CN212519596U - A prevent excursion formula paster forming die for SMT processing - Google Patents

A prevent excursion formula paster forming die for SMT processing Download PDF

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Publication number
CN212519596U
CN212519596U CN202020368839.1U CN202020368839U CN212519596U CN 212519596 U CN212519596 U CN 212519596U CN 202020368839 U CN202020368839 U CN 202020368839U CN 212519596 U CN212519596 U CN 212519596U
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China
Prior art keywords
tray
circuit board
mold
bottom plate
buckle
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CN202020368839.1U
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Chinese (zh)
Inventor
陈俊奎
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Suzhou Lianyongcheng Precision Machinery Co ltd
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Suzhou Lianyongcheng Precision Machinery Co ltd
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Abstract

The utility model discloses a prevent excursion formula paster forming die for SMT processing, include: the circuit board positioning device comprises a lower template, a tray, a circuit board and a limiting assembly, wherein the tray is arranged on the lower template, a group of placing grooves used for placing the circuit board are formed in the tray, and the circuit board is arranged in the placing grooves. The utility model discloses in a prevent excursion formula paster forming die for SMT processing, through set up the standing groove on the tray, let the circuit board can locate in the standing groove, effectively improve the stability of its production, still set up spacing subassembly, carry on spacingly to the circuit board in the tray, the circuit board of avoiding both sides on the tray appears removing in process of production and piles up and shift even appears to further improve the stability of circuit board paster processing, and then let its better needs that satisfy the production.

Description

A prevent excursion formula paster forming die for SMT processing
Technical Field
The utility model belongs to the technical field of advance manufacturing and automation, in particular to prevent excursion formula paster forming die for SMT processing.
Background
SMT is Surface mount Technology (Surface Mounted Technology), an acronym for Surface Mounted Technology, which is one of the most popular techniques and processes in the electronic assembly industry. Surface Mount Technology (SMT) is known as Surface Mount or Surface Mount Technology. The surface-mounted component (SMC/SMD, chip component in Chinese) with no pins or short leads is mounted on the surface of a Printed Circuit Board (PCB) or other substrates, and is soldered and assembled by means of reflow soldering, dip soldering and the like.
However, the circuit board is often misplaced or misplaced due to the displacement of the circuit board during the SMT surface mounting process, which results in the rejection of the circuit board, waste of raw materials, and influence on the processing efficiency and production cycle of the circuit board, so the conventional SMT surface mounting technology is still to be improved.
SUMMERY OF THE UTILITY MODEL
Utility model purpose: in order to overcome not enough above, the utility model aims at providing a prevent excursion formula paster forming die for SMT processing, its simple structure, reasonable in design through having set up the standing groove on the tray, lets the circuit board can locate in the standing groove, effectively improves the stability of its production, has still set up spacing subassembly, carries on spacingly to the circuit board in the tray to further improve the stability of circuit board paster processing.
The technical scheme is as follows: in order to achieve the above object, the utility model provides an prevent excursion formula paster forming die for SMT processing, include: the circuit board positioning device comprises a lower template, a tray, a circuit board and a limiting assembly, wherein the tray is arranged on the lower template, a group of placing grooves used for placing the circuit board are formed in the tray, and the circuit board is arranged in the placing grooves.
The utility model discloses in a prevent excursion formula paster forming die for SMT processing, through set up the standing groove on the tray, let the circuit board can locate in the standing groove, effectively improve the stability of its production, still set up spacing subassembly, carry on spacingly to the circuit board in the tray, the circuit board of avoiding both sides on the tray appears removing in process of production and piles up and shift even appears to further improve the stability of circuit board paster processing, and then let its better needs that satisfy the production.
The utility model discloses in be equipped with tray frame and tray bottom plate in the tray, the tray frame is located around the tray bottom plate, just the inboard of tray frame is equipped with the slide rail groove, the standing groove is located on the tray bottom plate.
The utility model discloses in be equipped with a set of limiting plate and a set of spacing buckle in the spacing subassembly, the slide rail groove is located at the both ends of limiting plate to be connected with the slide rail groove through the slider, spacing buckle is located all around of standing groove, and its one end is fixed in the tray bottom plate, and one end card is on the circuit board. The limiting plate is arranged in the sliding rail groove, the position of the limiting plate can be adjusted according to actual needs, the limiting plate can play a limiting role on the circuit board twice, the limiting role is further improved, the accuracy of the chip mounting is improved, the production requirement is better met, the circuit board can be effectively guaranteed to move in the chip mounting process by the aid of the limiting buckles, and the accuracy of the chip mounting is further improved.
The utility model discloses in be equipped with fixing base, connection handle and buckle in the spacing buckle, the fixing base passes through the connection handle and is connected with the buckle.
The utility model discloses in be equipped with the waist hole that is used for adjusting spacing buckle position around lieing in the standing groove on the tray bottom plate, the fixing base is located on the waist hole to it is fixed through the screw thread post.
The utility model discloses in be equipped with the recess that is used for installing the tray on the lower bolster, in the recess was located to the tray, just be equipped with the locating part around the lower bolster, the rotation type is connected with the lower bolster to locating part one end, and one end card is on the tray.
Above-mentioned technical scheme can find out, the utility model discloses following beneficial effect has:
1. the utility model discloses in an prevent excursion formula paster forming die for SMT processing, through set up the standing groove on the tray, let the circuit board can locate in the standing groove, effectively improve the stability of its production, still set up spacing subassembly, carry on spacingly to the circuit board in the tray, the circuit board of avoiding both sides on the tray appears removing in process of production and piles up even appearing to further improve the stability of circuit board paster processing, and then let its better needs that satisfy the production.
2. The utility model discloses in the slide rail groove is located to the limiting plate, lets its position that can adjust the limiting plate according to the needs of reality, lets it can play a limiting displacement to twice circuit board, further improves its limiting displacement, improves the precision of its paster, and then lets its better requirement of satisfying the production, the setting of spacing buckle can effectual assurance circuit board appear removing at the paster in-process, further improves the precision of its paster.
Drawings
Fig. 1 is a schematic structural view of the present invention;
FIG. 2 is a structure of a tray of the present invention;
FIG. 3 is a schematic view of a middle slide rail groove of the present invention;
fig. 4 is a schematic structural view of the middle limit buckle of the present invention.
Detailed Description
The invention will be further elucidated with reference to the drawings and the specific embodiments.
Examples
Reference will now be made in detail to embodiments of the present invention, examples of which are illustrated in the accompanying drawings, wherein like reference numerals refer to the same or similar elements or elements having the same or similar function throughout. The embodiments described below with reference to the drawings are exemplary and intended to be used for explaining the present invention, and should not be construed as limiting the present invention.
In the description of the present invention, it is to be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "clockwise", "counterclockwise" and the like indicate orientations or positional relationships based on the orientations or positional relationships shown in the drawings, and are only for convenience of description and to simplify the description, but do not indicate or imply that the device or element referred to must have a particular orientation, be constructed and operated in a particular orientation, and therefore should not be construed as limiting the present invention.
Furthermore, the terms "first", "second" and "first" are used for descriptive purposes only and are not to be construed as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of that feature. In the description of the present invention, unless otherwise specified, "a plurality" means two or more unless explicitly defined otherwise.
In the present invention, unless otherwise expressly specified or limited, the terms "mounted," "connected," and "fixed" are to be construed broadly and may, for example, be fixedly connected, detachably connected, or integrally connected; can be mechanically or electrically connected; they may be connected directly or indirectly through intervening media, or they may be interconnected between two elements. The specific meaning of the above terms in the present invention can be understood according to specific situations by those skilled in the art.
In the present disclosure, unless expressly stated or limited otherwise, the first feature "on" or "under" the second feature may comprise direct contact between the first and second features, or may comprise contact between the first and second features not directly. Also, the first feature being "on," "above" and "over" the second feature includes the first feature being directly on and obliquely above the second feature, or merely indicating that the first feature is at a higher level than the second feature. A first feature being "under," "below," and "beneath" a second feature includes the first feature being directly under and obliquely below the second feature, or simply meaning that the first feature is at a lesser elevation than the second feature.
An anti-shift patch forming die for SMT processing as shown in the figure comprises: lower bolster 1, tray 2, circuit board 3 and spacing subassembly 4, tray 2 is located on the lower bolster 1, be equipped with a set of standing groove 5 that is used for placing circuit board 3 on the tray 2, circuit board 3 is located in standing groove 5, spacing subassembly 4 is located on tray 2, just spacing subassembly 4's position is adjustable.
Further, a tray frame 21 and a tray bottom plate 22 are arranged in the tray 2, the tray frame 21 is arranged on the periphery of the tray bottom plate 22, a slide rail groove 23 is arranged on the inner side of the tray frame 21, and the placing groove 5 is arranged on the tray bottom plate 22.
Further, be equipped with a set of limiting plate 41 and a set of spacing buckle 42 in the spacing subassembly 4, the both ends of limiting plate 41 are located in the slide rail groove 23 to be connected with slide rail groove 23 through the slider, spacing buckle 42 is located around standing groove 5, and its one end is fixed on tray bottom plate 22, and one end card is on circuit board 3.
Preferably, a fixed seat 421, a connecting handle 422 and a buckle 423 are arranged in the limit buckle 42, and the fixed seat 421 is connected with the buckle 423 through the connecting handle 422.
Further preferably, a waist hole 224 for adjusting the position of the limit buckle 42 is formed around the placing groove 5 on the tray bottom plate 22, and the fixing seat 421 is formed on the waist hole 224 and fixed by a threaded column.
Furthermore, a groove for installing the tray 2 is formed in the lower template 1, the tray 2 is arranged in the groove, the limiting parts 6 are arranged on the periphery of the lower template 1, one end of each limiting part 6 is rotatably connected with the lower template 1, and one end of each limiting part is clamped on the corresponding tray 2.
The foregoing is only a preferred embodiment of the present invention, and it should be noted that, for those skilled in the art, a plurality of modifications can be made without departing from the principles of the present invention, and these modifications should also be regarded as the protection scope of the present invention.

Claims (6)

1. The utility model provides an anti-migration formula paster forming die for SMT processing which characterized in that: the method comprises the following steps: lower bolster (1), tray (2), circuit board (3) and spacing subassembly (4), on lower bolster (1) was located in tray (2), be equipped with a set of standing groove (5) that are used for placing circuit board (3) on tray (2), circuit board (3) are located in standing groove (5), on tray (2) was located in spacing subassembly (4).
2. The mold for SMT according to claim 1, wherein the mold comprises: the tray is characterized in that a tray frame (21) and a tray bottom plate (22) are arranged in the tray (2), the tray frame (21) is arranged on the periphery of the tray bottom plate (22), a slide rail groove (23) is arranged on the inner side of the tray frame (21), and the placing groove (5) is arranged on the tray bottom plate (22).
3. The mold for SMT according to claim 1, wherein the mold comprises: be equipped with a set of limiting plate (41) and a set of spacing buckle (42) in spacing subassembly (4), the slide rail groove (23) is located at the both ends of limiting plate (41) to be connected with slide rail groove (23) through the slider, spacing buckle (42) are located around standing groove (5), and its one end is fixed in tray bottom plate (22), and one end card is on circuit board (3).
4. The mold of claim 3, wherein the mold comprises: be equipped with fixing base (421), stem (422) and buckle (423) in spacing buckle (42), fixing base (421) are connected with buckle (423) through stem (422).
5. The mold of claim 4, wherein the mold comprises: waist holes (224) used for adjusting the positions of the limiting buckles (42) are formed in the periphery of the placing groove (5) on the tray bottom plate (22), and the fixing seat (421) is arranged on the waist holes (224) and fixed through threaded columns.
6. The mold for SMT according to claim 2, wherein the mold comprises: be equipped with the recess that is used for installing tray (2) on lower bolster (1), in the recess was located in tray (2), just be equipped with locating part (6) around lower bolster (1), locating part (6) one end is connected with lower bolster (1) rotation type, and one end card is on tray (2).
CN202020368839.1U 2020-03-23 2020-03-23 A prevent excursion formula paster forming die for SMT processing Active CN212519596U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
CN202020368839.1U CN212519596U (en) 2020-03-23 2020-03-23 A prevent excursion formula paster forming die for SMT processing

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
CN202020368839.1U CN212519596U (en) 2020-03-23 2020-03-23 A prevent excursion formula paster forming die for SMT processing

Publications (1)

Publication Number Publication Date
CN212519596U true CN212519596U (en) 2021-02-09

Family

ID=74441288

Family Applications (1)

Application Number Title Priority Date Filing Date
CN202020368839.1U Active CN212519596U (en) 2020-03-23 2020-03-23 A prevent excursion formula paster forming die for SMT processing

Country Status (1)

Country Link
CN (1) CN212519596U (en)

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