CN216820182U

CN216820182U - IC packaging support plate multilayer board and jig for pressing multilayer board

Info

Publication number: CN216820182U
Application number: CN202122369502.XU
Authority: CN
Inventors: 程光明; 周勇胜; 杨威; 邓贤江
Original assignee: Dongguan Hongyuen Electronics Co ltd
Current assignee: Dongguan Hongyuen Electronics Co ltd
Priority date: 2021-09-28
Filing date: 2021-09-28
Publication date: 2022-06-24
Anticipated expiration: 2031-09-28

Abstract

An IC packaging carrier plate multilayer board comprises a plurality of PNL sheet materials which are overlapped up and down in sequence, wherein the adjacent PNL sheet materials are different in material; the PNL sheet is provided with a plurality of lamination targets, alignment round targets, graphic alignment holes and direction holes; the centers of the alignment circular targets of the PNL plates are coaxially arranged, and the apertures of the alignment circular targets are gradually increased or decreased. In addition, the utility model also provides a jig for pressing the IC packaging carrier plate multilayer board. The utility model enables the plates of different layers to keep vertical superposition without deviation by designing the lamination targets; the alignment round target is designed to confirm the alignment precision of each layer of plate; the same type of pattern alignment holes are adopted among the plate materials of all layers, so that the consistency among different plate materials is ensured, and the exposure direction errors can be prevented through the direction holes; the one-step lamination of the multilayer board is realized through a specially designed lamination table top, a bearing steel plate, a lamination steel plate, a shaft sleeve and a pin; the utility model has strong practicability and stronger popularization significance.

Description

IC packaging support plate multilayer board and jig for pressing multilayer board

Technical Field

The utility model relates to the technical field of printed circuit board manufacturing, in particular to an IC packaging carrier board multilayer board and a jig for pressing the multilayer board.

Background

In the conventional IC package carrier process, the multi-layer board is widely applied in lamination. The composite board pressing process with more than 6 layers is realized by adopting a multi-time pressing mode, and the higher the layer number is, the more the pressing times are. However, the current pressing method still needs to be improved for the product with the outer layer designed by mechanical hole conduction and the inner layer designed without hole. In addition, the multiple pressing process is adopted, so that the process is long, the cost is high, the delivery period of the product is long, and the market competition is not facilitated.

SUMMERY OF THE UTILITY MODEL

In view of the above, it is necessary to provide a multilayer IC package carrier board for overcoming the defects in the prior art.

An IC packaging carrier plate multilayer board comprises a plurality of PNL sheet materials which are overlapped up and down in sequence, wherein the adjacent PNL sheet materials are different in material; the PNL sheet is provided with a plurality of laminating targets, alignment round targets, graphic alignment holes and direction holes; the centers of the alignment round targets of the PNL plates are coaxially arranged, and the aperture of the alignment round targets is gradually increased or decreased.

Furthermore, the corresponding pattern alignment holes in the PNL plates are coaxially arranged, and the pattern alignment holes are consistent in size.

Furthermore, the corresponding lamination targets on the PNL sheet materials are coaxially arranged, and the sizes of the lamination targets are consistent.

Furthermore, the alignment round targets are divided into copper sheet round targets and base material round targets, the alignment round targets on adjacent PNL sheet materials are different, wherein the alignment round target on one PNL sheet material is the copper sheet round target, and the alignment round target on the adjacent PNL sheet material is the base material round target.

Furthermore, a graph effective area is arranged in the middle of the PNL sheet, the alignment round targets are arranged in a corner area outside the effective area, and the lamination targets are arranged in a front edge area outside the graph effective area.

Furthermore, the pattern alignment holes are formed in the corner positions of the outer sides of the pattern effective areas of the PNL panel, and the direction holes are formed in the outer sides of one of the pattern alignment holes.

In addition, the utility model also provides a jig for pressing the IC packaging carrier plate multilayer board.

A jig for pressing a multilayer board of an IC packaging carrier board is used for pressing a multilayer PNL board at one time and comprises a pressing table board, pins, kraft liner paper, a bearing steel plate, a shaft sleeve and a pressing steel plate which are sequentially arranged from bottom to top; the pressing table board is provided with a plurality of grooves, and the kraft liner paper is flatly paved on the pressing table board; the lower end of the pin penetrates through the cow leather packing paper and is embedded and fixed in the groove of the pressing table board; corresponding through holes are formed in the positions, corresponding to the dry lamination targets, of the bearing steel plate and the pressing steel plate, and the bearing steel plate, the multiple layers of PNL plates, the pressing steel plate and the shaft sleeve are sequentially sleeved into the pins from bottom to top; the PNL sheet is a PNL sheet of a multilayer board of an overlapped IC packaging carrier board, and a plurality of lamination targets, alignment round targets, graphic alignment holes and direction holes are arranged on the PNL sheet; the centers of circles of the alignment round targets of the multilayer PNL sheet materials are coaxially arranged, and the aperture of the alignment round targets is gradually increased or decreased.

Furthermore, the corresponding pattern alignment holes in the multiple layers of PNL plates are coaxially arranged, and the sizes of the pattern alignment holes are consistent.

Furthermore, the corresponding lamination targets on the multiple layers of PNL plates are coaxially arranged, and the sizes of the plurality of lamination targets are consistent.

Further, the depth of the groove of the pressing table surface is one fifth of the length of the pin.

In summary, the IC package carrier multilayer board and the jig for pressing the multilayer board of the present invention have the following beneficial effects: by designing the lamination targets, the plates at different layers are vertically overlapped without deviation; the alignment round target is designed to confirm the alignment precision of each layer of plate; the same type of pattern alignment holes are adopted among the plate materials of all layers, so that the consistency among different plate materials is ensured, and the exposure direction errors can be prevented through the direction holes; the one-step lamination of the multilayer board is realized through a specially designed lamination table top, a bearing steel plate, a lamination steel plate, a shaft sleeve and a pin; the utility model has strong practicability and stronger popularization significance.

Drawings

Fig. 1 is a schematic structural diagram of a PNL board of an IC package carrier multilayer board according to the present invention;

FIG. 2 is a schematic top view of an alignment circle target of a multi-layer board of an IC package carrier according to the present invention;

FIG. 3 is a cross-sectional view of a jig for pressing a multi-layer board of an IC package carrier according to the present invention;

FIG. 4 is a top view of the crimping table of FIG. 3;

FIG. 5 is a top view of the load bearing steel plate of FIG. 3;

FIG. 6 is a top view of the laminated steel panel of FIG. 3;

figure 7 is a side view of the pin of figure 3.

Detailed Description

In order to make the objects, technical solutions and advantages of the present invention more clearly understood, the present invention will be further described in detail with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are merely illustrative of the utility model and are not intended to limit the utility model.

As shown in fig. 1 to fig. 2, the present invention provides an IC package carrier multilayer board, which includes a multilayer PNL board 100, wherein the PNL board 100 is provided with a plurality of lamination targets 10, alignment round targets 20, pattern alignment holes 30 and direction holes 40. The material of the PNL panels 100 of adjacent layers is different. The centers of the alignment round targets 20 of the PNL sheet materials 100 which are overlapped up and down are coaxially arranged. The radii of the alignment circular targets 20 of the top-to-bottom PNL slabs 100 increase in sequence. The alignment round targets 20 of different materials and different radii are more favorable for detecting the deviation condition by x-ray.

The centers of the circles of the upper and lower superposed PNL sheet materials 100 corresponding to the pattern alignment holes 30 are coaxially arranged. The pattern registration holes 30 are uniformly sized.

The geometric centers of the laminated targets 10 of the top-bottom superposed PNL panel 100 are coaxially arranged, and the sizes of the laminated targets 10 are consistent. The laminated targets 10 which have the same specification and are arranged on the same vertical shaft ensure that all layers of PNL plates 100 do not deviate to the maximum extent.

The lamination target 10 is of rectangular and rounded design. The lamination target 10 in the rectangular design is beneficial to fixing the inner PNL panel 100, reduces relative slippage and improves the alignment precision between layers. The rounded design facilitates nesting of the PNL panel 100 into the pins.

In this embodiment, the IC package carrier multilayer board includes six layers of PNL boards 100, which are a first layer PNL board (not shown), a second layer PNL board 100a (corresponding marks are marked in fig. 3), a third layer PNL board 100b, a fourth layer PNL board 100c, a fifth layer PNL board 100d, and a sixth layer PNL board (not shown) from top to bottom. The PNL panels of the second layer to the fifth layer are all inner graphic layers, wherein the PNL panel 100a of the second layer and the PNL panel 100c of the fourth layer are made of copper sheet, and the PNL panel 100b of the third layer and the PNL panel 100d of the fifth layer are made of base material.

The number of the alignment round targets 20 of each layer of PNL panel 100 is four, and the four alignment round targets are respectively positioned at four corners outside the graph effective area of each layer of PNL panel 100. Four laminating targets 10 of each layer of PNL sheet 100 are arranged and are respectively located at the central points of four sides outside the graph effective area of the PNL sheet 100. The four alignment round targets 20 improve the accuracy of deviation detection, and the four lamination targets 10 can make each layer of PNL panel 100 keep alignment accuracy better.

The four pattern alignment holes 30 of each layer of PNL panel 100 are respectively positioned at four corners outside the pattern effective area of the PNL panel 100. One direction hole 40 is arranged in each layer of PNL panel 100 and is positioned at the upper right corner outside the graph effective area of the PNL panel 100. The four pattern alignment holes 30 make the expansion and contraction of different PNL boards 100 consistent, and the direction hole 40 at the upper right corner facilitates the confirmation of the exposure direction, thereby preventing the exposure direction from being wrong.

As shown in fig. 3 to fig. 7, the present invention further provides a jig for pressing an IC package carrier multi-layer board, which is used for pressing the IC package carrier multi-layer board, and includes a pressing table 61, a pin 62, a kraft liner 63, a bearing steel plate 64, a shaft sleeve 65, and a pressing steel plate 66, which are sequentially disposed from bottom to top. The pressing table board 61 is provided with a plurality of grooves 67, and the kraft liner 63 is flatly paved on the pressing table board 61. The lower end of the pin 62 penetrates through the cow leather packing paper 63 and is embedded and fixed in the groove 67 of the pressing table surface 61. The bearing steel plate 64 and the pressing steel plate 66 are respectively and correspondingly provided with a plurality of lamination targets 10, the shaft sleeve 65 is provided with the lamination targets 10, and the bearing steel plate 64, the shaft sleeve 65 and the pressing steel plate 66 are sequentially sleeved into the pin 62 along the lamination targets 10 in sequence. A plurality of layers of PNL sheet materials 100 are arranged between the bearing steel plate 64 and the pressing steel plate 66, and the PNL sheet materials 100 are stacked IC packaging carrier plate multilayer plates.

The depth of the groove 67 of the press-fit table 61 is one fifth of the length of the pin 62. The proper proportion can ensure that the pin 62 is firmly embedded with the pressing table surface 61 and can meet the requirement of one-time pressing of the multilayer board of the IC packaging carrier board when the number of layers is large.

When the jig for pressing the IC package carrier multi-layer board is used, the kraft liner 63 is first laid on the pressing table 61, and the pin 62 is then fixed in the groove 67 of the pressing table 61. Then the bearing steel plate 64, each layer of PNL plate 100, the shaft sleeve 65 and the press-fit steel plate 66 are sleeved in sequence. And finally, applying pressure to the pressing steel plate 66 along the vertical downward direction by using pressing equipment, so that the PNL sheet material 100 is pressed into the IC package carrier multilayer board finished product at one time.

The above-described embodiment represents only one implementation of the present invention. Conceivably, the PNL slab 100 may include a plurality of STEP plates, each of which has four alignment holes 30 and one direction hole 40.

In summary, the IC package carrier multilayer board and the jig for pressing the multilayer board of the present invention have the following beneficial effects: by designing the lamination target 10, the plates at different layers are vertically overlapped without deviation; the alignment round target 20 is designed to confirm the alignment precision of each layer of plate; the same type of pattern alignment holes 30 are adopted among the plate materials of all layers, so that the consistency among different plate materials is ensured, and the exposure direction errors can be prevented through the direction holes 40; the multi-layer board is pressed at one time through a specially designed pressing table surface 61, a bearing steel plate 64, a pressing steel plate 66, a shaft sleeve 65 and a pin 62; the utility model has strong practicability and stronger popularization significance.

The above-described embodiments only represent one embodiment of the present invention, and the description thereof is more specific and detailed, but not to be construed as limiting the scope of the utility model. It should be noted that, for those skilled in the art, many variations and modifications can be made without departing from the spirit of the utility model, and these are within the scope of the utility model. Therefore, the protection scope of the utility model patent should be subject to the appended claims.

Claims

1. An IC packaging carrier multilayer board is characterized in that: the PNL panel comprises a plurality of PNL panels which are overlapped up and down in sequence, and the adjacent PNL panels are made of different materials; the PNL sheet is provided with a plurality of lamination targets, alignment round targets, graphic alignment holes and direction holes; the centers of the alignment round targets of the PNL plates are coaxially arranged, and the aperture of the alignment round targets is gradually increased or decreased.

2. The IC package carrier multilayer board according to claim 1, wherein: the corresponding figure alignment holes in the PNL plates are coaxially arranged, and the figure alignment holes are consistent in size.

3. The IC package carrier multilayer board according to claim 1, wherein: the corresponding lamination targets on the PNL sheet materials are coaxially arranged, and the lamination targets are consistent in size.

4. The IC package carrier multilayer board according to claim 1, wherein: the alignment round targets are divided into copper sheet round targets and base material round targets, the alignment round targets on adjacent PNL sheet materials are different, the alignment round target on one PNL sheet material is a copper sheet round target, and the alignment round target on the adjacent PNL sheet material is a base material round target.

5. The IC package carrier multilayer board according to claim 1, wherein: the middle part of the PNL sheet material is provided with a graph effective area, the plurality of alignment round targets are arranged in a corner area outside the effective area, and the plurality of lamination targets are arranged in a front edge area outside the graph effective area.

6. The IC package carrier multilayer board according to claim 1, wherein: the figure counterpoint hole sets up the corner position in the figure active area outside of PNL sheet material, the direction hole sets up in the outside of one of them figure counterpoint hole.

7. The utility model provides a tool of pressfitting IC encapsulation support plate multiply wood carries out disposable pressfitting, its characterized in that to multilayer PNL sheet material: the jig for pressing the multilayer board of the IC packaging carrier board comprises a pressing table board, a pin, cow leather packing paper, a bearing steel plate, a shaft sleeve and a pressing steel plate which are sequentially arranged from bottom to top; the pressing table board is provided with a plurality of grooves, and the kraft liner paper is flatly paved on the pressing table board; the lower end of the pin penetrates through the cow leather packing paper and is embedded and fixed in the groove of the pressing table board; corresponding through holes are formed in the positions, corresponding to the dry lamination targets, of the bearing steel plate and the pressing steel plate, and the bearing steel plate, the multiple layers of PNL plates, the pressing steel plate and the shaft sleeve are sequentially sleeved into the pins from bottom to top; the PNL panel being as claimed in any one of claims 1 to 6.

8. The jig for pressing together an IC package carrier multilayer board according to claim 7, wherein: the depth of the groove of the pressing table top is one fifth of the length of the pin.