CN216930401U - Circuit board for industrial control with composite multilayer structure - Google Patents
Circuit board for industrial control with composite multilayer structure Download PDFInfo
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- CN216930401U CN216930401U CN202220191446.7U CN202220191446U CN216930401U CN 216930401 U CN216930401 U CN 216930401U CN 202220191446 U CN202220191446 U CN 202220191446U CN 216930401 U CN216930401 U CN 216930401U
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- circuit board
- moisture absorption
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- board body
- multilayer structure
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Abstract
The utility model relates to the field of circuit boards, and discloses an industrial control circuit board with a composite multilayer structure. According to the utility model, the side mounting columns are arranged on the two transverse sides of the circuit board body, the wiring holes are formed in the surfaces of the side mounting columns, the side mounting chambers are arranged on the two longitudinal sides of the circuit board body, the moisture absorption drawer is movably arranged in the side mounting chambers, moisture absorption particles are filled in the moisture absorption drawer, the tail end of the moisture absorption drawer, which is positioned outside the side mounting chambers, is provided with the pull plate, the surfaces of the moisture absorption particles are provided with the pull handles, when the use environment of the circuit board body is humid, the moisture absorption particles in the side mounting chambers can absorb humid air near the circuit board body through the exchange moisture absorption holes, so that the circuit board body can be kept dry, and the dryness and safety of the circuit board body in the use process are improved.
Description
Technical Field
The utility model belongs to the technical field of circuit boards, and particularly relates to an industrial control circuit board with a composite multilayer structure.
Background
The names of the circuit boards are as follows: ceramic circuit boards, alumina ceramic circuit boards, aluminum nitride ceramic circuit boards; the circuit board has the characteristics of high wiring density, light weight, thin thickness and good bending property. The birth and development of FPC and PCB have promoted a new product of soft and hard combined board. Therefore, the rigid-flexible printed circuit board and the flexible printed circuit board are combined together according to the relevant process requirements through processes such as pressing and the like to form the circuit board with FPC (flexible printed circuit) characteristics and PCB (printed circuit board) characteristics.
However, when the common circuit board is used in a humid environment, the circuit board is easily affected with moisture and short circuit, which causes safety accidents.
SUMMERY OF THE UTILITY MODEL
The utility model aims to: in order to solve the problem that the circuit board is easily affected with damp and short circuit, the circuit board for industrial control with the composite multilayer structure is provided.
The technical scheme adopted by the utility model is as follows: the utility model provides a circuit board for industrial control with compound multilayer structure, includes the circuit board body, the center department of circuit board body has seted up the circuit board ventilation hole, the horizontal both sides of circuit board body are provided with the side-mounting post, the wiring hole has been seted up on the surface of side-mounting post, the vertical both sides of circuit board body are provided with the side-mounting room, the inside activity of side-mounting room is provided with the moisture absorption drawer, the inside of moisture absorption drawer is filled with the moisture absorption granule, the end that the moisture absorption drawer is located pull side-mounting room outside is provided with the pull board, the surface of moisture absorption granule is provided with the pull handle.
Through adopting above-mentioned technical scheme, when the service environment of circuit board body was comparatively moist, the moisture absorption granule of side installation indoor portion can see through the exchange moisture absorption hole and can absorb the moist air near the circuit board body this moment to make the circuit board body can keep dry, improved the aridity and the security of circuit board body in the use.
In a preferred embodiment, the upper surface of the side installation chamber is provided with an exchange moisture absorption hole, and the exchange moisture absorption hole is communicated with the inside and the outside of the side installation chamber.
By adopting the technical scheme, the moisture absorption capacity of the moisture absorption particles is improved.
In a preferred embodiment, the top of the moisture absorption drawer is provided with a limiting sliding groove at two side edges, and the top inner wall of the side mounting chamber is provided with a limiting protrusion matched with the side mounting chamber.
Through adopting above-mentioned technical scheme, spacing arch and spacing sliding tray cooperation can be so that the pull is more smooth in the use, has improved the stability in the use.
In a preferred embodiment, a metal body layer is arranged inside the circuit board body, and an adhesive bottom layer is arranged at the bottom of the metal body layer and is a silica gel adhesive layer.
By adopting the technical scheme, the circuit board body cannot easily fall off.
In a preferred embodiment, the upper surface of the metal body layer is provided with a heat conduction layer, the thickness of the heat conduction layer is 0.30mm, and the heat conduction layer is a copper metal sheet layer.
By adopting the technical scheme, the heat conducting layer is the copper metal sheet layer, and the heat conducting capacity is accelerated.
In a preferred embodiment, a heat dissipation layer is arranged on one side surface of the heat conduction layer, which is far away from the metal body layer, the thickness of the heat dissipation layer is 0.25mm, and the heat dissipation layer is a graphene layer.
Through adopting above-mentioned technical scheme, the thickness on heat dissipation layer is 0.25mm, the heat dissipation layer is graphite alkene layer.
In summary, due to the adoption of the technical scheme, the utility model has the beneficial effects that:
1. in the utility model, when the use environment of the circuit board body is humid, the moisture absorption particles in the side mounting chamber can absorb the humid air near the circuit board body through the exchange moisture absorption holes, so that the circuit board body can be kept dry, and the dryness and the safety of the circuit board body in the use process are improved.
2. According to the utility model, the heat conducting layer is arranged on the upper surface of the circuit board body, so that heat generated in the working process of the circuit board body can be conducted into the heat dissipation layer, and the heat generated in the working process of the circuit board body can be rapidly discharged through the heat dissipation layer, thereby improving the heat dissipation capability of the circuit board body in the working process.
Drawings
FIG. 1 is a schematic structural view of the present invention;
FIG. 2 is a schematic diagram of a laminated structure of a circuit board body according to the present invention;
FIG. 3 is an enlarged view of FIG. 1 taken at A.
The labels in the figure are: 1-circuit board body, 2-circuit board vent hole, 3-side mounting column, 4-wiring hole, 5-moisture absorption particle, 6-drawing plate, 7-moisture absorption drawer, 8-exchange moisture absorption hole, 9-side mounting chamber, 10-heat dissipation layer, 11-heat conduction layer, 12-metal body layer, 13-bonding bottom layer, 14-limiting bulge and 15-limiting sliding groove.
Detailed Description
In order to make the objects, technical solutions and advantages of the embodiments of the present invention clearer, the technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the embodiments of the present invention, and it is obvious that the described embodiments are some embodiments of the present invention, but not all embodiments. All other embodiments, which can be obtained by a person skilled in the art without inventive step based on the embodiments of the present invention, are within the scope of protection of the present invention.
With reference to figures 1-3 of the drawings,
example (b):
the utility model provides a circuit board for industrial control with compound multilayer structure, includes circuit board body 1, and circuit board ventilation hole 2 has been seted up to circuit board body 1's center department, can strengthen the heat-sinking capability of circuit board body 1 in the use through circuit board ventilation hole 2, has improved circuit board body 1 work efficiency.
The lateral installation columns 3 are arranged on the two lateral sides of the circuit board body 1, the wiring holes 4 are formed in the surfaces of the lateral installation columns 3, the lateral installation chambers 9 are arranged on the two longitudinal sides of the circuit board body 1, the moisture absorption drawers 7 are movably arranged in the lateral installation chambers 9, the moisture absorption particles 5 are filled in the moisture absorption drawers 7, when the use environment of the circuit board body 1 is wet, the moisture absorption particles 5 in the lateral installation chambers 9 can absorb wet air near the circuit board body 1 through the exchange moisture absorption holes 8, therefore, the circuit board body 1 can be kept dry, and the dryness and the safety of the circuit board body 1 in the use process are improved.
The tail end of the moisture absorption drawer 7, which is positioned outside the side mounting chamber 9, is provided with the drawing plate 6, the surface of the moisture absorption particles 5 is provided with the drawing handle, the drawing handle is held by a hand to draw the moisture absorption drawer 7, and the convenience of the moisture absorption drawer 7 in use is improved.
The upper surface of the side mounting chamber 9 is provided with the exchange moisture absorption holes 8, and the exchange moisture absorption holes 8 are communicated with the inside and the outside of the side mounting chamber 9, so that the moisture absorption capacity of the moisture absorption particles 5 is improved.
Limiting sliding grooves 15 are formed in the edges of the two sides of the top of the moisture absorption drawer 7, limiting protrusions 14 matched with the side installation chambers 9 are arranged on the inner wall of the top of each side installation chamber 9, the limiting protrusions 14 are matched with the limiting sliding grooves 15, the drawing can be more smoothly pulled in the using process, and the stability in the using process is improved.
The inside of circuit board body 1 is provided with metal body layer 12, and the bottom of metal body layer 12 is provided with bonding bottom layer 13, and bonding bottom layer 13 is the silica gel adhesive linkage for circuit board body 1 can not take place easily and drop.
The upper surface of metal body layer 12 is provided with heat-conducting layer 11, and the thickness of heat-conducting layer 11 is 0.30mm, and heat-conducting layer 11 is the copper metal lamella, has accelerated the heat conductivility.
The heat-conducting layer 11 is provided with the heat dissipation layer 10 on the surface of one side of keeping away from metal body layer 12, and the thickness of heat dissipation layer 10 is 0.25mm, and heat dissipation layer 10 is graphite alkene layer.
The application principle of the circuit board embodiment for industrial control with the composite multilayer structure is as follows: when the service environment of circuit board body 1 is comparatively moist, the moisture absorption granule 5 of side-mounting room 9 inside can see through exchange moisture absorption hole 8 and can absorb the moist air near circuit board body 1 this moment, thereby make circuit board body 1 can keep dry, the aridity and the security of circuit board body 1 in the use have been improved, the upper surface of circuit board body 1 is provided with heat-conducting layer 11, can conduct the inside of heat dissipation layer 10 with the heat that produces in circuit board body 1 course of operation, the heat that produces in circuit board body 1 course of operation that can be quick via heat dissipation layer 10 discharges, thereby the heat-sinking capability in circuit board body 1 course of operation has been improved.
It is noted that, herein, relational terms such as first and second, and the like may be used solely to distinguish one entity or action from another entity or action without necessarily requiring or implying any actual such relationship or order between such entities or actions. Also, the terms "comprises," "comprising," or any other variation thereof, are intended to cover a non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements does not include only those elements but may include other elements not expressly listed or inherent to such process, method, article, or apparatus. Without further limitation, an element defined by the phrase "comprising an … …" does not exclude the presence of other identical elements in a process, method, article, or apparatus that comprises the element.
The above examples are only intended to illustrate the technical solution of the present invention, and not to limit it; although the present invention has been described in detail with reference to the foregoing embodiments, it will be understood by those of ordinary skill in the art that: the technical solutions described in the foregoing embodiments may still be modified, or some technical features may be equivalently replaced; and such modifications or substitutions do not depart from the spirit and scope of the corresponding technical solutions of the embodiments of the present invention.
Claims (6)
1. The utility model provides a circuit board for industrial control with compound multilayer structure, includes circuit board body (1), its characterized in that: the utility model discloses a moisture absorption and moisture absorption machine, including circuit board body (1), horizontal both sides of circuit board body (1) are provided with side-mounting post (3), wiring hole (4) have been seted up on the surface of side-mounting post (3), the vertical both sides of circuit board body (1) are provided with side-mounting room (9), the inside activity of side-mounting room (9) is provided with moisture absorption drawer (7), moisture absorption drawer's (7) inside is filled with moisture absorption granule (5), moisture absorption drawer (7) are located the outside end of side-mounting room (9) and are provided with pull board (6), the surface of moisture absorption granule (5) is provided with the pull handle.
2. An industrial control wiring board having a composite multilayer structure as claimed in claim 1, wherein: exchange moisture absorption holes (8) are formed in the upper surface of the side mounting chamber (9), and the exchange moisture absorption holes (8) are communicated with the inside and the outside of the side mounting chamber (9).
3. An industrial control wiring board having a composite multilayer structure as claimed in claim 1, wherein: the top both sides edge of moisture absorption drawer (7) has seted up spacing sliding tray (15), the top inner wall of side installation room (9) is provided with spacing arch (14) with side installation room (9) looks adaptation.
4. An industrial control wiring board having a composite multilayer structure as claimed in claim 1, wherein: the circuit board comprises a circuit board body (1), wherein a metal body layer (12) is arranged inside the circuit board body (1), a bonding bottom layer (13) is arranged at the bottom of the metal body layer (12), and the bonding bottom layer (13) is a silica gel bonding layer.
5. An industrial control circuit board having a composite multilayer structure as claimed in claim 4, wherein: the upper surface of metal body layer (12) is provided with heat-conducting layer (11), the thickness of heat-conducting layer (11) is 0.30mm, heat-conducting layer (11) are copper metal laminated layer.
6. An industrial control circuit board having a composite multilayer structure as claimed in claim 5, wherein: a side surface of the heat conduction layer (11) far away from the metal body layer (12) is provided with a heat dissipation layer (10), the thickness of the heat dissipation layer (10) is 0.25mm, and the heat dissipation layer (10) is a graphene layer.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202220191446.7U CN216930401U (en) | 2022-01-25 | 2022-01-25 | Circuit board for industrial control with composite multilayer structure |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202220191446.7U CN216930401U (en) | 2022-01-25 | 2022-01-25 | Circuit board for industrial control with composite multilayer structure |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN216930401U true CN216930401U (en) | 2022-07-08 |
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ID=82262968
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202220191446.7U Active CN216930401U (en) | 2022-01-25 | 2022-01-25 | Circuit board for industrial control with composite multilayer structure |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN216930401U (en) |
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2022
- 2022-01-25 CN CN202220191446.7U patent/CN216930401U/en active Active
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