each heat dissipation pipe 7 are not connected together to form a gap, a drainage pipe 8 is connected between the upper ends of the gaps of the two heat dissipation pipes 7, the length of each drainage pipe 8 is the same as the width of the BMS shell 1, the lower end of one heat dissipation pipe 7 at the gap is connected with a discharge pipe 9, and the lower end of the other heat dissipation pipe 7 at the gap is connected with an inlet pipe 10;

on the basis of the above, the heat conducting oil enters the whole heat dissipation pipeline mechanism 2 from the inlet pipe 10, flows into one of the heat dissipation pipes 7 for circulation after entering from the inlet pipe 10, then flows into the other heat dissipation pipe 7 from the drainage pipe 8 connected to the other end of the heat dissipation pipe 7, and is discharged from the discharge pipe 9 connected to the other end of the heat dissipation pipe 7.

The inside cavity 11 of having seted up of heat dissipation base 3, heat absorption mechanism 4 is including installing circulating pump 12 inside cavity 11, discharge pipe 9 bottom is run through inside BMS casing 1 and heat dissipation base 3 extend to cavity 11, the suction pipe bottom is run through inside BMS casing 1 and heat dissipation base 3 extend to cavity 11 and still is connected with circulating pump 12.

On the basis, heat conduction oil is also stored in the cavity 11, the heat conduction oil is circulated through the circulating pump 12, conveyed to the inlet pipe 10 and conveyed to the whole heat dissipation pipeline mechanism 2, the circulating pump 12 provides power for the circulation of the heat conduction oil, and after the heat conduction oil circulates for a circle, the heat conduction oil is discharged from the discharge pipe 9 into the cavity 11, so that the whole circulation is completed.

The heat absorption mechanism 4 further comprises a semiconductor refrigeration sheet 13 embedded on the heat dissipation base 3, the refrigeration end of the semiconductor refrigeration sheet 13 is located inside the cavity 11, and the heat dissipation end of the semiconductor refrigeration sheet 13 penetrates through the heat dissipation base 3 and extends to the lower side of the heat dissipation base 3;

when having absorbed inside thermal conduction oil circulation to cavity 11 of BMS casing 1, absorb the heat through the refrigeration terminal pair heat of semiconductor refrigeration piece 13 for the temperature of conduction oil reduces rapidly, then circulates to heat dissipation pipeline mechanism 2 through circulating pump 12 again, and the effectual giveaway of heat progressive nature in the BMS casing 1 circulates like this.

Although the heat conduction oil has no conductivity and cannot affect the PN junction of the semiconductor refrigerating sheet 13, in order to avoid damage to the semiconductor refrigerating sheet 13 caused by condensed water generated due to temperature change in the cavity 11 in the working process, the refrigerating end of the semiconductor refrigerating sheet 13 is externally wrapped with a waterproof metal outer cover 14, and the service life of the semiconductor refrigerating sheet 13 can be prolonged.

Further, in order to avoid the heat dissipation end of the semiconductor refrigeration piece 13 from being squeezed, the height of the support rod 5 is set to be larger than the protruding distance of the heat dissipation end of the semiconductor refrigeration piece 13 on the heat dissipation base 3.

It is to be understood that the described embodiments are merely a few embodiments of the utility model, and not all embodiments. All other embodiments, which can be derived by one of ordinary skill in the art and related arts based on the embodiments of the present invention without any creative effort, shall fall within the protection scope of the present invention. Structures, devices, and methods of operation not specifically described or illustrated herein are generally practiced in the art without specific recitation or limitation.

Claims

1. The utility model provides a BMS shell structure with heat dissipation function integration in shell, a serial communication port, inlay the heat dissipation pipeline mechanism who is equipped with the bending type in the BMS casing, it has the conduction oil that is used for absorbing the inside heat of BMS casing to circulate among the heat dissipation pipeline mechanism, there is the heat dissipation base at BMS casing bottom fixed mounting, the inside heat absorption mechanism who is connected with heat dissipation pipeline mechanism that is provided with of heat dissipation base, a heat conduction oil for receiving the heat dissipation pipeline mechanism mesocycle distributes the heat in the conduction oil, install the bracing piece that is used for the support in the four corners department of heat dissipation base bottom.

2. The BMS housing structure of claim 1, wherein: a plurality of vacuum chamber vapor chambers are attached to the inner wall of the BMS case.

3. The BMS housing structure of claim 1, wherein: the heat dissipation pipeline mechanism comprises two heat dissipation pipes which are arranged in a 'return' shape, the two ends of each heat dissipation pipe are not connected together and form a notch, two the heat dissipation pipes are connected with drainage pipes between the upper ends of the notches, the lengths of the drainage pipes are the same as the width of the BMS shell, the lower end of one heat dissipation pipe at the notch is connected with a discharge pipe, and the lower end of the other heat dissipation pipe at the notch is connected with an inlet pipe.

4. A BMS housing structure integrating a heat dissipation function into a housing according to claim 3, characterized in that: the cavity is formed in the radiating base, the heat absorption mechanism comprises a circulating pump installed in the cavity and a semiconductor refrigerating piece embedded on the radiating base, the refrigerating end of the semiconductor refrigerating piece is located in the cavity, and the radiating end of the semiconductor refrigerating piece penetrates through the radiating base and extends to the lower portion of the radiating base.

5. The BMS housing structure of claim 4, wherein: and a metal outer cover for water prevention is wrapped outside the refrigerating end of the semiconductor refrigerating sheet.

6. The BMS housing structure of claim 4, wherein: the bottom end of the discharge pipe penetrates through the BMS shell and the heat dissipation base and extends to the inside of the cavity, and the bottom end of the inlet pipe penetrates through the BMS shell and the heat dissipation base and extends to the inside of the cavity and is connected with the circulating pump.