CN216902850U - Wafer boat box capable of effectively protecting wafers - Google Patents
Wafer boat box capable of effectively protecting wafers Download PDFInfo
- Publication number
- CN216902850U CN216902850U CN202123343575.8U CN202123343575U CN216902850U CN 216902850 U CN216902850 U CN 216902850U CN 202123343575 U CN202123343575 U CN 202123343575U CN 216902850 U CN216902850 U CN 216902850U
- Authority
- CN
- China
- Prior art keywords
- wafer boat
- wafer
- boat box
- effectively protecting
- wafers
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
- 235000012431 wafers Nutrition 0.000 title claims abstract description 86
- 238000005192 partition Methods 0.000 claims abstract description 21
- 239000011229 interlayer Substances 0.000 claims abstract 4
- 125000006850 spacer group Chemical group 0.000 claims description 5
- 239000002253 acid Substances 0.000 claims description 3
- 239000000463 material Substances 0.000 claims description 3
- 230000007423 decrease Effects 0.000 claims 1
- 230000003247 decreasing effect Effects 0.000 claims 1
- 238000003860 storage Methods 0.000 abstract description 7
- 238000004519 manufacturing process Methods 0.000 abstract description 6
- 239000004065 semiconductor Substances 0.000 abstract description 3
- 238000000034 method Methods 0.000 description 5
- 238000003780 insertion Methods 0.000 description 4
- 230000037431 insertion Effects 0.000 description 4
- 239000013078 crystal Substances 0.000 description 3
- 239000004594 Masterbatch (MB) Substances 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 230000017525 heat dissipation Effects 0.000 description 2
- 239000002184 metal Substances 0.000 description 2
- 238000001465 metallisation Methods 0.000 description 2
- 230000008094 contradictory effect Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000005566 electron beam evaporation Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000004806 packaging method and process Methods 0.000 description 1
- 238000012858 packaging process Methods 0.000 description 1
- 238000004544 sputter deposition Methods 0.000 description 1
- 238000006467 substitution reaction Methods 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
Images
Classifications
-
- Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
- Y02—TECHNOLOGIES OR APPLICATIONS FOR MITIGATION OR ADAPTATION AGAINST CLIMATE CHANGE
- Y02P—CLIMATE CHANGE MITIGATION TECHNOLOGIES IN THE PRODUCTION OR PROCESSING OF GOODS
- Y02P70/00—Climate change mitigation technologies in the production process for final industrial or consumer products
- Y02P70/50—Manufacturing or production processes characterised by the final manufactured product
Landscapes
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
- Packaging Frangible Articles (AREA)
Abstract
The invention belongs to the technical field of semiconductor manufacturing, and particularly relates to a wafer boat box capable of effectively protecting wafers, wherein a plurality of groups of interlayer parts which are arranged in parallel at intervals are arranged on two side walls of the wafer boat box from top to bottom, and each group of interlayer parts comprises two partition plates which are symmetrically arranged on the two side walls of the wafer boat box respectively; the two partition plates in the same group are positioned at the same horizontal height; the invention can reduce personnel loss and scratch during wafer processing, storage and transportation.
Description
Technical Field
The invention belongs to the technical field of semiconductor manufacturing, and particularly relates to a wafer boat box capable of effectively protecting wafers.
Background
Nowadays, semiconductor technology advances day by day, and future integrated circuit trend is to grind and thin the wafer to achieve the following packaging process to stack and package a plurality of thinned chips, and the wafer thinning can make the chip realize the advantages of low power and low on-resistance, not only effectively prolong the product life, but also more effectively improve the efficiency in use.
The Back Side metallization (Back Side Metal) is a packaging technique developed to improve the heat dissipation problem of high power ICs. The BSM uses electron beam evaporation or metal sputtering process to plate a layer of metal and substrate (heat sink/Lead frame) on the back of the wafer for bonding, so as to achieve better heat dissipation and electrical conduction effects.
At present, the wafer thinning process and the metallization of the back of the wafer cannot achieve full-automatic production in the processing production process, so the wafer needs to be manually carried out in the processing production process (loading and unloading, detecting the surface of the wafer, carrying to the next processing station, batch operation … … and other works), and after the wafer is thinned, the wafer is relatively fragile, so that the wafer is easy to insert obliquely when being stored or the wafer and a wafer cassette are collided when being carried in the carrying process, or the wafer is stored in the wafer cassette at too dense intervals, so that the wafer is collided with each other, and the quality of the wafer is seriously influenced.
Disclosure of Invention
In order to solve the problems of the prior art, the invention provides a wafer cassette capable of effectively protecting wafers. The method can reduce personnel loss and scratch during wafer processing, storage and transportation.
The technical scheme of the invention is realized as follows:
a can protect the crystal boat box of the wafer effectively, two sidewall of the crystal boat box have several groups of spacer pieces set up in parallel at interval from top to bottom, each group of spacer pieces include two symmetric baffles set up in two sidewalls of the crystal boat box separately; the two partition plates in the same group are positioned at the same horizontal height; the spacing distance between any two adjacent partition plates on the same side wall of the wafer boat box is 0.3-0.5 cm; .
Furthermore, the partition board is made of acid-resistant and high-temperature-resistant materials.
Furthermore, one side of the clapboard facing to the middle part of the wafer boat box is trapezoidal, and the width of the clapboard is gradually reduced.
Furthermore, one side of the clapboard facing to the middle part of the wafer boat box is in a trapezoid shape, and the width of the clapboard is gradually reduced; the end part of the clapboard is provided with two inclined planes.
The working principle and the effect of the scheme are as follows:
compared with the prior art, the invention is different in that 25 wafers in a master batch are basically batched in a wafer back processing program and a production flow, the wafers are processed in a way of 12 and 13 sub-batches, and the wafers are concentrated into the master batch for delivery when the back of the wafers is thinned and the back of the wafers is metallized and then is inspected; the existing wafer boat box has the spacing distance of 1cm, the wafer and wafer storage interval is dense, the problem of inclined insertion sheets is easy to generate, and the problem of high impact force between the wafer and the wafer boat box is easy to generate; the wafer is prevented from being damaged, and the wafer is more effectively protected.
When the scheme is used for checking, because the thickness of the partition plate is thicker than that of the existing wafer boat box, the wafer can be very easily found to be obliquely inserted due to careless operation, so that the wafer can be timely processed to be obliquely inserted, and the quality of subsequent processing can be conveniently provided.
Drawings
FIG. 1 is a schematic structural view of example 1 of the present invention;
FIG. 2 is a state diagram of the state of slanting insertion in embodiment 1 of the present invention;
fig. 3 is a view showing a state in which the sheet is normally laid flat in embodiment 1 of the present invention.
Reference numerals: a wafer boat 1, a wafer 2, and a partition plate 3.
Detailed Description
The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments of the present invention without making any creative effort, shall fall within the protection scope of the present invention.
It should be noted that all the directional indicators (such as upper, lower, left, right, front and rear … …) in the embodiment of the present invention are only used to explain the relative position relationship between the components, the movement situation, etc. in a specific posture (as shown in the drawing), and if the specific posture is changed, the directional indicator is changed accordingly.
In addition, the descriptions related to "first", "second", etc. in the present invention are for descriptive purposes only and are not to be construed as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include at least one such feature. In addition, technical solutions between various embodiments may be combined with each other, but must be realized by a person skilled in the art, and when the technical solutions are contradictory or cannot be realized, such a combination should not be considered to exist, and is not within the protection scope of the present invention.
Example 1
As shown in fig. 1-3, a wafer boat cassette for effectively protecting wafers, wherein two sidewalls of the wafer boat cassette 1 are respectively provided with a plurality of sets of spacer members arranged in parallel at intervals from top to bottom, and each set of spacer members comprises two partition plates 3 symmetrically arranged on two sidewalls of the wafer boat cassette 1; the two partitions 3 of the same group are at the same level; the spacing distance between any two adjacent partition boards 3 on the same side wall of the wafer boat box 1 is 0.3-0.5 cm.
In practical use, when the wafer 2 is placed, a horizontal swinging or inclined insertion mode is adopted.
When the flat swinging mode is adopted, the wafer 2 is horizontally placed on the upper surfaces of the two partition boards 3 in the same group.
During oblique insertion, one end of the wafer 2 is placed on the upper surface of one partition plate 3 in the same group of partition plates 3, and the other end of the wafer 2 is positioned below the lower surface of the other partition plate 3 in the same group;
the partition board 3 is made of acid-resistant and high-temperature-resistant materials;
one side of the partition plate 3 facing the middle part of the wafer boat box 1 is trapezoidal, and the width of the partition plate is gradually reduced;
one side of the clapboard 3 facing to the middle part of the wafer boat box 1 is in a trapezoid shape, and the width of the clapboard is gradually reduced; the end of the clapboard 3 is provided with two inclined planes.
When the wafer boat box is used, the storage interval of the wafer boat box 1 is newly set, the original storage interval of 0.5-1cm is changed into 0.3-0.5cm, the thickness of the thinned wafer 2 is below 0.1cm at present, if the storage interval is 0.5-1cm, the movable space is large relative to the wafer 2 during storage, personnel are in danger during carrying, the wafer 2 and the wafer boat box 1 generate impact due to shaking, the interval is reduced to reduce the movable space, and the impact force of the wafer 2 and the wafer boat box 1 is improved; the wafer 2 is prevented from being damaged, and the wafer 2 is more effectively protected.
In the scheme, when the wafer cassette is inspected, the thickness of the partition plate 3 is thicker than that of the existing wafer cassette 1, so that the wafer 2 can be easily obliquely inserted due to careless operation (as shown in fig. 2), the wafer 2 can be timely and obliquely inserted, and the quality of subsequent processing can be conveniently provided.
Finally, the above embodiments are only for illustrating the technical solutions of the present invention and not for limiting, although the present invention has been described in detail with reference to the preferred embodiments, it should be understood by those skilled in the art that modifications or equivalent substitutions may be made to the technical solutions of the present invention without departing from the spirit and scope of the technical solutions of the present invention, and all of them should be covered in the claims of the present invention.
Claims (4)
1. A wafer boat box capable of effectively protecting wafers is characterized by comprising a wafer boat box body, wherein a plurality of groups of interlayer parts which are arranged in parallel at intervals are arranged on two side walls of the wafer boat box body from top to bottom, and each group of interlayer parts comprises two partition plates which are symmetrically arranged on the two side walls of the wafer boat box respectively; the two clapboards in the same group are positioned at the same horizontal height, and the spacing distance between any two adjacent clapboards on the same side wall of the body is 0.3-0.5 cm.
2. The pod as claimed in claim 1, wherein the spacer is made of acid-resistant and high temperature-resistant material.
3. The wafer boat of claim 2, wherein the side of the partition plate facing the middle of the wafer boat is trapezoidal and gradually decreases in width.
4. The wafer boat box of claim 3, wherein the side of the partition plate facing the middle of the wafer boat box has a trapezoidal shape with a gradually decreasing width; the end part of the clapboard is provided with two inclined planes.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202123343575.8U CN216902850U (en) | 2021-12-28 | 2021-12-28 | Wafer boat box capable of effectively protecting wafers |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202123343575.8U CN216902850U (en) | 2021-12-28 | 2021-12-28 | Wafer boat box capable of effectively protecting wafers |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN216902850U true CN216902850U (en) | 2022-07-05 |
Family
ID=82208618
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202123343575.8U Expired - Fee Related CN216902850U (en) | 2021-12-28 | 2021-12-28 | Wafer boat box capable of effectively protecting wafers |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN216902850U (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN115489873A (en) * | 2022-10-20 | 2022-12-20 | 滁州钰顺企业管理咨询合伙企业(有限合伙) | Wafer warping packaging method and device |
| CN115972418A (en) * | 2023-03-20 | 2023-04-18 | 西安中威新材料有限公司 | Silicon carbide ceramic wafer boat tooth punching equipment for wafer diffusion |
-
2021
- 2021-12-28 CN CN202123343575.8U patent/CN216902850U/en not_active Expired - Fee Related
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN115489873A (en) * | 2022-10-20 | 2022-12-20 | 滁州钰顺企业管理咨询合伙企业(有限合伙) | Wafer warping packaging method and device |
| CN115972418A (en) * | 2023-03-20 | 2023-04-18 | 西安中威新材料有限公司 | Silicon carbide ceramic wafer boat tooth punching equipment for wafer diffusion |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| CN216902850U (en) | Wafer boat box capable of effectively protecting wafers | |
| CN101150118A (en) | Semiconductor device | |
| CN111788665B (en) | Package reinforcement for protecting semiconductor die | |
| WO2020024531A1 (en) | Stacking structure of flexible display assembly | |
| CN110993507B (en) | Method for reducing warping of copper-clad ceramic substrate mother board | |
| CN114792644A (en) | Wafer placing method | |
| CN218867061U (en) | Wafer box and wafer defect detection system | |
| US6849560B2 (en) | Method of depositing silicon thin film and silicon thin film solar cell | |
| JP2006076617A (en) | Storage tray and storing device | |
| US20210351094A1 (en) | Package substrate and method of manufacturing the same | |
| CN213546285U (en) | Substrate processing apparatus | |
| TW200737447A (en) | Brick stack type semiconductor package for memory module | |
| CN208077949U (en) | Structure for propping and holding door plate of container | |
| CN109768046B (en) | Method for forming embedded flash memory structure | |
| CN221010375U (en) | Protective ceramic circuit board | |
| CN111244044A (en) | Heat spreader for semiconductor devices and associated systems and methods | |
| CN1264203C (en) | Wet etching device | |
| CN111477576A (en) | Improved bearing disc and bearing device | |
| US20230207488A1 (en) | Methods and apparatus for using spacer-on-spacer design for solder joint reliability improvement in semiconductor devices | |
| CN218662885U (en) | Water droplet screen Tray dish | |
| US20240047424A1 (en) | Semiconductor dies including recesses for facilitating mechanical debonding, and associated systems and devices | |
| CN221008922U (en) | Compatible carrier of wafer magazine | |
| CN218056573U (en) | Copper-based circuit board transferring tool | |
| CN220116669U (en) | PECVD carrier plate for carrying silicon wafers with different sizes | |
| CN219619644U (en) | Multilayer misplacement stacked plastic sucking disc |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| CF01 | Termination of patent right due to non-payment of annual fee |
Granted publication date: 20220705 |