CN216816883U - Switchgear internal defect detection device based on signal analysis - Google Patents
Switchgear internal defect detection device based on signal analysis Download PDFInfo
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Abstract
The utility model discloses a switch equipment internal defect detection device based on signal analysis, which comprises N groups of detection modules and a monitoring display module; each group of detection modules respectively detect the performance of different positions in the switch equipment, and the output end of each group of detection modules is directly connected with the input end of the monitoring display module; each group of detection modules comprises a measurement module, a signal acquisition module, a signal amplification module, a bias elimination module, a band-pass filtering module and an alternating current-direct current conversion module which are sequentially connected. The N groups of detection modules work simultaneously, and the monitoring display module obtains the defect condition in the switch device based on the detection results of the N groups of detection modules. The switch equipment internal defect detection device based on signal analysis can realize rapid positioning of switch equipment internal defects.
Description
Technical Field
The utility model relates to the technical field of power equipment detection, in particular to a switch equipment internal defect detection device based on signal analysis.
Background
The usage proportion of the gas insulated metal enclosed switchgear in a power system is continuously increased, but the gas insulated metal enclosed switchgear has many hidden dangers of generating insulation defects in the gas insulated metal enclosed switchgear during transportation, installation and use, so that whether the insulation performance of the gas insulated metal enclosed switchgear is good or not is very necessary to detect regularly. At present, the detection is usually carried out by adopting a method of changing the wiring mode of the switchgear for many times and carrying out a voltage withstand test under the corresponding wiring mode, but the method needs to repeatedly operate the circuit breaker and the isolating switch for many times when the wiring mode is changed, wastes time and labor and simultaneously influences the service life of the switch device, and the voltage withstand test for many times is extremely unfavorable for the insulation systems of other fault-free air chambers and even can cause damage.
SUMMERY OF THE UTILITY MODEL
In order to overcome the defects of the prior art, the utility model aims to provide a switchgear internal defect detection device based on signal analysis, which not only can realize the rapid positioning of insulation defects in switchgear, but also can greatly save the labor force of detection personnel, improve the defect detection efficiency and reduce the influence of detection on the service life of the switchgear.
The embodiment of the utility model provides a switch equipment internal defect detection device based on signal analysis, which comprises N groups of detection modules and a monitoring display module; each group of detection modules respectively detect the performance of different positions in the switch equipment, and the output end of each group of detection modules is directly connected with the input end of the monitoring display module; each group of detection modules comprises a measurement module, a signal acquisition module, a signal amplification module, a bias elimination module, a band-pass filtering module and an AC-DC conversion module which are sequentially connected, wherein the output end of the AC-DC conversion module is used as the output end of the detection module to which the AC-DC conversion module belongs; the N groups of detection modules work simultaneously, and the monitoring display module obtains the defect condition in the switch equipment based on the detection results of the N groups of detection modules.
The measuring module comprises a sensor, a first measuring output interface and a second measuring output interface, wherein the first measuring output interface is directly connected with the sensor, and the second measuring output interface is directly connected with the sensor.
The signal acquisition module comprises a first acquisition input interface, a second acquisition input interface, a first resistor, a second resistor, a third resistor, a fourth resistor, a fifth resistor, a sixth resistor, a seventh resistor, a first capacitor, a second capacitor, a third capacitor, a fourth capacitor, a fifth capacitor, a first chip and an acquisition output interface; the first acquisition input interface is directly connected with the first measurement output interface, and the second acquisition input interface is directly connected with the second measurement output interface; one end of the first resistor is directly connected with the first acquisition input interface, and the other end of the first resistor is directly connected with the ground; one end of the second resistor is directly connected with the second acquisition input interface, the other end of the second resistor is directly connected with one end of the third resistor, and the other end of the third resistor is directly connected with an external voltage signal; one end of the first capacitor is directly connected with one end of the third resistor, and the other end of the first capacitor is directly connected with the ground; one end of the second capacitor is directly connected with one end of the third resistor, and the other end of the second capacitor is directly connected with the other end of the first capacitor; one end of the third capacitor is directly connected with one end of the first resistor, and the other end of the third capacitor is directly connected with a third pin of the first chip; one end of the fourth capacitor is directly connected with one end of the first resistor, and the other end of the fourth capacitor is directly connected with the second pin of the first chip;
one end of the fifth capacitor is directly connected with the other end of the first capacitor, and the other end of the fifth capacitor is directly connected with a third pin of the first chip; one end of the fourth resistor is directly connected with the second pin of the first chip, and the other end of the fourth resistor is directly connected with the third pin of the first chip; one end of the fifth resistor is directly connected with the second pin of the first chip, and the other end of the fifth resistor is directly connected with the other end of the first resistor; one end of the sixth resistor is directly connected with the first pin of the first chip, and the other end of the sixth resistor is directly connected with the fifth pin of the first chip; one end of the seventh resistor is directly connected with the first pin of the first chip, and the other end of the seventh resistor is directly connected with the fifth pin of the first chip; the fourth pin of the first chip is directly connected with a-5V power supply, the sixth pin of the first chip is directly connected with a +5V power supply, the seventh pin of the first chip is directly connected with the acquisition output interface, the eighth pin of the first chip is directly connected with the ground, and the type of the first chip is AD 620.
The signal amplification module comprises a signal amplification input interface, an eighth resistor, a ninth resistor, a tenth resistor, a sixth capacitor, a seventh capacitor, a second chip and a signal amplification output interface; the signal amplification input interface is directly connected with the acquisition output interface; one end of the sixth capacitor is directly connected with the signal amplification input interface, the other end of the sixth capacitor is directly connected with one end of the seventh capacitor, and the other end of the seventh capacitor is directly connected with the third pin of the second chip; one end of the eighth resistor is directly connected with one end of the seventh capacitor, and the other end of the eighth resistor is directly connected with a second pin of the second chip; one end of the ninth resistor is directly connected with one end of the seventh capacitor, and the other end of the ninth resistor is directly connected with the second pin of the second chip; one end of the tenth resistor is directly connected to the third pin of the second chip, and the other end of the tenth resistor is directly connected to the ground; the first stitch of second chip is unsettled, the second stitch lug connection of second chip the signal amplification output interface, the fourth stitch lug connection-5V power of second chip, the fifth stitch of second chip is unsettled, the sixth stitch lug connection +5V power of second chip, the seventh stitch lug connection of second chip the signal amplification output interface, the eighth stitch of second chip is unsettled, the model of second chip is OP 27.
The bias elimination module comprises a bias elimination input interface, an eleventh resistor, a twelfth resistor, an eighth capacitor, a ninth capacitor, a tenth capacitor, a third chip and a bias elimination output interface; the bias elimination input interface is directly connected with the signal amplification output interface; one end of the eleventh resistor is directly connected to the offset cancellation input interface, the other end of the eleventh resistor is directly connected to one end of the twelfth resistor, and the other end of the twelfth resistor is directly connected to the third pin of the third chip; one end of the eighth capacitor is directly connected with one end of the twelfth resistor, and the other end of the eighth capacitor is directly connected with the second pin of the third chip; one end of the ninth capacitor is directly connected with one end of the twelfth resistor, and the other end of the ninth capacitor is directly connected with the second pin of the third chip; one end of the tenth capacitor is directly connected to the third pin of the third chip, and the other end of the tenth capacitor is directly connected to the ground; the first stitch of third chip is unsettled, the second stitch lug connection of third chip the output interface is eliminated to the biasing, the fourth stitch lug connection-5V power of third chip, the fifth stitch of third chip is unsettled, the sixth stitch lug connection +5V power of third chip, the seventh stitch lug connection of third chip the output interface is eliminated to the biasing, the eighth stitch of third chip is unsettled, the model of third chip is OP 27.
The band-pass filtering module comprises a filtering input interface, a thirteenth resistor, a fourteenth resistor, an eleventh capacitor, a fourth chip and a filtering output interface; the filtering input interface is directly connected with the offset cancellation output interface; one end of the eleventh capacitor is directly connected to the filtering input interface, and the other end of the eleventh capacitor is directly connected to the third pin of the fourth chip; one end of the thirteenth resistor is directly connected with the second pin of the fourth chip, and the other end of the thirteenth resistor is directly connected with the seventh pin of the fourth chip; one end of the fourteenth resistor is directly connected to the third pin of the fourth chip, and the other end of the fourteenth resistor is directly connected to the ground; the first stitch of fourth chip is unsettled, the fourth stitch lug connection-5V power of fourth chip, the fifth stitch of fourth chip is unsettled, the sixth stitch lug connection +5V power of fourth chip, the seventh stitch lug connection of fourth chip the filtering output interface, the eighth stitch of fourth chip is unsettled, the model of fourth chip is OP 27.
The alternating current-direct current conversion module comprises an alternating current signal input interface, a fifteenth resistor, a sixteenth resistor, a twelfth capacitor, a thirteenth capacitor, a fourteenth capacitor, a fifth chip and a direct current signal output interface; the alternating current signal input interface is directly connected with the filtering output interface; one end of the fifteenth resistor is directly connected with the alternating-current signal input interface, and the other end of the fifteenth resistor is directly connected with the second pin of the fifth chip; one end of the sixteenth resistor is directly connected with the seventh pin of the fifth chip, and the other end of the sixteenth resistor is directly connected with the direct-current signal output interface; one end of the twelfth capacitor is directly connected with the first pin of the fifth chip, and the other end of the twelfth capacitor is directly connected with the ground; one end of the thirteenth capacitor is directly connected to the third pin of the fifth chip, and the other end of the thirteenth capacitor is directly connected to one end of the sixteenth resistor; one end of the fourteenth capacitor is directly connected to the fourth pin of the fifth chip, and the other end of the fourteenth capacitor is directly connected to the eighth pin of the fifth chip; the fourth stitch lug connection-5V power of fifth chip, the fifth stitch lug connection of fifth chip the other end of twelfth electric capacity, the sixth stitch lug connection +5V power of fifth chip, the model of fifth chip is AD 736.
The monitoring display module comprises N groups of communication input interfaces, a main control module, a display output interface and a display screen; each group of communication input interfaces is directly connected with a corresponding group of direct current signal output interfaces, and the N groups of communication input interfaces are also directly connected with the input end of the main control module; the output end of the main control module is directly connected with the display output interface, and the display output interface is directly connected with the display screen.
The switch device is a gas insulated metal enclosed switch device.
The defect is an insulation defect.
The utility model provides a switch equipment internal defect detection device based on signal analysis, which comprises N groups of detection modules and a monitoring display module; each group of detection modules respectively detect the performance of different positions in the switch equipment, and the output end of each group of detection modules is directly connected with the input end of the monitoring display module; each group of detection modules comprises a measurement module, a signal acquisition module, a signal amplification module, a bias elimination module, a band-pass filtering module and an alternating current-direct current conversion module which are sequentially connected. The N groups of detection modules work simultaneously, and the monitoring display module obtains the defect condition in the switch equipment based on the detection results of the N groups of detection modules. This switchgear internal defect detection device based on signal analysis not only can realize the quick location to switchgear internal insulation defect, can save the detection personnel labour moreover greatly, improves defect detection efficiency and reduces because of detecting the influence in switchgear life-span.
Drawings
In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings used in the description of the embodiments or the prior art will be briefly described below, and it is obvious that the drawings in the following description are some embodiments of the present invention, and other drawings can be obtained by those skilled in the art without creative efforts.
Fig. 1 is a system block diagram of a defect detecting apparatus inside a switchgear of the present invention.
Fig. 2 is a block diagram of a measurement module of the internal defect detecting apparatus of the switchgear of the present invention.
Fig. 3 is a block diagram of a signal acquisition module of the internal defect detection apparatus of a switchgear of the present invention.
Fig. 4 is a block diagram of a signal amplification module of the internal defect detection apparatus of the switchgear of the present invention.
Fig. 5 is a block diagram of an offset canceling module of the internal defect detecting apparatus of the switchgear of the present invention.
Fig. 6 is a block diagram of a band-pass filter module of the internal defect detecting apparatus of the switchgear of the present invention.
Fig. 7 is a block diagram of an ac/dc converter module of the internal defect detection apparatus for a switchgear according to the present invention.
Detailed Description
The technical solutions of the present invention will be described clearly and completely with reference to the accompanying drawings, and it should be understood that the described embodiments are some, but not all embodiments of the present invention. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
In the description of the present invention, it should be noted that the terms "first", "second", "third", etc. are presented for descriptive purposes only and are not to be construed as indicating or implying relative importance.
In the description of the present invention, it should be noted that, unless otherwise explicitly specified or limited, the terms "communicate" and "connect" are to be interpreted broadly, e.g., as a fixed connection, a removable connection, or an integral connection; can be mechanically or electrically connected; they may be connected directly or indirectly through intervening media, or they may be interconnected between two elements. The specific meanings of the above terms in the present invention can be understood in specific cases to those skilled in the art.
Please refer to fig. 1, fig. 2, fig. 3, fig. 4, fig. 5, fig. 6, and fig. 7.
A switch equipment internal defect detection device based on signal analysis comprises N groups of detection modules and a monitoring display module; the output end of each group of detection modules is directly connected with the input end of the monitoring display module; each group of detection modules comprises a measurement module, a signal acquisition module, a signal amplification module, a bias elimination module, a band-pass filtering module and an alternating current-direct current conversion module which are sequentially connected; and the output end of the alternating current-direct current conversion module is used as the output end of the detection module to which the alternating current-direct current conversion module belongs. The switch device is a gas insulated metal enclosed switch device. The defect is an insulation defect.
The output end of the measuring module is directly connected with the input end of the signal acquisition module; the input end of the signal amplification module is directly connected with the output end of the signal acquisition module, and the output end of the signal amplification module is directly connected with the input end of the offset cancellation module; the input end of the band-pass filtering module is directly connected with the output end of the offset eliminating module, and the output end of the band-pass filtering module is directly connected with the input end of the alternating current-direct current conversion module.
The measuring module comprises a sensor CQ, a first measuring output interface and a second measuring output interface, wherein the first measuring output interface is directly connected with the sensor CQ, and the second measuring output interface is directly connected with the sensor CQ. The sensor CQ adopts a KT40-T16R model high-precision ultrasonic sensor, the central frequency of the sensor CQ is 40Khz, the sensitivity is more than or equal to-68 dB, the environmental noise interference can be effectively shielded, and the reliable partial discharge frequency characteristic is acquired through the vibration and acceleration characteristics.
The signal acquisition module comprises a first acquisition input interface, a second acquisition input interface, a first resistor R1, a second resistor R2, a third resistor R3, a fourth resistor R4, a fifth resistor R5, a sixth resistor R6, a seventh resistor R7, a first capacitor C1, a second capacitor C2, a third capacitor C3, a fourth capacitor C4, a fifth capacitor C5, a first chip U1 and an acquisition output interface. The first chip U1 is AD 620.
The first acquisition input interface is directly connected with the first measurement output interface, and the second acquisition input interface is directly connected with the second measurement output interface; one end of the first resistor R1 is directly connected with the first acquisition input interface, and the other end of the first resistor R1 is directly connected with the ground; one end of the second resistor R2 is directly connected to the second acquisition input interface, the other end of the second resistor R2 is directly connected to one end of the third resistor R3, and the other end of the third resistor R3 is directly connected to an external voltage signal Vb; one end of the first capacitor C1 is directly connected to one end of the third resistor R3, and the other end of the first capacitor C1 is directly connected to ground; one end of the second capacitor C2 is directly connected to one end of the third resistor R3, and the other end of the second capacitor C2 is directly connected to the other end of the first capacitor C1; one end of the third capacitor C3 is directly connected to one end of the first resistor R1, and the other end of the third capacitor C3 is directly connected to the third pin of the first chip U1; one end of the fourth capacitor C4 is directly connected to one end of the first resistor R1, and the other end of the fourth capacitor C4 is directly connected to the second pin of the first chip U1; one end of the fifth capacitor C5 is directly connected to the other end of the first capacitor C1, and the other end of the fifth capacitor C5 is directly connected to the third pin of the first chip U1; one end of the fourth resistor R4 is directly connected to the second pin of the first chip U1, and the other end of the fourth resistor R4 is directly connected to the third pin of the first chip U1; one end of the fifth resistor R5 is directly connected with the second pin of the first chip U1, and the other end of the fifth resistor R5 is directly connected with the other end of the first resistor R1; one end of the sixth resistor R6 is directly connected to the first pin of the first chip U1, and the other end of the sixth resistor R6 is directly connected to the fifth pin of the first chip U1; one end of the seventh resistor R7 is directly connected to the first pin of the first chip U1, and the other end of the seventh resistor R7 is directly connected to the fifth pin of the first chip U1; the fourth pin of the first chip U1 is directly connected to a-5V power supply, the sixth pin of the first chip U1 is directly connected to a +5V power supply, the seventh pin of the first chip U1 is directly connected to the acquisition output interface, and the eighth pin of the first chip U1 is directly connected to the ground.
The signal amplification module comprises a signal amplification input interface, an eighth resistor R8, a ninth resistor R9, a tenth resistor R10, a sixth capacitor C6, a seventh capacitor C7, a second chip U2 and a signal amplification output interface; the model of the second chip U2 is OP 27; the signal amplification module can enable a signal to be accurately amplified in a high gain mode, and meanwhile excellent dynamic precision is achieved.
The signal amplification input interface is directly connected with the acquisition output interface; one end of the sixth capacitor C6 is directly connected to the signal amplification input interface, the other end of the sixth capacitor C6 is directly connected to one end of the seventh capacitor C7, and the other end of the seventh capacitor C7 is directly connected to the third pin of the second chip U2; one end of the eighth resistor R8 is directly connected to one end of the seventh capacitor C7, and the other end of the eighth resistor R8 is directly connected to the second pin of the second chip U2; one end of the ninth resistor R9 is directly connected to one end of the seventh capacitor C7, and the other end of the ninth resistor R9 is directly connected to the second pin of the second chip U2; one end of the tenth resistor R10 is directly connected to the third pin of the second chip U2, and the other end of the tenth resistor R10 is directly connected to the ground; the first stitch of second chip U2 is unsettled, the second stitch lug connection of second chip U2 the signal amplification output interface, the fourth stitch lug connection-5V power of second chip U2, the fifth stitch lug connection of second chip U2 is unsettled, the sixth stitch lug connection +5V power of second chip U2, the seventh stitch lug connection of second chip U2 the signal amplification output interface, the eighth stitch lug connection of second chip U2 is unsettled.
The bias elimination module comprises a bias elimination input interface, an eleventh resistor R11, a twelfth resistor R12, an eighth capacitor C8, a ninth capacitor C9, a tenth capacitor C10, a third chip U3 and a bias elimination output interface; the model of the third chip U3 is OP 27; the bias elimination module can realize low input bias current and has good load driving capability.
The bias elimination input interface is directly connected with the signal amplification output interface; one end of the eleventh resistor R11 is directly connected to the offset cancellation input interface, the other end of the eleventh resistor R11 is directly connected to one end of the twelfth resistor R12, and the other end of the twelfth resistor R12 is directly connected to the third pin of the third chip U3; one end of the eighth capacitor C8 is directly connected to one end of the twelfth resistor R12, and the other end of the eighth capacitor C8 is directly connected to the second pin of the third chip U3; one end of the ninth capacitor C9 is directly connected to one end of the twelfth resistor R12, and the other end of the ninth capacitor C9 is directly connected to the second pin of the third chip U3; one end of the tenth capacitor C10 is directly connected to the third pin of the third chip U3, and the other end of the tenth capacitor C10 is directly connected to ground; the first stitch of third chip U3 is unsettled, the second stitch lug connection of third chip U3 output interface is eliminated to the biasing, the fourth stitch lug connection-5V power of third chip U3, the fifth stitch lug connection of third chip U3 is unsettled, the sixth stitch lug connection +5V power of third chip U3, the seventh stitch lug connection of third chip U3 output interface is eliminated to the biasing, the eighth stitch lug connection of third chip U3 is unsettled.
The band-pass filtering module comprises a filtering input interface, a thirteenth resistor R13, a fourteenth resistor R14, an eleventh capacitor C11, a fourth chip U4 and a filtering output interface; the model of the fourth chip U4 is OP 27; the band-pass filtering module further shields the environmental interference noise.
The filtering input interface is directly connected with the offset cancellation output interface; one end of the eleventh capacitor C11 is directly connected to the filtering input interface, and the other end of the eleventh capacitor C11 is directly connected to the third pin of the fourth chip U4; one end of the thirteenth resistor R13 is directly connected to the second pin of the fourth chip U4, and the other end of the thirteenth resistor R13 is directly connected to the seventh pin of the fourth chip U4; one end of the fourteenth resistor R14 is directly connected to the third pin of the fourth chip U4, and the other end of the fourteenth resistor R14 is directly connected to the ground; the first stitch of fourth chip U4 is unsettled, fourth chip U4's fourth stitch lug connection-5V power, fourth chip U4's fifth stitch is unsettled, fourth chip U4's sixth stitch lug connection +5V power, fourth chip U4's seventh stitch lug connection the filtering output interface, fourth chip U4's eighth stitch is unsettled.
The alternating current-direct current conversion module comprises an alternating current signal input interface, a fifteenth resistor R15, a sixteenth resistor R16, a twelfth capacitor C12, a thirteenth capacitor C13, a fourteenth capacitor C14, a fifth chip U5 and a direct current signal output interface; the model of the fifth chip U5 is AD 736; the alternating current-direct current conversion module converts alternating current frequency characteristics into direct current digital characteristics, and the direct current digital characteristics are identified and calculated for the main control module.
The alternating current signal input interface is directly connected with the filtering output interface; one end of the fifteenth resistor R15 is directly connected to the AC signal input interface, and the other end of the fifteenth resistor R15 is directly connected to the second pin of the fifth chip U5; one end of the sixteenth resistor R16 is directly connected to the seventh pin of the fifth chip U5, and the other end of the sixteenth resistor R16 is directly connected to the DC signal output interface; one end of the twelfth capacitor C12 is directly connected to the first pin of the fifth chip U5, and the other end of the twelfth capacitor C12 is directly connected to ground; one end of the thirteenth capacitor C13 is directly connected to the third pin of the fifth chip U5, and the other end of the thirteenth capacitor C13 is directly connected to one end of the sixteenth resistor R16; one end of the fourteenth capacitor C14 is directly connected to the fourth pin of the fifth chip U5, and the other end of the fourteenth capacitor C14 is directly connected to the eighth pin of the fifth chip U5; the fourth pin of the fifth chip U5 is directly connected to a-5V power supply, the fifth pin of the fifth chip U5 is directly connected to the other end of the twelfth capacitor C12, and the sixth pin of the fifth chip U5 is directly connected to a +5V power supply.
The monitoring display module comprises N groups of communication input interfaces, a main control module, a display output interface and a display screen; each group of communication input interfaces is directly connected with a corresponding group of direct current signal output interfaces, and the N groups of communication input interfaces are also directly connected with the input end of the main control module; the output end of the main control module is directly connected with the display output interface, and the display output interface is directly connected with the display screen.
When the internal defects of the switch device, especially the gas insulated metal enclosed switch device, need to be checked, such as insulation defects, N groups of detection modules are respectively placed at different positions in the switch device. The selection of a specific location may be based on a rule of thumb, considering the location of the switchgear most susceptible to insulation failure. And the N groups of detection modules work simultaneously and send detection results to a main control module part of the monitoring display module. The main control module respectively judges whether the detection result exceeds a preset range in the N detection results, and if not, the main control module controls the display screen to output a no-fault indication; and if a certain detection result exceeds a preset range, controlling the display screen to output a fault indication and marking that the fault is detected by the detection modules in the groups. Therefore, frequent operation of the switch device is not needed, the detection result can be efficiently and reliably obtained, and the fault position can be rapidly positioned.
The utility model provides a switch equipment internal defect detection device based on signal analysis, which comprises N groups of detection modules and a monitoring display module; each group of detection modules respectively detect the performance of different positions in the switch equipment, and the output end of each group of detection modules is directly connected with the input end of the monitoring display module; each group of detection modules comprises a measurement module, a signal acquisition module, a signal amplification module, a bias elimination module, a band-pass filtering module and an alternating current-direct current conversion module which are sequentially connected. The N groups of detection modules work simultaneously, and the monitoring display module obtains the defect condition in the switch equipment based on the detection results of the N groups of detection modules. This switchgear internal defect detection device based on signal analysis not only can realize the quick location to switchgear internal insulation defect, can save the detection personnel labour moreover greatly, improves defect detection efficiency and reduces because of detecting the influence in switchgear life-span.
Finally, it should be noted that: the above embodiments are only used to illustrate the technical solution of the present invention, and not to limit the same; while the utility model has been described in detail and with reference to the foregoing embodiments, it will be understood by those skilled in the art that: the technical solutions described in the foregoing embodiments may still be modified, or some or all of the technical features may be equivalently replaced; and the modifications or the substitutions do not make the essence of the corresponding technical solutions depart from the scope of the technical solutions of the embodiments of the present invention.
Claims (10)
1. The internal defect detection device of the switch equipment based on the signal analysis is characterized by comprising N groups of detection modules and a monitoring display module; each group of detection modules respectively detect the performance of different positions in the switch equipment, and the output end of each group of detection modules is directly connected with the input end of the monitoring display module; each group of detection modules comprises a measurement module, a signal acquisition module, a signal amplification module, a bias elimination module, a band-pass filtering module and an AC-DC conversion module which are sequentially connected, wherein the output end of the AC-DC conversion module is used as the output end of the detection module to which the AC-DC conversion module belongs; and the N groups of detection modules work simultaneously.
2. The apparatus according to claim 1, wherein the measurement module comprises a sensor, a first measurement output interface and a second measurement output interface, the first measurement output interface is directly connected to the sensor, and the second measurement output interface is directly connected to the sensor.
3. The switching device internal defect detection apparatus based on signal analysis according to claim 2, wherein the signal acquisition module comprises a first acquisition input interface, a second acquisition input interface, a first resistor, a second resistor, a third resistor, a fourth resistor, a fifth resistor, a sixth resistor, a seventh resistor, a first capacitor, a second capacitor, a third capacitor, a fourth capacitor, a fifth capacitor, a first chip and an acquisition output interface; the first acquisition input interface is directly connected with the first measurement output interface, and the second acquisition input interface is directly connected with the second measurement output interface; one end of the first resistor is directly connected with the first acquisition input interface, and the other end of the first resistor is directly connected with the ground; one end of the second resistor is directly connected with the second acquisition input interface, the other end of the second resistor is directly connected with one end of the third resistor, and the other end of the third resistor is directly connected with an external voltage signal; one end of the first capacitor is directly connected with one end of the third resistor, and the other end of the first capacitor is directly connected with the ground; one end of the second capacitor is directly connected with one end of the third resistor, and the other end of the second capacitor is directly connected with the other end of the first capacitor; one end of the third capacitor is directly connected with one end of the first resistor, and the other end of the third capacitor is directly connected with a third pin of the first chip; one end of the fourth capacitor is directly connected with one end of the first resistor, and the other end of the fourth capacitor is directly connected with the second pin of the first chip; one end of the fifth capacitor is directly connected with the other end of the first capacitor, and the other end of the fifth capacitor is directly connected with a third pin of the first chip; one end of the fourth resistor is directly connected with the second pin of the first chip, and the other end of the fourth resistor is directly connected with the third pin of the first chip; one end of the fifth resistor is directly connected with the second pin of the first chip, and the other end of the fifth resistor is directly connected with the other end of the first resistor; one end of the sixth resistor is directly connected with the first pin of the first chip, and the other end of the sixth resistor is directly connected with the fifth pin of the first chip; one end of the seventh resistor is directly connected with the first pin of the first chip, and the other end of the seventh resistor is directly connected with the fifth pin of the first chip; the fourth pin of the first chip is directly connected with a-5V power supply, the sixth pin of the first chip is directly connected with a +5V power supply, the seventh pin of the first chip is directly connected with the acquisition output interface, the eighth pin of the first chip is directly connected with the ground, and the type of the first chip is AD 620.
4. The switching device internal defect detection apparatus based on signal analysis according to claim 3, wherein the signal amplification module comprises a signal amplification input interface, an eighth resistor, a ninth resistor, a tenth resistor, a sixth capacitor, a seventh capacitor, a second chip and a signal amplification output interface; the signal amplification input interface is directly connected with the acquisition output interface; one end of the sixth capacitor is directly connected with the signal amplification input interface, the other end of the sixth capacitor is directly connected with one end of the seventh capacitor, and the other end of the seventh capacitor is directly connected with the third pin of the second chip; one end of the eighth resistor is directly connected with one end of the seventh capacitor, and the other end of the eighth resistor is directly connected with a second pin of the second chip; one end of the ninth resistor is directly connected with one end of the seventh capacitor, and the other end of the ninth resistor is directly connected with the second pin of the second chip; one end of the tenth resistor is directly connected to the third pin of the second chip, and the other end of the tenth resistor is directly connected to the ground; the first stitch of second chip is unsettled, the second stitch lug connection of second chip the signal amplification output interface, the fourth stitch lug connection-5V power of second chip, the fifth stitch of second chip is unsettled, the sixth stitch lug connection +5V power of second chip, the seventh stitch lug connection of second chip the signal amplification output interface, the eighth stitch of second chip is unsettled, the model of second chip is OP 27.
5. The apparatus according to claim 4, wherein the bias elimination module comprises a bias elimination input interface, an eleventh resistor, a twelfth resistor, an eighth capacitor, a ninth capacitor, a tenth capacitor, a third chip and a bias elimination output interface; the bias elimination input interface is directly connected with the signal amplification output interface; one end of the eleventh resistor is directly connected with the offset cancellation input interface, the other end of the eleventh resistor is directly connected with one end of the twelfth resistor, and the other end of the twelfth resistor is directly connected with the third pin of the third chip; one end of the eighth capacitor is directly connected with one end of the twelfth resistor, and the other end of the eighth capacitor is directly connected with the second pin of the third chip; one end of the ninth capacitor is directly connected with one end of the twelfth resistor, and the other end of the ninth capacitor is directly connected with the second pin of the third chip; one end of the tenth capacitor is directly connected to the third pin of the third chip, and the other end of the tenth capacitor is directly connected to the ground; the first stitch of third chip is unsettled, the second stitch lug connection of third chip the output interface is eliminated to the biasing, the fourth stitch lug connection-5V power of third chip, the fifth stitch of third chip is unsettled, the sixth stitch lug connection +5V power of third chip, the seventh stitch lug connection of third chip the output interface is eliminated to the biasing, the eighth stitch of third chip is unsettled, the model of third chip is OP 27.
6. The switching device internal defect detection apparatus based on signal analysis according to claim 5, wherein the band-pass filtering module comprises a filtering input interface, a thirteenth resistor, a fourteenth resistor, an eleventh capacitor, a fourth chip and a filtering output interface; the filtering input interface is directly connected with the offset cancellation output interface; one end of the eleventh capacitor is directly connected to the filtering input interface, and the other end of the eleventh capacitor is directly connected to the third pin of the fourth chip; one end of the thirteenth resistor is directly connected with the second pin of the fourth chip, and the other end of the thirteenth resistor is directly connected with the seventh pin of the fourth chip; one end of the fourteenth resistor is directly connected to the third pin of the fourth chip, and the other end of the fourteenth resistor is directly connected to the ground; the first stitch of fourth chip is unsettled, the fourth stitch lug connection-5V power of fourth chip, the fifth stitch of fourth chip is unsettled, the sixth stitch lug connection +5V power of fourth chip, the seventh stitch lug connection of fourth chip the filtering output interface, the eighth stitch of fourth chip is unsettled, the model of fourth chip is OP 27.
7. The apparatus according to claim 6, wherein the AC-DC conversion module comprises an AC signal input interface, a fifteenth resistor, a sixteenth resistor, a twelfth capacitor, a thirteenth capacitor, a fourteenth capacitor, a fifth chip and a DC signal output interface; the alternating current signal input interface is directly connected with the filtering output interface; one end of the fifteenth resistor is directly connected with the alternating-current signal input interface, and the other end of the fifteenth resistor is directly connected with the second pin of the fifth chip; one end of the sixteenth resistor is directly connected with the seventh pin of the fifth chip, and the other end of the sixteenth resistor is directly connected with the direct-current signal output interface; one end of the twelfth capacitor is directly connected with the first pin of the fifth chip, and the other end of the twelfth capacitor is directly connected with the ground; one end of the thirteenth capacitor is directly connected to the third pin of the fifth chip, and the other end of the thirteenth capacitor is directly connected to one end of the sixteenth resistor; one end of the fourteenth capacitor is directly connected to the fourth pin of the fifth chip, and the other end of the fourteenth capacitor is directly connected to the eighth pin of the fifth chip; the fourth stitch lug connection-5V power of fifth chip, the fifth stitch lug connection of fifth chip the other end of twelfth electric capacity, the sixth stitch lug connection +5V power of fifth chip, the model of fifth chip is AD 736.
8. The switch device internal defect detection apparatus based on signal analysis according to claim 7, wherein the monitoring display module comprises N groups of communication input interfaces, a main control module, a display output interface and a display screen; each group of communication input interfaces is directly connected with a corresponding group of direct current signal output interfaces, and the N groups of communication input interfaces are also directly connected with the input end of the main control module; the output end of the main control module is directly connected with the display output interface, and the display output interface is directly connected with the display screen.
9. The apparatus for detecting internal defects of switchgear based on signal analysis according to claim 8, wherein the switchgear is a gas insulated metal enclosed switchgear.
10. The apparatus of claim 9, wherein the defect is an insulation defect.
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