CN216852991U - Paster device for integrated circuit processing - Google Patents

Abstract

The utility model provides a chip mounting device for integrated circuit processing, and relates to the technical field of integrated circuit board processing equipment. The semiconductor wafer clamping device comprises an operating platform, wherein a bearing plate is arranged above the operating platform, a plurality of grooves which are used for clamping and placing machine shells and limit the positions of the machine shells are formed in the bearing plate, a guide mechanism is vertically arranged on one side of the bearing plate, an operating plate is arranged outside the guide mechanism in a sliding mode, an operating groove is formed in the position, corresponding to the grooves, of the operating plate, and a clamping mechanism for clamping a semiconductor wafer is arranged on the inner bottom wall of the operating groove. The utility model clamps the semiconductor wafer through the clamping mechanism, so as to avoid the problem that inferior-quality products are generated because the semiconductor wafer is knocked by the side wall of the shell due to shaking of hands when the semiconductor wafer is manually taken, and then the operating plate drives the clamping mechanism to move towards the bearing plate through mechanical action, so that the speed and the precision of the clamping mechanism are far superior to those of manual operation, and the chip mounting efficiency is greatly improved.

Description

Paster device for integrated circuit processing

Technical Field

The utility model belongs to the technical field of integrated circuit board processing equipment, and particularly relates to a chip mounting device for integrated circuit processing.

Background

An integrated circuit is a miniature electronic device or component, and is made up through such technological steps as interconnection of chip tube, resistor, capacitor and inductor and wiring in a circuit, and making them on a small semiconductor chip or dielectric substrate, and packaging in a casing.

What adopt when installing the laminating of fritter semiconductor wafer in the casing at present is manual operation, and the problem that brings like this is more: 1. the error is large due to simple manual operation, and the semiconductor wafer is easy to collide during the attaching installation, so that the elements after being attached become inferior-quality products; 2. the efficiency of pure manual operation is low.

SUMMERY OF THE UTILITY MODEL

The present invention is directed to solving the above problems of the prior art. A chip mounting device for integrated circuit processing is provided. The technical scheme of the utility model is as follows:

a chip set for integrated circuit processing, comprising: comprises an operating platform (1), a bearing plate (2) is arranged above the operating platform (1), the bearing plate (2) is provided with a plurality of grooves (3) which are used for clamping the shell and limiting the position of the shell, a guide mechanism (4) is arranged on one side of the bearing plate (2) in the vertical direction, an operating plate (5) is arranged outside the guide mechanism (4) in a sliding manner, an operating groove (6) is formed on the back surface of the operating plate (5) corresponding to the groove (3), a clamping mechanism (7) for clamping the semiconductor wafer is arranged on the inner bottom wall of the operation groove (6), and the device also comprises a control mechanism (8) for controlling the operation plate (5) to move towards the bearing plate (2), so as to form a chip-mounting state that the operation plate (5) moves towards the bearing plate (2) after the clamping mechanism (7) clamps the semiconductor wafer.

Furthermore, the guide mechanism (4) comprises a guide rod (401) which is vertically installed on the bearing plate (2) and a through groove (402) which is formed in the bearing plate (2), a sliding sleeve (403) which is vertically arranged is fixedly arranged in the through groove (402), and the guide rod (401) is slidably arranged in the sliding sleeve (403).

Further, the clamping mechanism (7) comprises a vacuum generator (701) installed on the outer wall of the operation table (1) and vacuum suction cups (702) symmetrically installed at four corners of the operation groove (6) and used for being sucked at the edge of the semiconductor wafer, and the vacuum suction cups (702) are connected with the vacuum generator (701) through a conduit.

Furthermore, control mechanism (8) include that one end is fixed on operation panel (1) and other end fixed mounting are in electric push rod (801) of operation panel (5) bottom, install first travel switch (802) on loading board (2), the bracing piece is located the lateral wall of operation panel (5) top is installed second travel switch (803), first travel switch (802) are used for control its reverse motion when operation panel (5) move down, second travel switch (803) are used for stop its motion when operation panel (5) move up, still including control electric push rod (801) with control switch (804) of vacuum generator (701).

Further, the first travel switch (802) and the second travel switch (803) are both electrically connected to the electric push rod (801).

Further, the control switch (804) comprises a first foot switch (8041) and a second foot switch (8042) which are arranged on the ground below the operating platform (1), the first foot switch (8041) is electrically connected with the vacuum generator (701), and the second foot switch (8042) is electrically connected with the electric push rod (801).

Further, be provided with a plurality of landing boards (9) on operation panel (1), landing board (9) are used for placing the semiconductor wafer of treating the paster.

The utility model has the following advantages and beneficial effects:

the utility model clamps the semiconductor wafer through the clamping mechanism, so as to avoid the problem that inferior-quality products are generated because the semiconductor wafer is knocked by the side wall of the shell due to shaking of hands when the semiconductor wafer is manually taken, and then the operating plate drives the clamping mechanism to move towards the bearing plate through mechanical action, so that the speed and the precision of the clamping mechanism are far superior to those of manual operation, and the chip mounting efficiency is greatly improved.

Drawings

FIG. 1 is a schematic perspective view of a preferred embodiment of the present invention;

FIG. 2 is a schematic perspective view of another embodiment of the present invention;

FIG. 3 is a top view of the present invention;

FIG. 4 is a cross-sectional view taken along line A-A of FIG. 3 in accordance with the present invention;

reference numerals are as follows: 1. an operation table; 2. carrying a plate; 3. a groove; 4. a guide mechanism; 401. a guide bar; 402. a through groove; 403. a sliding sleeve; 5. an operation panel; 6. an operation slot; 7. a clamping mechanism; 701. a vacuum generator; 702. a vacuum chuck; 8. a control mechanism; 801. an electric push rod; 802. a first travel switch; 803. a second travel switch; 804. a control switch; 8041. a first foot switch; 8042. a second foot switch; 9. a platform plate.

Detailed Description

The technical solutions in the embodiments of the present invention will be described in detail and clearly with reference to the accompanying drawings. The described embodiments are only some of the embodiments of the present invention.

The technical scheme for solving the technical problems is as follows:

as shown in fig. 1, 2, 3, and 4, a chip mounting apparatus for processing an integrated circuit includes an operation table 1, a carrier plate 2 is installed above the operation table 1, a plurality of grooves 3 for clamping a housing of a placement machine and limiting the position of the housing are formed on the carrier plate 2, a guide mechanism 4 is vertically installed on one side of the carrier plate 2, an operation plate 5 is slidably installed outside the guide mechanism 4, an operation slot 6 is formed on the operation plate 5 corresponding to the groove 3, a clamping mechanism 7 for clamping a semiconductor chip is installed on an inner bottom wall of the operation slot 6, and a control mechanism 8 for controlling the operation plate 5 to move toward the carrier plate 2, so as to form a chip mounting state in which the operation plate 5 moves toward the carrier plate 2 after the semiconductor chip is clamped by the clamping mechanism 7, in some embodiments: the clamping mechanism 7 is used for clamping a semiconductor wafer to avoid the problem that inferior products are generated due to the fact that hands shake when the semiconductor wafer is manually taken and the semiconductor wafer is knocked by the side wall of a machine shell, and then the operating plate 5 drives the clamping mechanism 7 to move towards the bearing plate 2, so that the speed and the precision of the clamping mechanism are far superior to those of manual operation, and therefore the chip mounting efficiency is greatly improved, more specifically, the machine shell is firstly embedded into the groove 3 during operation, then the semiconductor wafer is upwards pushed out corresponding to the operating groove 6 in the state shown in figure 1, then the clamping mechanism 7 clamps the semiconductor wafer, rubber pads are attached and laid on the inner walls of the groove 3 and the operating groove 6, the thickness of the rubber pads is uniform, so that the semiconductor wafer is located in the middle position of the groove when clamped, when the clamping mechanism 7 clamps the semiconductor wafer, the control mechanism 8 controls the operating plate 5 to move towards the bearing plate 2, when the two are jointed and contacted, the clamping mechanism 7 cancels the clamping of the semiconductor wafer, and the semiconductor wafer is connected with the shell at the moment.

As shown in fig. 1, in some embodiments, the guiding mechanism 4 includes a guiding rod 401 vertically installed on the carrier plate 2 and a through groove 402 configured on the carrier plate 2, a sliding sleeve 403 is fixedly disposed in the through groove 402 along the depth direction thereof, the guiding rod 401 is slidably disposed in the sliding sleeve 403, and the use of the guiding rod 401 and the sliding sleeve 403 herein enables the carrier plate 2 to stably slide when moving, which increases the stability of the device.

As shown in fig. 2, 3 and 4, in some embodiments, the holding mechanism 7 includes a vacuum generator 701 installed on an outer wall of the operation table 1 and vacuum chucks 702 symmetrically installed at four corners of the operation bath 6 for sucking the semiconductor wafer at the edges thereof, and the vacuum chucks 702 are connected to the vacuum generator 701 through pipes, where the vacuum chucks 702 are installed at the four corners in order to stagger the minute electronic components such as transistors and the like, thereby preventing them from being damaged, and at the same time, the vacuum chucks 702 can suck the semiconductor wafer or release the semiconductor wafer when the vacuum generator 701 is operated.

As shown in fig. 1 and 4, in some embodiments, the control mechanism 8 includes an electric push rod 801 with one end fixed on the operation platform 1 and the other end fixed at the bottom of the operation panel 5, a first travel switch 802 is installed on the carrier plate 2, a second travel switch 803 is installed on the side wall of the support rod above the operation panel 5, the first travel switch 802 is used for controlling the operation panel 5 to move reversely when moving downwards, the second travel switch 803 is used for stopping the operation panel 5 from moving upwards, and a control switch 804 for controlling the electric push rod 801 and the vacuum generator 701, where the electric push rod 801 triggers the first travel switch 802 when moving downwards with the operation panel 5, and at this time, the travel switch controls the electric push rod 801 to extend so that the operation panel 5 reaches the second travel switch 803 reversely to stop, so as to prepare for next mounting the semiconductor wafer in the operation slot 6.

As shown in fig. 1, in some embodiments, the control switch 804 includes a first foot switch 8041 and a second foot switch 8042 disposed on the ground under the operation table 1, the first foot switch 8041 is electrically connected to the vacuum generator 701, the second foot switch 8042 is electrically connected to the electric push rod 801, where the first foot switch 8041 is used for controlling the suction and blowing of the vacuum generator 701 so as to control the vacuum chuck 702 to suck the semiconductor wafer or release the semiconductor wafer, and the second stroke switch 803 is used for turning on the electric push rod 801 when it is pressed down again when it reaches the second stroke switch 803.

As shown in fig. 1, in some embodiments, a plurality of stage plates 9 are disposed on the operation table 1, and the stage plates 9 are used for placing semiconductor wafers to be mounted.

As shown in fig. 1, in some embodiments, the first travel switch 802 and the second travel switch 803 are electrically connected to the electric push rod 801.

It should also be noted that the terms "comprises," "comprising," or any other variation thereof, are intended to cover a non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements does not include only those elements but may include other elements not expressly listed or inherent to such process, method, article, or apparatus. Without further limitation, an element defined by the phrase "comprising an … …" does not exclude the presence of other like elements in a process, method, article, or apparatus that comprises the element.

The above examples are to be construed as merely illustrative and not limitative of the remainder of the disclosure. After reading the description of the utility model, the skilled person can make various changes or modifications to the utility model, and these equivalent changes and modifications also fall into the scope of the utility model defined by the claims.

Claims (7)

1. A chip mounting device for integrated circuit processing, comprising: comprises an operating platform (1), a bearing plate (2) is arranged above the operating platform (1), the bearing plate (2) is provided with a plurality of grooves (3) which are used for clamping the shell and limiting the position of the shell, a guide mechanism (4) is arranged on one side of the bearing plate (2) in the vertical direction, an operation plate (5) is arranged outside the guide mechanism (4) in a sliding manner, an operation groove (6) is formed on the back surface of the operation plate (5) corresponding to the groove (3), a clamping mechanism (7) for clamping the semiconductor wafer is arranged on the inner bottom wall of the operation groove (6), and the device also comprises a control mechanism (8) for controlling the operation plate (5) to move towards the bearing plate (2), after the clamping mechanism (7) clamps the semiconductor wafer, the operation plate (5) moves towards the bearing plate (2) to reach a chip mounting state.

2. The chip mounting device for integrated circuit processing according to claim 1, wherein the guiding mechanism (4) comprises a guiding rod (401) vertically mounted on the carrier plate (2) and a through slot (402) configured on the carrier plate (2), a vertical sliding sleeve (403) is fixedly disposed in the through slot (402), and the guiding rod (401) is slidably disposed in the sliding sleeve (403).

3. A chip mounting apparatus for ic processing according to claim 1, wherein said holding means (7) comprises a vacuum generator (701) installed on the outer wall of said operation table (1) and vacuum chucks (702) symmetrically installed at the four corners of said operation bath (6) for sucking the edge of the semiconductor wafer, said vacuum chucks (702) being connected to said vacuum generator (701) through a pipe.

4. A chip mounting apparatus for integrated circuit processing according to claim 3, wherein the control mechanism (8) includes an electric push rod (801) having one end fixed on the operation platform (1) and the other end fixedly mounted at the bottom of the operation board (5), a first travel switch (802) is mounted on the carrier board (2), a second travel switch (803) is mounted on a side wall of the support rod above the operation board (5), the first travel switch (802) is used for controlling the operation board (5) to move in reverse direction when the operation board moves downward, the second travel switch (803) is used for stopping the operation board (5) when the operation board (5) moves upward, and a control switch (804) is further included for controlling the electric push rod (801) and the vacuum generator (701).

5. A die attachment device according to claim 4 wherein the first and second travel switches (802, 803) are each electrically connected to the electrical push rod (801).

6. A chip device for integrated circuit processing according to claim 4, wherein the control switch (804) comprises a first foot switch (8041) and a second foot switch (8042) which are arranged on the ground under the operation table (1), the first foot switch (8041) is electrically connected with the vacuum generator (701), and the second foot switch (8042) is electrically connected with the electric push rod (801).

7. A chip mounting device for integrated circuit processing according to any one of claims 1-6, wherein a plurality of platform boards (9) are arranged on the operation table (1), and the platform boards (9) are used for placing semiconductor wafers to be mounted.

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