CN216820245U

CN216820245U - Wave-soldering furnace-passing carrier

Info

Publication number: CN216820245U
Application number: CN202123420653.XU
Authority: CN
Inventors: 张晨浩
Original assignee: Jiaxing Qiwang Electronic Technology Co ltd
Current assignee: Jiaxing Qiwang Electronic Technology Co ltd
Priority date: 2021-12-31
Filing date: 2021-12-31
Publication date: 2022-06-24
Anticipated expiration: 2031-12-31

Abstract

The utility model relates to a wave-soldering furnace carrier, which comprises a mother board and a daughter board, wherein a first through hole is formed in the middle of the mother board, a step edge is arranged in the first through hole, the daughter board is placed on the step edge, a board groove is formed in the middle of the daughter board, a second through hole is formed in the middle of the board groove, a first buckle for limiting the daughter board to be separated from the mother board is arranged on the mother board, and a second buckle for limiting a PCB (printed circuit board) to be separated from the daughter board is arranged on the daughter board. According to the utility model, the carrier is designed into a two-layer form of the mother board and the daughter board, and the structure of the first buckle is matched, so that the mother board and the daughter board are conveniently combined and separated, meanwhile, the daughter board can easily rotate, the angle of the PCB entering the furnace can be adjusted, sockets, ICs and the like distributed on two sides of a square or rectangle of the PCB can enter at a certain angle with a wave crest during wave crest soldering, and after the PCB passes through the furnace at a certain angle, short circuits on two sides can be greatly reduced.

Description

Wave-soldering furnace-passing carrier

Technical Field

The utility model relates to the technical field of circuit board processing, in particular to a wave soldering furnace-passing carrier.

Background

The circuit board is a support body of the electronic components and is a carrier for electrical connection of the electronic components, and the circuit board has the main advantages of greatly reducing errors of wiring and assembly and improving the automation level and the production labor rate. The welding of some plug-in components in electronic manufacturing is carried out by adopting manual welding and wave soldering. For some PCB circuit boards with reasonable design, wave soldering can be directly adopted for welding. Wave soldering is to insert a plug-in type component into a PCB, spray flux, preheat, and solder the plug-in to the PCB by wave soldering.

The wave-soldering furnace is characterized in that most of PCBs are rectangular or square, wave-entering peak soldering can only enter along the track direction, but ICs with more dense sockets and pins are distributed on two edges of the rectangular or square PCB in the design of the PCB, the wave-entering furnace can only enter along one edge of the rectangular or square PCB, one edge of the wave-soldering furnace is certainly parallel to the wave crest after entering the furnace, so that the short circuit of the pins on one parallel edge is more, and the subsequent manual operation is increased.

SUMMERY OF THE UTILITY MODEL

In order to solve the above technical problems, an object of the present invention is to provide a carrier for wave soldering furnace, in which an angle of a PCB board is adjustable, so as to greatly reduce a risk of short circuit and improve product quality and production efficiency.

In order to realize the purpose of the utility model, the utility model adopts the following technical scheme:

the wave-soldering furnace carrier comprises a mother board and daughter boards, wherein a first through hole is formed in the middle of the mother board, a step edge is arranged in the first through hole, the daughter boards are placed on the step edge, a board groove is formed in the middle of the daughter boards, a second through hole is formed in the middle of the board groove, a first buckle for limiting the daughter boards to be separated from the mother board is arranged on the mother board, and a second buckle for limiting the PCB to be separated from the daughter boards is arranged on the daughter boards.

As a preferable scheme: first buckle is a plurality of, and equidistance interval distribution is in first through-hole outside along department.

As a preferable scheme: the number of the second buckles is even, and the second buckles are symmetrically arranged around the plate groove.

As a preferable scheme: the first buckle and the second buckle are identical in structure and comprise bolts, L-shaped clamping blocks and springs, the bolts are fixed on the mother board or the daughter board, the L-shaped clamping blocks are sleeved on the bolts, and the springs are arranged between the L-shaped clamping blocks and the tops of the bolts.

As a preferable scheme: the mother board is evenly provided with angle indication scales around the first through hole, and the daughter board is provided with an indication arrow penetrating through the second through hole.

As a preferable scheme: the daughter board is the same as the first through hole in shape and is circular, and the second through hole is the same as the PCB in shape and is square or rectangular.

As a preferable scheme: the width of the step edge is 0.5cm-1cm, and the outer diameter difference between the second through hole and the plate groove is 0.5cm-1 cm.

Compared with the prior art, the utility model has the beneficial effects that:

according to the utility model, the carrier is designed into a two-layer form of the mother board and the daughter board, and the structure of the first buckle is matched, so that the mother board and the daughter board are conveniently combined and separated, meanwhile, the daughter board can easily rotate, the angle of the PCB entering the furnace can be adjusted, sockets, ICs and the like distributed on two sides of a square or rectangle of the PCB can enter at a certain angle with a wave crest during wave crest soldering, and after the PCB passes through the furnace at a certain angle, short circuits on two sides can be greatly reduced.

Drawings

The accompanying drawings, which are incorporated in and constitute a part of this application, illustrate embodiments of the application and, together with the description, serve to explain the application and are not intended to limit the application.

FIG. 1 is a schematic view of the overall structure of an angle of the present invention;

fig. 2 is a schematic view of another embodiment of the present invention.

The labels in the figures are: 1. a motherboard; 2. indicating scales; 3. a first buckle; 4. a daughter board; 5. a plate groove; 6. an indicator line; 7. a second buckle; 8. a second through hole; 9. step edge.

Detailed Description

It should be noted that the following detailed description is exemplary and is intended to provide further explanation of the disclosure. Unless defined otherwise, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this application belongs.

It is noted that the terminology used herein is for the purpose of describing particular embodiments only and is not intended to be limiting of example embodiments according to the present application. As used herein, the singular forms "a", "an" and "the" are intended to include the plural forms as well, and it should be understood that when the terms "comprises" and/or "comprising" are used in this specification, they specify the presence of stated features, steps, operations, devices, elements, and/or combinations thereof, unless the context clearly indicates otherwise.

Further, in the description of the present invention, it is to be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "clockwise", "counterclockwise", and the like, indicate orientations and positional relationships based on those shown in the drawings, and are only for convenience of description and simplicity of description, but do not indicate or imply that the device or element being referred to must have a particular orientation, be constructed and operated in a particular orientation, and thus, should not be considered as limiting the present invention.

Furthermore, the terms "first", "second" and "first" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of that feature. In the description of the present invention, unless otherwise specified, "a plurality" means two or more unless explicitly defined otherwise.

In the present invention, unless otherwise expressly specified or limited, the terms "mounted," "connected," "secured," and the like are to be construed broadly and can, for example, be fixedly connected, detachably connected, or integrally connected; can be mechanically or electrically connected; they may be connected directly or indirectly through intervening media, or they may be interconnected between two elements. The specific meanings of the above terms in the present invention can be understood by those skilled in the art according to specific situations.

In the present invention, unless otherwise expressly stated or limited, "above" or "below" a first feature means that the first and second features are in direct contact, or that the first and second features are not in direct contact but are in contact with each other via another feature therebetween. Also, the first feature being "on," "above" and "over" the second feature includes the first feature being directly on and obliquely above the second feature, or merely indicating that the first feature is at a higher level than the second feature. A first feature being "under," "below," and "beneath" a second feature includes the first feature being directly under and obliquely below the second feature, or simply meaning that the first feature is at a lesser elevation than the second feature.

The utility model will be further illustrated with reference to the following examples and drawings:

as shown in fig. 1 and 2, the wave-soldering furnace carrier comprises a mother board 1 and a daughter board 4, wherein a first through hole is formed in the middle of the mother board 1, a step edge 9 is formed in the first through hole, the daughter board 4 is placed on the step edge, a board slot 5 is formed in the middle of the daughter board 4, a second through hole 8 is formed in the middle of the board slot 5, a first buckle 3 for limiting the daughter board 4 to be separated from the mother board 1 is arranged, and a second buckle 7 for limiting the PCB to be separated from the daughter board 4 is arranged on the daughter board 4.

According to the utility model, the carrier is designed into a two-layer form of the mother board and the daughter board, and the structure of the first buckle is matched, so that the mother board and the daughter board are conveniently combined and separated, meanwhile, the daughter board can easily rotate, the angle of the PCB entering the furnace can be adjusted, sockets, ICs and the like distributed on two sides of a square or rectangle of the PCB can enter at a certain angle with a wave crest during wave crest soldering, and after the PCB passes through the furnace at a certain angle, short circuits on two sides can be greatly reduced. The daughter board and the mother board are designed in a separated mode, the installation of the PCB can be facilitated, the PCB can be fixed on the daughter board firstly, and then the daughter board is directly installed on the mother board according to a certain angle, so that the operation is convenient.

First buckle 3 is a plurality of, and equidistance interval distribution is in first through-hole outside along department. The number of the second buckles 7 is even, and the second buckles are symmetrically arranged around the plate groove 5. The first buckle 3 and the second buckle 7 are identical in structure and respectively comprise a bolt, an L-shaped clamping block and a spring, the bolt is fixed on the mother board 1 or the daughter board 4, the L-shaped clamping block is sleeved on the bolt, and the spring is arranged between the L-shaped clamping block and the top of the bolt.

The simple structure of first buckle and second buckle, the bolt wherein can also be replaced with the post that has the top spacing, L shape fixture block can be in mother board plane vertical direction under the effect of spring, with the daughter board restriction in the step border, perhaps with the PCB board restriction in the board groove, can not restrict the rotation of daughter board in the plane again simultaneously, the structure is nimble, convenient operation.

The angle indicating scale 2 is uniformly arranged on the mother board 1 around the first through hole, and an indicating arrow 6 penetrating through the second through hole 8 is arranged on the daughter board 4. The cooperation of angle indication scale and instruction arrow head can make things convenient for more accurate adjustment PCB board to advance the stove angle, reduces the short circuit risk as far as possible.

The daughter board 4 is the same as the first through hole in shape and is circular, and the second through hole 8 is the same as the PCB in shape and is square or rectangular. The width of the step edge is 0.5cm-1cm, and the outer diameter difference between the second through hole and the plate groove is 0.5cm-1 cm.

The rotatable carrier with the adjustable angle is manufactured, so that the angle of the PCB before wave soldering can be adjusted to any angle, and the socket and the IC can be subjected to wave soldering at a certain angle. After the angle is adjustable, the material pins on the two edges of the PCB form a certain angle with wave crests when wave crest welding is carried out, so that the short circuit of the pins is greatly reduced.

In the description herein, references to the description of the term "one embodiment," "some embodiments," "an example," "a specific example," or "some examples," etc., mean that a particular feature, structure, material, or characteristic described in connection with the embodiment or example is included in at least one embodiment or example of the utility model. In this specification, the schematic representations of the terms used above do not necessarily refer to the same embodiment or example. Furthermore, the particular features, structures, materials, or characteristics described may be combined in any suitable manner in any one or more embodiments or examples.

Although the embodiments of the present invention have been shown and described above, it is understood that the above embodiments are exemplary and not to be construed as limiting the present invention, and those skilled in the art can make changes, modifications, substitutions and alterations to the above embodiments without departing from the principle and spirit of the present invention, and any simple modification, equivalent change and modification made to the above embodiments according to the technical spirit of the present invention still fall within the technical scope of the present invention.

Claims

1. Wave-soldering crosses stove carrier, its characterized in that: the PCB board fixing device comprises a mother board (1) and daughter boards (4), wherein a first through hole is formed in the middle of the mother board (1), a step edge (9) is arranged in the first through hole, the daughter boards (4) are placed on the step edge, a board groove (5) is formed in the middle of the daughter boards (4), a second through hole (8) is formed in the middle of the board groove (5), a first buckle (3) for limiting the daughter boards (4) to be separated from is arranged on the mother board (1), and a second buckle (7) for limiting the PCB boards to be separated from is arranged on the daughter boards (4).

2. The carrier of claim 1, wherein: first buckle (3) are a plurality of, and equidistance interval distribution is in first through-hole outside border department.

3. The carrier of claim 1, wherein: the number of the second buckles (7) is even, and the second buckles are symmetrically arranged around the plate groove (5).

4. The carrier of claim 1, wherein: the first buckle (3) and the second buckle (7) are identical in structure and comprise bolts, L-shaped clamping blocks and springs, the bolts are fixed on the mother board (1) or the daughter board (4), the L-shaped clamping blocks are sleeved on the bolts, and the springs are arranged between the L-shaped clamping blocks and the tops of the bolts.

5. The carrier of claim 1, wherein: the angle indicating scale (2) is uniformly arranged on the mother board (1) around the first through hole, and an indicating arrow (6) penetrating through the second through hole (8) is arranged on the daughter board (4).

6. The carrier of claim 1, wherein: the daughter board (4) is the same as the first through hole in shape and is circular, and the second through hole (8) is the same as the PCB in shape and is square or rectangular.

7. The carrier of claim 1, wherein: the width of the step edge is 0.5cm-1cm, and the outer diameter difference between the second through hole and the plate groove is 0.5cm-1 cm.