CN216905507U - Ultra-thin circuit board is led and is glued lamination instrument - Google Patents
Ultra-thin circuit board is led and is glued lamination instrument Download PDFInfo
- Publication number
- CN216905507U CN216905507U CN202123261006.9U CN202123261006U CN216905507U CN 216905507 U CN216905507 U CN 216905507U CN 202123261006 U CN202123261006 U CN 202123261006U CN 216905507 U CN216905507 U CN 216905507U
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- glue
- circuit board
- frame
- guiding
- pressing tool
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Abstract
The utility model discloses a glue guiding and pressing tool for an ultrathin circuit board. The frame is made of metal copper materials, a hollow area is arranged in the frame and used for preventing the circuit layer to be glued and pressed; the glue guide grooves are arranged at the edge of the frame at intervals; lead the gluey groove and include the inclined plane of slope towards the fretwork area from the frame, lead the degree of depth that gluey groove is located fretwork area one end and be greater than the degree of depth that is located the other end that leads the gluey groove and be located the frame outside. The glue guiding and pressing tool for the ultrathin circuit board solves the technical problems that in the prior art, after glue is applied, pressing flatness is low, and material waste is caused by plate cutting.
Description
Technical Field
The utility model relates to the field of circuit board manufacturing, in particular to an ultra-thin circuit board adhesive guiding and pressing tool.
Background
At present, PCB products or multilayer circuit boards in other industries are directly pressed by pure glue, the heating rate, the pressing time and the pressure of the glue are adjusted according to personal experience, the glue flows between two adjacent layers of circuit boards after being heated, the temperature is controlled, and the pressure is applied, so that the required thickness is pressed.
The disadvantages or shortcomings that exist:
1. under different temperatures, different board materials of the circuit board are heated differently, so that the time for melting the glue is inconsistent, the pressing time and the pressure control need to be very timely to ensure the thickness to be pressed, the edge of the circuit board is generally thinner than the middle part by about 0.2mm, for the circuit board requiring lower pressing thickness, the thickness of 0.2mm exceeds the requirement, and the uniformity of the whole circuit board after pressing is difficult to control.
2. The area of circuit board glue after the pressfitting is circular, just need cut off unqualifiedly at the circuit board edge this moment, does not have the area of glue, and general thickness is about 100 mm.
3. The material has high melting point (400-450 ℃), and the gel time after cooling cannot be manually tested, so that the time point of pressing and pressing is not easy to control.
SUMMERY OF THE UTILITY MODEL
The utility model aims to provide a glue guiding and pressing tool for an ultrathin circuit board, and solves the technical problems that in the prior art, after glue is applied, the pressing flatness is low, and a board is cut to cause material waste.
The glue guiding and pressing tool for the ultrathin circuit board is used for auxiliary glue applying and pressing of the circuit board, wherein the circuit board is formed by applying and pressing a plurality of circuit layers.
Wherein, lead gluey crimping tool and include:
the frame is made of metal copper materials, a hollow area is arranged in the frame and used for preventing the circuit layer to be glued and pressed;
the glue guide grooves are provided with a plurality of glue guide grooves, and the glue guide grooves are arranged at the edge of the frame at intervals;
the glue guide groove comprises an inclined plane which inclines from the frame to the hollow area, and the depth of one end, located at the hollow area, of the glue guide groove is larger than the depth of the other end, located at the outer side of the frame, of the glue guide groove.
Wherein, the width of leading gluey groove is not the same completely.
The upper side face and the lower side face of the frame are both provided with the glue guide grooves.
The glue guiding and pressing tool is provided with a plurality of glue guiding and pressing tools, and a circuit layer is placed in a hollow area of each tool; a plurality of the tools are stacked, and a plurality of the line layers are stacked.
And the glue guide groove in one glue guide pressing tool and the glue guide groove in the other adjacent glue guide pressing tool are arranged in a position staggered mode.
When the circuit layer laminating machine is used, a circuit layer to be laminated is placed in the hollow area of the glue guiding and pressing tool, and heated glue is applied to the glue guiding groove; then place the circuit layer on the circuit layer after the gluey with the second floor, carry out the pressfitting with two-layer circuit layer and lead gluey pressing tool through the pressfitting machine. On one hand, the pressing machine simultaneously acts on the glue guiding pressing tool, so that the pressing force of the circuit board can be improved, and compared with the situation that the pressing of a plurality of circuit layers is only carried out, the pressing of the circuit board is insufficient or the pressing is too large, the defect is caused; on the other hand, the glue is applied through the glue guide groove, so that the uniformity of the applied glue can be ensured to the maximum extent.
Wherein, when having multilayer circuit layer and need gluing the pressfitting, can adopt a plurality of gluey pressfitting instruments of leading to stack, every layer of circuit layer is placed at every fretwork region of leading gluey pressfitting instrument, and layer upon layer gluey and pressfitting in proper order realize the pressfitting work of multilayer circuit board that can be quick, also can guarantee the quality of gluey and pressfitting simultaneously.
Drawings
FIGS. 1 and 2 are schematic structural views of the present invention;
fig. 3 is a schematic diagram of a plurality of glue-guiding pressing tools used in a stacked manner.
Detailed Description
The utility model will be further elucidated and described with reference to the embodiments and drawings of the specification:
referring to fig. 1 to fig. 3, the ultra-thin circuit board adhesive guiding and pressing tool 100 provided by the present invention is used for auxiliary adhesive applying and pressing on the circuit board, wherein the circuit board is formed by applying and pressing a plurality of circuit layers 200.
In the present embodiment, the glue guiding and pressing tool 100 includes: a frame 20 and a glue guiding groove arranged on the frame 20.
The frame 20 is made of a metal copper material, a hollow area is formed in the frame 20, and the hollow area is used for preventing the circuit layer 200 to be glued and pressed; the glue guide grooves are provided with a plurality of glue guide grooves which are arranged at the edge of the frame 20 at intervals.
The glue guiding groove comprises an inclined surface 21 which inclines from the frame 20 to the hollowed-out area, and the depth of one end, located at the hollowed-out area, of the glue guiding groove is larger than the depth of the other end, located at the outer side of the frame 20, of the glue guiding groove.
In the utility model, when in use, the circuit layer 200 to be laminated is placed in the hollow area of the glue guiding and pressing tool 100, and heated glue is applied from the glue guiding groove; then, the second circuit layer 200 is placed on the glued circuit layer 200, and the two circuit layers 200 and the glue-guiding and pressing tool 100 are pressed together by a pressing machine. On one hand, the pressing machine simultaneously acts on the glue guiding pressing tool 100, so that the pressing force of the circuit board can be improved, and compared with the situation that the pressing of a plurality of circuit layers 200 is only carried out, the pressing of the circuit board is insufficient or the pressing is too large, the defects are caused; on the other hand, the glue is applied through the glue guide groove, so that the uniformity of the applied glue can be ensured to the maximum extent.
Wherein, the width of leading gluey groove is not exactly the same.
In this embodiment, adopt the not identical groove of leading to glue can make the adjustment to the circuit board of equidimension not to make the gluey more even.
The upper side surface and the lower side surface of the frame 20 are both provided with the glue guide grooves.
In the embodiment, the mode of arranging the two surfaces can further ensure the uniformity of the glue.
The adhesive guiding and pressing tool 100 is provided with a plurality of adhesive guiding and pressing tools, and a circuit layer 200 is placed in a hollow area of each adhesive guiding and pressing tool 100; a plurality of the tools 100 are stacked and a plurality of the wiring layers 200 are stacked.
The glue guide groove in one glue guide pressing tool 100 and the glue guide groove in the other adjacent glue guide pressing tool 100 are arranged in a position staggered mode.
Wherein, when having multilayer circuit layer 200 and need gluey pressfitting, can adopt a plurality of gluey pressfitting instruments 100 stacks of leading, every layer of circuit layer 200 is placed at every fretwork region of leading gluey pressfitting instrument 100, and gluey and pressfitting layer upon layer in proper order realizes the pressfitting work of multilayer circuit board, also can guarantee the quality of gluey and pressfitting simultaneously.
After the circuit layer 200 is laminated into a circuit board, the adhesive guiding and laminating tool 100 is directly taken down from the edge of the circuit board, so that the circuit board does not need to be cut, and the waste of materials is reduced.
The glue guiding and pressing tool 100 with the glue which is taken down can rapidly remove glue residues on the glue after being heated, and is convenient to reuse.
Finally, it should be noted that the above embodiments are only used for illustrating the technical solutions of the present invention, and not for limiting the protection scope of the present invention, although the present invention is described in detail with reference to the preferred embodiments, it should be understood by those skilled in the art that modifications or equivalent substitutions can be made on the technical solutions of the present invention without departing from the spirit and scope of the technical solutions of the present invention.
Claims (5)
1. The utility model provides an ultra-thin circuit board is led and is glued pressfitting instrument, the circuit board is glued pressfitting by multilayer circuit layer and is formed which characterized in that, it includes to lead gluey pressfitting instrument:
the frame is made of metal copper materials, a hollow area is arranged in the frame and used for preventing the circuit layer to be glued and pressed;
the glue guide grooves are provided with a plurality of glue guide grooves, and the glue guide grooves are arranged at the edge of the frame at intervals;
the glue guide groove comprises an inclined plane which inclines from the frame to the hollow area, and the depth of one end, located at the hollow area, of the glue guide groove is larger than the depth of the other end, located at the outer side of the frame, of the glue guide groove.
2. The ultra-thin circuit board glue guiding and pressing tool as claimed in claim 1, wherein the glue guiding grooves are not exactly the same width.
3. The ultra-thin circuit board glue guiding and pressing tool as claimed in claim 1 or 2, wherein the glue guiding grooves are arranged on both the upper and lower side surfaces of the frame.
4. The ultra-thin circuit board adhesive guiding and pressing tool as claimed in claim 3, wherein the adhesive guiding and pressing tool has a plurality of tools, and a circuit layer is placed in a hollow-out area of each tool; a plurality of the tools are stacked, and a plurality of the line layers are stacked.
5. The ultra-thin circuit board glue guiding and pressing tool as claimed in claim 4, wherein the glue guiding groove in one glue guiding and pressing tool is arranged in a staggered manner with the glue guiding groove in another adjacent glue guiding and pressing tool.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202123261006.9U CN216905507U (en) | 2021-12-23 | 2021-12-23 | Ultra-thin circuit board is led and is glued lamination instrument |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202123261006.9U CN216905507U (en) | 2021-12-23 | 2021-12-23 | Ultra-thin circuit board is led and is glued lamination instrument |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN216905507U true CN216905507U (en) | 2022-07-05 |
Family
ID=82206550
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202123261006.9U Active CN216905507U (en) | 2021-12-23 | 2021-12-23 | Ultra-thin circuit board is led and is glued lamination instrument |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN216905507U (en) |
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2021
- 2021-12-23 CN CN202123261006.9U patent/CN216905507U/en active Active
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