CN216928493U - Semiconductor direction detecting and preheating device - Google Patents
Semiconductor direction detecting and preheating device Download PDFInfo
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- CN216928493U CN216928493U CN202122917216.2U CN202122917216U CN216928493U CN 216928493 U CN216928493 U CN 216928493U CN 202122917216 U CN202122917216 U CN 202122917216U CN 216928493 U CN216928493 U CN 216928493U
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- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
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- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
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Abstract
The utility model relates to a semiconductor direction detection and preheating device which comprises a bottom plate, a material pushing mechanism, a detection mechanism and a preheating mechanism, wherein the material pushing mechanism, the detection mechanism and the preheating mechanism are sequentially arranged from front to back, the material pushing mechanism comprises a movable rod and a supporting plate, the supporting plate is horizontally arranged, a lifting assembly is arranged at the bottom of the supporting plate, and the movable rod is horizontally arranged on one side of the supporting plate far away from the detection mechanism.
Description
Technical Field
The utility model relates to a semiconductor direction detection and preheating device, and belongs to the technical field of semiconductor direction detection devices.
Background
The lead frame is used as a chip carrier of an integrated circuit, the lead frame is a key structural member for realizing the electrical connection between the leading-out end of an internal circuit of the chip and an external lead by means of bonding materials (gold wires, aluminum wires and copper wires) to form an electrical circuit, the lead frame plays a role of a bridge connected with an external lead, the lead frame is required to be used in most semiconductor integrated blocks, and the lead frame is an important basic material in the electronic information industry.
In the manufacturing process, the lead frame can be provided with a plurality of positioning holes in order to normally work in subsequent stations, and meanwhile, in order to enable a chip to have a stable structure when being packaged, the lead frame needs to be preheated, the detection of the existing positioning holes in the direction of the lead frame is mostly manual detection, the detection strength is high, the detection efficiency is low, the production cost is increased, and therefore a semiconductor direction detection and preheating device is needed.
SUMMERY OF THE UTILITY MODEL
The technical problem to be solved by the utility model is as follows: in order to overcome the defects of the prior art, a semiconductor direction detection and preheating device is provided.
The technical scheme adopted by the utility model for solving the problems is as follows: a semiconductor direction detecting and preheating device comprises a bottom plate, a material pushing mechanism, a detecting mechanism and a preheating mechanism, wherein the material pushing mechanism, the detecting mechanism and the preheating mechanism are sequentially arranged from front to back;
the pushing mechanism comprises a moving rod and a supporting plate, the supporting plate is horizontally arranged, a lifting assembly is arranged at the bottom of the supporting plate, the moving rod is horizontally arranged on one side of the supporting plate far away from the detection mechanism, the moving rod is arranged perpendicular to the front-back direction, a limiting sensor and a plurality of groups of pushing assemblies are arranged on the moving rod, the number of the pushing assemblies is even, each pushing assembly is uniformly arranged on one side of the moving rod close to the detection mechanism in a strip shape, a moving assembly is arranged on the other side of the moving rod, and the moving assembly drives the moving rod to move back and forth;
the pushing assembly comprises two push rods which are in a strip shape and are detachably arranged on one side of the moving rod close to the detection mechanism;
the detection mechanism comprises a movable plate and a lifting plate, the lifting plate is horizontally arranged below the movable plate, a linear module is arranged on the movable plate and drives the movable plate to move back and forth, a first sensor and a plurality of groups of detection assemblies are arranged on the lifting plate, and the detection assemblies correspond to the pushing assemblies one by one;
the detection assembly comprises two detection units which are symmetrically arranged, and the detection units correspond to the push rods one by one;
the detection unit comprises a second sensor, a first probe and two second probes, the first probe and the second probes are vertically and movably arranged on the lifting plate in a penetrating mode, the second probes are located below the first sensor, the second sensors are arranged on a moving plate, a first air cylinder is vertically arranged on the moving plate, the first air cylinder is connected with the second sensors, a cylinder body of the first air cylinder is arranged at the bottom of the moving plate, and the lifting plate is arranged at the telescopic end of the first air cylinder;
the preheating mechanism comprises a jacking assembly and a preheating assembly, the jacking assembly is arranged at the bottom of the bottom plate, and the jacking assembly is connected with the preheating assembly;
the preheating assembly comprises a track plate, a plurality of heating rods are arranged at the bottom of the track plate, and a material rack is arranged above the track plate.
Preferably, the moving assembly comprises a first screw rod parallel to the front-back direction, the first screw rod is driven by a first motor, a sliding block is connected to the first screw rod in a threaded mode, the sliding block is connected with the moving rod, and the first motor is connected with the limiting sensor.
Preferably, the first motor is a stepping motor.
Preferably, the bottom plate is made of stainless steel.
Preferably, the connection length of the push rod in the front-back direction is adjustable.
Preferably, the first sensor is an infrared sensor.
Preferably, the jacking assembly comprises a jacking plate horizontally arranged below the bottom plate, a second cylinder is vertically arranged between the jacking plate and the bottom plate, a cylinder body of the second cylinder is arranged at the bottom of the bottom plate, the jacking plate is arranged at the telescopic end of the second cylinder, the top of the jacking plate is provided with four guide rods in a matrix manner, the guide rods are vertically movably arranged on the bottom plate in a penetrating manner, the top ends of the guide rods are arranged at the bottom of the track plate, two third sensors are arranged on the jacking plate, and the second cylinder is connected with the third sensors.
Preferably, the lifting assembly comprises a second lead screw which is vertically arranged, a second motor is arranged at the bottom of the bottom plate and connected with the second lead screw, and the supporting plate is in threaded connection with the second lead screw.
Preferably, the top of the supporting plate is provided with anti-skid lines.
Compared with the prior art, the utility model has the advantages that:
the semiconductor direction detecting and preheating device can realize automatic detection of products, reduce the labor intensity of workers, improve the detection efficiency and reduce the production cost, and can integrate detection and preheating into a whole, so that the working efficiency can be further improved.
Drawings
FIG. 1 is a perspective view of a semiconductor orientation detecting and preheating apparatus according to the present invention;
FIG. 2 is a front view of a semiconductor orientation detecting and preheating apparatus according to the present invention;
FIG. 3 is a left side view of a semiconductor orientation detecting and preheating apparatus according to the present invention;
FIG. 4 is a right side view of a semiconductor orientation detecting and preheating apparatus according to the present invention;
FIG. 5 is a top view of a semiconductor orientation detection and preheating apparatus of the present invention;
FIG. 6 is a schematic structural view of a detection mechanism;
FIG. 7 is a perspective view of the detection mechanism;
fig. 8 is a schematic structural view of the track slab;
fig. 9 is a side view of the track plate;
fig. 10 is a schematic structural view of the stack;
FIG. 11 is a schematic structural view of a product;
FIG. 12 is an enlarged view of portion A of FIG. 3;
FIG. 13 is a perspective view of the jacking assembly.
Wherein: the automatic feeding device comprises a bottom plate 100, a pushing mechanism 200, a moving rod 201, a supporting plate 202, a lifting component 203, a second screw rod 203.1, a second motor 203.2, a limit sensor 204, a pushing component 205, a pushing rod 205.1, a moving component 206, a first screw rod 206.1, a first motor 206.2, a sliding block 206.3, a detection mechanism 300, a moving plate 301, a lifting plate 302, a linear module 303, a first sensor 304, a detection component 305, a detection unit 305.1, a second sensor 305.11, a first probe 305.12, a second probe 305.13, a first air cylinder 305.14, a preheating mechanism 400, a jacking component 401, a jacking plate 401.1, a second air cylinder 401.2, a guide rod 401.3, a third sensor 401.4, a preheating component 402, an orbit plate 402.1, a heating rod 402.2, a material rack 402.3, a product 500, a material box 600 and a controller 700.
Detailed Description
As shown in fig. 1 to 13, the semiconductor direction detecting and preheating device in this embodiment includes a bottom plate 100, a material pushing mechanism 200, a detecting mechanism 300, and a preheating mechanism 400, where the material pushing mechanism 200, the detecting mechanism 300, and the preheating mechanism 400 are sequentially arranged from front to back;
the material pushing mechanism 200 comprises a moving rod 201 and a supporting plate 202, the supporting plate 202 is horizontally arranged, a lifting assembly 203 is arranged at the bottom of the supporting plate 202, the moving rod 201 is horizontally arranged on one side, far away from the detection mechanism 300, of the supporting plate 202, the moving rod 201 is arranged perpendicular to the front-back direction, a limit sensor 204 and a plurality of groups of pushing assemblies 205 are arranged on the moving rod 201, the number of the pushing assemblies 205 is even, each pushing assembly 205 is uniformly arranged on one side, close to the detection mechanism 300, of the moving rod 201 in a strip shape, a moving assembly 206 is arranged on the other side of the moving rod 201, and the moving assembly 206 drives the moving rod 201 to move back and forth;
the pushing assembly 205 comprises two pushing rods 205.1, and the two pushing rods 205.1 are detachably arranged on one side of the moving rod 201 close to the detection mechanism 300 in a strip shape;
the detection mechanism 300 comprises a moving plate 301 and a lifting plate 302, the lifting plate 302 is horizontally arranged below the moving plate 301, a linear module 303 is arranged on the moving plate 301, the linear module 303 drives the moving plate 301 to move back and forth, a first sensor 304 and a plurality of groups of detection assemblies 305 are arranged on the lifting plate 302, and the detection assemblies 305 correspond to the pushing assemblies 205 one by one;
the detection assembly 305 comprises two detection units 305.1 which are symmetrically arranged, and the detection units 305.1 correspond to the push rods 205.1 one by one;
the detection unit 305.1 comprises a second sensor 305.11, a first probe 305.12 and two second probes 305.13, wherein the first probe 305.12 and the second probe 305.13 are vertically movably arranged on the lifting plate 302, the second probe 305.13 is located below the first sensor 304, the second sensor 305.11 is arranged on the moving plate 301, the moving plate 301 is provided with a vertically arranged first cylinder 305.14, the first cylinder 305.14 is connected with the second sensor 305.11, the cylinder body of the first cylinder 305.14 is arranged at the bottom of the moving plate 301, and the lifting plate 302 is arranged at the telescopic end of the first cylinder 305.14;
the preheating mechanism 400 comprises a jacking assembly 401 and a preheating assembly 402, wherein the jacking assembly 401 is arranged at the bottom of the bottom plate 100, and the jacking assembly 401 is connected with the preheating assembly 402;
the preheating assembly 402 comprises a track plate 402.1, a plurality of heating rods are arranged at the bottom of the track plate 402.1, and a material rack 402.3 is arranged above the track plate 402.1.
The magazine 600 containing the product 500 is placed on the pallet 202, for the convenience of detection, the products 500 in two adjacent magazines 600 are placed in a front-back reverse direction, the first motor 206.2 is started to rotate the first screw rod 206.1, so that the slide block 206.3 can move in a reverse direction on the first screw rod 206.1 towards the moving plate 301, the slide block 206.3 moves to drive the push rod 205.1 to move synchronously through the moving rod 201, so that the push rod 205.1 can push one product 500 in the magazine 600 to move to the lower part of the lifting plate 302, the device is actually provided with a controller 700, when the moving rod 201 moves to the limit sensor 204, the limit sensor 204 receives a signal and transmits the signal to the controller 700, the controller 700 controls the first motor 206.2 to stop running, then controls the first motor 206.2 to move the first screw rod 206.1 in a reverse direction, so that the slide block 206.3 can move in a reverse direction to realize reset, and the slide block 206.3 can drive the push rod 205.1 to reset, then, the controller 700 controls the second motor 203.2 to start the set time to rotate the second lead screw 203.1, so that the supporting plate 202 can descend for a set distance, the push rod 205.1 can push the product 500 continuously, after the product 500 moves to a position below the lifting plate 302, the controller 700 controls the first cylinder 305.14 to drive the lifting plate 302 to descend, when the lifting plate 302 descends for a certain distance, the second sensor 305.11 cannot receive a signal, at this time, the controller 700 controls the cylinder to stop driving the lifting plate 302 to descend, the descending of the lifting plate 302 drives the first probe 305.12 and the second probe 305.13 to descend synchronously, and when the first probe 305.12 and the second probe 305.13 are inserted into a positioning hole arranged on the product 500, when the processing direction of the positioning hole on the product 500 is wrong or unprocessed, the first probe 305.12 is jacked up and the first sensor 304 detects a signal, at this time, it is determined that the product 500 is not qualified, otherwise, the first sensor 304 cannot detect a signal, the product 500 is determined to be qualified, after the detection is finished, the controller 700 controls the linear module 303 to start, so that the moving plate 301 moves towards the direction away from the push rod 205.1, and thus the product 500 can be driven to move to the rack 402.3 by the first probe 305.12, then the controller 700 controls the first cylinder 305.14 to drive the lifting plate 302 to reset, and then controls the linear module 303 to drive the moving plate 301 to move reversely to reset, after the product 500 is located on the rack 402.3, the controller 700 controls the second cylinder 401.2 to drive the lifting plate 401.1 to ascend, when the ascending height of the lifting plate 401.1 can enable the third sensor 401.4 to detect a signal, the lifting plate 401.1 stops ascending, and the ascending of the lifting plate 401.1 drives the track plate 402.1 to ascend by the guide rod 401.3, and also controls the heating rod to be electrified to generate heat, so as to preheat the product 500 for a set time, after the preheating is finished, the controller 700 controls the second cylinder 401.2 to drive the lifting plate 401.1 to descend to reset, the scalding in the process of moving the product 500 is prevented when the distance between the track plate 402.1 and the product 500 is too small.
Preferably, the moving assembly 206 includes a first lead screw 206.1 parallel to the front-back direction, the first lead screw 206.1 is driven by a first motor 206.2, a sliding block 206.3 is connected to the first lead screw 206.1 through a thread, the sliding block 206.3 is connected to the moving rod 201, and the first motor 206.2 is connected to the limit sensor 204.
Preferably, the first motor 206.2 is a stepper motor.
Preferably, the base plate 100 is made of stainless steel.
Preferably, the connection length of the push rod 205.1 in the front-back direction is adjustable.
Preferably, the first sensor 304 is an infrared sensor.
Preferably, the jacking assembly 401 includes a jacking plate 401.1 horizontally disposed below the bottom plate 100, a second cylinder 401.2 is vertically disposed between the jacking plate 401.1 and the bottom plate 100, a cylinder body of the second cylinder 401.2 is disposed at the bottom of the bottom plate 100, the jacking plate 401.1 is disposed at a telescopic end of the second cylinder 401.2, four guide rods 401.3 are disposed at the top of the jacking plate 401.1 in a matrix manner, the guide rods 401.3 are vertically movably disposed on the bottom plate 100, the top ends of the guide rods 401.3 are disposed at the bottom of the track plate 402.1, two third sensors 401.4 are disposed on the jacking plate 401.1, and the second cylinder 401.2 is connected to the third sensor 401.4.
Preferably, the lifting assembly 203 comprises a second screw rod 203.1 vertically arranged, the bottom of the base plate 100 is provided with a second motor 203.2, the second motor 203.2 is connected with the second screw rod 203.1, and the supporting plate 202 is in threaded connection with the second screw rod 203.1.
Preferably, the top of the supporting plate 202 is provided with anti-skid lines.
In addition to the above embodiments, the present invention also includes other embodiments, and any technical solutions formed by equivalent transformation or equivalent replacement should fall within the scope of the claims of the present invention.
Claims (9)
1. The utility model provides a semiconductor orientation detects and preheating device which characterized in that: the automatic detection device comprises a bottom plate (100), a pushing mechanism (200), a detection mechanism (300) and a preheating mechanism (400), wherein the pushing mechanism (200), the detection mechanism (300) and the preheating mechanism (400) are sequentially arranged from front to back;
the material pushing mechanism (200) comprises a moving rod (201) and a supporting plate (202), the supporting plate (202) is horizontally arranged, a lifting component (203) is arranged at the bottom of the supporting plate (202), the moving rod (201) is horizontally arranged on one side, far away from the detection mechanism (300), of the supporting plate (202), the moving rod (201) is arranged perpendicular to the front-back direction, a limiting sensor (204) and a plurality of groups of pushing components (205) are arranged on the moving rod (201), the number of the pushing components (205) is even, each pushing component (205) is uniformly arranged on one side, close to the detection mechanism (300), of the moving rod (201) in a strip shape, a moving component (206) is arranged on the other side of the moving rod (201), and the moving component (206) drives the moving rod (201) to move back and forth;
the pushing assembly (205) comprises two push rods (205.1), and the two push rods (205.1) are detachably arranged on one side, close to the detection mechanism (300), of the moving rod (201) in a strip shape;
the detection mechanism (300) comprises a moving plate (301) and a lifting plate (302), the lifting plate (302) is horizontally arranged below the moving plate (301), a linear module (303) is arranged on the moving plate (301), the linear module (303) drives the moving plate (301) to move back and forth, a first sensor (304) and a plurality of groups of detection assemblies (305) are arranged on the lifting plate (302), and the detection assemblies (305) correspond to the pushing assemblies (205) one by one;
the detection assembly (305) comprises two detection units (305.1) which are symmetrically arranged, and the detection units (305.1) correspond to the push rods (205.1) one by one;
the detection unit (305.1) comprises a second sensor (305.11), a first probe (305.12) and two second probes (305.13), wherein the first probe (305.12) and the second probe (305.13) are vertically movably arranged on the lifting plate (302), the second probe (305.13) is located below the first sensor (304), the second sensor (305.11) is arranged on the moving plate (301), a first cylinder (305.14) which is vertically arranged is arranged on the moving plate (301), the first cylinder (305.14) is connected with the second sensor (305.11), a cylinder body of the first cylinder (305.14) is arranged at the bottom of the moving plate (301), and the lifting plate (302) is arranged at the telescopic end of the first cylinder (305.14);
the preheating mechanism (400) comprises a jacking assembly (401) and a preheating assembly (402), the jacking assembly (401) is arranged at the bottom of the bottom plate (100), and the jacking assembly (401) is connected with the preheating assembly (402);
the preheating assembly (402) comprises a track plate (402.1), a plurality of heating rods are arranged at the bottom of the track plate (402.1), and a material rack (402.3) is arranged above the track plate (402.1).
2. The semiconductor orientation detecting and preheating apparatus of claim 1, wherein: the moving assembly (206) comprises a first screw rod (206.1) parallel to the front-back direction, the first screw rod (206.1) is driven by a first motor (206.2), a sliding block (206.3) is connected to the first screw rod (206.1) in a threaded mode, the sliding block (206.3) is connected with the moving rod (201), and the first motor (206.2) is connected with the limit sensor (204).
3. The semiconductor orientation detecting and preheating apparatus of claim 2, wherein: the first motor (206.2) is a stepper motor.
4. The semiconductor orientation detecting and preheating apparatus of claim 1, wherein: the bottom plate (100) is made of stainless steel.
5. The semiconductor orientation detecting and preheating apparatus of claim 1, wherein: the connecting length of the push rod (205.1) in the front-back direction is adjustable.
6. The semiconductor orientation detecting and preheating apparatus of claim 1, wherein: the first sensor (304) is an infrared sensor.
7. The semiconductor orientation detecting and preheating apparatus of claim 1, wherein: jacking subassembly (401) is including the jacking board (401.1) that the level set up in bottom plate (100) below, the vertical second cylinder (401.2) that is provided with between jacking board (401.1) and bottom plate (100), the cylinder body setting of second cylinder (401.2) is in the bottom of bottom plate (100), jacking board (401.1) sets up the flexible end at second cylinder (401.2), the top of jacking board (401.1) is the matrix and is provided with four guide arms (401.3), vertical activity of guide arm (401.3) is worn to establish on bottom plate (100), the top setting of guide arm (401.3) is in the bottom of track board (402.1), be provided with two third sensor (401.4) on jacking board (401.1), second cylinder (401.2) is connected with third sensor (401.4).
8. The semiconductor orientation detecting and preheating apparatus of claim 1, wherein: the lifting assembly (203) comprises a second lead screw (203.1) which is vertically arranged, a second motor (203.2) is arranged at the bottom of the bottom plate (100), the second motor (203.2) is connected with the second lead screw (203.1), and the supporting plate (202) is in threaded connection with the second lead screw (203.1).
9. The semiconductor orientation detecting and preheating apparatus of claim 1, wherein: the top of the supporting plate (202) is provided with anti-skid grains.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202122917216.2U CN216928493U (en) | 2021-11-25 | 2021-11-25 | Semiconductor direction detecting and preheating device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202122917216.2U CN216928493U (en) | 2021-11-25 | 2021-11-25 | Semiconductor direction detecting and preheating device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN216928493U true CN216928493U (en) | 2022-07-08 |
Family
ID=82249431
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202122917216.2U Active CN216928493U (en) | 2021-11-25 | 2021-11-25 | Semiconductor direction detecting and preheating device |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN216928493U (en) |
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2021
- 2021-11-25 CN CN202122917216.2U patent/CN216928493U/en active Active
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