CN216882258U - Laser grinding device - Google Patents

Laser grinding device Download PDF

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Publication number
CN216882258U
CN216882258U CN202220051266.9U CN202220051266U CN216882258U CN 216882258 U CN216882258 U CN 216882258U CN 202220051266 U CN202220051266 U CN 202220051266U CN 216882258 U CN216882258 U CN 216882258U
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module
laser
grinding
cover plate
sensor
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CN202220051266.9U
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Inventor
吴喜泉
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Suzhou Gaoyi Laser Technology Co ltd
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Suzhou Gaoyi Laser Technology Co ltd
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Abstract

The application discloses a laser grinding device. This laser grinder includes, body and abrasive machining module, abrasive machining module has apron and framework, the framework has the opening, the apron is fixed in through adapting unit the opening side of framework, the apron is used for covering the opening, just abrasive machining module has the cavity, the cavity is used for in order to hold grinding unit, dispose the flowmeter in the abrasive machining module, its electric connection to control module, dispose first acoustic celotex board on the apron respectively the inboard of framework disposes the second acoustic celotex board, the combination of first acoustic celotex board and second acoustic celotex board is used for wrapping at least part grinding unit. Noise generated by the machine during operation is reduced by arranging the sound insulation component, and the environment of the operation site is improved.

Description

Laser grinding device
Technical Field
The application relates to the technical field of laser processing, in particular to laser grinding equipment.
Background
In recent years, the rapid increase in demand for industrial products made of superhard materials has driven the need for efficient surface treatment of diamond-based materials. However, as the content of diamond in the material is continuously increased, the electrical conductivity is reduced, which is not beneficial to adopting the traditional Electrical Discharge Machining (EDM), and at present, a few manufacturers have proposed that the surface treatment is realized by using laser, but the effect of laser plane machining is not ideal. In addition, the machine has the defects of high energy consumption and low economic efficiency.
Therefore, a new laser grinding apparatus is required.
SUMMERY OF THE UTILITY MODEL
In order to overcome the above disadvantages, the present application aims to provide a novel laser grinding apparatus to overcome the disadvantages of the existing processing technology and to improve the economic benefits.
In order to achieve the purpose, the following technical scheme is adopted in the application:
a laser grinding device is characterized by comprising,
a main body and a grinding processing module,
the grinding module comprises a cover plate and a frame body, the frame body is provided with an opening part,
the cover plate is fixed on the opening part side of the frame body through a connecting part, the cover plate is used for covering the opening part, the grinding processing module is provided with a cavity, the cavity is used for accommodating a grinding assembly,
the cover plate is provided with a first sound insulation plate and a second sound insulation plate respectively, the inner side of the frame body is provided with the second sound insulation plate, and the combination of the first sound insulation plate and the second sound insulation plate is used for wrapping at least part of the grinding assembly. By the design, the processing efficiency is improved, and meanwhile, the working site environment is improved.
Preferably, the laser grinding apparatus is characterized in that,
and one side of the cover plate opposite to the connecting part is provided with at least one first connecting part, and the first connecting part is connected with a second connecting part arranged on the frame body in a matching way.
Preferably, a seal ring is disposed on the periphery of the cover plate facing the cavity side.
Preferably, a seal ring is disposed on the opening portion.
Preferably, the cover plate is provided with an observation window made of a transparent material.
Preferably, the laser grinding device is further provided with a human-computer interaction module, the human-computer interaction module is provided with an input module, and the input module is used for inputting instructions.
Preferably, the laser grinding device is further provided with a prompt module which is electrically connected to the internal control module, and the prompt module is used for prompting the running state of the laser grinding device.
Preferably, the laser polishing apparatus is characterized in that the sensor module is disposed inside the housing and located at an upper middle portion of the cavity. Preferably, away from the laser source. To improve detection accuracy.
Preferably, the abrasive processing module is configured with a sensor module electrically connected to the control module, wherein the sensor module comprises at least one of a smoke sensor, a noise sensor, a VOC sensor, a PM10 sensor, and a PM2.5 sensor.
Preferably, a side plate is provided in the housing, a laser light source is provided thereon, and a workpiece is ground/cut by light emitted from the laser light source,
the side plate is provided with a cooling portion on which a nozzle is arranged, and an outlet of the nozzle faces the workpiece.
Has the advantages that:
the application provides a laser grinder improves laser grinding flatness and operating efficiency. Noise generated by the machine during operation is reduced by arranging the sound insulation component, and the environment of the operation site is improved.
Drawings
In order to more clearly illustrate the technical solutions in the embodiments of the present application, the drawings needed to be used in the description of the embodiments are briefly introduced below, it is obvious that the drawings in the following description are only some embodiments of the present application, and other drawings can be obtained by those skilled in the art without inventive efforts, wherein:
fig. 1 is a schematic perspective view of a laser polishing apparatus according to an embodiment of the present application.
Fig. 2 is a schematic structural diagram of a laser polishing apparatus according to an embodiment of the present disclosure.
Fig. 3 is a schematic diagram of an internal structure of an embodiment of the present application.
Fig. 4 is a partially enlarged view of a portion a in fig. 3.
Detailed Description
The above-described scheme is further illustrated below with reference to specific examples. It should be understood that these examples are for illustrative purposes and are not intended to limit the scope of the present application. The conditions employed in the examples may be further adjusted as determined by the particular manufacturer, and the conditions not specified are typically those used in routine experimentation.
The application provides a laser grinding device. The laser grinding device includes: the grinding module is provided with a cover plate and a frame body, the frame body is provided with an opening, the cover plate is fixed on the opening side of the frame body through a connecting part (such as a hinge), the cover plate is used for covering the opening, the cover plate is fixed on the frame body (on the opening side) through the connecting part, a cavity is arranged in the grinding module and used for accommodating a grinding assembly, a flowmeter is arranged in the grinding module and electrically connected to the control module, a first sound insulation plate is arranged on the cover plate, a second sound insulation plate is arranged on the inner side of the frame body, and the combination of the first sound insulation plate and the second sound insulation plate is used for wrapping at least part of the grinding assembly (or parts which make large sound when the grinding assembly operates so as to reduce the sound and transmit the sound to a working site). The laser grinding device improves the laser grinding flatness and the operation efficiency. Noise generated by the machine during operation is reduced by arranging the sound insulation component, and the environment of the operation site is improved.
The laser grinding apparatus according to the embodiment of the present application will be described in detail with reference to fig. 1 to 4.
The laser grinding device includes:
a body 110 and a polishing module 120, wherein,
the polishing module 120 is disposed on one side of the body 110, and a control module and the like are disposed in the body to control the operation of the laser polishing apparatus based on a preset command. The control module is electrically connected with the driving module and the laser head, preferably, the control module comprises a multi-axis linkage control card, and the X/Y displacement table can be controlled to move according to a preset direction based on an instruction.
The polishing module 120 has a cavity b, and a polishing unit (e.g., as disclosed in chinese utility model nos. CN214134480U, CN214166568U, and CN 214291435U) is disposed in the cavity b, and a workpiece is processed by the polishing unit.
The grinding module 120 is configured with a cover plate 121, one side of the cover plate 121 is fixed to a frame 124 of the grinding module through a connecting component (e.g., a hinge/a rotating shaft, etc.), the cover plate 121 can rotate along the connecting component to a certain extent (facilitating an operator to place a workpiece to be processed in a cavity b or take out a processed workpiece), at least one first connecting portion 121a is disposed on the other side of the cover plate 121, the first connecting portion 121a is connected to a second connecting portion 125 configured on the frame 124 in a matching manner, so that the cover plate 121 covers the frame 124 (e.g., covers an opening 124a of the frame 124). The cover plate is provided with a viewing window 126 made of transparent material, and the condition in the cavity can be checked through the viewing window 126.
In the present embodiment, the sound insulating plate 122 is disposed in the polishing module, and for example, the sound insulating plate 122a is disposed on the inner side of the frame 124, and the sound insulating plate 122b is disposed on the side of the cover plate 121 facing the cavity. The baffle 122 is configured to encase/encase the grinding assembly or a substantial portion of the components that generate noise during operation of the grinding assembly, and is designed to reduce the impact of the laser grinding apparatus on the environment during operation. The working environment of the site is improved (through experimental actual measurement, the sound generated when the laser grinding device operates is lower than 80 decibels by designing the sound insulation board, and the site working environment is greatly improved). In another embodiment, the seal ring may be disposed in the opening of the housing 124. In the present embodiment, the sealing ring 123 is disposed around the cover plate 121 facing the cavity, and when the cover plate 121 is covered with the frame 124, the sealing ring 123 at least partially contacts the opening 124a, which improves the sealing effect of the cover plate 121 after closing. In this case, the baffle is disposed inside the seal ring.
The laser polishing apparatus is provided with a human-machine interaction module 130, which is provided with an input module 131 through which commands (such as parameters required for processing a workpiece, parameters for maintenance of the laser polishing apparatus, etc.) are input.
The laser polishing apparatus is further provided with a prompt module 140 electrically connected to the internal control module, wherein the prompt module 140 prompts the operating state of the laser polishing apparatus. Preferably, different operating states are indicated by displaying different colors.
In one embodiment, as shown in fig. 2, the laser polishing apparatus includes: the gas exhaust part 150 is disposed on the top of the laser polishing apparatus (e.g., the top of the body 110, or the top of the polishing module 120), and the gas exhaust part 150 is connected to the cavity of the polishing module 120 through a pipe, so that gas or smoke generated when the laser polishing apparatus operates to polish/cut a workpiece is exhausted through the gas exhaust part 150. If the particles in the gas or smoke are not extracted in time, the measurement accuracy of the optical elements of the laser polishing apparatus is affected. The dust removal through this portion of bleeding has improved laser grinding plane degree and operating efficiency.
In one embodiment, as shown in fig. 3, a sensor module 140 is disposed in the frame 124, and the sensor module is used to detect the air quality in the cavity. The sensor module 140 includes at least one of a smoke sensor, a VOC sensor, a PM10 sensor, and a PM2.5 sensor. The sensor module 140 is electrically connected to the control module for feeding back the real-time inspection information to the control module. In one embodiment, the sensor module includes a noise sensor for determining the current operating state of the abrading device by detecting the sound of the abrading assembly during operation.
In one embodiment, if the concentration of smoke monitored by the sensor module 140 exceeds a predetermined threshold, the control module controls the polishing assembly to stop immediately and then start again when the concentration is below a predetermined safety threshold. Preferably, the sensor module is disposed at the middle upper portion in the cavity and is far away from the laser light source, so as to improve the detection precision and avoid interference of the laser light source during measurement.
The housing 124 is provided with a side plate 160 on which a laser light source (not shown) is disposed, and light is emitted from the laser light source to grind/cut a workpiece.
The side plate 160 is provided with a cooling portion 161 connected to a cool source through a pipe, and the cooling portion 161 is provided with a nozzle 162, an outlet of the nozzle 162 facing the workpiece 180. The workpiece 180 is placed on the jig 171 of the processing station 170, and the processing station 170 is provided with the shutter 172. The clamp 171 is connected to a driving part (not shown), and when machining is performed, the workpiece 180 is driven to rotate by the rotation of the driving part, and the nozzle 162 sprays cooling gas (compressed cooling gas with a pressure of 0.1MPa to 1.0 MPa) to cool the workpiece, so as to improve the precision and efficiency of polishing.
In one embodiment, the side plate further comprises: and the measuring mechanism is used for measuring the machining size. Preferably, the measuring mechanism comprises a light range finder which scans the height of the surface of the workpiece based on the instruction and feeds back the scanning information to the control module.
In one embodiment, a flow meter is disposed in the cavity, preferably, the flow meter is matched with the air extraction portion, and the air extraction effect can be checked through the flow meter.
In the present application, the terms "upper", "lower", "inside", "middle", and the like indicate orientations or positional relationships based on the orientations or positional relationships shown in the drawings. These terms are used primarily to better describe the present application and its embodiments, and are not used to limit the indicated devices, elements or components to a particular orientation or to be constructed and operated in a particular orientation.
The above embodiments are merely illustrative of the technical concepts and features of the present application, and the purpose of the embodiments is to enable those skilled in the art to understand the content of the present application and implement the present application, and not to limit the protection scope of the present application. All equivalent changes and modifications made according to the spirit of the present application are intended to be covered by the scope of the present application.

Claims (10)

1. A laser grinding device is characterized by comprising,
a main body and a grinding processing module,
the grinding module comprises a cover plate and a frame body, the frame body is provided with an opening part,
the cover plate is fixed on the opening part side of the frame body through a connecting part, the cover plate is used for covering the opening part, the grinding processing module is provided with a cavity, the cavity is used for accommodating a grinding assembly,
a flow meter is arranged in the grinding processing module and is electrically connected to the control module,
the cover plate is provided with a first sound insulation plate and a second sound insulation plate respectively, the inner side of the frame body is provided with the second sound insulation plate, and the combination of the first sound insulation plate and the second sound insulation plate is used for wrapping at least part of the grinding assembly.
2. The laser grinding apparatus of claim 1,
and one side of the cover plate opposite to the connecting part is provided with at least one first connecting part, and the first connecting part is connected with a second connecting part arranged on the frame body in a matching manner.
3. The laser grinding apparatus of claim 1,
the periphery of the cover plate facing the cavity side is provided with a sealing ring.
4. The laser grinding apparatus of claim 1,
the opening portion is provided with a seal ring.
5. The laser grinding apparatus of claim 1,
and the cover plate is provided with an observation window made of transparent material.
6. The laser grinding apparatus of claim 1,
the laser grinding device is further provided with a human-computer interaction module, the human-computer interaction module is provided with an input module, and the input module is used for inputting instructions.
7. The laser grinding apparatus of claim 1,
the laser grinding device is further provided with a prompt module which is electrically connected to the internal control module, and the prompt module is used for prompting the running state of the laser grinding device.
8. The laser grinding apparatus of claim 1,
the grinding module is internally provided with a sensor module which is electrically connected with the control module, and the sensor module comprises at least one of a smoke sensor, a noise sensor, a VOC sensor, a PM10 sensor and a PM2.5 sensor.
9. The laser grinding apparatus of claim 8,
the sensor module is arranged on the inner side of the frame body and is positioned on the middle upper part of the cavity.
10. The laser grinding apparatus of claim 1,
a side plate is arranged in the frame body, a laser light source is arranged on the side plate, a workpiece is ground/cut by light emitted by the laser light source,
the side plate is provided with a cooling part, a nozzle is arranged on the side plate, an outlet of the nozzle faces the workpiece, and the nozzle sprays cooling gas to cool the workpiece.
CN202220051266.9U 2022-01-10 2022-01-10 Laser grinding device Active CN216882258U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN202220051266.9U CN216882258U (en) 2022-01-10 2022-01-10 Laser grinding device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN202220051266.9U CN216882258U (en) 2022-01-10 2022-01-10 Laser grinding device

Publications (1)

Publication Number Publication Date
CN216882258U true CN216882258U (en) 2022-07-05

Family

ID=82213876

Family Applications (1)

Application Number Title Priority Date Filing Date
CN202220051266.9U Active CN216882258U (en) 2022-01-10 2022-01-10 Laser grinding device

Country Status (1)

Country Link
CN (1) CN216882258U (en)

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