CN216820455U

CN216820455U - Military semiconductor silicon carbide electronic component

Info

Publication number: CN216820455U
Application number: CN202123169054.5U
Authority: CN
Inventors: 叶明华
Original assignee: Jiangsu Huanneng Silicon Carbon Ceramics Co ltd
Current assignee: Jiangsu Huanneng Silicon Carbon Ceramics Co ltd
Priority date: 2021-12-16
Filing date: 2021-12-16
Publication date: 2022-06-24
Anticipated expiration: 2031-12-16

Abstract

The utility model relates to the technical field of electronic components, in particular to a military semiconductor silicon carbide electronic component which comprises a fixed shell and a heat radiating piece, wherein the top of the fixed shell is fixedly clamped into the heat radiating piece; the fixed shell comprises a shell body, an edge plate and a sawtooth clamping strip, the top of a side plate of the shell body is bent inwards to form the edge plate, and the inner edge of the edge plate is fixedly connected with the sawtooth clamping strip; the sawtooth clamping strip is fixedly clamped with a heat radiating piece; the heat dissipation part comprises a heat dissipation plate, a heat dissipation sheet, a depth adjusting sawtooth piece and a buffer block, and the middle of the heat dissipation plate is a flat plate. The utility model realizes the fixation and the disassembly of the heat dissipation plate by the depth adjustment sawtooth parts on the two sides of the heat dissipation part, and can realize the gradual deep clamping of the heat dissipation plate because the depth adjustment sawtooth parts are clamped with the sawtooth clamping strips, so that the heat dissipation plate can be flexibly arranged on electronic components with any depth.

Description

Military semiconductor silicon carbide electronic component

Technical Field

The utility model relates to the technical field of electronic components, in particular to a military semiconductor silicon carbide electronic component.

Background

Electronic electrical components can produce heat after the equipment is used, because the assembly is small, and inside installs the heat dissipation fan additional and is unable to be realized, can only take the mode of installing the fin additional to come the heat conduction, and this heat dissipation mode, the fin is small, and is big with the inside electronic components interval of casing, and the radiating effect is not very ideal.

SUMMERY OF THE UTILITY MODEL

The utility model aims to provide a semiconductor silicon carbide electronic component for military industry, which aims to solve the problems that the size of a radiating fin is small, the distance between the radiating fin and the electronic component in a shell is large, and the radiating effect is not ideal in the background technology.

In order to achieve the purpose, the utility model provides the following technical scheme:

the military semiconductor silicon carbide electronic component comprises a fixed shell and a heat dissipation piece, wherein the top of the fixed shell is fixedly clamped into the heat dissipation piece;

the fixed shell comprises a shell body, an edge plate and a sawtooth clamping strip, the top of a side plate of the shell body is bent inwards to form the edge plate, and the sawtooth clamping strip is fixedly connected to the inner edge of the edge plate;

the sawtooth clamping strip is fixedly clamped with a heat radiating piece;

the heat dissipation piece includes heating panel, fin, degree of depth regulation sawtooth spare and buffer block, the middle part of heating panel is dull and stereotyped, the both sides kickup of heating panel forms the arc, the flat board of heating panel goes up the side perpendicular, interval fixed mounting fin, the arc medial surface interval of heating panel sets up degree of depth regulation sawtooth spare, the sawtooth card strip agrees with the card and fixes the position between degree of depth regulation sawtooth spare, the dull and stereotyped downside of heating panel evenly sets up the buffer block.

As a further description of the above technical solution:

the height of the radiating fins is larger than the depth of the concave of the radiating plate.

As a further description of the above technical solution:

the width of the heat dissipation plate is the same as the width of the top of the shell.

As a further description of the above technical solution:

the length of the sawtooth clamping strip is the same as that of the depth adjusting sawtooth part.

As a further description of the above technical solution:

the depth adjusting sawtooth parts are arranged at the upper part and the middle part of the arc-shaped plate of the heat dissipation plate.

As a further description of the above technical solution:

the buffer block is of a hemispherical structure and is made of insulating rubber.

Compared with the prior art, the utility model provides a military semiconductor silicon carbide electronic component which has the following beneficial effects:

1. according to the utility model, the shell of the electronic component is split, no radiating fin is additionally arranged in the electronic component, the radiating piece is clamped and installed at the top of the shell, the sawtooth piece is adjusted by the depth on the two sides of the radiating piece, so that the fixing and the dismounting of the radiating plate are realized, and the sawtooth piece is adjusted by the depth and clamped with the sawtooth clamping strip, so that the radiating plate can be gradually deeply clamped, and can be flexibly installed on the electronic component with any depth;

2. according to the utility model, the buffer block is utilized to provide a space between the heat dissipation plate and the electronic component, the buffer block is used for protecting the electronic component, the interval between the heat dissipation plate and the electronic component is minimized while the heat dissipation plate is not pressed on the electronic component, so that heat dissipation can be more quickly transferred.

Drawings

FIG. 1 is a schematic view of a heat sink mounting structure according to the present invention;

FIG. 2 is a schematic view of the assembled rear view of the present invention;

FIG. 3 is a schematic top view of the assembled structure of the present invention;

FIG. 4 is a schematic view of a sawtooth fastening strip according to the present invention.

Illustration of the drawings:

1. a housing; 2. a rim plate; 3. a saw tooth clamping strip; 4. a heat dissipation plate; 5. a heat sink; 6. a depth adjustment serrated member; 7. and a buffer block.

Detailed Description

The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.

Example (b):

referring to fig. 1 to 4, the utility model provides a military semiconductor silicon carbide electronic component, which includes a fixed casing and a heat sink, wherein the top of the fixed casing is fixedly clamped into the heat sink;

the fixed shell comprises a shell body 1, an edge plate 2 and a sawtooth clamping strip 3, wherein the top of a side plate of the shell body 1 is bent inwards to form the edge plate 2, and the sawtooth clamping strip 3 is fixedly connected with the inner edge of the edge plate 2;

the heat sink is fixedly arranged at the sawtooth clamping strip 3;

the radiating piece includes heating panel 4, fin 5, depth adjustment sawtooth spare 6 and buffer block 7, the middle part of heating panel 4 is dull and stereotyped, the both sides kickup of heating panel 4 forms the arc, the side is perpendicular on the flat board of heating panel 4, interval fixed mounting fin 5, the arc medial surface interval of heating panel 4 sets up depth adjustment sawtooth spare 6, sawtooth card strip 3 agrees with the card and fixes the position between depth adjustment sawtooth spare 6, the flat board downside of heating panel 4 evenly sets up buffer block 7.

Specifically, as shown in fig. 1 and 2, the height of the heat sink 5 is greater than the depth of the recess of the heat sink 4, so as to facilitate contact with the wind from the external heat sink fan.

Specifically, as shown in fig. 3, the width of the heat dissipation plate 4 is the same as the width of the top of the housing 1, so that the housing 1 can be easily sealed.

Specifically, as shown in fig. 3 and 4, the length of the serration strip 3 is the same as that of the depth adjustment serration member 6, and the serration strip has sealability after being caught.

Specifically, as shown in fig. 1 and 2, the depth adjustment serrations 6 are provided at the upper and middle portions of the arc-shaped plate of the heat dissipation plate 4 to keep the arc-shaped bent portion smooth, so that the heat dissipation plate 4 is easily snapped into the top of the case 1.

Specifically, as shown in fig. 2, the buffer block 7 is of a hemispherical structure, the buffer block 7 is made of insulating rubber, and the contact surface between the buffer block 7 and the electronic component is small, so that the electronic component cannot be damaged, and the buffer block is insulating and high in insulating safety.

The working principle is as follows:

when using, push down heat dissipation plate 4 to the top of casing 1, because the both sides of heat dissipation plate 4 are the arc, heat dissipation plate 4 easily puts into like this, when putting into, when buffer block 7 slightly contacts the component in the casing 1, then stop moving down, at this moment, sawtooth card strip 3 card is in the position between the depth adjustment sawtooth spare 6 that corresponds, heat dissipation plate 4 is just so fixed because the spacing of sawtooth card strip 3, the top of casing 1 has also realized complete sealed, casing 1 internal component generates heat, heat dissipation plate 4 and fin 5 disperse the heat transfer, because fin 5 highly is higher than the indent degree of depth of heat dissipation plate 4, the upper portion of fin 5 can contact the wind that outside heat dissipation fan bloated like this, thereby take away the heat on the heat dissipation piece fast.

Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that changes, modifications, substitutions and alterations can be made in these embodiments without departing from the principles and spirit of the utility model, the scope of which is defined in the appended claims and their equivalents.

Claims

1. The utility model provides a military project semiconductor carborundum electronic components and parts, includes fixed casing and radiating piece, its characterized in that: the top of the fixed shell is fixedly clamped into the heat dissipation piece;

the fixed shell comprises a shell body (1), an edge plate (2) and a sawtooth clamping strip (3), the top of a side plate of the shell body (1) is bent inwards to form the edge plate (2), and the inner edge of the edge plate (2) is fixedly connected with the sawtooth clamping strip (3);

the sawtooth clamping strip (3) is fixedly clamped with a heat dissipation piece;

the heat dissipation piece includes heating panel (4), fin (5), degree of depth regulation sawtooth spare (6) and buffer block (7), the middle part of heating panel (4) is dull and stereotyped, the both sides kickup of heating panel (4) forms the arc, the side is perpendicular, interval fixed mounting fin (5) on the flat board of heating panel (4), the arc medial surface interval of heating panel (4) sets up degree of depth regulation sawtooth spare (6), sawtooth card strip (3) agree with the card and fix the position between degree of depth regulation sawtooth spare (6), the dull and stereotyped downside of heating panel (4) evenly sets up buffer block (7).

2. The military semiconductor silicon carbide electronic component of claim 1, wherein: the height of the radiating fins (5) is larger than the depth of the concave parts of the radiating plates (4).

3. The military semiconductor silicon carbide electronic component of claim 1, wherein: the width of the heat dissipation plate (4) is the same as the width of the top of the shell (1).

4. The military semiconductor silicon carbide electronic component of claim 1, wherein: the length of the sawtooth clamping strip (3) is the same as that of the depth adjusting sawtooth part (6).

5. The military semiconductor silicon carbide electronic component of claim 1, wherein: the depth adjusting sawtooth parts (6) are arranged at the upper part and the middle part of the arc-shaped plate of the heat dissipation plate (4).

6. The military semiconductor silicon carbide electronic component of claim 1, wherein: the buffer block (7) is of a hemispherical structure, and the buffer block (7) is made of insulating rubber.