CN216871900U - Vertical micro-motion mounting platform for bonding machine - Google Patents
Vertical micro-motion mounting platform for bonding machine Download PDFInfo
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- CN216871900U CN216871900U CN202121615515.4U CN202121615515U CN216871900U CN 216871900 U CN216871900 U CN 216871900U CN 202121615515 U CN202121615515 U CN 202121615515U CN 216871900 U CN216871900 U CN 216871900U
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- fixed seat
- mounting platform
- bonding machine
- swing head
- motion
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Abstract
The utility model provides a vertical micro-motion mounting platform for a bonding machine, which comprises a fixed seat and a swing head, wherein the fixed seat is arranged from top to bottom, the swing head is connected with the fixed seat through an elastic connecting assembly, the elastic connecting assembly comprises a connecting plate, a connecting rod and a plurality of spring pieces for connection, and gaps are reserved among the connecting plate, the connecting rod, the fixed seat and the swing head and are connected through the spring pieces. According to the utility model, the micro-motion of the bonding assembly arranged on the swing head is realized by the micro-motion mounting platform under the action of force, so that on one hand, the down force can be provided in the bonding process, and on the other hand, the mounting platform can automatically recover the original state when no down force exists, thus the accurate control and feedback of the bonding machine equipment on the motion and the force are met, the whole structure is simple and stable, and the later maintenance is convenient.
Description
Technical Field
The utility model relates to the technical field of bonder systems, in particular to a vertical micro-motion mounting platform for a bonder.
Background
The development of the chip industry plays a significant role in the development of the industry, and with the gradual independent localization of the chip industry in China, a series of devices required by process packaging testing are still in weak links.
The packaging of the integrated circuit chip is a process of arranging, pasting, fixing and connecting the chip and other elements on a frame or a substrate by using a membrane technology and a micro-machining technology, leading out a wiring terminal and embedding and fixing the wiring terminal through a plastic insulating medium to form an integral three-dimensional structure; the bonder is used as common equipment for chip packaging and is used for realizing automatic alignment and bonding of chips, so that the operation stability of the bonder is guaranteed to be very important.
SUMMERY OF THE UTILITY MODEL
The utility model aims to provide a vertical micro-motion mounting platform for a bonding machine, which solves the problems in the background technology.
In order to achieve the purpose, the utility model adopts the following technical scheme:
a vertical micro-motion mounting platform for a bonding machine comprises a fixed seat and a swing head, wherein the fixed seat is arranged from top to bottom, and the swing head is connected with the fixed seat through an elastic connecting assembly; the swing head is fixedly connected with a bonding assembly of the bonding machine.
Preferably, the elastic connection assembly comprises a connection plate, a connection rod and a plurality of spring pieces for connection, and gaps are reserved among the connection plate, the connection rod, the fixed seat and the swinging head and are connected through the spring pieces.
Preferably, the connecting plate adopts a cuboid plate, and the spring piece is fixed at the joints of the cuboid plate, the connecting rod, the fixing seat and the swinging head through bolt assemblies.
Further, the swing head is fixedly connected with a three-axis motion system of the bonding machine.
According to the utility model, the micro-motion of the bonding assembly arranged on the swing head is realized by the micro-motion mounting platform under the action of force, so that on one hand, the down force can be provided in the bonding process, and on the other hand, the mounting platform can automatically recover the original state when no down force exists, thus the accurate control and feedback of the bonding machine equipment on the motion and the force are met, the whole structure is simple and stable, and the later maintenance is convenient.
Drawings
FIG. 1 is a schematic view of the overall structure of the present invention;
in the figure: 1. a fixed seat; 2. a swinging head; 3. a connecting plate; 4. a connecting rod; 5. a spring plate.
Detailed Description
A preferred embodiment of the present invention will be described in detail below with reference to the accompanying drawings.
As shown in fig. 1, the vertical micro-motion mounting platform for a bonding machine includes a fixed seat 1 arranged from top to bottom and a swing head 2 connected to the fixed seat through an elastic connection assembly, where the elastic connection assembly in the preferred embodiment includes a connection plate 3, a connection rod 4 and a plurality of spring pieces 5 for connection, and gaps are left between the connection plate, the connection rod, the fixed seat and the swing head and connected through the spring pieces, and the spring pieces in the preferred embodiment need to have a proper thickness, so that after the structure is mounted, the swing head can bear a certain gravity under natural conditions without deformation of the whole structure, that is, after the swing head is subjected to a certain pressure, the swing head can deform, and when an external force disappears, the whole structure can recover its shape; specifically, the swing head is fixedly connected to a bonding assembly of the bonding machine, and the bonding assembly according to the preferred embodiment is generally a three-axis motion system of the bonding machine.
Wherein, connecting plate 3 adopt the cuboid board, the both ends of four corners, the connecting rod of cuboid board, the junction of fixing base and swing head all are fixed through bolt assembly leaf spring 5, bolt assembly includes hexagonal socket head cap screw and overlaps and establish bullet pad, the flat pad subassembly on the screw to reduce the wearing and tearing of leaf spring, increase of service life.
In the specific use, the swing head 2 is fixedly connected with a three-axis motion system of a bonding machine, when the bonding machine performs bonding work, the swing head is connected with a cleaver (Z axis), in the bonding process, the cleaver vertically moves downwards to be contacted with a device to be bonded, certain pressure is generated, the micro-motion platform deforms, and due to the fact that gaps among a connecting plate, the fixed head, the swing head, a connecting rod, the fixed head and the swing head are small and deformation amount is constant in the design of the whole structure, the structure motion in the bonding is accurately controlled, and meanwhile, due to the limitation of deformation positions, force feedback is provided for a bonding part of the bonding machine.
The above-mentioned embodiments are merely illustrative of the preferred embodiments of the present invention, and do not limit the scope of the present invention, and various modifications and improvements made to the technical solution of the present invention by those skilled in the art without departing from the spirit of the present invention should fall within the protection scope defined by the claims of the present invention.
Claims (4)
1. A vertical micro-motion mounting platform for a bonding machine is characterized by comprising a fixed seat (1) and a swing head (2), wherein the fixed seat (1) is arranged from top to bottom, and the swing head is connected with the fixed seat through an elastic connecting assembly; the swing head is fixedly connected with a bonding assembly of the bonding machine.
2. The vertical jiggle mounting platform for bonding machine according to claim 1, wherein the elastic connection assembly comprises a connection plate (3), a connection rod (4) and a plurality of spring strips (5) for connection, and the connection plate, the connection rod, the fixed seat and the swing head are connected with a gap therebetween through the spring strips.
3. The vertical micro-motion mounting platform for the bonding machine is characterized in that the connecting plate (3) is a rectangular parallelepiped plate, and the spring plate (5) is fixed at the joints of the rectangular parallelepiped plate, the connecting rod, the fixed seat and the swinging head through bolt assemblies.
4. The vertical jiggle mounting platform for a bonder of claim 1 wherein said oscillating head is fixedly connected to a triaxial kinematic system of the bonder.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202121615515.4U CN216871900U (en) | 2021-07-14 | 2021-07-14 | Vertical micro-motion mounting platform for bonding machine |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202121615515.4U CN216871900U (en) | 2021-07-14 | 2021-07-14 | Vertical micro-motion mounting platform for bonding machine |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN216871900U true CN216871900U (en) | 2022-07-01 |
Family
ID=82120363
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202121615515.4U Active CN216871900U (en) | 2021-07-14 | 2021-07-14 | Vertical micro-motion mounting platform for bonding machine |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN216871900U (en) |
-
2021
- 2021-07-14 CN CN202121615515.4U patent/CN216871900U/en active Active
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