CN216912481U - Ultrasonic transducer and wire bonding machine - Google Patents

Ultrasonic transducer and wire bonding machine Download PDF

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Publication number
CN216912481U
CN216912481U CN202220902262.7U CN202220902262U CN216912481U CN 216912481 U CN216912481 U CN 216912481U CN 202220902262 U CN202220902262 U CN 202220902262U CN 216912481 U CN216912481 U CN 216912481U
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ultrasonic
vibration
amplitude transformer
flange
node
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钟磊
李峥嵘
罗波
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Shenzhen Han Family Sealing And Testing Technology Co ltd
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Shenzhen Han Family Sealing And Testing Technology Co ltd
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  • Pressure Welding/Diffusion-Bonding (AREA)
  • Wire Bonding (AREA)

Abstract

The utility model discloses an ultrasonic transducer and a wire bonding machine. The ultrasonic transducer comprises a piezoelectric driver, an ultrasonic amplitude transformer and a bonding tool; the back end of the ultrasonic amplitude transformer is connected with the piezoelectric driver, and the front end of the ultrasonic amplitude transformer is connected with the bonding tool; the piezoelectric driver is used for converting electric energy into ultrasonic vibration waves along the axial direction of the ultrasonic amplitude transformer; a node flange is arranged on the ultrasonic amplitude transformer, the node flange is positioned at a position corresponding to a vibration node of the ultrasonic vibration wave, and the bonding tool is positioned at a position corresponding to the maximum amplitude of the ultrasonic vibration wave; and the ultrasonic amplitude transformer and/or the node flange are/is provided with a vibration damping structure. The ultrasonic transducer can reduce vibration in the process of welding and bonding the leads of the ultrasonic transducer, avoid the change of vibration modes and the loss of ultrasonic vibration energy, ensure the stability of welding and bonding the leads, maximize the ultrasonic vibration energy at the position of a bonding tool and contribute to improving the efficiency of welding and bonding the leads.

Description

Ultrasonic transducer and wire bonding machine
Technical Field
The utility model relates to the technical field of semiconductor packaging equipment, in particular to an ultrasonic transducer and a wire bonding machine.
Background
In the field of semiconductor packaging equipment, wire bonding is the most widely used technique for electrically connecting an integrated circuit chip to an external chip carrier by bonding tiny metal wires. Since the 1960 s, ultrasonic welding technology was introduced, and still is the bonding technology mainly adopted by wire bonding machines, and the carrier applying the technology is the ultrasonic transducer.
The ultrasonic transducer is used as a core component of the wire bonding machine and mainly comprises a piezoelectric driver, an ultrasonic amplitude transformer and a bonding tool. The piezoelectric driver converts electrical energy into axial vibrations along its length. The piezoelectric driver is connected with the ultrasonic amplitude transformer, and the ultrasonic amplitude transformer couples and amplifies the axial vibration of the piezoelectric driver. The bonding tool is arranged at the top end of the ultrasonic amplitude transformer, the vibration amplitude of the bonding tool is increased along with the increase of the ultrasonic power, the bonding tool is mainly responsible for fixing the metal bonding wire, the bonded metal bonding wire is plasticized under the pressure of ultrasonic vibration energy transmission, and the metal bonding wire is welded on the integrated circuit chip and the external chip carrier to realize the electrical connection between the integrated circuit chip and the external chip carrier.
As electronic components have smaller and smaller volumes with technological progress, the welding pins of integrated circuit chips are denser and denser, the wire bonding technology is developed towards the ultra-precise high-speed bonding technology, and the requirements on the performance of the ultrasonic transducer are higher and higher. Ultrasonic transducers are typically mounted to the wire bonding machine via a flange on the ultrasonic horn, and due to the need for ultra-precise high speed bonding, there is a greater demand for stability of the ultrasonic transducer during wire bond bonding operations and during motion in the X, Y, Z plane according to the bonding process. Generally, the ultrasonic transducer is mounted to the bonding machine via a flange on the ultrasonic horn, and vibrations generated during bonding and movement cause changes in the vibration mode and loss of ultrasonic vibration energy, which affect the stability of the ultrasonic transducer, and the bonding tool or other loads on the tip of the ultrasonic transducer during bonding and movement of the ultrasonic transducer cause deformation of the distal end of the ultrasonic transducer.
SUMMERY OF THE UTILITY MODEL
The embodiment of the utility model provides an ultrasonic transducer and a wire bonding machine, which aim to solve the problem of stability in the bonding and moving processes of the conventional ultrasonic heat exchanger.
The embodiment of the utility model provides an ultrasonic transducer, which comprises a piezoelectric driver, an ultrasonic amplitude transformer and a bonding tool; the rear end of the ultrasonic amplitude transformer is connected with the piezoelectric driver, and the front end of the ultrasonic amplitude transformer is connected with the bonding tool; the piezoelectric driver is used for converting electric energy into ultrasonic vibration waves along the axial direction of the ultrasonic amplitude transformer; a node flange is arranged on the ultrasonic amplitude transformer, the node flange is positioned at a position corresponding to a vibration node of the ultrasonic vibration wave, and the bonding tool is positioned at a position corresponding to the maximum amplitude of the ultrasonic vibration wave; and the ultrasonic amplitude transformer and/or the node flange is/are provided with a vibration damping structure.
Preferably, the node flange is located at a position corresponding to a first vibration node of the ultrasonic vibration wave; the bonding tool is located at a position corresponding to a maximum amplitude of a first vibration cycle of the ultrasonic vibration wave.
Preferably, the vibration reduction structure is provided on an ultrasonic horn at a position corresponding to a vibration node of the ultrasonic vibration wave.
Preferably, the vibration reduction structure comprises a vibration reduction groove and/or a vibration reduction hole which are arranged perpendicular to the axial direction of the ultrasonic horn.
Preferably, the node flange comprises a first flange extending from a first side of the ultrasonic horn in a direction perpendicular to the axial direction and a second flange extending from a second side of the ultrasonic horn in a direction perpendicular to the axial direction, the first side and the second side being oppositely disposed sides; the first flange is provided with a first connecting hole, the second flange is provided with a second connecting hole, and the first connecting hole and the second connecting hole are used for assembling the connecting assembly.
Preferably, the piezoelectric driver comprises a piezoelectric sheet, an electrode element and a connecting pressure plate; the connecting pressure plate is connected with the rear end of the ultrasonic amplitude transformer so as to form an accommodating space between the connecting pressure plate and the ultrasonic amplitude transformer; the piezoelectric piece and the electrode piece are assembled in the accommodating space, and the piezoelectric piece is connected with the electrode piece and used for converting electric energy transmitted by the electrode piece into ultrasonic vibration waves along the axial direction of the ultrasonic amplitude transformer.
Preferably, the connecting pressure plate extends out of the connecting stud or is provided with the connecting stud through a connecting through hole; the ultrasonic amplitude transformer is provided with a connecting groove, and the connecting groove is in threaded fit with the connecting stud so as to form an accommodating space between the connecting pressure plate and the ultrasonic amplitude transformer; the piezoelectric piece is assembled on the connecting stud corresponding to the accommodating space.
Preferably, the side surface of the rear end of the ultrasonic horn is provided with the connecting groove; or the side surface of the rear end of the ultrasonic amplitude transformer extends backwards to form a connecting bulge, and the connecting bulge is provided with the connecting groove.
Preferably, the front end of the ultrasonic amplitude transformer is provided with a tool assembly hole, an elastic gap and a locking through hole; the tool assembling holes are arranged along the up-down direction and used for assembling the bonding tool; the elastic gap is arranged along the axial direction of the ultrasonic amplitude transformer rod, is arranged along the up-down direction and is communicated with the tool assembling hole; the locking through hole is arranged along the left and right direction and used for assembling a locking assembly, so that the locking assembly locks the bonding tool assembled in the tool assembling hole.
The embodiment of the utility model provides a wire bonding machine which comprises a mounting support and the ultrasonic transducer, wherein the ultrasonic transducer is assembled on the mounting support through the node flange.
The embodiment of the utility model provides an ultrasonic transducer and a wire bonding machine, wherein a vibration node refers to a point which is kept still in a vibration process, and a node flange is positioned at a position corresponding to the vibration node of ultrasonic vibration waves, so that the vibration in the lead welding and bonding process of the ultrasonic transducer can be reduced, the vibration mode change and the ultrasonic vibration energy loss are avoided, and the stability of the lead welding and bonding is ensured. The bonding tool is located at a position corresponding to the maximum amplitude of the ultrasonic vibration waves, so that the ultrasonic vibration energy of the bonding tool is maximum in the process of carrying out wire bonding, and the efficiency of wire bonding is favorably ensured. Furthermore, the ultrasonic amplitude transformer and/or the node flange are/is provided with a vibration reduction structure, so that the vibration of the ultrasonic transducer in the lead welding and bonding process can be further reduced, and the stability of the lead welding and bonding is guaranteed.
Drawings
In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the drawings needed to be used in the description of the embodiments of the present invention will be briefly introduced below, and it is obvious that the drawings in the following description are only some embodiments of the present invention, and it is obvious for those skilled in the art that other drawings can be obtained according to these drawings without inventive labor.
FIG. 1 is a schematic view of an ultrasound transducer in an embodiment of the present invention;
fig. 2 is another schematic diagram of an ultrasound transducer in an embodiment of the utility model.
Wherein, 1, piezoelectric driver; 11. a piezoelectric sheet; 12. an electrode member; 13. connecting the pressing plate; 2. an ultrasonic horn; 21. a tool assembly hole; 22. loosening and tightening gaps; 23. locking the through hole; 24. a locking assembly; 3. a bonding tool; 4. a node flange; 41. a first flange; 42. a second flange; 43. a first connection hole; 44. a second connection hole; 5. a vibration reduction structure.
Detailed Description
In order to make the technical problems, technical solutions and advantageous effects solved by the present invention more clearly apparent, the present invention is further described in detail below with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are merely illustrative of the utility model and are not intended to limit the utility model.
In the description of the present invention, it is to be understood that the terms "longitudinal", "radial", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", etc. indicate orientations or positional relationships based on those shown in the drawings, and are only for convenience in describing the present invention and simplifying the description, but do not indicate or imply that the device or element being referred to must have a particular orientation, be constructed and operated in a particular orientation, and thus, should not be construed as limiting the present invention. In the description of the present invention, "a plurality" means two or more unless otherwise specified.
In the description of the present invention, it should be noted that, unless otherwise explicitly specified or limited, the terms "mounted," "connected," and "connected" are to be construed broadly, e.g., as meaning either a fixed connection, a removable connection, or an integral connection; can be mechanically or electrically connected; they may be connected directly or indirectly through intervening media, or they may be interconnected between two elements. The specific meanings of the above terms in the present invention can be understood in specific cases to those skilled in the art.
The utility model provides an ultrasonic transducer, as shown in fig. 1 and fig. 2, the ultrasonic transducer comprises a piezoelectric driver 1, an ultrasonic horn 2 and a bonding tool 3; the back end of the ultrasonic amplitude transformer 2 is connected with the piezoelectric driver 1, and the front end is connected with the bonding tool 3; the piezoelectric driver 1 is used for converting electric energy into ultrasonic vibration waves along the axial direction of the ultrasonic amplitude transformer 2; the ultrasonic amplitude transformer 2 is provided with a node flange 4, the node flange 4 is positioned at a position corresponding to a vibration node of the ultrasonic vibration wave, and the bonding tool 3 is positioned at a position corresponding to the maximum amplitude of the ultrasonic vibration wave; the ultrasonic amplitude transformer 2 and/or the node flange 4 are/is provided with a vibration damping structure 5.
The piezoelectric actuator 1 is a device that can convert electric energy into vibration waves. The bonding tool 3 is a tool for effecting wire bonding. The ultrasonic horn 2 is a device for realizing coupling and amplification of ultrasonic vibration waves. The node flange 4 is a flange extending from the radial direction of the ultrasonic horn 2, and may also be a flange sleeved on the ultrasonic horn 2, and may serve as a structure for assembling the ultrasonic transducer to a specific machine or other location. The vibration node of the ultrasonic vibration wave means a node which remains unchanged in the ultrasonic vibration wave. The position corresponding to the maximum amplitude of the ultrasonic vibration wave refers to a position corresponding to a peak point or a trough point of the ultrasonic vibration wave, that is, a position where the peak point or the trough point is perpendicular to the ultrasonic horn 2. The vibration damping structure 5 has a vibration damping effect, and the vibration damping structure 5 can be arranged on the ultrasonic horn 2, the node flange 4, or both the ultrasonic horn 2 and the node flange 4.
As an example, the ultrasonic horn 2 is connected at its rear end to the piezoelectric actuator 1 and at its front end to the bonding tool 3. The piezoelectric driver 1 is connected with a driving power supply and can convert electric energy into ultrasonic vibration waves along the axial direction of the ultrasonic amplitude transformer 2, wherein the axial direction of the ultrasonic amplitude transformer 2 can be understood as the length direction, namely the front-back direction, of the ultrasonic amplitude transformer 2. The ultrasonic horn 2 couples and amplifies the ultrasonic vibration wave formed by the piezoelectric driver 1 to increase the vibration amplitude thereof, so that the vibration amplitude of the front end of the ultrasonic horn 2, i.e., the end where the bonding tool 3 is fitted, is large. The bonding tool 3 is assembled at the rear end of the ultrasonic amplitude transformer 2, namely, the end far away from the piezoelectric driver 1, the vibration amplitude of the bonding tool is increased along with the increase of the ultrasonic power of the piezoelectric driver 1, the bonding tool is mainly responsible for fixing the metal bonding wire, and under the pressure of ultrasonic vibration energy transmission, the bonded metal bonding wire is plasticized, so that the metal bonding wire is welded on the integrated circuit chip and the external chip carrier, and the electrical connection between the integrated circuit chip and the external chip carrier is realized. In this embodiment, the ultrasonic horn 2 is provided with a node flange 4, which is mainly used for achieving a fixing function or a clamping function so as to assemble the ultrasonic transducer to a specific machine or other positions, for example, the ultrasonic transducer can be fixed on a mounting seat of a wire bonding machine through the node flange 4.
In the ultrasonic transducer provided by the embodiment, because the vibration node is a point which is kept motionless in the vibration process, and the node flange 4 is located at the position corresponding to the vibration node of the ultrasonic vibration wave, the vibration in the lead welding and bonding process of the ultrasonic transducer can be reduced, the vibration mode is prevented from changing and the ultrasonic vibration energy loss is avoided, and the stability of the lead welding and bonding is ensured. The bonding tool 3 is located at a position corresponding to the maximum amplitude of the ultrasonic vibration wave, so that the ultrasonic vibration energy of the bonding tool 3 is maximum in the process of wire bonding, and the efficiency of wire bonding is guaranteed. Furthermore, the ultrasonic amplitude transformer 2 and/or the node flange 4 are/is provided with a vibration reduction structure 5, so that the vibration of the ultrasonic transducer in the lead welding bonding process can be further reduced, and the stability of the lead welding bonding is guaranteed.
In one embodiment, the node flange 4 is located at a position corresponding to a first vibration node of the ultrasonic vibration wave; the bonding tool 3 is located at a position corresponding to the maximum amplitude of the first vibration period of the ultrasonic vibration wave.
Wherein, the first vibration node is the first vibration node intersected with the ultrasonic horn 2 in the ultrasonic vibration wave. The first vibration period of the ultrasonic vibration wave means a first vibration period from a first vibration node. As an example, the piezoelectric driver 1 can convert the electric energy into the ultrasonic vibration wave along the axial direction of the ultrasonic horn 2, and the ultrasonic vibration wave includes a plurality of vibration periods, and each vibration period has two maximum amplitudes, namely, amplitudes at corresponding positions of a peak point and a valley point. When the ultrasonic vibration wave is a sine wave, each vibration period can be understood as the corresponding ultrasonic vibration wave between three adjacent vibration nodes, and a maximum amplitude, namely the amplitude of the position corresponding to the peak point or the amplitude of the position corresponding to the valley point, exists in two adjacent vibration nodes.
As an example, the node flange 4 is located at a position corresponding to a first vibration node (e.g., point a in fig. 2) of the ultrasonic vibration wave, so that when the node flange 4 is mounted at a position of a non-vibration node or other vibration node other than the first vibration node, the ultrasonic transducer may transmit vibration to a wire bonding machine or other equipment through the node flange 4. Therefore, the node flange 4 is arranged at the position corresponding to the first vibration node of the ultrasonic vibration wave, so that the vibration in the welding and bonding process of the ultrasonic transducer lead can be reduced, the vibration mode is prevented from changing and the ultrasonic vibration energy loss is avoided, and the bonding stability is guaranteed. The bonding tool 3 is located at a position corresponding to the maximum amplitude of the first vibration cycle of the ultrasonic vibration wave (e.g., point B in fig. 2), that is, the position corresponding to the maximum amplitude of the vibration cycle of the ultrasonic vibration wave closest to the first vibration node, so that the ultrasonic vibration energy of the bonding tool 3 is maximized during the wire bonding process, which is helpful for ensuring the efficiency of wire bonding, and the distance between the bonding tool 3 and the node flange 4 is shortened, which can effectively improve the rigidity of the ultrasonic transducer.
As an example, the node flange 4 may be in-line, L-shaped, or i-shaped.
In one embodiment, the vibration damping structure 5 is provided on the ultrasonic horn 2 at a position corresponding to a vibration node of the ultrasonic vibration wave.
As an example, when the vibration reduction structure 5 is disposed on the ultrasonic horn 2, the ultrasonic horn 2 may be disposed at a position corresponding to a vibration node of the ultrasonic vibration wave, so as to reduce vibration during the welding and bonding process of the ultrasonic transducer lead, avoid a change in vibration mode and ultrasonic vibration energy loss, and ensure stability of bonding.
In an embodiment, the vibration reduction structure 5 comprises vibration reduction grooves and/or holes arranged perpendicular to the axial direction of the ultrasonic horn 2.
Wherein, the damping groove is a groove which can play a role in damping. The damping hole is a through hole which can play a role in damping vibration.
As an example, the vibration reduction structure 5 disposed on the ultrasonic horn 2 and/or the node flange 4 may be a vibration reduction groove disposed perpendicular to the axial direction of the ultrasonic horn 2, and since the vibration reduction groove is disposed perpendicular to the axial direction of the ultrasonic horn 2, so that a gap exists in the axial direction of the ultrasonic horn 2, when the ultrasonic transducer performs wire bonding to generate vibration, the vibration reduction groove may be scaled in the axial direction of the ultrasonic horn 2 to absorb and isolate the vibration transmitted to the ultrasonic horn 2 and/or the node flange 4, thereby ensuring the stability of the operation of the ultrasonic transducer. In this example. The damping groove may be a straight groove, a circular groove or a groove with other shapes, and the shape is not limited.
As an example, the vibration reduction structure 5 disposed on the ultrasonic horn 2 and/or the node flange 4 may be a vibration reduction hole disposed perpendicular to the axial direction of the ultrasonic horn 2, and since the vibration reduction hole is disposed perpendicular to the axial direction of the ultrasonic horn 2, so that a gap exists in the axial direction of the ultrasonic horn 2, when the ultrasonic transducer performs wire bonding to generate vibration, the vibration reduction hole may be scaled in the axial direction of the ultrasonic horn 2 to absorb and isolate the vibration transmitted to the ultrasonic horn 2 and/or the node flange 4, thereby ensuring the stability of the operation of the ultrasonic transducer. In this example, the damping hole may be a circular hole, a square hole, or a through hole of other shapes, and the shape thereof is not limited.
As an example, the vibration damping structure 5 disposed on the ultrasonic horn 2 and/or the node flange 4 may also be provided with a vibration damping groove and a vibration damping hole, which may be set by a user according to actual needs.
As an example, the damping groove and/or the damping hole may be provided in one or more than one, and may be set by a user according to actual needs.
In one embodiment, the node flange 4 includes a first flange 41 extending from a first side of the ultrasonic horn 2 in a direction perpendicular to the axial direction and a second flange 42 extending from a second side of the ultrasonic horn 2 in a direction perpendicular to the axial direction, the first side and the second side being oppositely disposed sides; the first flange 41 is provided with a first connection hole 43, the second flange 42 is provided with a second connection hole 44, and the first connection hole 43 and the second connection hole 44 are used for assembling the connection assembly.
Wherein the first flange 41 is a convex structure extending from the first side of the ultrasonic horn 2 in a direction perpendicular to the axial direction thereof. The second flange 42 is a convex structure extending from the first side of the ultrasonic horn 2 in a direction perpendicular to the axial direction thereof. The first side and the second side are two sides disposed opposite each other, for example, the first side is the left side of the ultrasonic horn 2, and the second side is the right side of the ultrasonic horn 2.
As an example, from two opposite sides of the ultrasonic horn 2, a first flange 41 and a second flange 42 extend respectively in a direction perpendicular to the axial direction thereof, so that the ultrasonic horn 2, the first flange 41 and the second flange 42 are integrally formed to ensure the connection tightness thereof; first and second attachment holes 43 and 44 are provided in the first and second flanges 41 and 42, respectively, so that a bolt-and-nut assembly or other attachment assembly may be subsequently employed to attach the ultrasonic transducer to a wire bonding machine or other device via the first and second attachment holes 43 and 44.
In one embodiment, the piezoelectric actuator 1 includes a piezoelectric sheet 11, an electrode member 12, and a connection pressing plate 13;
the connecting pressure plate 13 is connected with the rear end of the ultrasonic amplitude transformer 2, so that an accommodating space is formed between the connecting pressure plate 13 and the ultrasonic amplitude transformer 2;
the piezoelectric sheet 11 and the electrode element 12 are assembled in the accommodating space, and the piezoelectric sheet 11 is connected with the electrode element 12 and used for converting electric energy transmitted by the electrode element 12 into ultrasonic vibration waves along the axial direction of the ultrasonic amplitude transformer 2.
Among them, the piezoelectric sheet 11 is an element for converting electric energy into ultrasonic vibration waves in the axial direction of the ultrasonic horn 2. The electrode member 12 is an electrode for connecting the piezoelectric sheet 11 to a driving power source, and includes a positive electrode and a negative electrode, and each piezoelectric sheet 11 is connected to the positive electrode and the negative electrode. The connecting pressure plate 13 is an element for realizing the pressing and combining of the piezoelectric sheet 11 and the electrode member 12 into a whole body, so that the piezoelectric sheet is connected with the ultrasonic horn 2.
As an example, the piezoelectric driver 1 includes a plurality of piezoelectric patches 11 and electrode members 12 connected to all the piezoelectric patches 11 and a driving power supply, and during operation, the piezoelectric patches 11 can convert the electric energy transmitted by the driving power supply through the electrode members 12 into ultrasonic vibration waves along the axial direction of the ultrasonic horn 2, so as to implement functions such as wire bonding and the like by using the ultrasonic vibration waves. In this example, the connecting pressing plate 13 is connected to the rear end of the ultrasonic horn 2, so that an accommodating space is formed between the connecting pressing plate 13 and the ultrasonic horn 2, and the piezoelectric sheet 11 and the electrode member 12 are pressed to the rear end of the ultrasonic horn 2 by using the connecting pressing plate 13, so that the connection between the piezoelectric driver 1 and the ultrasonic horn 2 is realized, and the whole structure is simple and the volume is small.
As an example, the connection pressing plate 13 may be a pressing plate made of any one of stainless steel, copper alloy, aluminum, and aluminum alloy.
In one embodiment, the connecting pressure plate 13 is extended with connecting studs (not shown), or is equipped with connecting studs (not shown) through connecting through holes; the ultrasonic amplitude transformer 2 is provided with a connecting groove (not shown in the figure), and the connecting groove is in threaded fit with the connecting stud so as to form an accommodating space between the connecting pressing plate 13 and the ultrasonic amplitude transformer 2; the piezoelectric sheet 11 is assembled on the connecting stud corresponding to the accommodating space.
As an example, the connecting pressure plate 13 may extend with a connecting stud, specifically, a connecting stud that may extend forward along the axial direction of the ultrasonic horn 2, and the connecting stud is integrally formed with the connecting pressure plate 13, so that the assembling cooperation between the connecting pressure plate 13 and the connecting stud is not required, which is helpful to improve the assembling efficiency of the ultrasonic transducer. Or, the connecting pressing plate 13 may be provided with a connecting through hole, specifically, a connecting through hole is provided along the axial direction of the ultrasonic horn 2, and the connecting stud may be assembled in the connecting through hole, so that the connecting stud and the connecting pressing plate 13 form a whole. In this example, the connection stud is provided with an external thread.
As an example, the ultrasonic horn 2 is provided with a connecting groove, the connecting groove is provided with an internal thread, and the internal thread on the connecting groove is in threaded fit with the external thread on the connecting stud, so that an accommodating space is formed between the connecting pressure plate 13 and the ultrasonic horn 2, that is, an accommodating space for accommodating the piezoelectric plate 11 and the electrode 12 is formed.
As an example, the piezoelectric plate 11 may be assembled on a connecting stud corresponding to the accommodating space, the electrode element 12 is used to connect the piezoelectric plate 11 and the driving power supply, and then the connecting stud on the connecting pressing plate 13 is used to be in threaded fit with the connecting groove on the ultrasonic horn 2, so as to assemble the piezoelectric plate 11 and the electrode element 12 in the accommodating space formed between the connecting pressing plate 13 and the ultrasonic horn 2, so that the piezoelectric driver 1 and the ultrasonic horn 2 can be detachably connected.
In one embodiment, the side surface of the back end of the ultrasonic horn 2 is provided with a connecting groove; alternatively, the ultrasonic horn 2 may have a coupling protrusion (not shown) extending rearward from the rear end side thereof, the coupling protrusion being provided with a coupling groove.
As an example, a connecting groove recessed forward may be provided on the side surface of the rear end of the ultrasonic horn 2, and the ultrasonic horn 2 and the piezoelectric driver 1 are detachably connected by means of the threaded engagement of the connecting groove and the connecting stud on the connecting pressing plate 13. In this example, on the premise that the connecting groove is provided on the rear end side surface of the ultrasonic horn 2, when the vibration reduction groove and/or the vibration reduction hole perpendicular to the axial direction of the ultrasonic horn 2 is provided on the ultrasonic horn 2, the connecting groove needs to be avoided.
As an example, the rear end side of the ultrasonic horn 2 extends backward to form a connection protrusion, the connection protrusion is provided with a connection groove, and the connection groove is in threaded fit with a connection stud on the connection pressing plate 13, so that the ultrasonic horn 2 and the piezoelectric driver 1 are detachably connected. In this example, on the premise that the connecting groove is provided on the connecting projection extending rearward from the rear end side surface of the ultrasonic horn 2, when the vibration reduction groove and/or the vibration reduction hole perpendicular to the axial direction of the ultrasonic horn 2 is provided on the ultrasonic horn 2, it is not necessary to avoid the connecting groove.
In one embodiment, the front end of the ultrasonic amplitude transformer 2 is provided with a tool assembly hole 21, a tightness gap 22 and a locking through hole 23; the tool fitting hole 21 is provided in the up-down direction for fitting the bonding tool 3; the elastic gap 22 is arranged along the axial direction of the ultrasonic amplitude transformer 2, is arranged along the up-down direction and is communicated with the tool assembling hole 21; the lock through-hole 23 is provided in the left-right direction for fitting the lock assembly 24 so that the lock assembly 24 locks the bonding tool 3 fitted in the tool fitting hole 21.
As an example, a tool mounting hole 21 is provided at the front end of the ultrasonic horn 2, and the tool mounting hole 21 is provided in the up-down direction, specifically, at a position corresponding to the maximum amplitude of the ultrasonic vibration wave, for mounting the bonding tool 3 so that the bonding tool 3 is mounted at the front end of the ultrasonic horn 2 in the up-down direction and can operate under the action of the ultrasonic vibration energy.
As an example, a slack gap 22 is provided at the front end of the ultrasonic horn 2, the slack gap 22 is provided along the axial direction of the ultrasonic horn 2, and the slack gap 22 is provided in the vertical direction and communicates with the tool mounting hole 21, so that the slack of the tool mounting hole 21 can be adjusted to facilitate the mounting of the bonding tool 3 in the tool mounting hole 21.
As an example, a locking through-hole 23 is further provided at the front end of the ultrasonic horn 2, and the locking through-hole 23 is adapted to be fitted to a locking assembly 24, so that the locking assembly 24 locks the bonding tool 3 fitted in the tool fitting hole 21 to fix the bonding tool 3 to the front end of the ultrasonic horn 2. In this example, the locking assembly 24 may be a knob screw or other assembly that provides a secure locking effect.
The embodiment of the utility model also provides a wire bonding machine which comprises a mounting support and the ultrasonic transducer in the embodiment, wherein the ultrasonic transducer is assembled on the mounting support through the node flange 4. Because the vibration node is a point which is kept motionless in the vibration process, and the node flange 4 is positioned at the position corresponding to the vibration node of the ultrasonic vibration wave, the vibration in the welding and bonding process of the lead of the ultrasonic transducer can be reduced, the vibration mode is prevented from changing and the ultrasonic vibration energy is prevented from being lost, and the stability of the welding and bonding of the lead is ensured. The bonding tool 3 is located at a position corresponding to the maximum amplitude of the ultrasonic vibration wave, so that the ultrasonic vibration energy of the bonding tool 3 is maximum in the process of wire bonding, and the efficiency of wire bonding is guaranteed. Furthermore, the ultrasonic amplitude transformer 2 and/or the node flange 4 are/is provided with a vibration reduction structure 5, so that the vibration of the ultrasonic transducer in the lead welding bonding process can be further reduced, and the stability of the lead welding bonding is guaranteed.
The above-mentioned embodiments are only used for illustrating the technical solutions of the present invention, and not for limiting the same; although the present invention has been described in detail with reference to the foregoing embodiments, it will be understood by those of ordinary skill in the art that: the technical solutions described in the foregoing embodiments may still be modified, or some technical features may be equivalently replaced; such modifications and substitutions do not substantially depart from the spirit and scope of the embodiments of the present invention, and are intended to be included within the scope of the present invention.

Claims (10)

1. An ultrasonic transducer comprising a piezoelectric driver, an ultrasonic horn, and a bonding tool; the rear end of the ultrasonic amplitude transformer is connected with the piezoelectric driver, and the front end of the ultrasonic amplitude transformer is connected with the bonding tool; the piezoelectric driver is used for converting electric energy into ultrasonic vibration waves along the axial direction of the ultrasonic amplitude transformer; the ultrasonic bonding tool is characterized in that a node flange is arranged on the ultrasonic amplitude transformer, the node flange is positioned at a position corresponding to a vibration node of the ultrasonic vibration waves, and the bonding tool is positioned at a position corresponding to the maximum amplitude of the ultrasonic vibration waves; and the ultrasonic amplitude transformer and/or the node flange is/are provided with a vibration damping structure.
2. The ultrasonic transducer according to claim 1, wherein said node flange is located at a position corresponding to a first vibration node of said ultrasonic vibration waves; the bonding tool is located at a position corresponding to a maximum amplitude of a first vibration cycle of the ultrasonic vibration wave.
3. The ultrasonic transducer according to claim 1, wherein the vibration attenuating structure is provided on the ultrasonic horn at a position corresponding to a vibration node of the ultrasonic vibration wave.
4. The ultrasonic transducer according to claim 1, wherein said vibration damping structure comprises vibration damping grooves and/or holes arranged perpendicular to the axial direction of said ultrasonic horn.
5. The ultrasonic transducer of claim 1, wherein the nodal flange comprises a first flange extending from a first side of the ultrasonic horn in a direction perpendicular to the axial direction and a second flange extending from a second side of the ultrasonic horn in a direction perpendicular to the axial direction, the first side and the second side being oppositely disposed sides; the first flange is provided with a first connecting hole, the second flange is provided with a second connecting hole, and the first connecting hole and the second connecting hole are used for assembling the connecting assembly.
6. The ultrasonic transducer of claim 1, wherein the piezoelectric driver comprises a piezoelectric sheet, an electrode member, and a connection pressure plate; the connecting pressure plate is connected with the rear end of the ultrasonic amplitude transformer so as to form an accommodating space between the connecting pressure plate and the ultrasonic amplitude transformer; the piezoelectric piece and the electrode piece are assembled in the accommodating space, and the piezoelectric piece is connected with the electrode piece and used for converting electric energy transmitted by the electrode piece into ultrasonic vibration waves along the axial direction of the ultrasonic amplitude transformer.
7. The ultrasonic transducer according to claim 6, wherein the connecting pressure plate is extended with connecting studs or is equipped with connecting studs through connecting through holes; the ultrasonic amplitude transformer is provided with a connecting groove, and the connecting groove is in threaded fit with the connecting stud so as to form an accommodating space between the connecting pressure plate and the ultrasonic amplitude transformer; the piezoelectric piece is assembled on the connecting stud corresponding to the accommodating space.
8. The ultrasonic transducer according to claim 7, wherein said connecting groove is provided on the side of the rear end of said ultrasonic horn; or the side surface of the rear end of the ultrasonic amplitude transformer extends backwards to form a connecting bulge, and the connecting bulge is provided with the connecting groove.
9. The ultrasonic transducer according to claim 1, wherein the front end of the ultrasonic horn is provided with a tool mounting hole, a slack clearance and a locking through hole; the tool assembling holes are arranged along the up-down direction and used for assembling the bonding tool; the elastic gap is arranged along the axial direction of the ultrasonic amplitude transformer rod, is arranged along the up-down direction and is communicated with the tool assembling hole; the locking through hole is arranged along the left and right direction and used for assembling a locking assembly, so that the locking assembly locks the bonding tool assembled in the tool assembling hole.
10. A wire bonding machine comprising a mounting support, further comprising the ultrasonic transducer of any of claims 1-9, the ultrasonic transducer being mounted to the mounting support by the node flange.
CN202220902262.7U 2022-04-19 2022-04-19 Ultrasonic transducer and wire bonding machine Active CN216912481U (en)

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