CN216883398U - TSK attenuate machine polishing unit pipeline structure - Google Patents
TSK attenuate machine polishing unit pipeline structure Download PDFInfo
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- CN216883398U CN216883398U CN202123123930.0U CN202123123930U CN216883398U CN 216883398 U CN216883398 U CN 216883398U CN 202123123930 U CN202123123930 U CN 202123123930U CN 216883398 U CN216883398 U CN 216883398U
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Abstract
The utility model provides a pipeline structure of a polishing unit of a TSK thinning machine, which effectively reduces the crystallization condition of a pipeline, improves the stability of equipment, improves the utilization rate of the equipment and ensures the quality requirement of products. A TSK thinning machine polishing unit pipeline structure comprises a polishing solution storage tank, a pneumatic pump, a pressure regulating valve and a polishing terminal which are sequentially connected through a main pipeline; the polishing device comprises a pneumatic pump, a polishing terminal, a pressure regulating valve, a main pipeline, a polishing solution storage tank and a closed circulation pipeline, wherein the pneumatic pump is connected with a pneumatic source end, the polishing terminal comprises a polishing solution inlet and a polishing solution outlet, the pressure regulating valve is connected with the polishing solution inlet through the main pipeline, and the polishing solution outlet is connected with an inlet of the polishing solution storage tank through a bypass pipeline to form the closed circulation pipeline; the corner and the pipeline joint of the closed circulation pipeline are connected by a direct-connected pipeline.
Description
Technical Field
The utility model relates to the technical field of polishing, in particular to a pipeline structure of a polishing unit of a TSK thinning machine.
Background
When the chip package is thinned, because the polishing unit of the TSK thinning machine adopts a wet polishing chemical process, the main components of the polishing solution are silicon dioxide and organic amine, and the volatilization and contact of the organic amine can generate larger stimulation, the chip package is conveyed by adopting a pipeline in the application process. Use chemical polishing liquid to appear the crystallization easily in the pipeline, especially the joint department and the corner of pipeline very easily arouse the frequent crystallization of polishing liquid and deposit, lead to polishing pipeline to block up, in addition, the polishing liquid provides pressure power for the pneumatic pump, in the pneumatic pump in-process of exerting pressure, polishing liquid in the pipeline leads to the velocity of flow difference to be showing because of polishing pipeline's multinode, thereby the polishing liquid that more arouses piles up the crystallization, polishing liquid chemical corrosion is extremely strong, crystallization is detained inside can lead to the product back corruption of equipment, influence product quality, the attenuate machine is shut down and is led to the utilization ratio to reduce, influence production productivity.
SUMMERY OF THE UTILITY MODEL
In order to solve the problems in the prior art, the utility model provides a pipeline structure of a polishing unit of a TSK thinning machine, which effectively reduces the crystallization condition of the pipeline, improves the stability of equipment, improves the utilization rate of the equipment and ensures the quality requirement of products.
In order to achieve the purpose, the utility model provides the following technical scheme:
a TSK thinning machine polishing unit pipeline structure comprises a polishing solution storage tank, a pneumatic pump, a pressure regulating valve and a polishing terminal which are sequentially connected through a main pipeline;
the polishing device comprises a pneumatic pump, a polishing terminal, a pressure regulating valve, a main pipeline, a polishing solution storage tank and a closed circulation pipeline, wherein the pneumatic pump is connected with a pneumatic source end, the polishing terminal comprises a polishing solution inlet and a polishing solution outlet, the pressure regulating valve is connected with the polishing solution inlet through the main pipeline, and the polishing solution outlet is connected with an inlet of the polishing solution storage tank through a bypass pipeline to form the closed circulation pipeline;
the corner and the pipeline joint of the closed circulation pipeline are connected by a direct-connected pipeline.
Preferably, a pressure valve is arranged between the pneumatic pump and the air pressure source end, and a flow regulating valve is arranged on the main pipeline.
Preferably, an inlet flow meter and an outlet flow meter are respectively arranged at the polishing liquid inlet and the polishing liquid outlet.
Preferably, the pipe diameter of the direct connection pipeline is consistent with that of the main pipeline.
Preferably, the directly connected pipes are made of alkali-resistant plastics.
Preferably, the main pipeline is further connected with a pure water supply pipeline, and a pure water supply ball valve is arranged on the pure water supply pipeline.
Preferably, the polishing terminal comprises a liquid conveying disc and a polishing disc, a polishing liquid inlet of the polishing terminal is connected with the liquid conveying disc, and the liquid conveying disc is communicated with the polishing disc through a plurality of liquid conveying pipelines.
Preferably, the outlet ends of the plurality of liquid conveying pipes are uniformly distributed on the polishing disk.
Compared with the prior art, the utility model has the following beneficial effects:
the utility model provides a pipeline structure of a polishing unit of a TSK (thin-layer polishing) thinning machine, which is characterized in that a main pipeline is used for conveying polishing liquid to a polishing terminal for polishing, and then a bypass pipeline is separated for recycling redundant polishing liquid, one part of the bypass pipeline is converged with the main pipeline to form a closed circulation pipeline, meanwhile, an FM3 bypass in the original polishing pipeline structure is cancelled, the existence of the FM3 bypass structure can cause the increase of nodes and corners of the whole structure, thereby further causing the pressure and the flow rate of the polishing liquid in the pipeline to be unbalanced and causing abnormal flow rate, therefore, the utility model cancels the FM3 bypass, adopts barrier-free direct-connection pipelines to connect at the original pipeline joint and the corners, ensures that the whole pipeline structure always keeps stable and balanced pressure and flow rate when conveying the polishing liquid, reduces the possibility of crystallization and deposition of the polishing liquid, improves the stability of equipment, and reduces the product quality abnormality caused by equipment and abnormality, the pipeline cleaning frequency is reduced, the labor is saved, the equipment utilization rate is improved, and the product quality requirement is effectively guaranteed.
Drawings
FIG. 1 is a schematic view of a piping structure of a polishing unit according to the present invention;
FIG. 2 is a schematic view of an alternate position of a connector according to an embodiment of the present invention;
fig. 3 is a schematic view of an alternative position of a joint in an embodiment of the utility model.
In the figure, a polishing solution storage tank 1, a pneumatic pump 2, a pressure regulating valve 3, a polishing terminal 4, an inlet flowmeter 5 and an outlet flowmeter 6.
Detailed Description
In order to make the technical solutions of the present invention better understood, the technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
It should be noted that the terms "first," "second," and the like in the description and claims of the present invention and in the drawings described above are used for distinguishing between similar elements and not necessarily for describing a particular sequential or chronological order. It is to be understood that the data so used is interchangeable under appropriate circumstances such that the embodiments of the utility model described herein are capable of operation in sequences other than those illustrated or described herein. Furthermore, the terms "comprises," "comprising," and "having," and any variations thereof, are intended to cover a non-exclusive inclusion, such that a process, method, system, article, or apparatus that comprises a list of steps or elements is not necessarily limited to those steps or elements expressly listed, but may include other steps or elements not expressly listed or inherent to such process, method, article, or apparatus.
The utility model is described in further detail below with reference to the accompanying drawings:
as shown in fig. 1, the TSK thinning machine polishing unit pipeline structure of the present invention comprises a polishing liquid storage tank 1, a pneumatic pump 2, a pressure regulating valve 3 and a polishing terminal 4, which are connected in sequence through a main pipeline;
the polishing device comprises a pneumatic pump 2, a polishing terminal 4, a pressure regulating valve 3, a main pipeline, a polishing solution storage tank 1, a main pipeline, a bypass pipeline and a pressure regulating valve, wherein the pneumatic pump 2 is connected with a pneumatic source end, the polishing terminal 4 comprises a polishing solution inlet and a polishing solution outlet, the pressure regulating valve is connected with the polishing solution inlet through the main pipeline, and the polishing solution outlet is connected with an inlet of the polishing solution storage tank 1 through the bypass pipeline to form a closed circulating pipeline;
and corners and pipe joints of the closed circulating pipelines are connected by adopting direct-connected pipelines.
The utility model provides a pipeline structure of a polishing unit of a TSK (thin-layer polishing) thinning machine, which is characterized in that a main pipeline is used for conveying polishing liquid to a polishing terminal 4 for polishing operation, and then a bypass pipeline is separated for recycling redundant polishing liquid, one part of the bypass pipeline is converged with the main pipeline to form a closed circulation pipeline, and meanwhile, an FM3 bypass in the original polishing pipeline structure is eliminated, the existence of the FM3 bypass structure can cause the increase of nodes and corners of the whole structure, thereby further causing the pressure and flow rate of the polishing liquid in the pipeline to be unbalanced and causing abnormal flow rate, therefore, the utility model eliminates the FM3 bypass, and adopts barrier-free direct pipelines to connect at the original pipeline joint and the corners, so that the whole pipeline structure can always keep stable and balanced pressure and flow rate when conveying the polishing liquid, the possibility of crystallization and deposition of the polishing liquid is reduced, and the stability of equipment is improved, the device has the advantages that the product quality abnormity caused by equipment downtime and abnormity is reduced, the pipeline cleaning frequency is reduced, the labor is saved, the equipment utilization rate is improved, and the product quality requirement is effectively guaranteed.
In this embodiment, as shown in fig. 2 and 3, the following joints and corners are mainly replaced by barrier-free direct-connection pipelines, where the parts that are prone to flow rate abnormality, such as the outlet inflection point of the polishing solution storage tank 1 in the polishing solution preparation supply area, the inlet connection inflection point of the bypass pipeline and the polishing solution storage tank 1, the pressure regulating valve 3 joint on the main pipeline, the main pipeline and the bypass pipeline joint, are all replaced by direct-connection pipelines for connection, specifically, a plurality of flow rate measuring devices may be provided at each node on the main pipeline, and the part that is prone to flow rate abnormality or crystallization is determined for replacement.
In this embodiment, a pressure valve is disposed between the pneumatic pump 2 and the pneumatic source end, and a flow control valve is disposed on the main pipeline.
The polishing device can determine the flow demand of the polishing solution according to the flow detection conditions of the inlet flowmeter 5 and the outlet flowmeter 6 arranged at the inlet and the outlet of the polishing solution, adjust the pressure power required by the delivery of the polishing solution through the pressure adjusting valve 3, and control the flow delivery condition of the polishing solution through the flow adjusting valve, thereby further ensuring the polishing effect.
In this embodiment, the main gas pressure is controlled to 0.2 Mpa.
In this embodiment, the pipe diameter that directly links the pipeline keeps unanimous with the pipe diameter of main road pipeline, directly links the pipeline and prefers to use the model the same with main road pipeline and bypass pipeline material and the pipe diameter is the same, the joint of being convenient for, simultaneously save material and cost.
In this embodiment, the directly-connected pipeline is made of alkali-resistant plastic, and since the polishing solution contains silica and organic amine as main components, the pipeline cannot be made of metal, and is easily corroded, thereby causing equipment abnormality.
The material can be made of a peek material, a PTFE material, a PA46 material, a PA6T material, an LCP material and the like.
Preferably, the main pipeline is further connected with a pure water supply pipeline, and a pure water supply ball valve is arranged on the pure water supply pipeline.
When the equipment is crystallized, the polishing unit pipeline can be closed, the pure water supply ball valve is opened, and pure water backflushing is carried out through the pure water supply pipeline, so that the formation of crystals in the polishing solution pipeline of the polishing machine is effectively avoided, the equipment failure rate is reduced, the process stability is enhanced, and the product yield is obviously improved.
Preferably, the polishing terminal 4 comprises a liquid conveying disc and a polishing disc, a polishing liquid inlet of the polishing terminal 4 is connected with the liquid conveying disc, and the liquid conveying disc and the polishing disc are communicated through a plurality of liquid conveying pipelines.
Preferably, the outlet ends of the plurality of liquid conveying pipes are uniformly distributed on the polishing disk.
According to the polishing terminal 4 provided by the utility model, the polishing liquid is conveyed to the operation table through the plurality of liquid conveying pipelines, and the outlet ends of the plurality of liquid conveying pipelines are uniformly arranged on the grinding surface of the polishing disc, so that the supply of the polishing liquid is uniform, the polishing liquid in the polishing machine is uniformly distributed, the same grinding degree at different positions is ensured, and the polishing effect is improved.
Finally, it should be noted that: the above embodiments are only for illustrating the technical solutions of the present invention and not for limiting the same, and although the present invention is described in detail with reference to the above embodiments, those of ordinary skill in the art should understand that: modifications and equivalents may be made to the embodiments of the utility model without departing from the spirit and scope of the utility model, which is to be covered by the claims.
Claims (8)
1. A TSK thinning machine polishing unit pipeline structure is characterized by comprising a polishing solution storage tank (1), a pneumatic pump (2), a pressure regulating valve (3) and a polishing terminal (4) which are sequentially connected through a main pipeline;
the polishing system comprises a pneumatic pump (2), a polishing terminal (4), a pressure regulating valve (3), a polishing solution storage tank (1), a pressure regulating valve and a polishing solution storage tank, wherein the pneumatic pump (2) is connected with a pneumatic source end, the polishing terminal (4) comprises a polishing solution inlet and a polishing solution outlet, the pressure regulating valve (3) is connected with the polishing solution inlet through a main pipeline, and the polishing solution outlet is connected with an inlet of the polishing solution storage tank (1) through a bypass pipeline to form a closed circulation pipeline;
the corner and the pipeline joint of the closed circulation pipeline are connected by a direct-connected pipeline.
2. A TSK thinning machine polishing unit pipeline structure according to claim 1, characterized in that, a pressure valve is arranged between the pneumatic pump (2) and the pneumatic source end, and a flow regulating valve is arranged on the main pipeline.
3. A TSK thinning machine polishing unit pipeline structure according to claim 1, characterized in that, the polishing liquid inlet and outlet are respectively provided with an inlet flowmeter (5) and an outlet flowmeter (6).
4. The TSK thinning machine polishing unit pipeline structure according to claim 1, wherein the pipe diameter of the direct connecting pipeline is consistent with the pipe diameter of the main pipeline.
5. The TSK thinning machine polishing unit pipeline structure of claim 1, wherein the direct connecting pipeline is made of alkali-resistant plastic.
6. The pipeline structure of a polishing unit of a TSK thinning machine according to claim 1, wherein a pure water supply pipeline is further connected to the main pipeline, and a pure water supply ball valve is provided on the pure water supply pipeline.
7. The TSK thinning machine polishing unit pipeline structure is characterized in that the polishing terminal (4) comprises a liquid conveying disc and a polishing disc, a polishing liquid inlet of the polishing terminal (4) is connected with the liquid conveying disc, and the liquid conveying disc is communicated with the polishing disc through a plurality of liquid conveying pipelines.
8. The piping structure of a polishing unit of a TSK thinning machine according to claim 7, wherein the outlet ends of the plurality of liquid feeding pipes are uniformly distributed on the polishing disk.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202123123930.0U CN216883398U (en) | 2021-12-13 | 2021-12-13 | TSK attenuate machine polishing unit pipeline structure |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202123123930.0U CN216883398U (en) | 2021-12-13 | 2021-12-13 | TSK attenuate machine polishing unit pipeline structure |
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| Publication Number | Publication Date |
|---|---|
| CN216883398U true CN216883398U (en) | 2022-07-05 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN202123123930.0U Active CN216883398U (en) | 2021-12-13 | 2021-12-13 | TSK attenuate machine polishing unit pipeline structure |
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2021
- 2021-12-13 CN CN202123123930.0U patent/CN216883398U/en active Active
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