CN216902904U

CN216902904U - Lead frame for sensor

Info

Publication number: CN216902904U
Application number: CN202220307373.3U
Authority: CN
Inventors: 王路广; 王孟杰
Original assignee: Ningbo Yinzhou Lumai Electronics Co ltd
Current assignee: Ningbo Yinzhou Lumai Electronics Co ltd
Priority date: 2022-02-16
Filing date: 2022-02-16
Publication date: 2022-07-05
Anticipated expiration: 2032-02-16

Abstract

The utility model relates to the technical field of semiconductors and discloses a lead frame for a sensor, which comprises a mounting plate, wherein the middle part of the top end of the mounting plate is provided with a mounting groove, the front side and the rear side of the bottom end of the mounting plate are respectively and transversely provided with lead holes which are arranged at equal intervals, the lead holes are communicated with the inside of the mounting groove, the top end of the mounting plate is provided with a mounting frame, the top end of the mounting frame is provided with a movable opening, and the tops of the two sides of the mounting frame are respectively provided with a movable hole. According to the utility model, the sensor can be conveniently installed through the installation groove, the pins of the sensor can be conveniently inserted into the installation groove through the lead holes, the pins can be conveniently connected, the upper part of the sensor can be limited through the action of the movable baffle, the phenomenon that the sensor falls off after the installation plate is turned over when the pins are connected is avoided, the sensor is conveniently installed, and the heat dissipation of the sensor can be conveniently carried out through the heat dissipation plate.

Description

Lead frame for sensor

Technical Field

The utility model relates to the technical field of semiconductors, in particular to a lead frame for a sensor.

Background

The lead frame is used as a chip carrier of an integrated circuit, is a key structural member for realizing the electrical connection between a leading-out end of an internal circuit of a chip and an external lead by means of a bonding material to form an electrical circuit, plays a role of a bridge connected with an external wire, needs to be used in most semiconductor integrated blocks, and is an important basic material in the electronic information industry.

When the existing lead frame for the sensor is additionally provided with the sensor, the sensor is easy to fall off, the heat dissipation effect on the sensor is poor, the normal working state of the sensor is influenced, and the lead frame for the sensor is provided for solving the problem.

SUMMERY OF THE UTILITY MODEL

The utility model aims to solve the defects in the prior art, such as: when the existing lead frame for the sensor is additionally provided with the sensor, the sensor is easy to fall off, the heat dissipation effect on the sensor is poor, and the normal working state of the sensor is influenced, so that the lead frame for the sensor is provided.

In order to achieve the purpose, the utility model adopts the following technical scheme:

the utility model provides a lead frame for sensor, includes the mounting panel, the mounting groove has been seted up at the middle part on mounting panel top, the pin hole that the equidistance was arranged is all transversely seted up to both sides around the mounting panel bottom, the pin hole all is linked together with the inside of mounting groove, the mounting bracket is installed on the top of mounting panel, the expansion joint has been seted up on the top of mounting bracket, the movable hole has all been seted up at the top of mounting bracket both sides, adjustable fender is all transversely installed to the inside of movable hole, the fixed plate is all installed to one side of adjustable fender bottom, canceling release mechanical system is all installed at the top of two inner walls about the mounting bracket, canceling release mechanical system's one end is connected with the fixed plate respectively, the mounting hole has all been seted up in the four corners of mounting panel, the heating panel that the equidistance was arranged is installed on adjustable fender's top.

Preferably, canceling release mechanical system is including installing the movable sleeve of volume inner wall about the mounting bracket, reset spring is all installed to the inside of movable sleeve, the movable block is installed to one side of reset spring, the connecting rod is installed to one side that reset spring was kept away from to the movable block, one side of connecting rod is connected with the fixed plate.

Preferably, the equal vertical spacing groove of having seted up of two inner walls about the movable sleeve, the stopper is all installed to the both sides of movable block, the stopper is the activity respectively and alternates in the inside in spacing groove.

Preferably, the guide grooves are transversely formed in the tops of the front inner wall and the rear inner wall of the mounting frame, and the front side and the rear side of the movable baffle are movably inserted into the guide grooves respectively.

Preferably, the first reinforcing plate that the equidistance was arranged is all installed to the left and right sides on mounting panel top, the second reinforcing plate is all installed to both sides around the mounting panel top, one side of first reinforcing plate and second reinforcing plate all is connected with the side of mounting bracket.

Preferably, movable push plates are arranged on one sides of the top ends of the movable baffle plates and located on one sides of the heat dissipation plates.

Compared with the prior art, the utility model has the beneficial effects that:

(1) according to the sensor fixing structure, the sensor can be conveniently installed through the installation groove, the pins of the sensor can be conveniently inserted into the pin holes, the pins can be conveniently connected, the upper part of the sensor can be limited through the action of the movable baffle, the phenomenon that the sensor falls off after the installation plate is turned over when the pins are connected is avoided, the sensor is conveniently installed, and the heat dissipation of the sensor can be conveniently carried out through the heat dissipation plate.

(2) According to the utility model, the front side and the rear side of the movable baffle are inserted into the guide groove, so that the movable baffle is prevented from deviating during movement, the movable baffle can be prevented from falling off, the movable baffle can be driven to slide in the movable hole by pulling the movable push plate, and the connecting rod can be driven to move towards the outer side of the movable sleeve by pushing the movable block through the reset spring, so that the fixed plate can be pushed to move, the movable baffle can move towards the middle part in the guide groove, the movable openings are blocked by the two movable baffles, and the sensor is prevented from being damaged.

Drawings

FIG. 1 is a schematic structural view of the present invention as a whole;

FIG. 2 is an enlarged schematic view of FIG. 1 at A according to the present invention;

FIG. 3 is a schematic structural diagram according to a first embodiment of the present invention;

fig. 4 is a schematic structural diagram of a second embodiment of the present invention.

In the figure: 1. mounting a plate; 2. mounting grooves; 3. a wire hole; 4. mounting holes; 5. a first reinforcing plate; 6. a movable opening; 7. a movable push plate; 8. a reset mechanism; 81. a movable sleeve; 82. a return spring; 83. a movable block; 84. a connecting rod; 85. a limiting groove; 86. a limiting block; 9. a heat dissipation plate; 10. a movable baffle; 11. a fixing plate; 12. a movable hole; 13. a mounting frame; 14. a guide groove; 15. a second reinforcing plate.

Detailed Description

The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments.

In the description of the present invention, it is to be understood that the terms "upper", "lower", "front", "rear", "left", "right", "top", "bottom", "inner", "outer", and the like, indicate orientations or positional relationships based on the orientations or positional relationships shown in the drawings, are merely for convenience in describing the present invention and simplifying the description, and do not indicate or imply that the device or element being referred to must have a particular orientation, be constructed and operated in a particular orientation, and thus, should not be construed as limiting the present invention.

Referring to fig. 1-4, a lead frame for a sensor comprises a mounting plate 1, wherein a mounting groove 2 is formed in the middle of the top end of the mounting plate 1, lead holes 3 are transversely formed in the front side and the rear side of the bottom end of the mounting plate 1 and are arranged at equal intervals, the lead holes 3 are communicated with the inside of the mounting groove 2, the sensor can be conveniently mounted through the mounting groove 2, pins of the sensor can be conveniently inserted into the lead holes 3, the pins can be conveniently connected, a mounting frame 13 is mounted at the top end of the mounting plate 1, a movable opening 6 is formed in the top end of the mounting frame 13, movable holes 12 are formed in the tops of the two sides of the mounting frame 13, movable baffles 10 are transversely mounted inside the movable holes 12, the upper part of the sensor can be limited through the action of the movable baffles 10, and the phenomenon that the sensor drops after the mounting plate 1 turns over is avoided when the pins are connected, the sensor is convenient to mount, guide grooves 14 are transversely formed in the top portions of the front inner wall and the rear inner wall of the mounting frame 13, the front side and the rear side of the movable baffle 10 are movably inserted into the guide grooves 14 respectively, the front side and the rear side of the movable baffle 10 are inserted into the guide grooves 14 respectively, the movable baffle 10 is prevented from shifting in the moving process, the movable baffle 10 can be prevented from falling off, a fixing plate 11 is mounted on one side of the bottom end of the movable baffle 10, reset mechanisms 8 are mounted on the top portions of the left inner wall and the right inner wall of the mounting frame 13, one ends of the reset mechanisms 8 are respectively connected with the fixing plate 11, mounting holes 4 are formed in four corners of the mounting plate 1, heat dissipation plates 9 which are arranged at equal intervals are mounted at the top end of the movable baffle 10, the sensor can be conveniently dissipated heat through the heat dissipation plates 9, movable push plates 7 are mounted on one side of the top end of the movable baffle 10, and the movable push plates 7 are positioned on one side of the heat dissipation plates 9, the movable baffle plate 10 is conveniently pulled to move by the movable push plate 7.

The first embodiment is as follows:

as shown in fig. 3, the reset mechanism 8 includes a movable sleeve 81 installed on the left and right inner walls of the mounting frame 13, a reset spring 82 is installed inside the movable sleeve 81, a movable block 83 is installed on one side of the reset spring 82, a connecting rod 84 is installed on one side of the movable block 83 away from the reset spring 82, one side of the connecting rod 84 is connected with the fixed plate 11, a limiting groove 85 is vertically formed on each of the left and right inner walls of the movable sleeve 81, limiting blocks 86 are installed on both sides of the movable block 83, the limiting blocks 86 are respectively movably inserted into the limiting grooves 85, the movable baffle 10 can be driven to slide inside the movable hole 12 by pulling the movable push plate 7, the connecting rod 84 can be driven to move to the outer side of the movable sleeve 81 by pushing the reset spring 82 to push the fixed plate 11 to move, so that the movable baffle 10 moves to the middle inside the guide groove 14, the two movable baffles 10 are used for plugging the movable opening 6, so that the sensor is prevented from being damaged.

Example two:

as shown in fig. 4, first reinforcing plates 5 arranged equidistantly are mounted on the left side and the right side of the top end of the mounting plate 1, second reinforcing plates 15 are mounted on the front side and the rear side of the top end of the mounting plate 1, one side of each of the first reinforcing plates 5 and the second reinforcing plates 15 is connected with the side face of the mounting frame 13, structural strength between the mounting frame 13 and the mounting plate 1 can be enhanced through the first reinforcing plates 5 and the second reinforcing plates 15, and the whole structure is prevented from being damaged due to external force.

In the utility model, when a user uses the device and installs the sensor, the movable push plate 7 is pulled towards two sides to drive the movable baffle plate 10 to slide in the guide groove 14 to expose the installation groove 2, the movable baffle 10 can limit the upper part of the sensor, thereby avoiding the falling of the sensor after the mounting plate 1 is turned over when the pins are connected, the sensor is arranged in the mounting groove 2, the stitches on the sensor are respectively inserted in the lead holes 3, the pushing of the movable block 83 by the return spring 82 can drive the connecting rod 84 to move to the outside of the movable sleeve 81, therefore, the fixed plate 11 can be pushed to move, the movable baffle plates 10 move towards the middle part in the guide groove 14, the movable openings 6 are blocked by the two movable baffle plates 10, and when the sensor operates, the sensor can be conveniently cooled through the cooling plate 9.

The above description is only for the preferred embodiment of the present invention, but the scope of the present invention is not limited thereto, and any person skilled in the art should be considered to be within the technical scope of the present invention, and equivalent alternatives or modifications according to the technical solution of the present invention and the inventive concept thereof should be covered by the scope of the present invention.

It is noted that, herein, relational terms such as first and second, and the like may be used solely to distinguish one entity or action from another entity or action without necessarily requiring or implying any actual such relationship or order between such entities or actions. Also, the terms "comprises," "comprising," or any other variation thereof, are intended to cover a non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements does not include only those elements but may include other elements not expressly listed or inherent to such process, method, article, or apparatus.

Claims

1. The lead frame for the sensor comprises a mounting plate (1) and is characterized in that a mounting groove (2) is formed in the middle of the top end of the mounting plate (1), lead holes (3) which are arranged equidistantly are transversely formed in the front side and the rear side of the bottom end of the mounting plate (1), the lead holes (3) are communicated with the inside of the mounting groove (2), a mounting frame (13) is mounted at the top end of the mounting plate (1), a movable opening (6) is formed in the top end of the mounting frame (13), movable holes (12) are formed in the tops of the two sides of the mounting frame (13), movable baffles (10) are transversely mounted in the movable holes (12), a fixing plate (11) is mounted on one side of the bottom end of each movable baffle (10), a reset mechanism (8) is mounted on the tops of the left inner wall and the right inner wall of the mounting frame (13), one end of each reset mechanism (8) is connected with the fixing plate (11) respectively, mounting holes (4) are formed in four corners of the mounting plate (1), and the top end of the movable baffle plate (10) is provided with heat dissipation plates (9) which are arranged equidistantly.

2. The lead frame for the sensor according to claim 1, wherein the reset mechanism (8) comprises movable sleeves (81) arranged on the left and right inner walls of the mounting frame (13), reset springs (82) are arranged inside the movable sleeves (81), movable blocks (83) are arranged on one sides of the reset springs (82), connecting rods (84) are arranged on one sides, far away from the reset springs (82), of the movable blocks (83), and one sides of the connecting rods (84) are connected with the fixing plate (11).

3. The lead frame for the sensor according to claim 2, wherein the left and right inner walls of the movable sleeve (81) are vertically provided with a limiting groove (85), the two sides of the movable block (83) are provided with limiting blocks (86), and the limiting blocks (86) are respectively movably inserted into the limiting groove (85).

4. The lead frame for the sensor according to claim 1, wherein guide grooves (14) are transversely formed in the tops of the front and rear inner walls of the mounting frame (13), and the front and rear sides of the movable baffle (10) are movably inserted into the guide grooves (14) respectively.

5. The lead frame for the sensor according to claim 1, wherein the first reinforcing plates (5) are arranged at equal intervals on the left and right sides of the top end of the mounting plate (1), the second reinforcing plates (15) are arranged on the front and back sides of the top end of the mounting plate (1), and one sides of the first reinforcing plates (5) and the second reinforcing plates (15) are connected with the side surface of the mounting frame (13).

6. The lead frame for the sensor according to claim 1, wherein the movable push plate (7) is mounted on one side of the top end of the movable baffle plate (10), and the movable push plates (7) are located on one side of the heat dissipation plate (9).