CN216834773U

CN216834773U - Pin-connected panel fretwork magazine for semiconductor package

Info

Publication number: CN216834773U
Application number: CN202220436661.9U
Authority: CN
Inventors: 许松
Original assignee: Wuxi Jingzheng Electronic Technology Co ltd
Current assignee: Wuxi Jingzheng Electronic Technology Co ltd
Priority date: 2022-03-02
Filing date: 2022-03-02
Publication date: 2022-06-28
Anticipated expiration: 2032-03-02

Abstract

The utility model discloses an assembled hollowed-out material box for semiconductor packaging, which comprises two side plates, a top plate, a bottom plate and two sealing covers, wherein the side plates, the top plate and the bottom plate are installed in a rectangular shape, a plurality of through gas grooves are formed in the surfaces of the side plates, the top plate and the bottom plate, clamping grooves are formed in the surfaces of the side plates, clamping plates are fixed on two sides of each sealing cover and clamped into the clamping grooves, clamping plates are fixed on the inner sides of the two side plates, and the number of the clamping plates is a plurality; this practicality can conveniently replace and maintain the structure of damage through the four board pin-connected panel structures that set up to adopt the closing cap to seal the both sides opening, guarantee the stability of connecting, form the structure of fretwork through the gas tank of seting up in addition, guaranteed the abundant entering of temperature, when having accelerated drying efficiency, can alleviate holistic weight.

Description

Pin-connected panel fretwork magazine for semiconductor package

Technical Field

The utility model relates to a magazine field specifically is a pin-connected panel fretwork magazine for semiconductor package.

Background

The magazine generally refers to the box body structure that holds the material, and in semiconductor processing, the magazine of great specification can be used to the part condition under, and the magazine that pulls out through the mould when the specification is great, not only inconvenient removal causes the damage in addition easily, is difficult to the maintenance, consequently needs to provide a semiconductor encapsulation and uses pin-connected panel fretwork magazine.

SUMMERY OF THE UTILITY MODEL

An object of the utility model is to provide a pin-connected panel fretwork magazine is used in semiconductor package to solve the magazine that pulls out through the mould, when the specification is great, not only inconvenient removal causes the damage moreover easily, is difficult to the problem of maintenance.

In order to achieve the above purpose, the utility model provides a following technical scheme: the utility model provides a pin-connected panel fretwork magazine for semiconductor package, includes two sideboard, roof, bottom plate and two closing caps, sideboard, roof and bottom plate are the rectangle installation, the gas tank that a plurality of runs through is all seted up on the surface of sideboard, roof and bottom plate, the draw-in groove has been seted up on the surface of sideboard, the both sides of closing cap all are fixed with the cardboard, the inside of draw-in groove, two is gone into to the cardboard card the inboard of sideboard is fixed with splint, the quantity of splint is a plurality of.

Preferably, a baffle is fixed at the top of the sealing cover, and bayonets corresponding to the clamping grooves are formed in the two sides of the top plate and the bottom plate.

Preferably, the clamping plate comprises a connecting plate welded with the side plate, a first clamping plate is fixed at the upper end of the connecting plate, and a second clamping plate is fixed at the lower end of the connecting plate.

Preferably, the first clamping plate and the second clamping plate are both in obtuse angle structures, and the first clamping plate and the second clamping plate are symmetrically arranged at the upper end and the lower end of the connecting plate.

Preferably, the first clamping plate is a plurality of plate bodies which are arranged at intervals and have obtuse-angle structures, and the second clamping plate is a plurality of plate bodies which are clamped into the gaps between the first clamping plates and have obtuse-angle structures.

Preferably, the inner sides of the lower parts of the two side plates are fixed with the bottom plate through bolts, and the tops of the two side plates are fixed with the top plate through bolts.

Compared with the prior art, the beneficial effects of the utility model are that:

through the four board pin-connected panel structures that set up, can conveniently replace and maintain the structure of damage, and adopt the closing cap to seal the both sides opening, guarantee the stability of connection, in addition through the structure of the gas tank formation fretwork of seting up, the abundant entering of temperature has been guaranteed, when drying efficiency has been accelerated, can alleviate holistic weight, in addition through the splint that set up, the centre gripping mode of deformation formula is provided, the inboard of splint is gone into to the charging tray card that will hold the semiconductor, extrude through the mode of deformation, not only convenient the dismantlement, and fixed effect is stable, contrast current structure, and certain beneficial effect is possessed.

Drawings

Fig. 1 is a front view of the present invention;

fig. 2 is a side view of the present invention;

fig. 3 is a top view of the present invention;

FIG. 4 is a schematic structural view of the cover of the present invention;

fig. 5 is a schematic structural view of the splint of the present invention.

In the figure: 10. a side plate; 11. a card slot; 12. a splint; 121. a connecting plate; 122. a first clamping plate; 123. a second clamping plate; 20. a top plate; 21. a bayonet; 22. an air tank; 30. a base plate; 40. sealing the cover; 41. a baffle plate; 42. and (4) clamping the board.

Detailed Description

The technical solutions in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments in the present invention, all other embodiments obtained by a person skilled in the art without creative work belong to the protection scope of the present invention.

Referring to fig. 1-5, an assembled hollow magazine for semiconductor packaging comprises two side plates 10, a top plate 20, a bottom plate 30 and two seal covers 40, wherein the side plates 10, the top plate 20 and the bottom plate 30 are installed in a rectangular shape, the surfaces of the side plates 10, the top plate 20 and the bottom plate 30 are all provided with a plurality of through air grooves 22, the surface of the side plate 10 is provided with a clamping groove 11, clamping plates 42 are fixed on two sides of the seal cover 40, the clamping plates 42 are clamped into the clamping grooves 11, clamping plates 12 are fixed on the inner sides of the two side plates 10, and the number of the clamping plates 12 is a plurality;

through the rail mounted between draw-in groove 11 and cardboard 42 and be connected, form the sliding construction that can easily dismantle, closing cap 40 provides the seal to opening department, ventilates through gas tank 22 and dries to gas tank 22 has reduced holistic weight, convenient transportation and installation.

The top of the sealing cover 40 is fixed with a baffle 41, and bayonets 21 corresponding to the positions of the slots 11 are formed on both sides of the top plate 20 and the bottom plate 30, so as to provide a space for the movement of the clamping plate 42 and avoid blocking the movement of the clamping plate 42.

The clamping plate 12 comprises a connecting plate 121 welded with the side plate 10, a first clamping plate 122 is fixed at the upper end of the connecting plate 121, a second clamping plate 123 is fixed at the lower end of the connecting plate 121, and a tray for containing semiconductors is clamped and fixed through the first clamping plate 122 and the second clamping plate 123.

Wherein, first grip block 122 all is obtuse angle structure with second grip block 123, first grip block 122 is the symmetry with second grip block 123 and sets up the upper and lower both ends at connecting plate 121, when the charging tray was inserted, can extrude first grip block 122 and second grip block 123, thereby make first grip block 122 and second grip block 123 produce deformation and form the angular deflection, loosen the back, first grip block 122 and second grip block 123 have the trend of restoring to deformation, thereby will place the plate body centre gripping between the two fixed.

Wherein, the first grip block 122 is the plate body that is obtuse angle structure that a plurality of interval set up, and the second grip block 123 is the plate body that is obtuse angle structure of the interval notch between the first grip block 122 is gone into for a plurality of card, and first grip block 122 and second grip block 123 can insert the interval notch between each other to reduced the space that provides deformation and taken up, can install more splint 12 in inside.

The lower inner sides of the two side plates 10 are fixed with the bottom plate 30 through bolts, the tops of the two side plates 10 are fixed with the top plate 20 through bolts, and the side plates can be conveniently detached through a bolt fixing mode.

The working principle is as follows: before using, at first with two sideboard 10 through the bolt, roof 20, bottom plate 30 fixes and forms the rectangle structure, then can insert the inboard of splint 12 with the charging tray that holds the semiconductor, produce deformation and carry out the centre gripping to the charging tray between first grip block 122 and the second grip block 123, then go into the closing cap from the draw-in groove 11 card of both sides and can accomplish fixedly, can dry from the gas tank 22 of surface, and owing to seted up gas tank 22, holistic weight has been reduced, during the transportation, can also dismantle into single plate body earlier wholly, then transport, it is more convenient to transport.

It is noted that, herein, relational terms such as first and second, and the like may be used solely to distinguish one entity or action from another entity or action without necessarily requiring or implying any actual such relationship or order between such entities or actions. Also, the terms "comprises," "comprising," or any other variation thereof, are intended to cover a non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements does not include only those elements but may include other elements not expressly listed or inherent to such process, method, article, or apparatus.

Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that changes, modifications, substitutions and alterations can be made in these embodiments without departing from the principles and spirit of the invention, the scope of which is defined in the appended claims and their equivalents.

Claims

1. The utility model provides a semiconductor packaging is with pin-connected panel fretwork magazine, includes two sideboard (10), roof (20), bottom plate (30) and two closing caps (40), its characterized in that: sideboard (10), roof (20) and bottom plate (30) are the rectangle installation, gas groove (22) that a plurality of runs through have all been seted up on the surface of sideboard (10), roof (20) and bottom plate (30), draw-in groove (11) have been seted up on the surface of sideboard (10), the both sides of closing cap (40) all are fixed with cardboard (42), inside, two of draw-in groove (11) are gone into to cardboard (42) the inboard of sideboard (10) is fixed with splint (12), the quantity of splint (12) is a plurality of.

2. The assembling type hollowed-out material box for semiconductor packaging according to claim 1, wherein: the top of closing cap (40) is fixed with baffle (41), bayonet socket (21) that correspond with draw-in groove (11) position are all seted up to the both sides of roof (20) and bottom plate (30).

3. The assembling type hollowed-out material box for semiconductor packaging according to claim 1, wherein: the clamping plate (12) comprises a connecting plate (121) welded with the side plate (10), a first clamping plate (122) is fixed at the upper end of the connecting plate (121), and a second clamping plate (123) is fixed at the lower end of the connecting plate (121).

4. The assembling type hollowed-out material box for semiconductor packaging according to claim 3, wherein: the first clamping plate (122) and the second clamping plate (123) are both in obtuse-angle structures, and the first clamping plate (122) and the second clamping plate (123) are symmetrically arranged at the upper end and the lower end of the connecting plate (121).

5. The assembling type hollowed-out material box for semiconductor packaging according to claim 4, wherein: first grip block (122) are the plate body that is the obtuse angle structure that a plurality of interval set up, second grip block (123) are the plate body that is the obtuse angle structure of the interval notch between first grip block (122) is gone into to a plurality of card.

6. The assembling type hollowed-out material box for semiconductor packaging according to claim 1, wherein: the inner sides of the lower parts of the two side plates (10) are fixed with the bottom plate (30) through bolts, and the tops of the two side plates (10) are fixed with the top plate (20) through bolts.