CN216900796U - Chip divergence angle testing arrangement - Google Patents

Abstract

The application provides a chip divergence angle testing arrangement, includes: the device comprises a first platform, a laser simulation mechanism, a third testing mechanism and a controller, wherein the laser simulation mechanism and the third testing mechanism are respectively connected with the controller; the controller is used for receiving the third light intensity information of each position and the fourth light intensity information of each position and calculating the divergence angle of the laser beam emitted by the chip to be tested; and judging whether the chip to be tested is qualified or not according to the divergence angle, and outputting a test result. The problems that the existing manual testing method for the divergence angle of the chip is unreliable in testing result and low in efficiency are solved, the automation degree is high, and the testing efficiency and the accuracy of the testing result are improved.

Description

Chip divergence angle testing arrangement

Technical Field

The application belongs to the technical field of semiconductor detection, and particularly relates to a chip divergence angle testing device.

Background

With the rapid development of the semiconductor laser industry, a divergence angle test is performed on a laser chip to determine whether the performance and the working state of the chip can meet the requirements. However, most of the prior art adopts manual operation, which has low efficiency, consumes manpower and material resources, and has unreliable test results.

SUMMERY OF THE UTILITY MODEL

The embodiment of the application provides a chip divergence angle testing device, which aims to solve the problems that the existing manual testing method for the chip divergence angle is unreliable in testing result and low in efficiency.

In a first aspect, an embodiment of the present application provides a chip divergence angle testing apparatus, including:

a first platform;

the laser simulation mechanism comprises a workbench, a power-on component and a cooling component, wherein the power-on component is positioned on one side of the workbench and is used for powering up a chip to be tested on the workbench so as to enable the chip to be tested to emit laser beams, and the cooling component is connected with the workbench and is used for cooling the chip to be tested on the workbench;

the third testing mechanism arranged on the first platform comprises a first sensor, a second sensor, a first rotating assembly and a second rotating assembly, the first sensor is mounted on the first rotating assembly, the second sensor is mounted on the second rotating assembly, the first sensor and the second sensor are arranged along a direction perpendicular to a light beam of the chip to be tested, the first rotating assembly is used for driving the first sensor to swing along a first arc, the first sensor is used for detecting third light intensity information of each position in the swinging process along the first arc, the second rotating assembly is used for driving the second sensor to swing along a second arc line, the second sensor is used for detecting fourth light intensity information at each position in the swing process along the second arc line, and the plane where the first arc line is located is perpendicular to the plane where the second arc line is located;

the controller, simulation laser mechanism and third accredited testing organization respectively with the controller is connected, the controller is used for:

receiving the third light intensity information of each position and the fourth light intensity information of each position, and calculating a divergence angle of a laser beam emitted by the chip to be tested according to the third light intensity information of each position and the fourth light intensity information of each position;

and judging whether the chip to be tested is qualified or not according to the divergence angle, and outputting a test result.

Optionally, the workbench includes a first base, a driving portion and a clamping portion, a boss is arranged on the first base, the area of the boss is matched with the area of the chip to be tested, the driving portion is connected with the clamping portion, the boss is used for placing the chip to be tested, and the driving portion is used for driving the clamping portion to clamp and fix the chip to be tested.

Optionally, the clamping portion includes a first sub-portion and a second sub-portion symmetrically disposed on two sides of the boss, one side of the first sub-portion and one side of the second sub-portion, which are close to the boss, have contact surfaces adapted to the shape of the side wall of the chip to be tested, one side of the first sub-portion and one side of the second sub-portion, which are close to the boss, are further provided with abutting surfaces adapted to the shape of the side wall of the boss, and the contact surfaces are located above the abutting surfaces.

Optionally, the driving part includes: the first cylinder is connected with one end, far away from the contact surface, of the first sub-part, the second cylinder is connected with one end, far away from the contact surface, of the second sub-part, and the first cylinder and the second cylinder respectively drive the first sub-part and the second sub-part to relatively approach or move away;

the first base is provided with a limiting part, the limiting part is located between the first sub-part and the second sub-part and located on one side of the boss, and the limiting part is used for abutting against the first sub-part and the second sub-part when the first sub-part and the second sub-part clamp the chip to be tested.

Optionally, the cooling assembly comprises: semiconductor refrigeration piece and water-cooling board, first base with the water-cooling board is connected, the semiconductor refrigeration piece is fixed in by the centre gripping first base with between the water-cooling board, the cold face of semiconductor refrigeration piece is connected first base, the hot face of semiconductor refrigeration piece is connected the water-cooling board.

Optionally, the first rotating assembly includes a second motor, a first mounting plate and a first swing rod, the second motor is installed on the first mounting plate, the first swing rod is connected with an output end of the second motor, the first sensor is installed at one end, far away from the second motor, of the first swing rod, the second motor drives the first swing rod to swing in the horizontal plane, and therefore the first sensor swings in the horizontal plane along a first arc line.

Optionally, the first swing rod includes a first sub-rod and a second sub-rod, one end of the first sub-rod is connected to the output end of the second motor, one end of the second sub-rod is vertically installed at the other end of the first sub-rod, and the first sensor is disposed at the other end of the first sub-rod.

Optionally, the first rotating assembly further includes a second photoelectric switch, and a second shielding piece used in cooperation with the second photoelectric switch, the second photoelectric switch is electrically connected to the controller, the second photoelectric switch is disposed on a side surface of the support column close to the first swing link, and the second shielding piece is disposed on the first swing link.

Optionally, the second rotating assembly includes a third motor, a second mounting plate and a second swing rod, the third motor is mounted on the second mounting plate, an output end of the third motor is connected to one end of the second swing rod, the second sensor is mounted at the other end of the second swing rod, the third motor drives the second swing rod to swing in a vertical plane, and the second sensor swings in the vertical plane along a second arc line.

Optionally, the second rotating assembly further includes a third photoelectric switch, and a third shielding piece used in cooperation with the third photoelectric switch, the third photoelectric switch is electrically connected to the controller, the third photoelectric switch is disposed on the second mounting plate, and the third shielding piece is disposed on the second swing rod.

The chip divergence angle testing device provided by the embodiment of the application applies different currents to the chip to be tested by arranging the analog laser mechanism on the first platform, the first sensor and the second sensor are driven to move by the first rotating component and the second rotating component of the third testing mechanism, optical signals sent by the chip to be tested are collected differently, coordinates are recorded, the divergence angle of the laser beam is obtained, whether the chip to be tested is qualified or not is judged according to the divergence angle, the divergence angles of the laser beams of the chip to be tested under the action of the currents with different intensities all accord with the set divergence angle range, the test result is that the output chip to be tested is qualified, otherwise, the test result is that the chip to be tested is unqualified, the problems of unreliable test result and low efficiency of the existing manual test of the divergence angle of the chip are solved, the automation degree is improved, and the test efficiency and the accuracy of the test result are improved.

Drawings

In order to more clearly illustrate the technical solutions in the embodiments of the present application, the drawings used in the description of the embodiments will be briefly described below. It is obvious that the drawings in the following description are only some embodiments of the application, and that other drawings can be derived from these drawings by a person skilled in the art without inventive effort.

For a more complete understanding of the present application and its advantages, reference is now made to the following descriptions taken in conjunction with the accompanying drawings. Wherein like reference numerals refer to like parts in the following description.

Fig. 1 is a schematic structural diagram of a chip divergence angle testing apparatus according to an embodiment of the present application.

Fig. 2 is a schematic structural diagram of a third testing mechanism according to an embodiment of the present application.

Fig. 3 is a schematic diagram of a powered component in a chip divergence angle testing apparatus according to an embodiment of the present application.

Fig. 4 is an isometric view of a workbench in a chip divergence angle testing apparatus provided in an embodiment of the present application.

Fig. 5 is an exploded view of a part of a workbench in the chip divergence angle testing apparatus according to the embodiment of the present application.

Fig. 6 is an isometric view of a part of a workbench in the chip divergence angle testing apparatus provided in the embodiment of the present application.

Fig. 7 is a partial enlarged view of a portion a in fig. 6.

Fig. 8 is a side view of a part of a workbench in a chip divergence angle testing apparatus according to an embodiment of the present application.

Fig. 9 is a sectional view taken along line B-B in fig. 8.

Fig. 10 is a schematic view of a water injection part in a chip divergence angle testing apparatus according to an embodiment of the present application.

Detailed Description

The technical solutions in the embodiments of the present application will be clearly and completely described below with reference to the drawings in the embodiments of the present application. It is to be understood that the embodiments described are only a few embodiments of the present application and not all embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present application.

The embodiment of the application provides a chip divergence angle testing device, which aims to solve the problems that the existing manual testing method for the chip divergence angle is unreliable in testing result and low in efficiency. The following description will be made with reference to the accompanying drawings.

Referring to fig. 1, a chip divergence angle testing device includes a first platform 1, a laser simulation mechanism 3, a third testing mechanism 6 and a controller, the laser simulation mechanism 3 and the third testing mechanism 6 are respectively connected with the controller, the laser simulation mechanism 3 and the third testing mechanism 6 are arranged on the first platform 1, the laser simulation mechanism 3 includes a workbench 30, a power-up component 31 and a cooling component 32, the power-up component 31 is located at one side of the workbench 30, the power-up component 31 is used for powering up a chip to be tested on the workbench 30 so as to enable the chip to be tested to emit a laser beam, and the cooling component 32 is connected with the workbench 30 and used for cooling the chip to be tested on the workbench 30; the third testing mechanism 6 comprises a first sensor 60, a second sensor 61, a first rotating assembly 62 and a second rotating assembly 63, the first sensor 60 is mounted on the first rotating assembly 62, the second sensor 61 is mounted on the second rotating assembly 63, the first sensor 60 and the second sensor 61 are arranged in a direction perpendicular to a light beam of a chip to be tested, the first rotating assembly 62 is used for driving the first sensor 60 to swing along a first arc, the first sensor 60 is used for detecting third light intensity information at each position in a swinging process along the first arc, the second rotating assembly 63 is used for driving the second sensor 61 to swing along a second arc, the second sensor 61 is used for detecting fourth light intensity information at each position in a swinging process along the second arc, and a plane where the first arc is located is arranged perpendicular to a plane where the second arc is located. The controller is used for receiving the third light intensity information of each position and the fourth light intensity information of each position and calculating the divergence angle of the laser beam emitted by the chip to be tested according to the third light intensity information of each position and the fourth light intensity information of each position; and judging whether the chip to be tested is qualified or not according to the divergence angle, and outputting a test result.

It can be understood that preset divergence angle ranges corresponding to currents with different intensities are preset, and divergence angles of laser beams of chips to be tested under the action of the currents with different intensities all accord with the set divergence angle ranges, the test result is that the output chips to be tested are qualified, otherwise, the test result is that the chips to be tested are unqualified. In the embodiment of the present application, the first rotating component 62 drives the first sensor 60 to rotate at a certain speed in the horizontal direction, the first sensor 60 continuously collects the optical signal emitted by the chip to be tested through the change of the rotation angle, the light intensity at different positions is measured in the moving process, the coordinate of the position is recorded at the same time until the first sensor 60 does not respond, the second component 63 drives the second sensor 60 to rotate at a certain speed in the vertical direction, the second sensor 61 ceaselessly collects the light signal sent by the chip to be tested through the change of the rotation angle, the light intensity at different positions is measured during the movement, and the coordinates of the position are recorded at the same time, until the second sensor 61 does not respond, and thus, the divergence angle of the laser beam is obtained according to the third light intensity information and the fourth light intensity information tested by the first sensor.

In some embodiments, referring to fig. 2, the first rotating assembly 62 includes a second motor 620, a first mounting plate 621, and a first swing link 622, the second motor 620 is mounted on the first mounting plate 621, the first swing link 622 is connected to an output end of the second motor 620, the first sensor 60 is mounted at an end of the first swing link 622 away from the second motor 620, and the second motor 620 drives the first swing link 622 to swing in a horizontal plane, such that the first sensor 60 swings in the horizontal plane along a first arc.

In some embodiments, referring to fig. 2, the first swing link 622 includes a first sub-lever 6220 and a second sub-lever 6221, one end of the first sub-lever 6220 is connected to the output end of the second motor 620, one end of the second sub-lever 6221 is vertically installed at the other end of the first sub-lever 6220, and the first sensor 60 is disposed at the other end of the first sub-lever 6220.

In some embodiments, referring to fig. 2, the first rotating assembly 62 further includes a second photoelectric switch 623 and a second shielding piece 624 cooperating with the second photoelectric switch 623, the second photoelectric switch 623 is disposed on a side surface of the supporting column 303 close to the first oscillating bar 622, and the second shielding piece 624 is disposed on the first oscillating bar 622.

In some embodiments, referring to fig. 2, the second rotating assembly 63 includes a third motor 630, a second mounting plate 631, and a second swinging rod 632, the third motor 630 is mounted on the second mounting plate 631, an output end of the third motor 630 is connected to one end of the second swinging rod 632, the second sensor 61 is mounted at the other end of the second swinging rod 632, and the third motor 630 drives the second swinging rod 632 to swing in a vertical plane, and the second sensor 61 swings in the vertical plane along a second arc.

In some embodiments, referring to fig. 2, the second rotating assembly 63 further includes a third photoelectric switch 633, a third shielding plate 634 used in cooperation with the third photoelectric switch 633, the third photoelectric switch 633 is disposed on the second mounting plate 631, and the third shielding plate 634 is disposed on the second swing link 632.

It can be understood that, the second photoelectric switch 623 and the third photoelectric switch 633 are connected to the controller, and when the second photoelectric switch 623 and the third photoelectric switch 633 are turned on, both the first swing link 622 and the second swing link 632 are located at the starting position, where the starting position of the first swing link 622 refers to: the swing angle of the first swing link 622 is zero, and at this time, the first sensor 60 on the first swing link 622 is aligned with the light emitting end of the chip to be tested; the starting position of the second swing link 632 is: the swing angle of the second swing link 632 is zero, and at this time, the second sensor 61 on the second swing link 632 directly faces the light emitting end of the chip to be tested. The first sensor 60 and the second sensor 61 are both PD sensors, the PD sensors collect optical signals emitted by the chip to be tested according to different specified rotation angle changes, measure light intensities at different positions in the moving process, and record coordinates of the positions until the PD sensors do not respond.

In some embodiments, referring to fig. 2, the second swing link 632 includes a third sub-link 6320 and a fourth sub-link 6321, one end of the third sub-link 6320 is connected to the output terminal of the third motor 630, the fourth sub-link 6321 is vertically installed at the other end of the third sub-link 6320, and the second sensor 61 is installed at the other end of the fourth sub-link 6322.

In some embodiments, referring to fig. 2, the third sub-rod 6320 is provided with an avoidance space 6322, and interference with the second support 533 of the second testing mechanism 5 is avoided by the avoidance space 6322.

As shown in fig. 2, the third sub-bar 6320 includes an inverted U-shaped section and a horizontal section, one end of the inverted U-shaped section is connected to the output end of the third motor 630, the horizontal section is connected to the other end of the inverted U-shaped section, the fourth sub-bar 6321 is perpendicular to the horizontal section, the fourth sub-bar 6321 extends toward the first swing link 622 until the second sensor 61 is aligned with the first sensor 60, and the U-shaped space of the inverted U-shaped section is an avoidance space 6322 for avoiding interference.

In some embodiments, referring to fig. 1, 3 and 4, the simulated laser mechanism 3 includes a workbench 30, a power-on component 31 and a cooling component 32, the workbench 30 includes a first base 300, a driving portion 301 and a clamping portion 304, the driving portion 301 is connected to the clamping portion 304, the driving portion 301 drives the clamping portion 304 to clamp and fix a chip to be tested, the first base 300 is fixed on the first platform 1, a side of the first base 300 away from the first platform 1 is provided with a boss 302, an area of the boss 302 is adapted to an area of the chip to be tested, the boss 302 is used for placing the chip to be tested, and the driving portion 301 is arranged on the first base 300.

It can be understood that, the area of the boss 302 is adapted to the area of the chip to be tested, which means that the area of the boss 302 is slightly larger than the area of the chip to be tested, if the width of the chip to be tested is 4.05mm, and the width of the boss 302 is 4.1mm, the clamping portion 304 calibrates and fixes the position of the chip to be tested, so that the chip to be tested is completely located on the boss 302, the positioning accuracy of the clamping portion 304 is controlled within 0.025mm, and the positioning accuracy is high. In the power-up process of the power-up component 31, the clamping portion 304 clamps and fixes the chip to be tested, so as to avoid the chip to be tested from shifting, fix the position of the light-emitting end of the chip to be tested, and ensure the testing effect.

In some embodiments, referring to fig. 5, 6 and 7, the clamping portion 304 includes a first sub-portion 3040 and a second sub-portion 3041 symmetrically disposed at two sides of the boss 302, and one sides of the first sub-portion 3040 and the second sub-portion 3041 near the boss 302 have a contact surface 3042 adapted to a shape of a sidewall of a chip to be tested. In addition, the first sub-portion 3040 and the second sub-portion 3041 are further provided with a holding surface 3044 adapted to the shape of the side surface of the boss 302.

It can be understood that the driving portion 301 drives the first sub-portion 3040 and the second sub-portion 3041 to relatively approach or move away from each other, when the first sub-portion 3040 and the second sub-portion 3041 relatively abut against and clamp two sides of a chip to be tested, the contact surfaces 3042 of the first sub-portion 3040 and the second sub-portion 3041 abut against two sides of the chip to be tested, the first sub-portion 3040 and the second sub-portion 3041 clamp and fix the chip to be tested from two sides, and meanwhile, the first sub-portion 3040 and the second sub-portion 3041 also abut against and fix two sides of the boss 302 through the abutting surface 3044, so that the clamping structure is simple, the clamping stability is good, the boss 302 limits excessive clamping of the first sub-portion 3040 and the second sub-portion 3041 while clamping the chip to be tested from two sides, and avoids damaging the chip to be tested, and limits the strength of the first sub-portion 3040 and the second sub-portion 3041 while keeping the clamping stability, and protects the chip to be tested.

In some embodiments, referring to fig. 6, the driving portion 301 includes a first cylinder 3010 and a second cylinder 3011, the first cylinder 3010 is mounted on the first base 300, the first cylinder 3010 is located outside the first sub-portion 3040, a telescopic end of the first cylinder 3010 is connected to an end of the first sub-portion 3040 away from the contact surface 3042, the second cylinder 3011 is mounted on the first base 300, the second cylinder 3011 is located outside the second sub-portion 3041, a telescopic end of the second cylinder 3011 is connected to an end of the second sub-portion 3041 away from the contact surface 3041, the telescopic ends of the first cylinder 3010 and the second cylinder 3011 are disposed opposite to each other, and the first sub-portion 3040 and the second sub-portion 3041 are slidably mounted on the first base 300.

The protrusion 302 may be disposed at any position on the first base 300, for example, on a side of the first base 300 away from the feeding mechanism 2, a side of the protrusion 302 is aligned with a side of the first base 300, at this time, the first cylinder 3010 and the second cylinder 3011 are disposed at an end of the first base 300 close to the feeding mechanism 2, the first sub-portion 3040 and the second sub-portion 3041 are easy to generate torsional deformation under a long-time action of the first cylinder 3010 and the second cylinder 3011, in order to adjust the first sub-portion 3040 and the second sub-portion 3041 to be uniformly stressed, the clamping portion 304 further includes a limiting portion 3043 disposed on the first base 300, the limiting portion 3043 is located between the first sub-portion 3040 and the second sub-portion 3041, the limiting portion 3043 is located at a side of the boss 302, and the limiting portion 3043 is used for supporting the first sub-portion 3040 and the second sub-portion 3041 when the first sub-portion 3040 and the second sub-portion 3041 clamp a chip to be tested.

It can be understood that the position-limiting portion 3043 is a fixed block disposed on the first base 300, and a plurality of fixed blocks may be disposed along the length direction of the first sub-portion 3040, when the first sub-portion 3040 and the second sub-portion 3041 clamp and fix the chip to be tested, the position-limiting portion 3043 supports the inner surfaces of the first sub-portion 3040 and the second sub-portion 3041, so as to uniformly bear force along the length direction of the first sub-portion 3040 and the second sub-portion 3041, and avoid the occurrence of a positioning deflection angle, even if the processing precision of the first base 300 does not meet the requirement, the position can be assisted by the position-limiting portion 3043, which not only improves the positioning precision, but also improves the service life of the first sub-portion 3040 and the second sub-portion 3041.

In some embodiments, referring to fig. 7, the first sub-portion 3040 includes a first plate 30400 and a second plate 30401, the first cylinder 3010 is connected to one end of the first plate 30400, the second plate 30401 is vertically connected to the other end of the first plate 30400, a contact surface 3042 and a support surface 3044 are disposed on the sides of the first plate 30400 and the second plate 30401 close to the boss 302, and the upper surface of the first plate 30400 is flush with the upper surface of the chip to be tested; the second sub-portion 3041 includes a third plate 30410 and a fourth plate 30411, the second cylinder 3011 is connected to one end of the third plate 30410, the fourth plate 30411 is connected to the other end, a contact surface 3042 and a supporting surface 3044 are disposed on one side of the fourth plate 30411 close to the boss 392, and an upper surface of the fourth plate 30411 is flush with an upper surface of the chip to be tested.

It is understood that the first plate 30400 and the second plate 30401 of the first sub-portion 3040 may be a separate structure or an integrated structure, and the third plate 30410 and the fourth plate 30411 of the second sub-portion 3041 may also be a separate structure or an integrated structure.

Opposite side edges of the first plate body 30400 and the third plate body 30410 respectively and correspondingly abut against two sides of the limiting portion 3043, upper surfaces of the first plate body 30400 and the third plate body 30410 are higher than upper surfaces of the limiting portion 3043, and upper surfaces of the first plate body 30400 and the third plate body 30410 are higher than upper surfaces of the second plate body 30401 and the fourth plate body 30411.

It can be understood that the area between the first plate 30400 and the third plate 30410 allows the core assembly 21 to move through, and the heights of the second plate 30401 and the fourth plate 30411 are lower than the heights of the first plate 30400 and the third plate 30410, so as to avoid the interference between the second plate 30401 and the fourth plate 30411 and the core assembly 21.

In some embodiments, referring to fig. 6, the first base plate 300 is further provided with a first fixing seat 3002, a second fixing seat 3003, a first connecting plate 3004 and a second connecting plate 3005, the first fixing seat 3002 and the second fixing seat 3003 are installed on a side of the first base 300 away from the boss 302, the first cylinder 3010 is installed on the first fixing seat 3002, an output end of the first cylinder 3010 is connected to the first sub-portion 3040 through the first connecting plate 3004, the second cylinder 3011 is installed on the second fixing seat 3003, and an output end of the second cylinder 3011 is connected to the second sub-portion 3041 through the second connecting plate 3005.

In some embodiments, referring to fig. 1 and 7, the cooling assembly 32 includes a water-cooling plate 320 and a semiconductor refrigeration sheet 321, the semiconductor refrigeration sheet 321 is disposed between the first base 300 and the water-cooling plate 320, a cold surface of the semiconductor refrigeration sheet 321 is attached to a surface of the first base 300 away from the boss 302, a hot surface of the semiconductor refrigeration sheet 321 is attached to the water-cooling plate 320, the first base 300 is fixedly connected to the water-cooling plate 320, the semiconductor refrigeration sheet 321 is clamped and fixed between the first base 300 and the water-cooling plate 320, the semiconductor refrigeration sheet 321 can be fixed without other connection structures, the first base 300 is flush with the periphery of the water-cooling plate 320, the workbench 30 is beautiful in appearance structure, and is convenient to install and maintain.

In some embodiments, referring to fig. 9 and 10, the cooling assembly 32 further includes a water injection portion 322, a water inlet 3020 and a water outlet 3021 are provided on the boss 302, the first base 300 is provided with a first channel 3000 and a second channel 3001, the first channel 3000 communicates the water injection portion 322 with the water inlet 3020, and the second channel 3001 communicates with the water outlet 3021.

Illustratively, referring to fig. 10, the water filling part 322 includes a first motor 3220, a driving screw rod 3221, a push plate 3222, an injection syringe 3223 and a second base 3224, the first motor 3220, the driving screw rod 3221, the push plate 3222 and the injection syringe 3223 are all disposed on the second base 3224, an output end of the first motor 3220 is connected to the driving screw rod 3221, one end of the push plate 3222 is connected to a nut on the driving screw rod 3221, the push plate 3222 is connected to a movable end of the injection syringe 3223, a water outlet end of the injection syringe 3223 faces to a side where the chip to be tested is located, and the push plate 3222 moves along an axial direction of the driving screw rod 3221 with rotation of the driving screw rod 3221 to push the movable end of the injection syringe 3223, so that the water outlet end of the injection syringe 3223 fills water into the first channel 3022. A plurality of first photoelectric switches 3225 are disposed on the second base 3224, the plurality of first photoelectric switches 3225 are disposed along a circumferential direction of the driving screw rod 3221, and a first shielding sheet 3226 used in cooperation with the first photoelectric switches 3225 is disposed on the push plate 3222.

In some embodiments, referring to fig. 3, the power-up assembly 31 includes a third base 310, a first linear module 311, a first sliding portion 312, and a probe portion 313, the first linear module 311 is mounted on the third base 310, the probe portion 313 is slidably mounted on the first linear module 311 through the first sliding portion 312, the probe portion 313 is located right above the boss 302, the probe portion 313 moves in the third direction, when the probe portion 313 is located at the highest position, the wick assembly 21 moves to the boss 302, and the probe portion 313 is higher than the wick assembly 21.

It can be understood that the probe portion 313 is higher than the wick assembly 21, so that the interference between the wick assembly 21 and the elastic needle portion 313 is avoided, and the components on the first platform 1 are reasonably arranged, so that the product has a small volume and an attractive appearance.

In addition, as shown in fig. 3, a seventh sub-moving stage 314 is further disposed on the third base 310, an output end of the seventh sub-moving stage 314 is connected to the first linear module 311, the seventh sub-moving stage 314 drives the first linear module 311 to perform fine adjustment along the first direction and the second direction, wherein the seventh sub-moving stage 314 may be an electric moving stage or a manual moving stage, and the position of the needle ejecting portion 313 is adjusted with high precision.

In addition, the chip testing system further comprises a memory, the memory is connected with the controller, and the memory is used for storing the divergence angles of the chips to be tested under different current intensities, so that the testing data of the chips to be tested can be traced conveniently. In addition, the controller can also be butted with an MES system of a production line, and test data of the chip to be tested can be stored in the MES system.

In the foregoing embodiments, the descriptions of the respective embodiments have respective emphasis, and for parts that are not described in detail in a certain embodiment, reference may be made to the related descriptions of other embodiments.

In the description of the present application, the terms "first", "second" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance or implying any number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more features.

The ice making device provided by the embodiments of the present application is described in detail above, and the principles and embodiments of the present application are explained herein by applying specific examples, and the above description of the embodiments is only used to help understand the method and the core idea of the present application; meanwhile, for those skilled in the art, according to the idea of the present application, there may be variations in the specific embodiments and the application scope, and in summary, the content of the present specification should not be construed as a limitation to the present application.

Claims (10)

1. A chip divergence angle testing apparatus, comprising:

a first platform;

the laser simulation mechanism comprises a workbench, a power-on component and a cooling component, wherein the power-on component is positioned on one side of the workbench and is used for powering up a chip to be tested on the workbench so as to enable the chip to be tested to emit laser beams, and the cooling component is connected with the workbench and is used for cooling the chip to be tested on the workbench;

the third testing mechanism arranged on the first platform comprises a first sensor, a second sensor, a first rotating assembly and a second rotating assembly, the first sensor is mounted on the first rotating assembly, the second sensor is mounted on the second rotating assembly, the first sensor and the second sensor are arranged along a direction perpendicular to a light beam of the chip to be tested, the first rotating assembly is used for driving the first sensor to swing along a first arc, the first sensor is used for detecting third light intensity information of each position in the swinging process along the first arc, the second rotating assembly is used for driving the second sensor to swing along a second arc line, the second sensor is used for detecting fourth light intensity information at each position in the swing process along the second arc line, and the plane where the first arc line is located is perpendicular to the plane where the second arc line is located;

the controller, simulation laser mechanism and third accredited testing organization respectively with the controller is connected, the controller is used for:

receiving the third light intensity information of each position and the fourth light intensity information of each position, and calculating a divergence angle of a laser beam emitted by the chip to be tested according to the third light intensity information of each position and the fourth light intensity information of each position;

and judging whether the chip to be tested is qualified or not according to the divergence angle, and outputting a test result.

2. The chip divergence angle testing device according to claim 1, wherein the worktable comprises a first base, a driving part and a clamping part, a boss is arranged on the first base, the area of the boss is matched with the area of the chip to be tested, the driving part is connected with the clamping part, the boss is used for placing the chip to be tested, and the driving part is used for driving the clamping part to clamp and fix the chip to be tested.

3. The chip divergence angle testing device according to claim 2, wherein the clamping portion comprises a first sub-portion and a second sub-portion which are symmetrically arranged at two sides of the boss, one sides of the first sub-portion and the second sub-portion, which are close to the boss, are provided with contact surfaces which are matched with the shape of the side wall of the chip to be tested, one sides of the first sub-portion and the second sub-portion, which are close to the boss, are also provided with abutting surfaces which are matched with the shape of the side wall of the boss, and the contact surfaces are located above the abutting surfaces.

4. The chip divergent angle test apparatus as claimed in claim 3, wherein the driving part includes: the first cylinder is connected with one end, far away from the contact surface, of the first sub-part, the second cylinder is connected with one end, far away from the contact surface, of the second sub-part, and the first cylinder and the second cylinder respectively drive the first sub-part and the second sub-part to relatively approach or move away;

the first base is provided with a limiting part, the limiting part is located between the first sub part and the second sub part and located on one side of the boss, and the limiting part is used for abutting against the first sub part and the second sub part when the first sub part and the second sub part clamp the chip to be tested.

5. The chip divergence angle testing apparatus according to claim 2, wherein the cooling module comprises: semiconductor refrigeration piece and water-cooling board, first base with the water-cooling board is connected, the semiconductor refrigeration piece is fixed in by the centre gripping first base with between the water-cooling board, the cold face of semiconductor refrigeration piece is connected first base, the hot face of semiconductor refrigeration piece is connected the water-cooling board.

6. The chip divergence angle testing device according to claim 1, wherein the first rotating assembly comprises a second motor, a first mounting plate and a first swing link, the second motor is mounted on the first mounting plate, the first swing link is connected with an output end of the second motor, the first sensor is mounted at one end of the first swing link far away from the second motor, and the second motor drives the first swing link to swing in a horizontal plane, so that the first sensor swings in a first arc line in the horizontal plane.

7. The chip divergence angle testing device according to claim 6, wherein the first swing link comprises a first sub-link and a second sub-link, one end of the first sub-link is connected to the output end of the second motor, one end of the second sub-link is vertically installed at the other end of the first sub-link, and the first sensor is disposed at the other end of the first sub-link.

8. The chip divergence angle testing device according to claim 7, wherein the first rotating assembly further comprises a second photoelectric switch and a second shielding piece used in cooperation with the second photoelectric switch, the second photoelectric switch is electrically connected to the controller, the second photoelectric switch is disposed on a side surface of the supporting column close to the first swing link, and the second shielding piece is disposed on the first swing link.

9. The chip divergence angle testing apparatus according to claim 1, wherein the second rotating assembly comprises a third motor, a second mounting plate and a second swing link, the third motor is mounted on the second mounting plate, an output end of the third motor is connected to one end of the second swing link, the second sensor is mounted at the other end of the second swing link, and the third motor drives the second swing link to swing in a vertical plane, such that the second sensor swings in a second arc line in the vertical plane.

10. The chip divergence angle testing apparatus according to claim 9, wherein the second rotating assembly further comprises a third photoelectric switch and a third shielding plate cooperating with the third photoelectric switch, the third photoelectric switch is electrically connected to the controller, the third photoelectric switch is disposed on the second mounting plate, and the third shielding plate is disposed on the second swing rod.

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