CN207498513U - A kind of wafer processing device and the heater assembly for this kind processing device - Google Patents
A kind of wafer processing device and the heater assembly for this kind processing device Download PDFInfo
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- CN207498513U CN207498513U CN201721627331.3U CN201721627331U CN207498513U CN 207498513 U CN207498513 U CN 207498513U CN 201721627331 U CN201721627331 U CN 201721627331U CN 207498513 U CN207498513 U CN 207498513U
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Abstract
The utility model discloses a kind of heater assembly and the wafer processing device equipped with this heating component, comprising：Heating element includes the multiple calandrias set from heating element center to edge subregion；Wherein, positioned at the calandria of heating element most outer shroud, equipped with being serially connected and/or multiple heating plates that are in parallel and encompassing annulus, wherein each heating plate is connect by corresponding connector with adjacent heating plate, each heating plate is connect at least provided with a movable end by corresponding active connection with the movable end of adjacent heating plate.The utility model has processing simple, reduces maintenance cost, and when heating to wafer, the deformation of heating plate is small, and the advantages of be easy to control.
Description
Technical field
The utility model is related to MOCVD epitaxial wafer production technical fields, more particularly to a kind of wafer processing device and it is used for
The heater assembly of this kind processing device.
Background technology
MOCVD refers to metal-organic chemical vapor deposition equipment, and it is thin to be now widely used for III-V compound semiconductor
The growth of membrane material.Reative cell is brought into MO sources by carrier gas, in Al2O3It is reacted on substrate, deposition forms GaN film material.Substrate is put
It is placed in high purity graphite to be made, on the graphite plate of surface package SiC coating, heater is arranged in below graphite plate, passes through heater
Graphite plate is heated, heating temperature is up to 500~1300 DEG C.
Many semiconductor devices systems carry out epitaxial growth to the semi-conducting material on substrate by MOCVD techniques and are made,
And wafer is disk-shaped crystalline material.In order to promote the uniformity of epitaxial growth, the semiconductor crystal wafer of growth is placed on crystalline substance
On the wafer carrier that circle processing unit is equipped with；It is quickly rotated by wafer carrier so that crystal column surface is equably exposed to
For the atmospheric environment in the process chamber of deposited semiconductor material.
Wafer carrier is maintained at by raised temperature by heating element, generally under the bottom surface of wafer carrier
The stratie of side.The temperature of above-mentioned heating element is maintained above crystal column surface required temperature, and distribution device in gas-fluid
Temperature be usually maintained at less than required reaction temperature, to prevent from occurring to early reaction.Therefore, heat is transferred to from heating element
The bottom surface of wafer carrier, and it is transferred to whole wafer via wafer carrier.
One problem of existing heating element is the thermal induction deformation of heating element.With the ruler of heating element
To adapt to more massive MOCVD, deformation can become more serious for very little increase.Heat to wafer
In the process, heating element can extend or shrink, so as to cause the internal heat generation induced stress of heating element material.
Utility model content
The utility model aim is to provide a kind of wafer processing device and the heater assembly for this kind processing device, with
Meet the MOCVD systems of the heating component with larger diameter size, heating element can be swollen with raising heating temperature
It is swollen, while reduce the heat-induced stress of heating element and keep being evenly heated pending wafer.
In order to achieve the goal above, the utility model is achieved through the following technical solutions：
A kind of heater assembly, comprising：Heating element, it is multiple comprising being set from heating element center to edge subregion
Calandria, the multiple calandria are fixed on bottom plate；Wherein, positioned at the calandria of heating element most outer shroud, equipped with phase
Mutually series connection and/or multiple heating plates that are in parallel and encompassing annulus, wherein connector and electrode that each heating plate passes through both ends
Or adjacent heating plate connects, at least one in two connectors at each heating plate both ends is active connection, by corresponding
Active connection is connected with adjacent heating plate or electrode, wherein the active connection includes an at least elastic piece, elastic piece
First end be connected to the heating plate, the second end of elastic piece is connected to a connecting portion for being fixed to the bottom plate or company
It is connected to other connectors, the elastic piece being capable of flexible deformation so that the heating plate in the calandria of most outer shroud is expanded in heating
Can along the circumferential direction it extend in the process.
Preferably, the heater assembly also includes：Heater bottom plate and it is arranged on the heating element and heater
Heating guard part between plate top surface；The heating element is installed on by multiple support terminals on Heating guard part.
Preferably, multiple calandrias of heating element, comprising the first calandria to the 4th calandria, the 4th calandria is position
In the calandria of heating element most outer shroud.First calandria is axis heater, at the center of the heating element.Institute
It states the second calandria and includes a heating plate, be circumferentially positioned at the outer circumferential sides of first calandria.Second heating
The heating plate of body is bent along the zigzag path in single plane and its excircle is generally circular.The third calandria
Including two heating plates；Described two heating plates are arranged symmetrically, and are circumferentially positioned at the outer circumferential sides of second calandria.It is described
Each heating plate of third calandria is substantially semicircle to form excircle along the zigzag path bending in single plane
Helicoidal structure.The annulus that four heating plates of the 4th calandria are surrounded in same plane is circumferentially positioned at described
The outer circumferential sides of third calandria.
Preferably, first to fourth calandria is respectively provided with two connector ends for being connect with electrode so that electricity
Pole powers to first to fourth calandria；Gap is equipped between described two connector ends.
Preferably, in four heating plates of the 4th calandria, the fixing end of the first heating plate and the second heating plate
Fixing end connects respectively with two connector ends being connect with electrode that the first fixedly connected part is equipped with.
The movable end of first heating plate passes through corresponding first active connection and the movable end string of the 4th heating plate
Connection connection.The fixing end of 4th heating plate is connected company by corresponding second fixedly connected part with the fixing end of third heating plate
It connects.The movable end of third heating plate is connected in series with by the movable end of corresponding second active connection and the second heating plate.
Preferably, the connector end passes through the Heating guard part that the heater assembly is equipped with and heater bottom plate, with
The connector board connection of the subjacent of the heater bottom plate is arranged on, and then by the way that electrode is passed through to seal on connector board
The conducting wire completion of part is connect with the wiring of electrode.
Preferably, second fixedly connected part includes top connecting plate, middle part changeover portion and bottom connecting plate；Wherein push up
Portion's connecting plate makes the fixing end of the 4th heating plate be connect with the fixing end of third heating plate；
The middle part changeover portion is through Heating guard plate and heater bottom plate；
The bottom connecting plate is arranged on the bottom surface of the heater bottom plate, so as to by the fixing end of the 4th heating plate with
The fixing end of third heating plate is fixed.
Preferably, first active connection is flexibly connected with any one in the second active connection includes：Mutually
Symmetrically arranged a pair of flexible U shape plate, a pair of of support element；The support element includes a vertical section and horizontal segment；Wherein, two water
Flat section correspondence is connect respectively with the second end of the first heating plate with the first end of the 4th heating plate.Described two vertical sections run through institute
State Heating guard part and heater bottom plate；The top of each vertical section is connected with corresponding horizontal segment, each described vertical
One end of flexible U shape plate by fixed plate is fixed and is fitted and connected by the bottom end of section；The other end of the flexible U shape plate passes through connection
Plate is arranged on the bottom surface of the heater bottom plate with support element.
Preferably, two heating plate parallel connections of the third calandria.Or four heating in the 4th calandria
Piece is in parallel two-by-two.Alternatively, the third calandria is continued to be divided into two independent heating zones, by setting, there are two independent controls
Power supply control heating processed.Alternatively, the 4th calandria is continued into the heating zone for being divided into two independent controls, there are two setting
Independent control power supply control heating.
Another technical solution of the utility model is a kind of wafer processing device, comprising：Reaction chamber is arranged in reaction chamber
At least one wafer carrier and the heater assembly as described above being arranged below the wafer carrier heating
Element.
The utility model has the following advantages compared with prior art：
By the improvement to heating element, it is made to meet the MOCVD systems of the heating component with larger diameter size, prevented
Only since own dimensions are larger and the deformation of temperature higher band.And be divided into four regions and heated, wherein the 4th heating
Region, that is, outer ring is divided into four heating plates, and processing is simple, meanwhile, reduce cost of manufacture.Wherein a piece of, reduction dimension can be individually replaced
Protect cost.Existing outer ring is mostly single piece type or two-piece type, and it is difficult control to deform larger and deformation direction.Using four-piece type plus
The deformation of whole circle can be evenly distributed on four heating plates by backing, and the deformation of every is smaller, and is easy to control.
Description of the drawings
Fig. 1 is a kind of vertical view of the heater assembly of wafer processing device of the utility model；
Fig. 2 is the sectional view shown in Fig. 1 at A；
Fig. 3 is a kind of bottom view of the heater assembly of wafer processing device of the utility model；
Fig. 4 is a kind of structure diagram of 4th calandria of the heater assembly of wafer processing device of the utility model.
Specific embodiment
Below in conjunction with attached drawing, by the way that a preferable specific embodiment is described in detail, the utility model is done and is further explained
It states.
Embodiment one
As shown in Fig. 2, a kind of heater assembly of wafer processing device of the utility model, comprising：Heating element, multilayer
Heating guard part 6 and heater bottom plate 7, the heating element are installed on by multiple support terminals on Heating guard part 6.Institute
Heating guard part 6 is stated to be arranged on the top surface of the heater bottom plate 7.The Heating guard part 6 is located at the heating element
Lower section, the heating element is for the heat of generation to be accommodated therein, so as to which it can be to the wafer that wafer processing device is equipped with
The upward direction of carrier provides heat, and then the wafer being located on wafer carrier is heated.
The heating element may include four Zone heating, systems, and in other examples, the heating element may include
Fewer or greater than four-range heating system.Heat is provided for wafer so that wafer has uniform temperature by subregion.
The support terminals have various structures and to be attached or is installed in several ways, can be installed by fastener or
Person can mount in the mounting hole that the Heating guard part 6 is equipped with.In some embodiments, the support terminals may include ceramics
Or non-thermally conductive material.
As shown in Figure 1, in the present embodiment, the reative cell that above-mentioned heating element is used to be equipped with for wafer processing device provides
Cycling hot and advection heat.The heating element is in integrally flat circle plate-like substantially, and is divided into four heating regions, wherein, the
One heating region 1 is located at heating element center, is made of the first calandria, and first calandria is located at the heating element
It is axis heater in plane.
Second heating region 2 is circumferentially positioned at 1 outside of the first heating region；Second heating region 2
It is made of the second calandria；Second calandria includes the heating plate of a single length, and the heating plate is put down along single
Zigzag path bending and its excircle in face are circle substantially.The heating plate of second calandria is generally around symmetrical
Axis X is symmetrical.The both ends of the heating plate of second calandria are respectively by being correspondingly connected with two connector ends of part 511 and electricity
Pole connects.Separation distance is equipped between described two connectors.The edge or side of each curved section of the heating plate are mutual
It does not contact, the spacing between each curved section is generally uniform, and is not also contacted with the heating plate of other heating regions.Due to second
The shape of calandria and other settings, will not inhibit thermal expansion.
The third heating region 3 is circumferentially positioned at 2 outside of the second heating region；The third heating region 3
It is made of third calandria；The third calandria includes the heating plate 3a and 3b of two single length, each heating plate edge
The zigzag path in single plane is bent to form excircle as semicircular helicoidal structure substantially.The third adds
Two heating plate 3a and 3b of hot body are generally symmetrical around axis of symmetry X, form whole circumference.Two of the third calandria
One end of heating plate is connect by being correspondingly connected with two connector ends of part with electrode.It is equipped with and separates between described two connectors
Distance.The other end of two heating plates of the third calandria is cascaded by a corresponding connector.Each institute
The edge or side for stating each curved section of heating plate are mutually not in contact with each other, and the spacing between each curved section is generally uniform, and with
The heating plate of other heating regions does not also contact.Since the shape of third calandria is set with position, thermal expansion will not be inhibited.
4th heating region 4 is circumferentially positioned at 3 outside of third heating region；4th heating region 4
It is made of the 4th calandria；4th calandria includes the heating plate of four single length, and each heating plate is single
Plane inner bending is to form circular configuration of the excircle as a quarter substantially.Four heating plates of the 4th calandria are whole
Body is symmetrical around axis of symmetry X and Y, forms whole circumference.
With reference to shown in Fig. 3 and Fig. 4, the first end of the first heating plate 40 of the 4th calandria is solid by corresponding first
A connector end for determining connector 503 is connect with electrode；The second end of second heating plate 41 of the 4th calandria passes through
Another connector end of first fixedly connected part 503 is connect with electrode；Between described two connectors be equipped with separate away from
From.
The second end of first heating plate 40 pass through corresponding first active connection 500 and the 4th heating plate 43
One end is connected in series with；
The second end of 4th heating plate 43 passes through corresponding second fixedly connected part 504 and the first end of third heating plate 42
It is connected in series with；
The first end that the second end of third heating plate 42 passes through corresponding second active connection, 501 and second heating plate 41
It is connected in series with.
Wherein, the first end of first heating plate 40 is to be fixedly connected with the second end of the second heating plate 41 with electrode.
The second end of 4th heating plate 43 is to be fixedly connected with the first end of third heating plate 42.
The second end of first heating plate 40 is with the first end of the 4th heating plate 43 to be flexibly connected；Second heating
The first end of piece 41 is with the second end of third heating plate 42 to be flexibly connected.
The edge or side of each curved section of each heating plate are mutually not in contact with each other, the spacing between each curved section
It is generally uniform, and also do not contacted with the heating plate of other heating regions.It, will not since the shape of the 4th calandria is set with position
Inhibit thermal expansion.
The above-mentioned connector being connect with electrode is each passed through Heating guard part 6 and heater bottom plate 7, with being arranged on described add
The connector board 9 of the subjacent of hot device bottom plate 7 connects；Electrode seal 8 on connector board 9 is completed by conducting wire and electrode
Wiring connection.Nonconducting electrode seal 8 provides access for the conducting wire being connect with electrode, and the conducting wire is made to pass through the electricity
Pole sealing element 8 is connect with conductive connector board 9.
The connector is when through Heating guard part 6 and heater bottom plate 7, with the Heating guard part 6 and heater
Bottom plate 7 does not contact.
As shown in figure 4, one end of two connector ends of first fixedly connected part 503 and the corresponding described 4th
Calandria connects；The other end of described two connector ends passes through Heating guard part 6 and heater bottom plate 7, described with being arranged on
The connector board 9 of the subjacent of heater bottom plate 7 connects.Electrode seal 8 on connector board 9 is completed and electricity by conducting wire
The wiring connection of pole.Nonconducting electrode seal 8 provides access for the conducting wire being connect with electrode, passes through the conducting wire described
Electrode seal 8 is connect with conductive connector board 9.
As shown in Figure 2 and Figure 3, in the present embodiment, top connecting plate, middle part are included for the second fixedly connected part 504
Changeover portion and bottom connecting plate；, integrally in I-shaped, the top connecting plate of the 4th connector 504 passes through fastening respectively for it
Part makes the second end of the 4th heating plate 43 be fixedly connected with the first end of third heating plate 42.
The middle part changeover portion of second fixedly connected part 504 sequentially passes through Heating guard part 6 and heater bottom plate 7, and
It is not contacted with Heating guard part 6 with heater bottom plate 7.
The both ends of the bottom connecting plate of second fixedly connected part 504 pass through support element and the heater bottom plate 7
Bottom surface connects.
First and second described active connection 500,501 is equipped with flexible U shape plate 5001,5011；
And first active connection 500 is identical with the structure of the second active connection 501.Wherein, with described
The structure for telling about the first active connection 500 for first connector 500 and the company between the heating plate of the 4th calandria
Connect relationship.First active connection 500 includes a pair of of the flexible U shape plate 5001 being symmetrically set, and a pair is in inverted "L" shape
Support element.Wherein, it is set close to the flexible U shape plate 5001 of the first heating plate 40 there are two elastic piece 5002a and 5002b, first
The elastic piece 5002b in expanded by heating of heating plate 40 can be deformed along the circumferential direction, be reached in figure at dotted line position.Elastic piece
5002a is connected to an electrical connection section 5040, which is connected with the electrical connection section of the first adjacent heating plate 40
Or be connected with external electrode, finally so that multiple heating plates form mutually connection in series or in parallel.
The support element includes a vertical section and horizontal segment；Wherein, two horizontal segments correspond to respectively with the first heating plate 40
Second end connect with the first end of the 4th heating plate；
Described two vertical sections run through the Heating guard part 6 and heater bottom plate 7, and not with Heating guard part 6 with adding
Hot device bottom plate 7 contacts.
The top of the vertical section is connected with corresponding horizontal segment, and the bottom end of the vertical section will be above-mentioned by electrical connection section
One end of one flexible U shape plate 5001 is fixed and is fitted and connected.The other end of the flexible U shape plate 5001 passes through connecting plate and support
Part is arranged on the bottom surface of the heater bottom plate 7.
The flexible U shape plate 5001 of another close 4th heating plate 43 also is provided with two elastic pieces, wherein, far from described
An elastic piece of elastic piece 5002b be connected by an electrical connection section 5043 with the electrical connection section of the 4th heating plate 43 or with
External electrode is connected, finally so that multiple heating plates form mutually connection in series or in parallel.
The both sides of each flexible U shape plate 5001 are substantially parallel to each other.
Identical with the structure of first active connection 500, second active connection 501 is again provided with a pair of soft
Property U-board 5011, wherein, set close to the flexible U shape plate 5011 of the second heating plate 41 there are two elastic piece 5012a and 5012b, the
Two heating plates 41 elastic piece 5012b in expanded by heating can be deformed along the circumferential direction, be reached in figure at dotted line position.Elastic piece
5012a is connected to an electrical connection section 5041, which is connected with the electrical connection section of the second adjacent heating plate 41
Or be connected with external electrode, finally so that multiple heating plates form mutually connection in series or in parallel.
The flexible U shape plate 5011 of another close third heating plate 42 also is provided with two elastic pieces, wherein, far from described
An elastic piece of elastic piece 5012b be connected by an electrical connection section 5042 with the electrical connection section of third heating plate 42 or with
External electrode is connected, finally so that multiple heating plates form mutually connection in series or in parallel.
As shown in figure 4, the flexible U shape plate is made of molybdenum material, with good electric conductivity；The flexible U shape
The preferred Thickness of plate is 1mm ~ 3mm.When electrode heats the 4th calandria, pass through the flexible U being equipped with
Shape plate 5001 makes four heating plates of the 4th calandria be extended with the raising of temperature to the direction away from the center of circle
Or expansion；Alternatively, four heating plates can be shunk with the reduction of temperature to center of circle direction；Its deformation is smaller.That is,
Made by the flexible U shape plate between the second end of first heating plate 40 and the first end of the 4th heating plate 43 and described
Can be located remotely from each other between the first end of second heating plate 41 and the second end of third heating plate 42 with the raising of temperature or
It is close to each other with the reduction of temperature.
In the present embodiment, the bottom surface of the heater bottom plate 7 is additionally provided with cooling system 10；On the cooling system corresponds to
State the heating region being equipped with and be respectively equipped with two cooling pipes, the first cooling pipe correspond to the first calandria, the second calandria with
And the region of third calandria, along the zigzag path bending in single plane and it is circle substantially with excircle in it
Shape.Second cooling pipe correspond to the 4th calandria region, along in single plane zigzag path bending and its in
Excircle is also circle substantially.
The input of first cooling pipe is adjacent with delivery outlet；The input of first cooling pipe is similary with delivery outlet
It is adjacent.
The cooling system 10 is used to cool down heating component after wafer-process is terminated.
In the present embodiment, first to fourth calandria is respectively equipped with the power supply of a control heating independently of each other.
Embodiment two
By two heating plate parallel connections of the third calandria for the third heating region 3 being equipped in embodiment one.Other are constant.
Embodiment three
It is four heating plates in the 4th calandria in embodiment one or embodiment two are in parallel two-by-two and be connected to electrode.
Example IV
Third heating region in embodiment one and/or embodiment two and/or embodiment three is continued to be divided into two independences
Heating zone, by setting, there are two independent control power supplys to control heating.
Alternatively, by the heating zone that the 4th heating region continues to be divided into two independent controls, by setting, there are two independent controls
Power supply control heating processed.
In the heater assembly being equipped with based on above-described embodiment, the invention also discloses a kind of wafer processing device,
Comprising：Reaction chamber, at least one wafer carrier being arranged in reaction chamber and is arranged below the wafer carrier
The heating element of above-mentioned heater assembly.
Although the content of the utility model is discussed in detail by above preferred embodiment, but it should be appreciated that on
The description stated is not considered as the limitation to the utility model.After those skilled in the art have read the above, for
A variety of modifications and substitutions of the utility model all will be apparent.Therefore, the scope of protection of the utility model should be by appended
Claim limit.
Claims (10)
1. a kind of heater assembly, which is characterized in that include：
Heating element, comprising the multiple calandrias set from heating element center to edge subregion, the multiple calandria is consolidated
Surely it is arranged on bottom plate；
Wherein, positioned at the calandria of heating element most outer shroud, equipped with being serially connected and/or in parallel and encompass the multiple of annulus
Heating plate, wherein each heating plate is connect by the connector at both ends with electrode or adjacent heating plate, each heating plate both ends
At least one in two connectors is active connection, is connected by corresponding active connection with adjacent heating plate or electrode
It connects,
Wherein described active connection includes an at least elastic piece, and the first end of elastic piece is connected to the heating plate, elastic piece
Second end be connected to one be fixed to the bottom plate connecting portion or be connected to other connectors, the elastic piece being capable of bullet
Property deformation so that the heating plate in the calandria of most outer shroud can along the circumferential direction extend in the expansion process that heats up.
2. heater assembly as described in claim 1, which is characterized in that
The heater assembly also includes：It heater bottom plate and is arranged between the heating element and heater plate top surface
Heating guard part；The heating element is installed on by multiple support terminals on Heating guard part.
3. heater assembly as described in claim 1, which is characterized in that
Multiple calandrias of heating element, comprising the first calandria to the 4th calandria, the 4th calandria is to be located at heating element
The calandria of most outer shroud；
First calandria is axis heater, at the center of the heating element；
Second calandria includes a heating plate, is circumferentially positioned at the outer circumferential sides of first calandria；
The heating plate of second calandria is substantially justified along the zigzag path bending in single plane and its excircle
Shape；
The third calandria includes two heating plates；Described two heating plates are arranged symmetrically, and are circumferentially positioned at described second and are added
The outer circumferential sides of hot body；Each heating plate of the third calandria is bent to be formed along the zigzag path in single plane
The substantially semicircular helicoidal structure of excircle；
The annulus that four heating plates of the 4th calandria are surrounded in same plane is circumferentially positioned at the third calandria
Outer circumferential sides.
4. heater assembly as claimed in claim 3, which is characterized in that
First to fourth calandria is respectively provided with two connector ends for being connect with electrode so that electrode is to described first
It powers to the 4th calandria；Gap is equipped between described two connector ends.
5. heater assembly as claimed in claim 3, which is characterized in that
In four heating plates of the 4th calandria, the fixing end of the fixing end of the first heating plate and the second heating plate respectively with
Two connector end connections being connect with electrode that first fixedly connected part is equipped with；
The movable end of first heating plate is connected company by corresponding first active connection with the movable end of the 4th heating plate
It connects；
The fixing end of 4th heating plate is connected in series with by corresponding second fixedly connected part and the fixing end of third heating plate；
The movable end of third heating plate is connected in series with by the movable end of corresponding second active connection and the second heating plate.
6. heater assembly as described in claim 4 or 5, which is characterized in that
The connector end passes through the Heating guard part that the heater assembly is equipped with and heater bottom plate, with being arranged on described add
The connector board connection of the subjacent of hot device bottom plate, and then by the way that the conducting wire of electrode seal is passed through to complete on connector board
It is connect with the wiring of electrode.
7. heater assembly as claimed in claim 6, which is characterized in that
Second fixedly connected part includes top connecting plate, middle part changeover portion and bottom connecting plate；Wherein top connecting plate makes
The fixing end of 4th heating plate is connect with the fixing end of third heating plate；
The middle part changeover portion is through Heating guard plate and heater bottom plate；
The bottom connecting plate is arranged on the bottom surface of the heater bottom plate, thus by the fixing end and third of the 4th heating plate
The fixing end of heating plate is fixed.
8. heater assembly as claimed in claim 6, which is characterized in that
First active connection is flexibly connected with any one in the second active connection to be included：
A pair of of the flexible U shape plate being symmetrically set, a pair of of support element；The support element includes a vertical section and horizontal segment；Its
In, two horizontal segment correspondences are connect respectively with the second end of the first heating plate with the first end of the 4th heating plate；
Described two vertical sections are through the Heating guard part and heater bottom plate；The top of each vertical section with it is corresponding
Horizontal segment connects, and one end of flexible U shape plate is fixed by fixed plate in the bottom end of each vertical section to be fitted and connected；It is described soft
The other end of property U-board is arranged on the bottom surface of the heater bottom plate by connecting plate and support element.
9. the heater assembly described in claim 3, which is characterized in that
Four heating plates in two heating plate parallel connections of the third calandria or the 4th calandria are in parallel two-by-two；
Alternatively, the third calandria is continued to be divided into two independent heating zones, by setting, there are two independent control power supplys
Control heating；
Alternatively, the 4th calandria is continued the heating zone for being divided into two independent controls, by setting, there are two independent controls
Power supply control heating.
10. a kind of wafer processing device, which is characterized in that include：
Reaction chamber, at least one wafer carrier being arranged in reaction chamber and is arranged below the wafer carrier
The heating element of heater assembly as described in claim 1 ~ 9 any one claim.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201721627331.3U CN207498513U (en) | 2017-11-29 | 2017-11-29 | A kind of wafer processing device and the heater assembly for this kind processing device |
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| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201721627331.3U CN207498513U (en) | 2017-11-29 | 2017-11-29 | A kind of wafer processing device and the heater assembly for this kind processing device |
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| CN207498513U true CN207498513U (en) | 2018-06-15 |
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| CN201721627331.3U Active CN207498513U (en) | 2017-11-29 | 2017-11-29 | A kind of wafer processing device and the heater assembly for this kind processing device |
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Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110983299A (en) * | 2019-12-04 | 2020-04-10 | 江苏实为半导体科技有限公司 | Heating plate for MOCVD reaction chamber |
| CN111560606A (en) * | 2020-05-21 | 2020-08-21 | 北京北方华创微电子装备有限公司 | Heating furnace body control method in semiconductor heat treatment equipment, heating furnace body and equipment |
-
2017
- 2017-11-29 CN CN201721627331.3U patent/CN207498513U/en active Active
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN110983299A (en) * | 2019-12-04 | 2020-04-10 | 江苏实为半导体科技有限公司 | Heating plate for MOCVD reaction chamber |
| CN110983299B (en) * | 2019-12-04 | 2024-05-14 | 江苏实为半导体科技有限公司 | Heating plate for MOCVD reaction chamber |
| CN111560606A (en) * | 2020-05-21 | 2020-08-21 | 北京北方华创微电子装备有限公司 | Heating furnace body control method in semiconductor heat treatment equipment, heating furnace body and equipment |
| CN111560606B (en) * | 2020-05-21 | 2022-08-16 | 北京北方华创微电子装备有限公司 | Heating furnace body control method in semiconductor heat treatment equipment, heating furnace body and equipment |
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