CN216930299U

CN216930299U - Low-delay car audio system

Info

Publication number: CN216930299U
Application number: CN202220453076.XU
Authority: CN
Inventors: 李仕天
Original assignee: GAC Honda Automobile Co Ltd; Guangqi Honda Automobile Research and Development Co Ltd
Current assignee: GAC Honda Automobile Co Ltd; Guangqi Honda Automobile Research and Development Co Ltd
Priority date: 2022-03-02
Filing date: 2022-03-02
Publication date: 2022-07-08
Anticipated expiration: 2032-03-02

Abstract

The application discloses a low-delay car audio system, which comprises an MIC module, a DSP chip, an SOC chip, a communication module, a power amplifier module, an IIC transmission line and a loudspeaker; the positive electrode of the MIC module is connected to the DSP chip through a first capacitor, the negative electrode of the MIC module is grounded through a second capacitor, and the resistance values of the first capacitor and the second capacitor are the same; the DSP chip is connected to the SOC chip through an IIC transmission line, the DSP chip is connected with the input end of the power amplification module, and the output end of the power amplification module is connected with the loudspeaker; the communication module is connected with the SOC chip and is used for being in remote communication connection with the terminal equipment; the input end of the power amplifier module comprises a plurality of ports, the DSP chip is connected to each port, and each port is grounded through a corresponding capacitor with the same resistance value. The car machine audio system can more thoroughly eliminate noise, so that the experience of a user using the car machine audio system is improved. The method can be widely applied to the technical field of automobiles.

Description

Low-delay car audio system

Technical Field

The utility model relates to the technical field of automobiles, in particular to a low-delay car audio system.

Background

At present, a car audio system in the related art includes components such as an MIC module, a noise reduction module, a DSP chip, a power amplifier, and a speaker. The sound source is processed by the power amplifier and then played by the loudspeaker.

However, the MIC module is prone to introduce noise problems, such as common noise and echo in the vehicle interior environment, and in order to eliminate these noise and noise, an independent noise reduction module is added to a general vehicle audio system for processing, MIC signals and audio feedback signals output by a DSP chip are all introduced into the noise reduction module for noise reduction, MIC audio signals are processed cleanly, and then output to the DSP for further audio processing. The processing mode increases the hardware cost of the system on one hand, and on the other hand, the audio signal received by the noise reduction module and the audio signal picked up by the MIC module have a certain time delay, which may cause incomplete noise cancellation.

In summary, there is a need to solve the problems in the related art.

SUMMERY OF THE UTILITY MODEL

The present invention has been made to solve at least one of the technical problems occurring in the related art to some extent.

Therefore, an object of the embodiments of the present invention is to provide a low-latency car audio system, which can perform noise cancellation more thoroughly, thereby improving user experience of using the car audio system.

In order to achieve the technical purpose, the technical scheme adopted by the embodiment of the utility model comprises the following steps:

in one aspect, an embodiment of the present invention provides a low-latency car audio system, including:

the system comprises an MIC module, a DSP chip, an SOC chip, a communication module, a power amplifier module, an IIC transmission line and a loudspeaker;

the positive electrode of the MIC module is connected to the DSP chip through a first capacitor, the negative electrode of the MIC module is grounded through a second capacitor, and the resistance values of the first capacitor and the second capacitor are the same; the DSP chip is connected to the SOC chip through the IIC transmission line, the DSP chip is connected with the input end of the power amplification module, and the output end of the power amplification module is connected with the loudspeaker; the communication module is connected to the SOC chip and is used for being in remote communication connection with terminal equipment;

the input end of the power amplifier module comprises a plurality of ports, the DSP chip is connected to each port, and each port is grounded through a corresponding capacitor with the same resistance value.

In addition, the car audio system with low delay according to the above embodiment of the present invention may further have the following additional technical features:

further, in one embodiment of the present invention, the IIC transmission line includes a bit clock line, a channel selection line, a serial audio data output line, a serial audio data input line, a first resistor, a second resistor, a third resistor, and a fourth resistor;

the DSP chip is connected to the bit clock line, the sound channel selection line, the serial audio data output line and the serial audio data input line; the bit clock line is connected to the SOC chip through the first resistor, the channel select line is connected to the SOC chip through the second resistor, the serial audio data output line is connected to the SOC chip through the third resistor, and the serial audio data input line is connected to the SOC chip through the fourth resistor.

Further, in one embodiment of the present invention, the IIC transmission line further includes a fifth resistor and a sixth resistor;

the bit clock line is grounded through the fifth resistor, and the channel select line is grounded through the sixth resistor.

Further, in an embodiment of the present invention, the first resistor has a resistance value of less than 50 ohms.

Further, in an embodiment of the present invention, the first resistor has a resistance of 10 ohms.

Further, in an embodiment of the present invention, the car audio system further includes a storage unit;

the storage unit is connected to the SOC chip.

Further, in one embodiment of the present invention, the storage unit includes a usb disk.

Further, in an embodiment of the present invention, the resistance of the fifth resistor is 100k ohms.

Advantages and benefits of the present invention will be set forth in part in the description which follows and, in part, will be obvious from the description, or may be learned by practice of the utility model:

the application discloses a low-delay car audio system, which comprises an MIC module, a DSP chip, an SOC chip, a communication module, a power amplifier module, an IIC transmission line and a loudspeaker; the positive electrode of the MIC module is connected to the DSP chip through a first capacitor, the negative electrode of the MIC module is grounded through a second capacitor, and the resistance values of the first capacitor and the second capacitor are the same; the DSP chip is connected to the SOC chip through the IIC transmission line, the DSP chip is connected with the input end of the power amplification module, and the output end of the power amplification module is connected with the loudspeaker; the communication module is connected to the SOC chip and is used for being in remote communication connection with terminal equipment; the input end of the power amplifier module comprises a plurality of ports, the DSP chip is connected to each port, and each port is grounded through a corresponding capacitor with the same resistance value. The car machine audio system can process noise possibly existing in the system without depending on an independent noise reduction module, can reduce the occurrence of processing delay condition, and can more thoroughly eliminate noise, thereby improving the experience of a user using the car machine audio system.

Drawings

Fig. 1 is a schematic structural diagram of a low-latency car audio system according to an embodiment of the present invention;

fig. 2 is a schematic circuit diagram of a circuit between an MIC module and a DSP chip of a low-latency car audio system according to an embodiment of the present invention;

fig. 3 is a schematic circuit diagram between a DSP chip and a power amplifier module of a low-latency car audio system according to an embodiment of the present invention;

fig. 4 is a schematic circuit diagram of an IIC transmission line of a car audio system with low latency according to an embodiment of the present invention.

Detailed Description

Reference will now be made in detail to embodiments of the present invention, examples of which are illustrated in the accompanying drawings, wherein like or similar reference numerals refer to the same or similar elements or elements having the same or similar function throughout. The embodiments described below with reference to the accompanying drawings are illustrative only for the purpose of explaining the present invention, and are not to be construed as limiting the present invention.

In the description of the present invention, it is to be understood that the terms "length," "upper," "lower," "front," "rear," "left," "right," "top," "inner," "outer," "axial," "radial," "circumferential," and the like are used in the orientations and positional relationships indicated in the drawings for convenience in describing the present invention and for simplicity in description, and are not intended to indicate or imply that the referenced device or element must have a particular orientation, be constructed and operated in a particular orientation, and are not to be construed as limiting the present invention. Furthermore, a feature defined as "first" or "second" may explicitly or implicitly include one or more of that feature. In the description of the present invention, "a plurality" means two or more unless otherwise specified.

In the description of the present invention, it should be noted that, unless otherwise explicitly specified or limited, the terms "disposed," "mounted," "connected," and "connected" are to be construed broadly, e.g., as meaning either a fixed connection, a removable connection, or an integral connection; can be mechanically or electrically connected; they may be connected directly or indirectly through intervening media, or they may be interconnected between two elements. The specific meanings of the above terms in the present invention can be understood in specific cases to those skilled in the art.

In view of this, the embodiment of the present application provides a low-latency car audio system, which can process noise that may exist in the system without depending on a separate noise reduction module, reduce the occurrence of processing latency, and can more thoroughly perform noise reduction, thereby improving the experience of a user using the car audio system.

Hereinafter, a detailed description will be given of a low-latency car audio system provided in an embodiment of the present application with reference to the accompanying drawings.

The low-delay car audio system provided in the embodiment of the application can be applied to the technical field of automobiles. Specifically, referring to fig. 1, an in-vehicle audio system with low latency in the embodiment of the present application mainly includes:

the positive electrode of the MIC module is connected to the DSP chip through a first capacitor, the negative electrode of the MIC module is grounded through a second capacitor, and the resistance values of the first capacitor and the second capacitor are the same; the DSP chip is connected to the SOC chip through the IIC transmission line, the DSP chip is connected with the input end of the power amplification module, and the output end of the power amplification module is connected with the loudspeaker;

The embodiment of the application provides a car machine audio system which can reduce the occurrence of processing delay and can more thoroughly eliminate noise. Specifically, the system comprises an MIC module, a DSP chip, an SOC chip, a communication module, a power amplifier module, an IIC transmission line and a loudspeaker; the MIC module is used for picking up the sound of a passenger or a vehicle owner, and it can be understood that when the MIC module works, the noise in the vehicle and the sound of a horn in the vehicle can be inevitably received, and the sounds can possibly cause interference to the sound of the passenger or the vehicle owner. The received audio data of MIC module, can transmit the DSP chip and handle, in the embodiment of this application, can carry out the signal that the MIC module was gathered in the DSP chip and filter and fall the noise and the echo eliminates the back of handling such as, the transmission gives the SOC chip, the rethread SOC chip transmits audio data through communication module, here, communication module can with long-range terminal equipment communication connection, for example, can set up communication module to the bluetooth module, the SOC chip can give communication module with audio data, communication module is defeated again for the remote user who uses bluetooth telephone.

In this application embodiment, to far-end user's audio data of transmitting for car machine audio system, receive the back through communication module, can input in the SOC chip, the SOC chip can set up the timesharing in the chip is inside to be switched, transmits through IIS transmission line and handles for the DSP chip, and then analog signal after the DSP chip is handled can be given the power amplifier module and enlargies, and the rethread loudspeaker are broadcast.

In particular, referring to fig. 2 in the embodiment of the present application, detailed circuit principles between the MIC module and the DSP chip in the embodiment of the present application are shown in fig. 2: the signals transmitted by the MIC module comprise direct current signals and alternating current signals, but only the alternating current signals are useful signals, so the direct current signals transmitted by the MIC module need to be filtered, the positive pole of the MIC module separates the direct current signals by serially connecting a first capacitor C1 and transmits the useful alternating current signals to a DSP chip, and the negative pole of the MIC module needs to be connected with a second capacitor C2 with the same capacitance value to the ground in order to avoid introducing ground noise. Therefore, part of noise can be filtered at the signal acquisition end, and the efficiency and the effect of subsequent audio data processing are improved.

Referring to fig. 3, in the embodiment of the present application, as for a connection relationship between a DSP chip and a power amplifier module, as shown in fig. 3. Here, the input end of the power amplifier module may include a plurality of ports, for example, four power amplifiers are provided in fig. 3, the DSP chip is connected to each port, and each port is grounded through a corresponding capacitor with the same resistance value. Therefore, the peak pulse can be filtered, the noise is reduced, and the definition of the audio frequency played by the loudspeaker is improved. Specifically, in the embodiment of the present application, the capacitance of each path of power amplifier grounded may be set to 6.8 NF.

In some embodiments, referring to fig. 4, in an embodiment of the present application, the IIC transmission line includes a bit clock line, a channel selection line, a serial audio data output line, a serial audio data input line, a first resistor, a second resistor, a third resistor, and a fourth resistor;

In the embodiment of the present application, the principle of the IIS transmission line between the DSP chip and the SOC chip is shown in fig. 4: the IIS transmission line between the DSP chip and the SOC chip comprises four lines of a bit clock line, a sound channel selection line, a serial audio data output line and a serial audio data input line, wherein each line is respectively connected with a resistor (R24/R25/R28/R30) in series, so that the transmission current can be reduced, the external electromagnetic radiation is reduced, the interference of high-speed energy of IIS transmission signals to other equipment is avoided, and the IIS transmission line is more suitable for the use environment in an automobile. Specifically, the resistance value of the series resistor here may be smaller than 50 ohms, and for example, the resistance value of the first resistor may be set to 10 ohms.

Referring to fig. 4, in some embodiments, the IIC transmission line further includes a fifth resistor and a sixth resistor;

In the embodiment of the application, two clock signals of the IIC transmission line can be connected with a resistor in parallel to the ground, so that noise waves can be guided to the ground more quickly, and external interference is reduced. Here, the resistance values of the fifth resistor and the sixth resistor may be 100k ohms.

In some embodiments, the in-vehicle audio system further comprises a storage unit;

the storage unit is connected to the SOC chip.

In the embodiment of the application, the car machine system can further comprise a storage unit and a radio module besides the components, wherein the storage unit can be connected to the SOC chip, the audio signals stored in the storage unit can be transmitted to the SOC chip, the SOC chip decodes the audio signals and transmits the audio signals to the DSP chip for processing through the IIS signals, and the DSP chip plays the audio signals after sound processing. The radio module can give the DSP chip directly to handle radio signal through the IIS signal, and the rethread analog signal gives power amplifier chip and enlargies to play out through the loudspeaker. Specifically, the storage unit may be a device such as a usb disk, which is not specifically limited in this application.

In the description herein, references to the description of "one embodiment," "another embodiment," or "certain embodiments," etc., mean that a particular feature, structure, material, or characteristic described in connection with the embodiment or example is included in at least one embodiment or example of the utility model. In this specification, schematic representations of the above terms do not necessarily refer to the same embodiment or example. Furthermore, the particular features, structures, materials, or characteristics described may be combined in any suitable manner in any one or more embodiments or examples.

While embodiments of the present invention have been shown and described, it will be understood by those of ordinary skill in the art that: various changes, modifications, substitutions and alterations can be made to the embodiments without departing from the principles and spirit of the utility model, the scope of which is defined by the claims and their equivalents.

Claims

1. The utility model provides a low-latency car audio system which characterized in that includes:

2. The car audio system with low time delay of claim 1, wherein the IIC transmission line comprises a bit clock line, a channel selection line, a serial audio data output line, a serial audio data input line, a first resistor, a second resistor, a third resistor and a fourth resistor;

3. The car audio system with low delay of claim 2, wherein the IIC transmission line further comprises a fifth resistor and a sixth resistor;

4. The car audio system with low latency of claim 2, wherein the first resistor has a resistance of less than 50 ohms.

5. The car audio system with low latency of claim 4, wherein the first resistor has a resistance of 10 ohms.

6. The car audio system with low latency of claim 1, further comprising a storage unit;

the storage unit is connected to the SOC chip.

7. The car audio system with low latency of claim 6, wherein the storage unit comprises a USB flash drive.

8. The car audio system with low latency of claim 3, wherein the fifth resistor has a resistance of 100 kohms.