CN216847973U - Microwave monitoring circuit, microwave board card and microwave test equipment - Google Patents
Microwave monitoring circuit, microwave board card and microwave test equipment Download PDFInfo
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- CN216847973U CN216847973U CN202123417800.8U CN202123417800U CN216847973U CN 216847973 U CN216847973 U CN 216847973U CN 202123417800 U CN202123417800 U CN 202123417800U CN 216847973 U CN216847973 U CN 216847973U
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Abstract
The utility model provides a microwave monitoring circuit, microwave integrated circuit board and microwave test equipment, microwave monitoring circuit include radio frequency module, fault monitoring unit and microcontroller. The radio frequency module is used for receiving and transmitting radio frequency signals; the fault monitoring unit is electrically connected with the radio frequency module and is used for monitoring the current and/or voltage of the radio frequency module; and the microcontroller is electrically connected with the fault monitoring unit and is used for sampling the current and/or the voltage of the radio frequency module. The utility model discloses be used for solving the current defect that the operation that detects microwave test equipment's internal work state is not convenient enough.
Description
Technical Field
The utility model relates to the field of electronic technology, especially, relate to a microwave monitoring circuit, microwave integrated circuit board and microwave test equipment.
Background
Microwave refers to electromagnetic waves with a frequency between 300MHz and 300 GHz. The microwave frequency is higher than the frequency of a general radio wave, and is also generally called "ultra high frequency electromagnetic wave". The basic properties of microwaves are generally represented by three characteristics, namely penetration, reflection and absorption. For glass, plastic and porcelain, microwaves almost pass through without being absorbed. The microwave is absorbed into water and food, and the microwave is self-heated. And for metal objects, the microwave is reflected.
The microwave test equipment is used for testing the performance and parameters of components, antennas, feeders, circuits, complete machines, systems, propagation media and links working in a microwave band. The existing microwave test equipment generally has no monitoring means for the internal working state. But only through the interactive interface access of the microwave test equipment, if the interactive interface does not respond, the abnormal work is judged. Therefore, various fault points (such as area points with abnormal voltage, current and temperature) cannot be accurately positioned, and the signal link of the microwave test equipment needs to be checked one by one, namely, the operation of detecting the internal working state of the existing microwave test equipment is not convenient enough.
SUMMERY OF THE UTILITY MODEL
The utility model provides a microwave monitoring circuit, microwave integrated circuit board and microwave test equipment, the utility model is used for solving the not enough convenient defect of operation of the inside operating condition of current detection microwave test equipment.
The utility model provides a microwave monitoring circuit, include:
the radio frequency module is used for receiving and transmitting radio frequency signals;
the fault monitoring unit is electrically connected with the radio frequency module and is used for monitoring the current and/or the voltage of the radio frequency module; and
and the microcontroller is electrically connected with the fault monitoring unit and is used for sampling the current and/or the voltage of the radio frequency module.
According to the utility model provides a pair of microwave monitoring circuit, microcontroller includes the analog-to-digital conversion unit, the analog-to-digital conversion unit with fault monitoring unit electric connection.
According to the utility model provides a pair of microwave monitoring circuit, microwave monitoring circuit is still including being close to the temperature monitoring unit that radio frequency module set up, temperature monitoring unit with microcontroller electric connection.
According to the utility model provides a pair of microwave monitoring circuit, microwave monitoring circuit still includes the bottom plate portion, radio frequency module locates on the bottom plate portion, the temperature monitoring unit spacing in radio frequency module with in the vacant space that forms between the bottom plate portion.
According to the utility model provides a pair of microwave monitoring circuit, the fault monitoring unit is including being used for the monitoring the current detection chip of radio frequency module electric current, be used for the monitoring the voltage detection chip of radio frequency module voltage is used for the monitoring arbitrary one of the mixed detection chip of radio frequency module voltage and electric current.
The utility model provides a still provide a microwave integrated circuit board, including foretell microwave monitoring circuit, and with microwave monitoring circuit's microcontroller electric connection's first connector.
According to the utility model provides a pair of microwave board card, first connector includes CPCI connector or PXIE connector.
The utility model also provides a microwave test device, which comprises the microwave board card, a back plate electrically connected with the microwave board card and a main control plate electrically connected with the back plate; the main control board is used for monitoring the current and/or the voltage of the radio frequency module of the microwave board card.
According to the utility model provides a microwave test equipment, the backplate includes the second connector of microwave integrated circuit board electric connection, the third connector of main control board electric connection and auxiliary processor; the auxiliary processor is electrically connected with the second connector and the third connector respectively, and the auxiliary processor is used for realizing data interaction between the main control board and the microwave board card.
According to the utility model provides a pair of microwave test equipment, CPCI connector or PXIE connector are chooseed for use to second connector and third connector.
The utility model provides a microwave monitoring circuit, microwave board card and microwave test equipment, through fault monitoring unit and the radio frequency module electric connection, and then fault monitoring unit monitors the electric current and/or the voltage of radio frequency module; and the microcontroller is electrically connected with the fault monitoring unit and samples the current and/or voltage of the radio frequency module. The current and/or voltage signal of the radio frequency module can be read from the I/O port of the microcontroller, and the radio frequency module can be judged to be in a stable working state or an abnormal working state according to the change/fluctuation of the voltage and/or the current. The utility model discloses can conveniently detect microwave test equipment's internal work state.
Drawings
In order to more clearly illustrate the technical solutions of the present invention or the prior art, the following briefly introduces the drawings required for the embodiments or the prior art descriptions, and obviously, the drawings in the following description are some embodiments of the present invention, and for those skilled in the art, other drawings can be obtained according to the drawings without creative efforts.
Fig. 1 is a schematic circuit diagram of a microwave monitoring circuit provided by the present invention;
fig. 2 is a schematic circuit diagram of a microwave board card provided by the present invention;
fig. 3 is a schematic circuit diagram of the microwave testing apparatus provided by the present invention.
Reference numerals:
100: a microwave monitoring circuit; 10: a radio frequency module; 20: a fault monitoring unit; 30: a microcontroller; 40: a temperature monitoring unit; 200: a microwave board card; 201: a first connector; 202: an interface processor; 203: a low speed digital to analog converter; 204: a high-speed analog-to-digital converter; 205: a high speed digital to analog converter; 206: a high-speed DDR memory; 1000: microwave test equipment; 300: a back plate; 400: a main control board; 401: a host controller; 402: a display screen; 403: a keyboard; 301: a second connector; 302: a third connector; 303: an auxiliary processor; 404: and a fourth connector.
Detailed Description
To make the objects, technical solutions and advantages of the present invention clearer, the drawings of the present invention are combined to clearly and completely describe the technical solutions of the present invention, and obviously, the described embodiments are some embodiments of the present invention, not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative efforts belong to the protection scope of the present invention.
The microwave test equipment is used for testing the performance and parameters of components, antennas, feeders, circuits, complete machines, systems, propagation media and links working in a microwave band. The existing microwave test equipment usually has no monitoring means for the internal working state. But only through the interactive interface access of the microwave test equipment, if the interactive interface does not respond, the abnormal work is judged. Therefore, various fault points (such as area points with abnormal voltage, current and temperature) cannot be accurately positioned, and the fault points need to be checked one by one along a signal link of the microwave test equipment, namely, the operation of detecting the internal working state of the existing microwave test equipment is not convenient enough.
In view of this, the utility model provides a microwave monitoring circuit, microwave integrated circuit board and microwave test equipment for solve the current defect that the operation that detects microwave test equipment's internal work state is not convenient enough.
The microwave monitoring circuit 100 of the present invention is described below with reference to fig. 1, please refer to fig. 1, the microwave monitoring circuit of the present invention includes: a radio frequency module 10, a fault monitoring unit 20 and a microcontroller 30.
The rf module 10 is used for receiving and transmitting rf signals.
And a fault monitoring unit 20 electrically connected to the rf module 10, for monitoring the current and/or voltage of the rf module 10. Specifically, the fault monitoring unit 20 includes a current detection chip for monitoring the current of the radio frequency module 10, a voltage detection chip for monitoring the voltage of the radio frequency module 10, and any one of a mixed detection chip for monitoring the voltage and the current of the radio frequency module 10. Through the electrical connection between the fault monitoring unit 20 and the rf module 10, the fault monitoring unit 20 can detect the current and/or voltage of the rf module 10, and detect the operating state of the rf module 10 according to the current and/or voltage change of the rf module 10.
In some embodiments, the current sense die is model AD8217, manufactured by Addeno semiconductor. The voltage detection chip can adopt a voltage detection chip of model CN61C produced by Shanghai Yun electronics Co., Ltd; alternatively, a PW4200 voltage detection chip manufactured by West Flat core Microcos may be used.
It should be noted that, in order to facilitate simultaneous monitoring of the voltage and the current of the radio frequency module 10, the operating state of the radio frequency module 10 is monitored through two dimensions of the voltage and the current, so as to improve the accuracy and reliability of monitoring the operating state of the radio frequency module 10. In some embodiments, the fault monitoring unit 20 employs a hybrid detection chip that simultaneously monitors the voltage and current of the rf module 10. Specifically, the hybrid detection chip may be a voltage current detection chip manufactured by ideno semiconductor corporation and having a model number LTC 2991.
And the microcontroller 30 is electrically connected with the fault monitoring unit 20 and is used for sampling the current and/or the voltage of the radio frequency module 10. Specifically, the microcontroller 30 may be any one of the microcontrollers 30 or a single-chip microcomputer. For example, microcontroller 30 may be an embedded single-chip microcomputer of type STM32F446VET6, manufactured by Italian semiconductor. And connecting two IIC signal wires of the microcontroller 30STM32F446VET6 to the radio frequency module 10 for voltage and current detection of the radio frequency module 10.
The fault monitoring unit 20 is electrically connected to the rf module 10, and the fault monitoring unit 20 monitors the current and/or voltage of the rf module 10; and then electrically connected to the fault monitoring unit 20 through the microcontroller 30, and the microcontroller 30 samples the current and/or voltage of the rf module 10. By reading the current and/or voltage signal of the rf module 10 from the I/O port of the microcontroller 30, it can be determined whether the rf module 10 is in a stable operation state or an abnormal operation state according to the variation/fluctuation of the voltage and/or current. The utility model discloses can conveniently detect microwave test equipment's internal work state.
Further, the microcontroller 30 includes an analog-to-digital conversion unit electrically connected to the fault monitoring unit 20. The analog-to-digital conversion unit is electrically connected with the fault monitoring unit 20, and the voltage and current are sampled by the analog-to-digital conversion unit arranged in the single chip microcomputer, so that other external devices are effectively reduced, and the number of devices and the hardware cost are reduced. The working state of the radio frequency module 10 can be effectively judged through the voltage and current collected by the analog-to-digital conversion unit arranged in the single chip microcomputer, and whether the radio frequency module 10 works stably or abnormally can be judged when the voltage and current changes/fluctuates.
In other aspects of the present invention, the microwave monitoring circuit further comprises a temperature monitoring unit 40 disposed near the rf module 10, the temperature monitoring unit 40 is electrically connected to the microcontroller 30. By arranging the temperature monitoring unit 40 close to the rf module 10 and electrically connecting the temperature monitoring unit 40 with the microcontroller 30, the real-time temperature of the rf module 10 can be read by the microcontroller 30. Thereby determining the operating state of the rf module 10.
It should be noted that the radio frequency module 10 is predefined to have a normal temperature range, and when the microcontroller 30 reads that the real-time temperature of the radio frequency module 10 through the temperature monitoring unit 40 is within the preset normal temperature range, it indicates that the radio frequency module 10 is in a normal operating state. When the real-time temperature read by the microcontroller 30 is not within the preset normal temperature range, it indicates that the rf module 10 is in an abnormal operating state.
It should be noted that the temperature monitoring unit 40 uses the DS18B20 to monitor the radio frequency module 10, and the temperature monitoring unit 40 may use 5Vmux for power supply and an IIC interface for communication with the microprocessor.
Further, in order to improve the accuracy of the temperature detection of the radio frequency module 10. The microwave monitoring circuit further includes a bottom plate portion (not shown), the rf module 10 is disposed on the bottom plate portion, and the temperature monitoring unit 40 is limited in an empty space formed between the rf module 10 and the bottom plate portion. Specifically, utilize temperature monitoring unit 40 to weld upwards from bottom plate portion, do the cutting on the bottom plate portion and dodge, guarantee that temperature monitoring unit 40's whole tube embedding is in bottom plate portion to temperature monitoring unit 40 can be cliied and have stable atress by bottom plate portion and radio frequency module 10, thereby radio frequency module 10 can carry out effective heat transfer, improves the accuracy of radio frequency module 10 temperature-detecting.
Referring to fig. 2, the present invention further provides a microwave board 200, which includes the microwave monitoring circuit 100 and a first connector 201 electrically connected to the microcontroller 30 of the microwave monitoring circuit. The specific structure of the microwave monitoring circuit 100 refers to the above embodiments, and since the microwave board card 200 adopts all technical solutions of all the above embodiments, all beneficial effects brought by the technical solutions of the above embodiments are at least achieved, and are not described in detail herein.
Wherein the first connector 201 comprises a CPCI connector or a PXIE connector. The microcontroller 30 can be electrically connected to the CPCI connector or the PXIE connector through its own serial port.
The microwave board 200 further includes an interface processor 202, where the interface processor 202 may be implemented by an FPGA (Field Programmable Gate Array), and the interface processor 202 is configured to communicate with the outside through auxiliary logic interfaces on the CPCI connector, such as PCIe, SRIO, and TRIG. The interface processor 202 has an on-chip FLASH capable of externally writing contents such as board card information and calibration data, and has an on-chip RAM for realizing data caching. The interface processor 202 may specifically employ an FPGA having a model number XC7Z015-1CLG485I, available from Xilinx corporation.
In addition, the microwave board 200 further includes a low-speed digital-to-analog converter 203, a high-speed analog-to-digital converter 204, a high-speed digital-to-analog converter 205, a high-speed DDR memory 206, and the like, which are selectively configured according to different functional requirements.
Referring to fig. 3, the present invention further provides a microwave testing apparatus 1000, which includes the microwave board 200, a back plate 300 electrically connected to the microwave board 200, and a main control board 400 electrically connected to the back plate 300; the main control board 400 is configured to monitor a current and/or a voltage of the rf module 10 of the microwave board 200. The specific structures of the microwave monitoring circuit 10 and the microwave board card 200 refer to the above embodiments, and since the microwave testing device adopts all the technical solutions of all the above embodiments, all the beneficial effects brought by the technical solutions of the above embodiments are at least achieved, and are not described in detail herein.
Specifically, the main control board 400 includes a host controller 401, a display screen 402, a keyboard 403, and the like, and completes the whole human-computer interaction function. The backplane 300 realizes a control signal distribution function from the main control board 400 to the microwave board cards 200, a power supply distribution function, and a control signal distribution function among the microwave board cards 200; the microwave board 200 is used for generating a reference clock or generating a local oscillator signal.
The voltage, current and temperature information of the radio frequency module 10 collected by the microwave board card 200 is transmitted to the main control board 400 through the backboard 300 and the microwave board card 200, and then the backboard 300 and the main control board 400 are electrically connected. Thus, the main control board 400 reads the voltage, current and temperature information of the radio frequency module 10, and displays the voltage, current and temperature of the radio frequency module 10 through the display screen.
Specifically, the backplane 300 includes a second connector 301 electrically connected to the microwave board 200, a third connector 302 electrically connected to the main control board 400, and an auxiliary processor 303; the auxiliary processor 303 is electrically connected to the second connector 301 and the third connector 302, respectively, and the auxiliary processor 303 is configured to implement data interaction between the main control board 400 and the microwave board card 200. The main control board 400 further includes a fourth connector 404 electrically connected to the third connector 302. The auxiliary processor can be implemented by an FPGA (Field Programmable Gate Array). Specifically, the auxiliary processor may be an FPGA of Xilinx corporation model XC7Z015-1CLG 485I.
Specifically, the second connector 301, the third connector 302 and the fourth connector 404 may be CPCI connectors or PXIE connectors.
Finally, it should be noted that: the above embodiments are only used to illustrate the technical solution of the present invention, and not to limit it; although the present invention has been described in detail with reference to the foregoing embodiments, it should be understood by those skilled in the art that: the technical solutions described in the foregoing embodiments may still be modified, or some technical features may be equivalently replaced; such modifications or substitutions do not depart from the spirit and scope of the technical solutions of the embodiments of the present invention.
Claims (10)
1. A microwave monitoring circuit, comprising:
the radio frequency module is used for receiving and transmitting radio frequency signals;
the fault monitoring unit is electrically connected with the radio frequency module and is used for monitoring the current and/or the voltage of the radio frequency module; and
and the microcontroller is electrically connected with the fault monitoring unit and is used for sampling the current and/or the voltage of the radio frequency module.
2. A microwave monitoring circuit according to claim 1 wherein the microcontroller comprises an analog to digital conversion unit, the analog to digital conversion unit being electrically connected to the fault monitoring unit.
3. The microwave monitoring circuit of claim 1 further comprising a temperature monitoring unit disposed proximate to the rf module, the temperature monitoring unit being electrically connected to the microcontroller.
4. A microwave monitoring circuit according to claim 3, further comprising a bottom plate portion, wherein the rf module is disposed on the bottom plate portion, and the temperature monitoring unit is limited in an empty space formed between the rf module and the bottom plate portion.
5. The microwave monitoring circuit according to claim 1, wherein the fault monitoring unit includes any one of a current detection chip for monitoring the rf module current, a voltage detection chip for monitoring the rf module voltage, and a hybrid detection chip for monitoring the rf module voltage and current.
6. A microwave board card comprising the microwave monitoring circuit of any one of claims 1 to 5, and a first connector electrically connected to a microcontroller of the microwave monitoring circuit.
7. The microwave board card of claim 6, wherein the first connector comprises a CPCI connector or a PXIE connector.
8. Microwave test equipment, comprising the microwave board of claim 6 or 7, a backplane electrically connected to the microwave board, and a main control board electrically connected to the backplane; the main control board is used for monitoring the current and/or the voltage of the radio frequency module of the microwave board card.
9. A microwave test apparatus according to claim 8, wherein the backplane includes a second connector electrically connected to a microwave board card, a third connector electrically connected to the main control board, and an auxiliary processor; the auxiliary processor is electrically connected with the second connector and the third connector respectively, and the auxiliary processor is used for realizing data interaction between the main control board and the microwave board card.
10. The microwave test equipment of claim 9, wherein the second connector and the third connector are CPCI connectors or PXIE connectors.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202123417800.8U CN216847973U (en) | 2021-12-31 | 2021-12-31 | Microwave monitoring circuit, microwave board card and microwave test equipment |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202123417800.8U CN216847973U (en) | 2021-12-31 | 2021-12-31 | Microwave monitoring circuit, microwave board card and microwave test equipment |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN216847973U true CN216847973U (en) | 2022-06-28 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202123417800.8U Active CN216847973U (en) | 2021-12-31 | 2021-12-31 | Microwave monitoring circuit, microwave board card and microwave test equipment |
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| CN (1) | CN216847973U (en) |
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- 2021-12-31 CN CN202123417800.8U patent/CN216847973U/en active Active
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