CN216891321U - Vacuum coating equipment - Google Patents
Vacuum coating equipment Download PDFInfo
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- CN216891321U CN216891321U CN202123088241.0U CN202123088241U CN216891321U CN 216891321 U CN216891321 U CN 216891321U CN 202123088241 U CN202123088241 U CN 202123088241U CN 216891321 U CN216891321 U CN 216891321U
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Abstract
The disclosure provides vacuum coating equipment, and belongs to the technical field of vacuum coating equipment. The vacuum coating equipment comprises a reaction cavity, a target substrate and a coating pot, wherein the coating pot is rotatably connected to the top of the reaction cavity, and the second surface of the coating pot is provided with a plurality of concentric annular placing groove units for placing the substrate. The heating wire connected with the plating pot through the fixing buckle in the heating assembly comprises at least two annular parts and a connecting part, the symmetrical plane of the opening of each annular part is the same plane, one annular part is arranged between every two adjacent annular placing groove units to uniformly heat the annular placing groove units, and the temperature uniformity of the substrate in the substrate placing groove is improved. The annular parts are connected with each other through the connecting part connected with the side wall of the opening of the annular part, so that the uniform heating degree of the plating pot is further improved. The whole can improve the uniformity degree that the basement in the different positions basement standing grooves on the plating pot is heated in order to improve the thickness uniformity degree of the coating film on the basement.
Description
Technical Field
The disclosure relates to the technical field of vacuum coating equipment, in particular to vacuum coating equipment.
Background
Vacuum coating equipment is commonly used in the fabrication of semiconductor devices for depositing metal or epitaxial materials on a substrate or epitaxial layer. The vacuum coating equipment at least comprises a reaction cavity, a target substrate, a plating pot and a heating assembly, wherein the target substrate is positioned at the bottom of the reaction cavity and used for evaporating materials required by film forming, the plating pot is rotatably arranged at the top of the reaction cavity and is right opposite to the target substrate, a plurality of substrate placing grooves are formed in the plating pot, and the heating assembly is used for heating the inside of the reaction cavity so as to meet the temperature condition required by film coating.
The heating assembly usually comprises a plurality of heating halogen tungsten lamps which are equidistantly arranged along the circumferential direction of the bottom of the reaction chamber, but the irradiation range of the heating halogen tungsten lamps is uneven, which easily causes uneven heating of the substrate in the substrate placing groove at different positions on the plating pot, and thus causes uneven thickness of the plated film on the substrate.
SUMMERY OF THE UTILITY MODEL
The embodiment of the disclosure provides vacuum coating equipment, which can improve the uniformity of heating of substrates in substrate placing grooves at different positions on a coating pan so as to improve the thickness uniformity of coating films on the substrates. The technical scheme is as follows:
the embodiment of the disclosure provides vacuum coating equipment, which comprises a reaction cavity, a target substrate, a coating pot and a heating assembly,
the plating pot is rotatably connected to the top of the reaction cavity and is provided with a first surface close to the reaction cavity and a second surface far away from the top of the reaction cavity,
the second surface is provided with a plurality of concentric annular placing groove units, each annular placing groove unit comprises a plurality of base placing grooves which are distributed equidistantly along the circumferential direction of the plating pot,
the target base is connected with the bottom of the reaction chamber and is opposite to the plating pot,
the heating element comprises a heating wire and a fixed buckle, the heating wire comprises at least two concentric annular parts with openings and at least one connecting part, each annular part is provided with an opening symmetrical surface which is the same plane, the radial direction of the plating pot is provided with two adjacent annular placing groove units, one annular part is arranged between the two adjacent annular parts, the two adjacent annular parts are respectively connected with the two ends of the connecting part, each connecting part is respectively connected with the two side walls of the openings of the annular parts, and each annular part is connected with the plating pot through the fixed buckle.
Optionally, the minimum distance between each annular part and two adjacent annular placing groove units is equal.
Optionally, a plurality of the fixing buckles are distributed on the circumferential direction of each annular part at intervals.
Optionally, the minimum distance between two adjacent fixing buckles is 5-10 cm.
Optionally, fixed buckle includes semi-annular mounting panel and connecting piece, the both ends of semi-annular mounting panel with plate the pot and pass through the connecting piece links to each other, the heater strip is located the semi-annular mounting panel with plate in the centre gripping space that forms between the pot.
Optionally, the heating assembly further comprises a first temperature monitoring thermocouple and a second temperature monitoring thermocouple arranged to measure temperature and distributed at intervals on the second surface.
Optionally, the first temperature monitoring thermocouple and the second temperature monitoring thermocouple are both contact temperature thermocouples.
Optionally, the heating assembly further comprises an alarm configured to alarm when a temperature difference between the temperature monitored by the first temperature monitoring thermocouple and the temperature monitored by the second temperature monitoring thermocouple is equal to or greater than 10 degrees celsius, and the alarm is connected with the second surface of the plating pot.
Optionally, the first temperature monitoring thermocouple, the second temperature monitoring thermocouple and the alarm are all located within the annular portion with the smallest diameter.
Optionally, the first temperature monitoring thermocouple, the second temperature monitoring thermocouple and the alarm are distributed at equal intervals along the circumferential direction of the plating pot.
The beneficial effects brought by the technical scheme provided by the embodiment of the disclosure include:
the vacuum coating equipment comprises a reaction chamber, a target substrate and a plating pot, wherein the plating pot is rotatably connected to the top of the reaction chamber, the plating pot is provided with a first surface close to the reaction chamber and a second surface far away from the top of the reaction chamber, the second surface is provided with a plurality of concentric annular placing groove units, each annular placing groove unit comprises a plurality of substrate placing grooves distributed along the circumferential direction of the plating pot at equal intervals, and the substrate placing grooves can be used for placing the substrate to ensure the normal growth of epitaxial materials on the substrate. The target substrate is connected with the bottom of the reaction cavity and is opposite to the plating pot, so that the material can be ensured to be evaporated or sputtered onto the substrate, and stable film plating is realized. Heating assembly includes heater strip and fixed buckle in the vacuum coating equipment to the heater strip includes at least two concentric and have open-ended annular part and at least one coupling part, and the open-ended plane of symmetry of every annular part is the coplanar, in the footpath of plating the pot, all has an annular part between two adjacent annular standing groove units, and every annular part of heater strip can carry out the even heating to the annular standing groove unit adjacent with this annular part, improves the temperature degree of consistency of the base in the base standing groove. And the annular parts are connected through the connecting parts connected with the side walls of the openings of the annular parts, so that the heating wire is ensured to be a whole, when the whole heating wire is used for heating, the overall heating value and temperature of the heating wire can be ensured to be consistent, and the uniform heating degree of the plating pot is further improved. The heating wire is connected to the second surface of the plating pot through the fixing buckle, so that the stable connection between the heating wire and the plating pot can be guaranteed, and the heating wire is convenient to disassemble and assemble. The uniformity of the heated substrate in the substrate placing grooves at different positions on the plating pot can be improved integrally, so that the thickness uniformity of the plated film on the substrate can be improved.
Drawings
In order to more clearly illustrate the technical solutions in the embodiments of the present disclosure, the drawings needed to be used in the description of the embodiments are briefly introduced below, and it is obvious that the drawings in the following description are only some embodiments of the present disclosure, and it is obvious for those skilled in the art to obtain other drawings based on the drawings without creative efforts.
Fig. 1 is a simplified positional relationship diagram of a vacuum coating apparatus provided in an embodiment of the present disclosure;
fig. 2 is a schematic structural diagram of a plating pot provided by the embodiment of the disclosure.
Detailed Description
To make the objects, technical solutions and advantages of the present disclosure more apparent, embodiments of the present disclosure will be described in detail with reference to the accompanying drawings.
Fig. 1 is a simplified positional relationship diagram of a vacuum deposition apparatus according to an embodiment of the present disclosure, and as can be seen from fig. 1, the embodiment of the present disclosure provides a vacuum deposition apparatus including a reaction chamber 1, a target substrate 2, a deposition pot 3, and a heating assembly 4.
The plating pot 3 is rotatably connected to the top of the reaction chamber 1, and the plating pot 3 has a first surface 31 close to the reaction chamber 1 and a second surface 32 far from the top of the reaction chamber 1.
The second surface 32 has a plurality of concentric annular placing groove units 33, and each annular placing groove unit 33 includes a plurality of base placing grooves 331 that are equidistantly distributed in the circumferential direction of the plating pot 3. The target substrate 2 is connected to the bottom of the reaction chamber 1, and is opposed to the plating pot 3.
Fig. 2 is a schematic structural diagram of a plating pot provided by an embodiment of the disclosure, as can be seen from fig. 2, the heating assembly 4 includes a heating wire 41 and a fixing clip 42, the heating wire 41 includes at least two concentric annular portions 411 having openings 4111 and at least one connecting portion 412, the symmetry planes of the openings 4111 of each annular portion 411 are coplanar, in the radial direction of the plating pot 3, one annular portion 411 is disposed between two adjacent annular placing groove units 33, the two adjacent annular portions 411 are respectively connected to two ends of the connecting portion 412, two ends of each connecting portion 412 are respectively connected to the side walls of the openings 4111 of the two annular portions 411, and each annular portion 411 is connected to the plating pot 3 through the fixing clip 42.
The vacuum coating equipment comprises a reaction chamber 1, a target substrate 2 and a plating pot 3, wherein the plating pot 3 is rotatably connected to the top of the reaction chamber 1, the plating pot 3 is provided with a first surface 31 close to the reaction chamber 1 and a second surface 32 far away from the top of the reaction chamber 1, the second surface 32 is provided with a plurality of concentric annular placing groove units 33, each annular placing groove unit 33 comprises a plurality of substrate placing grooves 331 which are equidistantly distributed along the circumferential direction of the plating pot 3, and the substrate placing grooves can be used for placing a substrate to ensure the normal growth of epitaxial materials on the substrate. The target substrate 2 is connected with the bottom of the reaction chamber 1 and is opposite to the plating pot 3, so that the material can be ensured to be evaporated or sputtered onto the substrate, and stable film plating is realized. The heating assembly 4 in the vacuum coating device comprises a heating wire 41 and a fixing buckle 42, the heating wire 41 comprises at least two concentric annular parts 411 with openings 4111 and at least one connecting part 412, the symmetrical surfaces of the openings 4111 of each annular part 411 are all the same plane, one annular part 411 is arranged between two adjacent annular placing groove units 33 in the radial direction of the coating pan 3, each annular part 411 of the heating wire 41 can uniformly heat the annular placing groove unit 33 adjacent to the annular part 411, and the temperature uniformity of the substrate in the substrate placing groove 331 is improved. And the annular parts 411 are connected through the connecting parts 412 connected with the side walls of the openings 4111 of the annular parts 411, so that the heater strip 41 is ensured to be a whole, and when the whole heater strip 41 is heated, the whole heating value and temperature of the heater strip 41 can be ensured to be consistent, and the uniform heating degree of the plating pot 3 is further improved. The heating wire 41 is connected to the second surface 32 of the plating pot 3 through the fixing buckle 42, so that the stable connection between the heating wire 41 and the plating pot 3 can be ensured, and the mounting and dismounting are convenient. The uniformity of the heating of the substrates in the substrate placing grooves 331 at different positions on the plating pot 3 can be improved integrally so as to improve the thickness uniformity of the plated film on the substrates.
It should be noted that the centers of the plurality of substrate placement grooves 331 of each annular placement groove unit 33 are all on the same circumference. The connecting portion 412 of the heating wire 41 is located in a gap between the two substrate placing grooves 331 in a certain annular placing groove unit 33. The substrate to be plated is mounted in the substrate placing groove 331 in each of the ring-shaped placing groove units 33. The substrate 100 mounted in the substrate placement slot 331 is illustrated in fig. 1.
Alternatively, the reaction chamber 1 may be a vacuum chamber. The degree of cleanliness in the reaction chamber 1 can be increased to improve the quality of the epitaxial material deposited on the substrate and to reduce impurities that may be present in the epitaxial material.
It should be noted that the reaction chamber 1 may be a space formed by closing a box body and a box door, or a space formed by closing a chamber and a chamber door. In order to realize vacuum, the vacuum coating equipment can be provided with an air suction pump.
Optionally, the entire plating pot 3 may be in a concave mirror shape, the circle centers corresponding to the two concave curved surfaces of the plating pot 3 are at the same point, and the first surface 31 and the second surface 32 are the two concave curved surfaces with the largest area of the plating pot 3. The mounting plate of the plating pot 3 adopts the structure, so that the preparation and the acquisition are convenient.
Illustratively, the connecting portion 412 of each heating wire 41 is parallel to the side wall of the opening 4111 of the annular portion 411, and the connecting portions 412 are alternately arranged on both sides of the symmetrical plane of the opening 4111 in the radial direction of the plating pot 3 and in the direction in which the diameter of the annular portion 411 increases. The stable heating of the heater strip 41 and the convenient detachment of the heater strip 41 as a whole can be ensured.
Illustratively, the minimum distance between each annular portion 411 and two adjacent annular placement groove units 33 is equal.
The minimum distance between each annular part 411 and two adjacent annular placing groove units 33 is equal, so that the annular parts 411 of the heating wires 41 can uniformly and stably heat the substrate in the substrate placing groove 331 in the adjacent annular placing groove units 33, the uniform heating degree of the substrate is further improved, and the uniformity degree of the thickness of the film layer deposited on the substrate is improved.
It should be noted that the minimum distance between each ring portion 411 and two adjacent ring-shaped placement groove units 33 is actually the minimum distance between each ring portion 411 and each substrate placement groove 331 in each ring-shaped placement groove unit 33.
Optionally, a plurality of fixing buckles 42 are distributed on the circumference of each annular part 411 at intervals.
The addition of the plurality of fixing buckles 42 can ensure that each annular part 411 can be stably connected with the plating pot 3.
Optionally, the minimum distance between two adjacent fixing buckles 42 is 5-10 cm.
The minimum distance between two adjacent fixed buckles 42 is 5-10 cm. The connection and fixation of the heating wires 41 with different specifications can be met, and the stable connection between the heating wires 41 with different specifications and the plating pot 3 is ensured.
Illustratively, the fixing buckle 42 comprises a semi-annular mounting plate 421 and a connecting piece 422, two ends of the semi-annular mounting plate 421 are connected with the plating pot 3 through the connecting piece 422, and the heating wire 41 is located in a clamping space formed between the semi-annular mounting plate 421 and the plating pot 3.
The fixing buckle 42 is arranged to comprise the semi-annular mounting plate 421 and the connecting piece 422, so that the stable connection between the heating wire 41 and the plating pot 3 can be realized on the premise of not damaging the heating wire 41, and meanwhile, the heating wire 41 and the plating pot 3 can be conveniently disassembled and assembled.
Illustratively, the connecting member 422 may be a bolt or a screw or a stud. The present disclosure is not so limited.
Optionally, the heating assembly 4 further comprises a first temperature monitoring thermocouple 43 and a second temperature monitoring thermocouple 44 spaced apart from each other on the second surface 32 and configured to measure temperature.
The first temperature monitoring thermocouple 43 and the second temperature monitoring thermocouple 44 for measuring the temperature are added on the second surface 32 of the plating pot 3, so that the temperature of the plating pot 3 and the substrate on the plating pot 3 can be stably measured, and whether the temperature in the reaction chamber 1 is uniform or not can be conveniently monitored.
Illustratively, the first temperature monitoring thermocouple 43 and the second temperature monitoring thermocouple 44 are contact temperature thermocouples.
The temperature measured by the contact thermocouple is accurate, so that the temperature of the plating pot 3 can be accurately measured, and the heating control of the heating wire 41 and the accuracy of film coating are facilitated.
Optionally, the heating assembly 4 further comprises an alarm 45 configured to alarm when the temperature monitored by the first temperature monitoring thermocouple 43 differs from the temperature monitored by the second temperature monitoring thermocouple 44 by 10 degrees celsius or more, the alarm 45 being connected to the second surface 32 of the plating pot 3.
The temperature difference between the temperature monitored by the first temperature monitoring thermocouple 43 and the temperature difference between the second temperature monitoring thermocouple 44 is equal to or greater than 10 ℃, the temperature difference measured between the first temperature monitoring thermocouple 43 and the second temperature monitoring thermocouple 44 is too large, the problem that the heating of the coating pan 3 is uneven due to heating obstacles of the heating wire 41 can occur, and the alarm 45 can give an alarm at the moment to maintain the vacuum coating equipment, so that the condition of invalid coating is avoided.
Optionally, the first temperature monitoring thermocouple 43, the second temperature monitoring thermocouple 44 and the alarm 45 are all located within the smallest diameter annular portion 411.
The space within the smallest diameter ring portion 411 is large to facilitate the installation of the first temperature monitoring thermocouple 43, the second temperature monitoring thermocouple 44 and the alarm 45.
Optionally, the first temperature monitoring thermocouple 43, the second temperature monitoring thermocouple 44 and the alarm 45 are distributed at equal intervals along the circumferential direction of the plating pot 3. The temperature detected by the two thermocouples can be ensured to be accurate.
In one implementation manner provided by the present disclosure, the second surface 32 of the plating pot 3 may further have 3 tablet accompanying grooves 321 equidistantly spaced along the circumferential direction of the plating pot 3, and the first temperature monitoring thermocouple 43, the second temperature monitoring thermocouple 44 and the alarm 45 are respectively distributed in the 3 tablet accompanying grooves 321 along the plating pot 3. The installation is convenient.
Although the present disclosure has been described with reference to specific embodiments, it will be understood by those skilled in the art that various changes, substitutions and alterations can be made herein without departing from the spirit and scope of the disclosure.
Claims (10)
1. A vacuum coating device is characterized by comprising a reaction chamber (1), a target substrate (2), a coating pot (3) and a heating component (4),
the plating pot (3) is rotatably connected to the top of the reaction chamber (1), the plating pot (3) is provided with a first surface (31) close to the reaction chamber (1) and a second surface (32) far away from the top of the reaction chamber (1),
the second surface (32) is provided with a plurality of concentric annular placing groove units (33), each annular placing groove unit (33) comprises a plurality of base placing grooves (331) which are distributed equidistantly along the circumferential direction of the plating pot (3),
the target base (2) is connected with the bottom of the reaction chamber (1) and is opposite to the plating pot (3),
the heating assembly (4) comprises a heating wire (41) and a fixing buckle (42), wherein the heating wire (41) comprises at least two concentric annular parts (411) with openings (4111) and at least one connecting part (412), the symmetrical surfaces of the openings (4111) of the annular parts (411) are coplanar, in the radial direction of the plating pot (3), two adjacent annular parts (411) are arranged between the annular placing groove units (33), the two adjacent annular parts (411) are respectively connected with two ends of the connecting part (412), two ends of the connecting part (412) are respectively connected with two side walls of the openings (4111) of the annular parts (411), and each annular part (411) is connected with the plating pot (3) through the fixing buckle (42).
2. The vacuum plating apparatus according to claim 1, wherein the minimum distance between each annular portion (411) and two adjacent annular placement groove units (33) is equal.
3. The vacuum plating apparatus according to claim 1, wherein a plurality of the fixing catches (42) are distributed at intervals in the circumferential direction of each annular portion (411).
4. The vacuum plating apparatus according to claim 3, wherein the minimum distance between two adjacent fixing buckles (42) is 5-10 cm.
5. The vacuum plating apparatus according to claim 3, wherein the fixing buckle (42) comprises a semi-annular mounting plate (421) and a connecting piece (422), two ends of the semi-annular mounting plate (421) are connected with the plating pot (3) through the connecting piece (422), and the heating wire (41) is positioned in a clamping space formed between the semi-annular mounting plate (421) and the plating pot (3).
6. The vacuum coating apparatus according to any of claims 1 to 5, wherein the heating assembly (4) further comprises a first temperature monitoring thermocouple (43) and a second temperature monitoring thermocouple (44) spaced apart from each other on the second surface (32) and configured to measure temperature.
7. The vacuum plating apparatus according to claim 6, wherein the first temperature monitoring thermocouple (43) and the second temperature monitoring thermocouple (44) are contact temperature thermocouples.
8. The vacuum plating apparatus according to claim 6, wherein the heating assembly (4) further comprises an alarm (45) configured to alarm when a temperature difference between the temperature monitored by the first temperature monitoring thermocouple (43) and the temperature monitored by the second temperature monitoring thermocouple (44) is equal to or greater than 10 degrees Celsius, the alarm (45) being connected to the second surface (32) of the plating pot (3).
9. The vacuum plating apparatus according to claim 8, wherein the first temperature monitoring thermocouple (43), the second temperature monitoring thermocouple (44), and the alarm (45) are each located in the annular portion (411) having the smallest diameter.
10. The vacuum plating apparatus according to claim 9, wherein the first temperature monitoring thermocouple (43), the second temperature monitoring thermocouple (44) and the alarm (45) are equidistantly spaced apart in a circumferential direction of the plating pot (3).
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202123088241.0U CN216891321U (en) | 2021-12-09 | 2021-12-09 | Vacuum coating equipment |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202123088241.0U CN216891321U (en) | 2021-12-09 | 2021-12-09 | Vacuum coating equipment |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN216891321U true CN216891321U (en) | 2022-07-05 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202123088241.0U Active CN216891321U (en) | 2021-12-09 | 2021-12-09 | Vacuum coating equipment |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN216891321U (en) |
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2021
- 2021-12-09 CN CN202123088241.0U patent/CN216891321U/en active Active
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