CN216884680U

CN216884680U - Silicon wafer cutting device and silicon wafer cutting equipment

Info

Publication number: CN216884680U
Application number: CN202220140948.7U
Authority: CN
Inventors: 王筱锋; 范鑫; 杨必红
Original assignee: Lufeng Longji Silicon Material Co ltd
Current assignee: Lufeng Longji Silicon Material Co ltd
Priority date: 2022-01-19
Filing date: 2022-01-19
Publication date: 2022-07-05
Anticipated expiration: 2032-01-19
Also published as: WO2023138193A1

Abstract

The utility model discloses a silicon wafer cutting device and silicon wafer cutting equipment, relates to the technical field of silicon wafer cutting, and aims to solve the problem that the impact force of cutting liquid on a wire mesh is large and the quality of a cut silicon wafer is influenced. The silicon wafer cutting device comprises a cutting assembly and a spraying assembly. The cutting assembly comprises a wire mesh and at least two main rollers, wherein every two main rollers are arranged at intervals. The wire mesh is wound on the roll surface of the main roll along the axial direction of the main roll. The wire mesh is located below the silicon rod in the direction of cutting the silicon rod, for cutting the silicon rod. The plane of the wire mesh between the two main rollers is vertical to the direction of cutting the silicon rod, part of the wire mesh is in contact with the silicon rod and used for cutting the silicon rod, and the part of the wire mesh forms a working wire mesh. The spraying assembly is positioned below the working wire net and used for spraying the working wire net. The utility model also provides silicon wafer cutting equipment which comprises the silicon wafer cutting device in the technical scheme.

Description

Silicon wafer cutting device and silicon wafer cutting equipment

Technical Field

The utility model relates to the technical field of silicon wafer cutting, in particular to a silicon wafer cutting device and silicon wafer cutting equipment.

Background

Cutting fluid spray set among the prior art is located the top of gauze, and in the in-service use in-process, cutting fluid from the top down directly sprays the gauze to the silicon rod below. In this process, the impact force of the cutting fluid on the wire mesh is large. Therefore, the problems of TTV (Total Thickness Variation) and line marks are easily caused in the cutting process, and the quality of the cut silicon wafer is influenced.

SUMMERY OF THE UTILITY MODEL

The utility model aims to provide a silicon wafer cutting device and silicon wafer cutting equipment, which are used for reducing the impact of cutting liquid on a wire mesh and improving the quality of a silicon wafer.

In order to achieve the above object, in a first aspect, the present invention provides a silicon wafer dicing apparatus. The silicon wafer cutting device comprises a cutting assembly and a spraying assembly. The cutting assembly comprises a wire mesh and at least two main rollers, wherein every two main rollers are arranged at intervals. The wire mesh is wound on the roll surface of the main roll along the axial direction of the main roll. The wire mesh is located below the silicon rod in the direction of cutting the silicon rod, for cutting the silicon rod. The plane of the wire mesh between the two main rollers is vertical to the direction of cutting the silicon rod, part of the wire mesh is in contact with the silicon rod and used for cutting the silicon rod, and the part of the wire mesh forms a working wire mesh. The spraying assembly is positioned below the working wire net and used for spraying the working wire net.

Compared with the prior art, in the silicon wafer cutting device provided by the utility model, the working wire net between the two main rollers is used for cutting the silicon rod, so that the silicon rod can be cut into silicon wafers, and the silicon wafers can be further processed at a later stage conveniently. Then, the spraying assembly is positioned below the working wire net and is used for spraying the working wire net. At this time, the spray assembly can play a role in cooling and lubricating the working wire net. Furthermore, because the cutting fluid in the spraying assembly sprays the working wire net from bottom to top, at the moment, the gravity action of the cutting fluid on the working wire net can be reduced or ignored, and only the impact force of the cutting fluid on the working wire net is considered. Based on this, compare the mode of spraying among the prior art, reduced the impact of cutting fluid to the working wire net, and then can reduce or avoid the working wire net to produce the condition emergence of TTV and line mark in the cutting process to improve the quality of silicon chip.

In one implementation, the spray assembly includes: spray pipe and delivery conduit. The spraying pipeline is used for spraying a working wire net, and the length extending direction of the spraying pipeline is parallel to the axial direction of the main roller. The conveying pipeline is communicated with the spraying pipeline and is used for conveying cutting fluid for the spraying pipeline.

Adopt under the circumstances of above-mentioned technical scheme, because spray piping's length extending direction is on a parallel with the axial of home roll, at this moment, spray piping can spray most position or all positions of working net to in cutting fluid cools off and lubricates working net, and then the later stage cutting silicon rod of being convenient for. In addition, the spraying assembly only comprises a spraying pipeline and a conveying pipeline, and is simple in structure and easy to manufacture and install.

In one implementation mode, the radial section of the spray pipeline is triangular, and an edge angle of the spray pipeline close to the silicon rod is provided with a chamfered edge. A first included angle A is formed between the chamfered edge and the plane where the wire mesh is located, and A is more than or equal to 0 degrees and less than or equal to 180 degrees. The spraying pipeline is provided with a connecting hole, and the conveying pipeline is communicated with the spraying pipeline through the connecting hole. The chamfered edge is provided with a spraying hole and/or a spraying seam, and the spraying hole and/or the spraying seam are used for spraying cutting fluid to the working wire net.

Under the condition of adopting the technical scheme, on the one hand, the radial section of the spray pipeline is triangular, and one edge angle of the spray pipeline close to the silicon rod is provided with a chamfered edge. At this time, the space occupied by the shower pipes can be reduced to reduce or avoid the influence on the positional connection relationship of other structures (for example, the wire mesh and the main roller). Based on this, can reduce spray piping's the installation degree of difficulty, improve work efficiency. In the second aspect, the delivery pipe communicates with the shower pipe through the connection hole. At this time, the content of the cutting fluid in the spray pipe can be ensured, and further the content of the cutting fluid sprayed onto the working wire net through the spray pipe can be ensured. Then, a first included angle A is formed between the chamfered edge and the plane where the wire mesh is located, wherein A is more than or equal to 0 degree and less than or equal to 180 degrees, and the chamfered edge is provided with a spraying hole and/or a spraying seam for spraying cutting fluid to the working wire mesh. At the moment, the angle between the cutting fluid sprayed from the spraying pipeline and the working wire net can be adjusted by adjusting the size of the first included angle A, and the liquid falling point of the cutting fluid can be adjusted. Based on the method, the liquid falling points of a plurality of cutting liquids can be reduced or avoided from falling at the same position of the working wire net, so that the impact force of the cutting liquids on the working wire net is reduced, the TTV and the wire mark generated in the cutting process of the working wire net are reduced or avoided, and the quality of the silicon wafer is improved. Furthermore, the silicon wafer cutting device provided by the utility model can improve the uniformity of spraying the cutting liquid onto the working wire net.

In one implementation, the central axis of the spray holes and/or the spray slits has a second angle B with the plane of the wire web, 0 DEG < B < 90 deg.

Under the condition of adopting the technical scheme, on the first aspect, the liquid dropping points of the cutting liquid can be adjusted by adjusting the size of the second included angle B so as to reduce or avoid that the liquid dropping points of a plurality of beams of cutting liquid all drop at the same position of the working wire net and reduce the impact force of the cutting liquid on the working wire net. In the second aspect, through the matching of the first included angle A and the second included angle B, the liquid dropping point of the cutting liquid can be further adjusted so as to adjust the uniformity of the cutting liquid sprayed onto the working wire net. Based on the structure, the impact force of the cutting liquid on the working wire net can be further reduced, so that the TTV and wire marks generated in the cutting process of the working wire net are reduced or avoided, and the quality of the silicon wafer is improved.

In one implementation mode, the chamfered edge is provided with a spraying hole, and when the cross section of the spraying hole is circular, the inner diameter of the circular spraying hole is 1-2 mm. And/or when the chamfered edge is provided with a spraying seam, the width of the spraying seam is 1 mm-2 mm.

Under the condition of adopting the technical scheme, the content and the impact force of the cutting liquid sprayed on the working wire net can be controlled by adjusting the inner diameter of the circular spraying hole and/or the width of the spraying gap, so that the TTV and the wire mark generated in the cutting process of the working wire net are reduced or avoided, and the quality of the silicon wafer is improved.

In one implementation, the above-mentioned delivery conduit comprises: a flow guide pipe and a drainage pipe. The honeycomb duct is communicated with the liquid supply source, and the liquid supply source is used for providing cutting liquid. One end of the drainage tube is communicated with the flow guide tube, and the other end of the drainage tube is communicated with the spraying pipeline.

In one implementation, the spray pipe includes a liquid distribution pipe and a plurality of spray pieces, and the liquid distribution pipe is communicated with the drainage pipe. Along the length extending direction of the liquid separating pipe, a plurality of spraying pieces are distributed on the liquid separating pipe at intervals and are used for spraying a working wire net.

Under the condition of adopting the technical scheme, the selectivity of the spray pipeline is increased, so that the spray pipeline is suitable for different application scenes, and the application range of the spray pipeline is expanded.

In one implementation mode, the silicon wafer cutting device further comprises a crushing box, and the crushing box is located below the working wire net and the silicon rod and used for collecting impurities generated after the silicon rod is cut.

Adopt under the condition of above-mentioned technical scheme, the later stage centralized processing of being convenient for above-mentioned impurity, at this moment, not only can save time, improve work efficiency. Simultaneously, the injured condition appears when can also avoiding staff's later stage clearance impurity.

In one implementation, the spray assembly and the particle box are detachably connected.

Under the condition of adopting the technical scheme, the spraying assembly and the particle box can exist independently. When the access & exit of work place is less or there is crooked passageway, can carry the spray assembly and the crushed aggregates box that set up separately to work place respectively, later assemble above-mentioned structure again to satisfy actual need. In this case, the applicable range of the silicon wafer dicing apparatus can be expanded.

In one implementation, the spray assembly and the particle box are integrally formed.

By adopting the technical scheme, the silicon wafer cutting device (the spraying component and the fragment box) does not need to be assembled again, so that errors during assembly are reduced or eliminated, the adjustment time is saved, and the working efficiency is improved.

In one implementation mode, the silicon wafer cutting device comprises two spraying assemblies, and each spraying assembly comprises a spraying pipeline and a conveying pipeline. Two spray pipe says and sets up relatively, and each pipeline and each spray pipe way one-to-one correspondence intercommunication.

Under the condition of adopting the technical scheme, the two spraying assemblies are mutually independent, and when one spraying assembly goes wrong, the other spraying assembly cannot be influenced. At the moment, the normal use of the silicon wafer cutting device can be ensured, namely, the probability that the whole silicon wafer cutting device stops working due to the fault of one spraying assembly can be reduced or eliminated.

In a second aspect, the utility model further provides silicon wafer cutting equipment, which comprises the silicon wafer cutting device in the technical scheme.

Compared with the prior art, the silicon wafer cutting equipment provided by the utility model has the same beneficial effects as the silicon wafer cutting device in the technical scheme, and the detailed description is omitted here.

Drawings

The accompanying drawings, which are included to provide a further understanding of the utility model and are incorporated in and constitute a part of this specification, illustrate embodiments of the utility model and together with the description serve to explain the utility model and not to limit the utility model. In the drawings:

FIG. 1 is a schematic structural view of a silicon wafer cutting device and a silicon rod according to an embodiment of the present invention;

FIG. 2 is a front view of FIG. 1 in an embodiment of the present invention;

FIG. 3 is a top view of FIG. 1 in an embodiment of the present invention;

FIG. 4 is a schematic view of a part of a silicon wafer cutting apparatus according to an embodiment of the present invention;

FIG. 5 is a schematic structural diagram of a spray pipe according to an embodiment of the present invention;

fig. 6 is a schematic structural diagram of a conveying pipeline in an embodiment of the utility model.

Reference numerals:

1-cutting component, 10-wire mesh, 100-working wire mesh, 11-main roller;

2-spraying component, 20-spraying pipeline, 200-spraying seam,

21-a conveying pipeline, 210-a guide pipe, 211-a drainage pipe,

212-liquid separating pipe, 213-spraying piece; 22-a connection hole for the connection of the cable,

3-silicon rod and 4-crushed material box.

Detailed Description

In order to make the technical problems, technical solutions and advantageous effects to be solved by the present invention more clearly apparent, the present invention is further described in detail below with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are merely illustrative of the utility model and are not intended to limit the utility model.

It will be understood that when an element is referred to as being "secured to" or "disposed on" another element, it can be directly on the other element or be indirectly on the other element. When an element is referred to as being "connected to" another element, it can be directly connected to the other element or be indirectly connected to the other element.

Furthermore, the terms "first", "second" and "first" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance or to implicitly indicate the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of that feature. In the description of the present invention, "a plurality" means two or more unless specifically defined otherwise. The meaning of "a number" is one or more unless specifically limited otherwise.

In the description of the present invention, it is to be understood that the terms "upper", "lower", "front", "rear", "left", "right", and the like indicate orientations or positional relationships based on those shown in the drawings, and are only for convenience of description and simplicity of description, but do not indicate or imply that the referred device or element must have a specific orientation, be constructed in a specific orientation, and be operated, and thus, should not be construed as limiting the present invention.

In the description of the present invention, it should be noted that, unless otherwise explicitly specified or limited, the terms "mounted," "connected," and "connected" are to be construed broadly and may be, for example, fixedly connected, detachably connected, or integrally connected; can be mechanically or electrically connected; either directly or indirectly through intervening media, either internally or in any other relationship. The specific meanings of the above terms in the present invention can be understood by those skilled in the art according to specific situations.

Based on the description of the background art section, since the mortar pipe in the prior art is above the wire net, at this time, the cutting fluid is directly sprayed downward onto the wire net below the silicon rod from top to bottom in a waterfall manner. Further, due to the influence of the structure and the installation position of the mortar pipe, the variables in the actual working process are increased, and the control difficulty is increased.

In order to solve the above technical problems, in a first aspect, an embodiment of the present invention provides a silicon wafer cutting apparatus. Referring to fig. 1 and 2, the silicon wafer cutting apparatus includes a cutting assembly 1 and a shower assembly 2. The cutting assembly 1 comprises a wire web 10 and at least two main rollers 11, each two main rollers 11 being arranged at a distance. The wire mesh 10 is wound on the roll surface of the main roll 11 in the axial direction of the main roll 11. In the direction of cutting the silicon rod 3, a wire web 10 is located below the silicon rod 3 for cutting the silicon rod 3. Wherein, the plane of the wire mesh 10 between the two main rollers 11 is perpendicular to the direction of cutting the silicon rod 3, and a part of the wire mesh 10 contacts with the silicon rod 3 for cutting the silicon rod 3, and the part of the wire mesh 10 constitutes a working wire mesh 100. Spray assembly 2 is positioned below work wire web 100 for spraying work wire web 100.

Referring to fig. 1 and 2, the number of the main rollers 11 may be two, three, four, or the like. When the silicon wafer cutting apparatus includes two identical main rollers 11, the two main rollers 11 are disposed at intervals, and the axes of the two main rollers 11 are parallel. When the silicon wafer cutting device comprises three identical main rollers, the straight lines of the centers of the three main rollers can form a triangle in a surrounding mode. When the silicon wafer cutting device comprises four identical main rollers, the straight lines of the centers of the four main rollers can form a quadrangle in a surrounding mode. It is to be understood that the above description is intended to be illustrative, and not restrictive. In an embodiment of the utility model, the silicon wafer cutting device comprises two identical main rollers. The wire mesh 10 may be formed of diamond wire, but may be formed of other cutting wires, such as steel wire, and is not particularly limited thereto.

Referring to fig. 1 to 3, in the silicon wafer cutting apparatus according to the embodiment of the present invention, since the working wire net 100 between the two main rollers 11 is used for cutting the silicon rod 3, the silicon rod 3 may be cut into silicon wafers for further processing at a later stage. Next, since spray assembly 2 is located below work wire web 100, it is used to spray work wire web 100. At this time, the spray assembly 2 may perform cooling and lubricating functions on the working wire web 100. Further, because the cutting fluid in the spray assembly 2 sprays the working wire net 100 from bottom to top, at this time, the gravity action of the cutting fluid on the working wire net 100 can be reduced or ignored, and only the impact force of the cutting fluid on the working wire net 100 is considered. Based on this, compared with the spraying mode in the prior art, the impact of the cutting liquid on the working wire net 100 is reduced, and then the occurrence of TTV and wire marks generated in the cutting process of the working wire net 100 can be reduced or avoided, so that the quality of the silicon wafer is improved. The raw materials of the cutting fluid may be set according to actual conditions, and are not particularly limited herein. In addition, the silicon wafer cutting device provided by the embodiment of the utility model can reduce the occurrence of overlarge wire bow. Based on this, not only can the quality of silicon chip be further improved, but also the life of gauze 10 can be prolonged simultaneously.

As a possible implementation, referring to fig. 2 and 4, the spraying assembly 2 may include: a shower pipe 20 and a delivery pipe 21. The shower pipes 20 are used for spraying the work wire net 100, and the length extension direction of the shower pipes 20 is parallel to the axial direction of the main roll 11. The conveying pipeline 21 is communicated with the spraying pipeline 20 and is used for conveying cutting fluid for the spraying pipeline 20.

Under the condition of adopting the technical scheme, referring to fig. 2 and 4, as the length extending direction of the spraying pipe 20 is parallel to the axial direction of the main roller 11, at the moment, the spraying pipe 20 can spray most positions or all positions of the working wire net 100, so that the cutting fluid can cool and lubricate the working wire net 100, and the silicon rod 3 can be cut at the later stage. In addition, the spraying assembly 2 is only composed of two parts, namely a spraying pipeline 20 and a conveying pipeline 21, and is simple in structure and easy to manufacture and install.

In an alternative, referring to fig. 1 to 5, the radial cross section of the spray pipe 20 is triangular, and an edge of the spray pipe 20 near the silicon rod 3 has a chamfered edge. A first included angle A is formed between the chamfered edge and the plane where the wire mesh 10 is located, and A is more than or equal to 0 degrees and less than or equal to 180 degrees. The spraying pipeline 20 is provided with a connecting hole 22, and the conveying pipeline 21 is communicated with the spraying pipeline 20 through the connecting hole 22. The chamfered edge is provided with a spray hole and/or a spray slit 200, and the spray hole and/or the spray slit 200 is used for spraying cutting fluid to the working wire net 100. It is understood that the inverted edge has only spraying holes, or the inverted edge has only spraying slits 200, or the inverted edge has both spraying holes and spraying slits 200.

Under the condition of adopting the technical scheme, referring to fig. 1 to 5, on the first aspect, the radial section of the spray pipe 20 is triangular, and an edge angle of the spray pipe 20 close to the silicon rod 3 has a chamfered edge. At this time, the space occupied by the shower duct 20 can be reduced to reduce or avoid the influence on the positional connection relationship of other structures (for example, the wire 10 and the main roll 11). Based on this, can reduce the degree of difficulty of the installation of shower 20, improve work efficiency. In the second aspect, the delivery pipe 21 is communicated with the shower pipe 20 through the connection hole 22. At this time, the content of the cutting fluid liquid in the shower pipe 20, and thus the content of the cutting fluid sprayed onto the wire net 100 through the shower pipe 20, can be secured. Then, a first included angle A is formed between the chamfered edge and the plane where the wire mesh 10 is located, wherein A is more than or equal to 0 degree and less than or equal to 180 degrees, and the chamfered edge is provided with a spraying hole and/or provided with a spraying seam 200 for spraying cutting fluid to the working wire mesh 100. At this time, the angle between the cutting fluid sprayed from the spraying pipe 20 and the working wire net 100 can be adjusted by adjusting the size of the first included angle a, so that the dropping point of the cutting fluid can be adjusted. Therefore, the liquid falling points of a plurality of cutting liquids can be reduced or avoided from falling on the same position of the working wire net 100, so that the impact force of the cutting liquids on the working wire net 100 is reduced, the TTV and the wire mark generated in the cutting process of the working wire net 100 are reduced or avoided, and the quality of the silicon wafer is improved. Illustratively, the first included angle a may be 0 °, 20 °, 45 °, 125 °, 180 °, or the like. Further, by adopting the silicon wafer cutting device provided by the embodiment of the utility model, the uniformity of spraying the cutting liquid onto the working wire net 100 can be improved.

In an alternative, see fig. 2 and 5, the spray holes and/or spray slots 200 have a central axis with a second angle B with respect to the plane of the wire web 10, 0 ° < B < 90 °.

With the above technical solution, referring to fig. 2 and 5, in the first aspect, the size of the second included angle B is adjusted, so as to reduce or prevent the liquid falling points of a plurality of cutting liquids from all falling on the same position of the working wire net 100, and reduce the impact force of the cutting liquids on the working wire net 100. In the second aspect, the liquid dropping point of the cutting liquid can be further adjusted by matching the first included angle a and the second included angle B, so as to adjust the uniformity of the cutting liquid sprayed onto the working wire net 100. Based on the structure, the impact force of the cutting liquid on the working wire net 100 can be further reduced, and the TTV and wire marks generated in the cutting process of the working wire net 100 can be further reduced or avoided, so that the quality of the silicon wafer is improved. Illustratively, the second included angle B may be 1 °, 20 °, 36 °, 56 °, 89 °, or the like.

In an alternative mode, referring to fig. 2 and 5, the inverted edge is provided with a spraying hole, and when the cross section of the spraying hole is circular, the inner diameter of the circular spraying hole is 1 mm-2 mm. And/or when the chamfered edge is provided with the spraying seam 200, the width of the spraying seam 200 is 1 mm-2 mm. At this time, the content and impact force of the cutting fluid sprayed onto the wire web 100 can be controlled by adjusting the inner diameter of the circular spray holes and/or the width of the spray slits 200, so as to reduce or prevent TTV and wire marks from occurring in the cutting process of the wire web 100, thereby improving the quality of the silicon wafer. Illustratively, the inner diameter of the circular spray holes may be 1mm, 1.2mm, 1.4mm, 1.8mm, or 2 mm. The width of the spray slit 200 may be 1mm, 1.05mm, 1.3mm, 1.5mm, or 2 mm.

In the embodiment of the present invention, referring to fig. 2 and 5, the first included angle a is 60 °, the second included angle B is 45 °, the chamfered edge has a spray slit 200, and the width of the spray slit 200 is 1 mm. When the spray pipe 20 is filled with the cutting fluid, the cutting fluid may be sprayed onto the wire web 100 through the spray holes and/or the spray slits 200.

In an alternative, with reference to fig. 6, the above-mentioned delivery duct may comprise: a draft tube 210 and a draft tube 211. The flow guide tube 210 is in communication with a liquid supply source for providing cutting fluid. One end of the draft tube 211 is communicated with the draft tube 210, and the other end of the draft tube 211 is communicated with the spray duct 20. The length, diameter, material and the like of the draft tube 210 and the draft tube 211 can be set according to actual conditions, and are not specifically limited herein.

In an alternative manner, referring to fig. 1 to 6, the spray duct 20 may further include a liquid distribution pipe 212 and a plurality of spray pieces 213, the liquid distribution pipe 212 communicating with the draft tube 211. Along the length extension direction of liquid separation pipe 212, a plurality of spray pieces 213 are distributed at intervals on liquid separation pipe 212 for spraying working wire net 100. At this time, the selectivity of the spray pipes 20 is increased, so that the spray pipes 20 adapt to different application scenarios, and the application range of the spray pipes 20 is expanded. The length of the liquid separating tube 212 is greater than or equal to the length of the silicon rod 3 or the width of the wire mesh 100. The spray member 213 may be a spray member 213 of the prior art, and will not be described in detail. The plurality of spray pieces 213 may be distributed on the liquid distribution pipe 212 at equal intervals, or may be distributed on the liquid distribution pipe 212 at unequal intervals. The cutting fluid spraying capacity of the single spray member 213 can be set and adjusted according to actual conditions. In the embodiment of the present invention, the flow guide pipe 210 may be disposed outside the main roller 11, and the spray pipe 20 is located below the wire mesh 100.

As a possible implementation manner, referring to fig. 1 and 2, the silicon wafer cutting apparatus further includes a scrap box 4, and the scrap box 4 is located below the work wire net 100 and the silicon rod 3 and is used for collecting impurities generated after cutting the silicon rod 3.

Adopt under the condition of above-mentioned technical scheme, the above-mentioned impurity of later stage centralized processing of being convenient for, this moment, not only can save time, improve work efficiency. Simultaneously, the injured condition appears when can also avoiding staff's later stage clearance impurity.

As a possible implementation, the spray assembly and the particle box are detachably connected. And/or the spraying assembly and the particle box are integrally formed.

In an alternative, the spray assembly and the particle cassette are removably connected.

Under the condition of adopting the technical scheme, the spraying assembly and the particle box can exist independently. When the access & exit of work place is less or there is crooked passageway, can carry the spray assembly and the crushed aggregates box that set up separately to work place respectively, later assemble above-mentioned structure again to satisfy actual need. In this case, the applicable range of the silicon wafer dicing apparatus can be expanded. The detachable connection mode is various, such as bolt connection, clamping connection and the like.

In another alternative, the spray assembly and the particle box are integrally formed.

Of course, the spray assembly and the particle box may be welded.

Referring to fig. 1 to 6, in the embodiment of the present invention, the particle box 4 is located between the two main rollers 11, and the particle box 4 is installed at a position that does not affect the normal up-and-down movement of the silicon rod 3 in the particle box 4. Next, one spraying assembly 2 is arranged on both sides of the chaff box 4, between the chaff box 4 and either of the main rollers 11. When assembling the spray assembly 2 and chip box 4, the side walls of the chip box 4 (i.e., the side walls connected to the spray pipe 20) and the side walls of the spray pipe 20 are first perforated with connection holes 22. Next, the delivery pipe 21 matching the size of the connection hole 22 is installed. The above-mentioned delivery duct 21 may be a Z-shaped duct, for example. At this time, the Z-shaped pipe may avoid the box body and corners of the chip box 4 to ensure smooth flow of the cutting fluid and also to extend the service life of the delivery pipe 21. And then, welding a hoop at the vertically downward tail part of the Z-shaped pipe so as to be convenient for connecting with other cutting fluid supply pipelines. In actual use, the shower pipe 20 needs to be cleaned periodically. For example, the cleaning may be performed with clean water, but may be performed with other cleaning liquids. At this time, it is possible to prevent excessive impurities of the cutting fluid from being deposited in the spray pipe 20 to contaminate the silicon rod 3 and the wire mesh 100.

In an alternative mode, referring to fig. 1 and 2, the silicon wafer cutting apparatus may include two shower assemblies 2, each shower assembly 2 including a shower pipe 20 and a delivery pipe 21. The two spraying pipelines 20 are oppositely arranged, and each conveying pipeline 21 is communicated with each spraying pipeline 20 in a one-to-one correspondence mode.

With the above technical solution, referring to fig. 1 and 2, the two spray assemblies 2 are independent of each other, and when one fails, the other is not affected. At the moment, the normal use of the silicon wafer cutting device can be ensured, namely, the probability that the whole silicon wafer cutting device stops working due to the fault of one spraying assembly 2 can be reduced or eliminated.

In a second aspect, an embodiment of the present invention further provides a silicon wafer cutting apparatus, including the silicon wafer cutting device according to the foregoing technical solution.

The beneficial effects of the silicon wafer cutting equipment provided by the embodiment of the utility model are the same as those of the silicon wafer cutting device in the technical scheme, and the details are not repeated here.

In the foregoing description of embodiments, the particular features, structures, materials, or characteristics may be combined in any suitable manner in any one or more embodiments or examples.

The above description is only for the specific embodiments of the present invention, but the scope of the present invention is not limited thereto, and any person skilled in the art can easily conceive of the changes or substitutions within the technical scope of the present invention, and all the changes or substitutions should be covered within the scope of the present invention. Therefore, the protection scope of the present invention shall be subject to the protection scope of the claims.

Claims

1. An apparatus for cutting a silicon wafer, comprising:

the cutting assembly comprises a wire mesh and at least two main rollers, wherein every two main rollers are arranged at intervals; the wire mesh is wound on the surface of the main roller along the axial direction of the main roller; the wire mesh is positioned below the silicon rods along the direction of cutting the silicon rods and is used for cutting the silicon rods;

the plane of the wire mesh between the two main rollers is vertical to the direction of cutting the silicon rod, part of the wire mesh is in contact with the silicon rod and used for cutting the silicon rod, and the part of the wire mesh forms a working wire mesh;

and the spraying assembly is positioned below the working wire net and is used for spraying the working wire net.

2. The silicon wafer cutting apparatus according to claim 1, wherein the shower assembly comprises:

the spraying pipeline is used for spraying the working wire net; the length extension direction of the spray pipeline is parallel to the axial direction of the main roller;

and the conveying pipeline is communicated with the spraying pipeline and is used for conveying the cutting fluid for the spraying pipeline.

3. The silicon wafer cutting device according to claim 2, wherein the radial cross section of the spray pipe is triangular, and an edge of the spray pipe adjacent to the silicon rod has a chamfered edge;

a first included angle A is formed between the chamfered edge and the plane where the wire mesh is located, and A is more than or equal to 0 degree and less than or equal to 180 degrees;

the spraying pipeline is provided with a connecting hole, and the conveying pipeline is communicated with the spraying pipeline through the connecting hole;

the chamfered edge is provided with a spraying hole and/or the chamfered edge is provided with a spraying seam, and the spraying hole and/or the spraying seam are used for spraying the cutting fluid to the working wire net.

4. The silicon wafer cutting device according to claim 3, wherein the central axis of the shower holes and/or the shower slits has a second angle B with the plane of the wire mesh, 0 ° < B < 90 °.

5. The silicon wafer cutting device according to claim 3 or 4, wherein the chamfered edge is provided with a spray hole, and when the cross section of the spray hole is circular, the inner diameter of the circular spray hole is 1mm to 2 mm; and/or the presence of a gas in the gas,

when the inverted edge is provided with the spraying seam, the width of the spraying seam is 1 mm-2 mm.

6. The silicon wafer cutting apparatus as set forth in claim 2, wherein the delivery pipe comprises:

the guide pipe is communicated with a liquid supply source, and the liquid supply source is used for providing the cutting liquid;

and one end of the drainage tube is communicated with the flow guide tube, and the other end of the drainage tube is communicated with the spraying pipeline.

7. The silicon wafer cutting device according to claim 6, wherein the shower duct comprises a liquid dividing pipe and a plurality of shower members;

the liquid dividing pipe is communicated with the drainage pipe;

along divide the length extending direction of liquid pipe, a plurality of spray spare interval distribution is in divide on the liquid pipe for spray work net.

8. The silicon wafer cutting device according to claim 1, further comprising a scrap box located below the wire mesh and the silicon rod for collecting impurities generated after cutting the silicon rod;

the spraying assembly is detachably connected with the crushed aggregate box; and/or the spraying assembly and the particle box are integrally formed.

9. The silicon wafer cutting device according to claim 2, wherein the silicon wafer cutting device comprises two spray assemblies, each spray assembly comprising a spray pipe and a delivery pipe;

the two spraying pipelines are oppositely arranged, and each conveying pipeline is communicated with each spraying pipeline in a one-to-one correspondence mode.

10. A silicon wafer cutting apparatus comprising the silicon wafer cutting device according to any one of claims 1 to 9.