CN216900804U - Laser simulation system for chip test - Google Patents
Laser simulation system for chip test Download PDFInfo
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- CN216900804U CN216900804U CN202123449187.8U CN202123449187U CN216900804U CN 216900804 U CN216900804 U CN 216900804U CN 202123449187 U CN202123449187 U CN 202123449187U CN 216900804 U CN216900804 U CN 216900804U
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Abstract
The application provides a laser simulation system for chip testing, which comprises a workbench, a power-on component and a cooling component, wherein the workbench comprises a first base, a driving part and a clamping part, a boss is arranged on the first base, the area of the boss is matched with the area of a chip to be tested, the boss is used for placing the chip to be tested, the driving part is connected with the clamping part, the driving part is fixed on the first base, the driving part is used for driving the clamping part to clamp and fix the chip to be tested, and the power-on component is positioned on one side of the workbench and used for powering on the chip to be tested on the workbench so as to enable the chip to be tested to send laser beams; the cooling assembly comprises a semiconductor refrigeration piece and a water cooling plate, a first base is attached to the cold surface of the semiconductor refrigeration piece, a water cooling plate is attached to the hot surface of the semiconductor refrigeration piece, the water cooling plate is connected with the first base, and the semiconductor refrigeration piece is fixed through clamping. The problems of complex structure and large occupied space in the prior art are solved, and the product has compact structure and beautiful appearance.
Description
Technical Field
The application belongs to the technical field of semiconductor detection, and particularly relates to a laser simulation system for chip testing.
Background
Along with the rapid development of the semiconductor laser industry, among the existing test equipment, when testing, the chip that awaits measuring is generally fixed on the workstation through vacuum adsorption, need set up the vacuum adsorption hole on the workstation, the bottom of workstation sets up the gas circuit of being connected with the vacuum adsorption hole, the gas tightness requirement of workstation is higher, the workstation still needs to use with other structure cooperations, it influences cooling device's installation to arrange the gas circuit at the workstation bottom, the overall structure that workstation and cooling device constitute is complicated, and is bulky, lead to laser instrument analog system occupation space big, the wasting of resources.
SUMMERY OF THE UTILITY MODEL
The embodiment of the application provides a laser simulation system for chip testing, which aims to solve the problems of complex structure and large occupied space in the prior art.
In a first aspect, an embodiment of the present application provides a laser simulation system for chip testing, including:
the workbench comprises a first base, a driving part and a clamping part, wherein a boss is arranged on the first base, the area of the boss is matched with the area of a chip to be tested, the boss is used for placing the chip to be tested, the driving part is connected with the clamping part, the driving part is fixed on the first base, and the driving part is used for driving the clamping part to clamp and fix the chip to be tested;
the power-on component is positioned on one side of the workbench and is used for powering on the chip to be tested on the workbench so as to enable the chip to be tested to emit laser beams;
the cooling assembly comprises a semiconductor refrigeration piece and a water cooling plate, wherein the cold surface of the semiconductor refrigeration piece is attached to the first base, the hot surface of the semiconductor refrigeration piece is attached to the water cooling plate, the water cooling plate is connected with the first base, and the semiconductor refrigeration piece is clamped and fixed.
Optionally, the clamping portion includes a first sub-portion and a second sub-portion symmetrically disposed on two sides of the boss, and one side of the first sub-portion and one side of the second sub-portion, which are close to the boss, have contact surfaces adapted to the shape of the side wall of the chip to be tested.
Optionally, a supporting surface adapted to the shape of the side wall of the boss is further disposed on one side of the first sub-portion and the second sub-portion close to the boss, and the contact surface is located above the supporting surface.
Optionally, the driving portion includes a first cylinder and a second cylinder, the first cylinder is connected to one end of the first sub portion away from the contact surface, the second cylinder is connected to one end of the second sub portion away from the contact surface, and the first cylinder and the second cylinder respectively drive the first sub portion and the second sub portion to approach or move away from each other relatively.
Optionally, a limiting portion is disposed on the first base, the limiting portion is located between the first sub portion and the second sub portion, the limiting portion is located on one side of the boss, and the limiting portion is used for abutting against the first sub portion and the second sub portion when the first sub portion and the second sub portion clamp the chip to be tested.
Optionally, the first sub-portion includes a first plate and a second plate, the first cylinder is connected to one end of the first plate, the second plate is vertically connected to the other end of the first plate, the contact surface and the abutting surface are disposed on one side of the second plate close to the boss, and the upper surface of the first plate is flush with the upper surface of the chip to be tested;
the second sub-portion comprises a third plate body and a fourth plate body, the second cylinder is connected with one end of the third plate body, the fourth plate body is vertically connected with the other end of the third plate body, one side, close to the boss, of the fourth plate body is provided with the contact surface and the abutting surface, and the upper surface of the fourth plate body is flush with the upper surface of the chip to be tested.
Optionally, one side of the first plate body opposite to the third plate body corresponds to and abuts against two sides of the limiting portion, the upper surfaces of the first plate body and the third plate body are higher than the upper surface of the limiting portion, and the upper surfaces of the first plate body and the third plate body are higher than the upper surfaces of the second plate body and the fourth plate body.
Optionally, the first base is further provided with a first fixing seat, a second fixing seat, a first connecting plate and a second connecting plate, the first fixing seat and the second fixing seat are installed on one side of the first base, the boss is close to the other side of the first base, the first cylinder is installed on the first fixing seat, the output end of the first cylinder is connected with the first sub-portion through the first connecting plate, the second cylinder is installed on the second fixing seat, and the output end of the second cylinder is connected with the second sub-portion through the second connecting plate.
Optionally, the cooling module still includes water injection portion, be provided with water inlet and delivery port on the boss, first base is equipped with first passageway and second passageway, first passageway intercommunication water injection portion with the water inlet, the second passageway with the delivery port intercommunication.
Optionally, add the electrical component and include third base, first sharp module, first sliding part, fourth displacement platform and probe portion, the fourth displacement platform install in on the third base, the output of four displacement platforms is connected first sharp module, probe portion passes through first sliding part connects first sharp module, first sharp module is used for driving probe portion removes along the third direction, the fourth displacement platform is used for adjusting probe portion is located directly over the boss.
The embodiment of the application provides a laser simulation system for chip test, include the workstation, add power subassembly and cooling module, it is fixed with the chip centre gripping that awaits measuring through the clamping part, first base bottom sets up semiconductor refrigeration piece and water-cooling board, gives first base cooling through the semiconductor refrigeration piece, and the water-cooling board is given semiconductor refrigeration piece cooling, has overcome current structure complicacy, the problem that occupation space is big, product compact structure, the appearance is pleasing to the eye.
Drawings
In order to more clearly illustrate the technical solutions in the embodiments of the present application, the drawings used in the description of the embodiments will be briefly described below. It is obvious that the drawings in the following description are only some embodiments of the application, and that other drawings can be derived from these drawings by a person skilled in the art without inventive effort.
For a more complete understanding of the present application and its advantages, reference is now made to the following descriptions taken in conjunction with the accompanying drawings. Wherein like reference numerals refer to like parts in the following description.
Fig. 1 is a schematic structural diagram of a laser simulation system for chip testing according to an embodiment of the present disclosure.
Fig. 2 is a schematic structural diagram of a power-up component according to an embodiment of the present disclosure.
Fig. 3 is an isometric view of a table provided in an embodiment of the present application.
Fig. 4 is an exploded view of a partial structure of a workbench according to an embodiment of the present application.
Fig. 5 is an isometric view of a local structure of a workbench in a laser simulation system for chip testing according to an embodiment of the present disclosure.
Fig. 6 is a partially enlarged view of a point a in fig. 5.
Fig. 7 is a side view of a partial structure of a worktable in a laser simulation system for chip testing according to an embodiment of the present disclosure.
Fig. 8 is a sectional view taken along line B-B of fig. 7.
Fig. 9 is a schematic view of a water injection portion in a laser simulation system for chip testing according to an embodiment of the present disclosure.
Detailed Description
The technical solutions in the embodiments of the present application will be clearly and completely described below with reference to the drawings in the embodiments of the present application. It is to be understood that the embodiments described are only a few embodiments of the present application and not all embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present application.
The embodiment of the application provides a laser simulation system for chip testing to solve the problems of complex structure and large occupied space in the prior art. The following description will be made with reference to the accompanying drawings.
Referring to fig. 1, the analog laser mechanism 3 includes a workbench 30 installed on the first platform 1, an electrical component 31 and a cooling component 32, the workbench 30 includes a first base 300, a driving portion 301 and a clamping portion 304, the driving portion 301 is connected to the clamping portion 304, the driving portion 301 drives the clamping portion 304 to clamp and fix a chip to be tested, the first base 300 is fixed on the first platform 1, a boss 302 is arranged on a side surface of the first base 300 far away from the first platform 1, the area of the boss 302 is adapted to the area of the chip to be tested, the boss 302 is used for placing the chip to be tested, and the driving portion 301 is arranged on the first base 300.
It can be understood that, the area of the boss 302 is adapted to the area of the chip to be tested, which means that the area of the boss 302 is slightly larger than the area of the chip to be tested, for example, the width of the chip to be tested is 4.05mm, while the width of the boss 302 is 4.1mm, the position of the chip to be tested is calibrated and fixed by the clamping portion 304, so that the chip to be tested is completely located on the boss 302, the positioning accuracy of the clamping portion 304 is controlled within 0.025mm, and the positioning accuracy is high. In the power-up process of the power-up component 31, the clamping portion 304 clamps and fixes the chip to be tested, so as to avoid the chip to be tested from shifting, fix the position of the light-emitting end of the chip to be tested, and ensure the testing effect.
In some embodiments, referring to fig. 5, 6 and 7, the clamping portion 304 includes a first sub-portion 3040 and a second sub-portion 3041 symmetrically disposed at two sides of the boss 302, and a side of the first sub-portion 3040 and the second sub-portion 3041 near the boss 302 has a contact surface 3042 adapted to a shape of a sidewall of a chip to be tested. In addition, the first sub-portion 3040 and the second sub-portion 3041 are further provided with a holding surface 3044 adapted to the shape of the side surface of the boss 302.
It can be understood that the driving portion 301 drives the first sub-portion 3040 and the second sub-portion 3041 to relatively approach or move away from each other, when the first sub-portion 3040 and the second sub-portion 3041 relatively abut against and clamp two sides of a chip to be tested, the contact surfaces 3042 of the first sub-portion 3040 and the second sub-portion 3041 abut against two sides of the chip to be tested, the first sub-portion 3040 and the second sub-portion 3041 clamp and fix the chip to be tested from two sides, and meanwhile, the first sub-portion 3040 and the second sub-portion 3041 also abut against and fix two sides of the boss 302 through the abutting surface 3044, so that the clamping structure is simple, the clamping stability is good, the boss 302 limits excessive clamping of the first sub-portion 3040 and the second sub-portion 3041 while clamping the chip to be tested from two sides, and avoids damaging the chip to be tested, and limits the strength of the first sub-portion 3040 and the second sub-portion 3041 while keeping the clamping stability, and protects the chip to be tested.
In some embodiments, referring to fig. 5, the driving portion 301 includes a first cylinder 3010 and a second cylinder 3011, the first cylinder 3010 is mounted on the first base 300, the first cylinder 3010 is located outside the first sub-portion 3040, a telescopic end of the first cylinder 3010 is connected to an end of the first sub-portion 3040 away from the contact surface 3042, the second cylinder 3011 is mounted on the first base 300, the second cylinder 3011 is located outside the second sub-portion 3041, a telescopic end of the second cylinder 3011 is connected to an end of the second sub-portion 3041 away from the contact surface 3041, the telescopic ends of the first cylinder 3010 and the second cylinder 3011 are disposed opposite to each other, and the first sub-portion 3040 and the second sub-portion 3041 are slidably mounted on the first base 300.
The boss 302 may be disposed at any position on the first base 300, for example, on a side of the first base 300 away from the feeding mechanism 2, a side edge of the boss 302 is aligned with a side edge of the first base 300, at this time, the first cylinder 3010 and the second cylinder 3011 are disposed at an end of the first base 300 close to the feeding mechanism 2, the first sub-portion 3040 and the second sub-portion 3041 are easy to generate torsional deformation under a long-term action of the first cylinder 3010 and the second cylinder 3011, in order to adjust the first sub-portion 3040 and the second sub-portion 3041 to be uniformly stressed, the clamping portion 304 further includes a limiting portion 3043 disposed on the first base 300, the limiting portion 3043 is located between the first sub-portion 3040 and the second sub-portion 3041, the limiting portion 3043 is located at a side of the boss 302, and the limiting portion 3043 is used for supporting the first sub-portion 3040 and the second sub-portion 3041 when the first sub-portion 3040 and the second sub-portion 3041 clamp a chip to be tested.
As shown in fig. 5, the positioning portion 3043 is a fixing block disposed on the first base 300, and a plurality of fixing blocks may be disposed along the length direction of the first sub-portion 3040, when the first sub-portion 3040 and the second sub-portion 3041 clamp and fix a chip to be tested, the positioning portion 3043 supports the inner surfaces of the first sub-portion 3040 and the second sub-portion 3041, so as to uniformly apply a force along the length direction of the first sub-portion 3040 and the second sub-portion 3041, and avoid a positioning deflection angle, even if the processing accuracy of the first base 300 does not meet the requirement, the positioning may be assisted by the positioning portion 3043, which not only improves the positioning accuracy, but also improves the service lives of the first sub-portion 3040 and the second sub-portion 3041.
In some embodiments, referring to fig. 6, the first sub-portion 3040 includes a first plate 30400 and a second plate 30401, the first cylinder 3010 is connected to one end of the first plate 30400, the second plate 30401 is vertically connected to the other end of the first plate 30400, a contact surface 3042 and a support surface 3044 are disposed on the sides of the first plate 30400 and the second plate 30401 close to the boss 302, and the upper surface of the first plate 30400 is flush with the upper surface of the chip to be tested; the second sub-portion 3041 includes a third plate 30410 and a fourth plate 30411, the second cylinder 3011 is connected to one end of the third plate 30410, the fourth plate 30411 is connected to the other end, a contact surface 3042 and a supporting surface 3044 are disposed on one side of the fourth plate 30411 close to the boss 392, and an upper surface of the fourth plate 30411 is flush with an upper surface of the chip to be tested.
It is understood that the first plate 30400 and the second plate 30401 of the first sub-portion 3040 may be a separate structure or an integrated structure, and the third plate 30410 and the fourth plate 30411 of the second sub-portion 3041 may also be a separate structure or an integrated structure.
Opposite side edges of the first plate body 30400 and the third plate body 30410 respectively and correspondingly abut against two sides of the limiting portion 3043, upper surfaces of the first plate body 30400 and the third plate body 30410 are higher than upper surfaces of the limiting portion 3043, and upper surfaces of the first plate body 30400 and the third plate body 30410 are higher than upper surfaces of the second plate body 30401 and the fourth plate body 30411.
It can be understood that the area between the first plate 30400 and the third plate 30410 allows the core assembly 21 to move through, and the heights of the second plate 30401 and the fourth plate 30411 are lower than the heights of the first plate 30400 and the third plate 30410, so as to avoid the interference between the second plate 30401 and the fourth plate 30411 and the core assembly 21.
In some embodiments, referring to fig. 5, the first base 300 is further provided with a first fixing seat 3002, a second fixing seat 3003, a first connecting plate 3004 and a second connecting plate 3005, the first fixing seat 3002 and the second fixing seat 3003 are installed on a side of the first base 300 away from the boss 302, the first cylinder 3010 is installed on the first fixing seat 3002, an output end of the first cylinder 3010 is connected to the first sub-portion 3040 through the first connecting plate 3004, the second cylinder 3011 is installed on the second fixing seat 3003, and an output end of the second cylinder 3011 is connected to the second sub-portion 3041 through the second connecting plate 3005.
In some embodiments, referring to fig. 1, fig. 8, and fig. 9, the cooling assembly 32 includes a water-cooling plate 320 and a semiconductor cooling plate 321, the semiconductor cooling plate 321 is disposed between the first base 300 and the water-cooling plate 320, a cold surface of the semiconductor cooling plate 321 is attached to a surface of the first base 300 away from the boss 302, a hot surface of the semiconductor cooling plate 321 is attached to the water-cooling plate 320, the first base 300 is fixedly connected to the water-cooling plate 320, the semiconductor cooling plate 321 is clamped and fixed between the first base 300 and the water-cooling plate 320, the semiconductor cooling plate 321 can be fixed without other connection structures, the first base 300 is flush with a periphery of the water-cooling plate 320, the workbench 30 has an attractive appearance structure, and is convenient to install and maintain.
In some embodiments, referring to fig. 9, the cooling assembly 32 further comprises a water injection part 322, the boss 302 is provided with a water inlet 3020 and a water outlet 3021, the first base 300 is provided with a first channel 3000 and a second channel 3001, the first channel 3000 is communicated with the water injection part 322 and the water inlet 3020, and the second channel 3001 is communicated with the water outlet 3021.
Illustratively, referring to fig. 9, the water filling part 322 includes a first motor 3220, a driving screw rod 3221, a push plate 3222, an injection syringe 3223 and a second base 3224, the first motor 3220, the driving screw rod 3221, the push plate 3222 and the injection syringe 3223 are all disposed on the second base 3224, an output end of the first motor 3220 is connected to the driving screw rod 3221, one end of the push plate 3222 is connected to a nut on the driving screw rod 3221, the push plate 3222 is connected to a movable end of the injection syringe 3223, a water outlet end of the injection syringe 3223 faces to a side where the chip to be tested is located, and the push plate 3222 moves along an axial direction of the driving screw rod 3221 with rotation of the driving screw rod 3221 to push the movable end of the injection syringe 3223, so that the water outlet end of the injection syringe 3223 fills water into the first channel 3022. A plurality of first photoelectric switches 3225 are disposed on the second base 3224, the plurality of first photoelectric switches 3225 are disposed along a circumferential direction of the driving screw rod 3221, and a first shielding sheet 3226 used in cooperation with the first photoelectric switches 3225 is disposed on the push plate 3222.
In some embodiments, referring to fig. 9, the power-on assembly 31 includes a third base 310, a first linear module 311, a first sliding portion 312, and a probe portion 313, the first linear module 311 is mounted on the third base 310, the probe portion 313 is slidably mounted on the first linear module 311 through the first sliding portion 312, the probe portion 313 is located right above the boss 302, the probe portion 313 moves in the third direction, when the probe portion 313 is located at the highest position, the wick assembly 21 moves to the boss 302, and the probe portion 313 is higher than the wick assembly 21.
It can be understood that the probe portion 313 is higher than the wick assembly 21, so as to avoid the occurrence of the interference between the wick assembly 21 and the probe portion 313, and the components on the first platform 1 are reasonably arranged, and have small product volume and beautiful appearance.
In addition, as shown in fig. 3, a fourth displacement table 314 is further disposed on the third base 310, an output end of the fourth displacement table 314 is connected to the first linear module 311, and the fourth displacement table 314 drives the first linear module 311 to perform fine adjustment along the first direction and the second direction, where the fourth displacement table 314 may be an electric displacement table or a manual displacement table, and the position of the probe portion 313 is adjusted with high precision.
In the foregoing embodiments, the descriptions of the respective embodiments have respective emphasis, and for parts that are not described in detail in a certain embodiment, reference may be made to related descriptions of other embodiments.
In the description of the present application, the terms "first", "second" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance or implying any number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more features.
The laser simulation system for chip testing provided by the embodiment of the present application is described in detail above, and a specific example is applied in the description to explain the principle and the implementation of the present application, and the description of the embodiment is only used to help understand the method and the core idea of the present application; meanwhile, for those skilled in the art, according to the idea of the present application, there may be variations in the specific embodiments and the application scope, and in summary, the content of the present specification should not be construed as a limitation to the present application.
Claims (10)
1. A laser simulation system for chip testing is characterized by comprising:
the workbench comprises a first base, a driving part and a clamping part, wherein a boss is arranged on the first base, the area of the boss is matched with the area of a chip to be tested, the boss is used for placing the chip to be tested, the driving part is connected with the clamping part, the driving part is fixed on the first base, and the driving part is used for driving the clamping part to clamp and fix the chip to be tested;
the power-on component is positioned on one side of the workbench and is used for powering on the chip to be tested on the workbench so as to enable the chip to be tested to emit laser beams;
the cooling assembly comprises a semiconductor refrigeration piece and a water cooling plate, wherein the cold surface of the semiconductor refrigeration piece is attached to the first base, the hot surface of the semiconductor refrigeration piece is attached to the water cooling plate, the water cooling plate is connected with the first base, and the semiconductor refrigeration piece is clamped and fixed.
2. The laser simulation system for chip testing according to claim 1, wherein the clamping portion includes a first sub-portion and a second sub-portion symmetrically disposed on two sides of the boss, and a side of the first sub-portion and the second sub-portion close to the boss has a contact surface adapted to a shape of a sidewall of the chip to be tested.
3. The laser simulation system for chip testing according to claim 2, wherein a contact surface adapted to a shape of a sidewall of the boss is further disposed on a side of the first sub-portion and the second sub-portion close to the boss, and the contact surface is located above the contact surface.
4. The laser simulation system for chip testing according to claim 3, wherein the driving portion comprises a first cylinder and a second cylinder, the first cylinder is connected to an end of the first sub portion away from the contact surface, the second cylinder is connected to an end of the second sub portion away from the contact surface, and the first cylinder and the second cylinder respectively drive the first sub portion and the second sub portion to approach or separate relatively.
5. The laser simulation system for chip testing according to claim 4, wherein a position-limiting portion is disposed on the first base, the position-limiting portion is located between the first sub-portion and the second sub-portion, the position-limiting portion is located at one side of the boss, and the position-limiting portion is configured to abut against the first sub-portion and the second sub-portion when the first sub-portion and the second sub-portion clamp the chip to be tested.
6. The laser simulation system for chip testing according to claim 5, wherein the first sub-section comprises a first plate body and a second plate body, the first cylinder is connected with one end of the first plate body, the second plate body is vertically connected with the other end of the first plate body, the contact surface and the abutting surface are arranged on one side of the second plate body close to the boss, and the upper surface of the first plate body is flush with the upper surface of the chip to be tested;
the second sub-portion comprises a third plate body and a fourth plate body, the second cylinder is connected with one end of the third plate body, the fourth plate body is vertically connected with the other end of the third plate body, one side, close to the boss, of the fourth plate body is provided with the contact surface and the abutting surface, and the upper surface of the fourth plate body is flush with the upper surface of the chip to be tested.
7. The laser simulation system for chip testing according to claim 6, wherein opposite side edges of the first plate and the third plate respectively and correspondingly abut against two sides of the limiting portion, upper surfaces of the first plate and the third plate are higher than upper surfaces of the limiting portion, and upper surfaces of the first plate and the third plate are higher than upper surfaces of the second plate and the fourth plate.
8. The laser simulation system for chip testing according to claim 7, wherein the first base is further provided with a first fixing seat, a second fixing seat, a first connecting plate and a second connecting plate, the first fixing seat and the second fixing seat are mounted on one side of the first base, the boss is close to the other side of the first base, the first cylinder is mounted on the first fixing seat, the output end of the first cylinder is connected to the first sub-portion through the first connecting plate, the second cylinder is mounted on the second fixing seat, and the output end of the second cylinder is connected to the second sub-portion through the second connecting plate.
9. The laser simulation system for chip testing according to claim 1, wherein the cooling module further comprises a water injection portion, the boss is provided with a water inlet and a water outlet, the first base is provided with a first channel and a second channel, the first channel is communicated with the water injection portion and the water inlet, and the second channel is communicated with the water outlet.
10. The laser simulation system for chip testing according to claim 1, wherein the power-on assembly comprises a third base, a first linear module, a first sliding portion, a fourth displacement table and a probe portion, the fourth displacement table is mounted on the third base, an output end of the fourth displacement table is connected to the first linear module, the probe portion is connected to the first linear module through the first sliding portion, the first linear module is used for driving the probe portion to move in a third direction, and the fourth displacement table is used for adjusting the probe portion to be located right above the boss.
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| CN202123449187.8U CN216900804U (en) | 2021-12-31 | 2021-12-31 | Laser simulation system for chip test |
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| CN202123449187.8U CN216900804U (en) | 2021-12-31 | 2021-12-31 | Laser simulation system for chip test |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN115684675A (en) * | 2022-11-17 | 2023-02-03 | 镭神技术（深圳）有限公司 | Miniature semiconductor refrigerating sheet aging clamp and power-on and temperature acquisition method |
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2021
- 2021-12-31 CN CN202123449187.8U patent/CN216900804U/en active Active
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN115684675A (en) * | 2022-11-17 | 2023-02-03 | 镭神技术（深圳）有限公司 | Miniature semiconductor refrigerating sheet aging clamp and power-on and temperature acquisition method |
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