CN216793712U

CN216793712U - Ultraviolet packaging device

Info

Publication number: CN216793712U
Application number: CN202123056834.9U
Authority: CN
Inventors: 李文博; 孙钱; 杨勇; 张智聪; 汤乐明; 李光辉; 王宏伟
Original assignee: Guangdong Zhongke Semiconductor Micro Nano Manufacturing Technology Research Institute; Suzhou Institute of Nano Tech and Nano Bionics of CAS
Current assignee: Guangdong Zhongke Semiconductor Micro Nano Manufacturing Technology Research Institute; Suzhou Institute of Nano Tech and Nano Bionics of CAS
Priority date: 2021-12-06
Filing date: 2021-12-06
Publication date: 2022-06-21
Anticipated expiration: 2031-12-06

Abstract

The utility model relates to the technical field of ultraviolet LED packaging, and relates to an ultraviolet packaging device. The ultraviolet packaging device comprises a substrate, an inner shell, an outer shell and a lens. The base plate is enclosed to the inner shell, and the internal surface laminating of inner shell in the upper surface of base plate, the inner shell forms the mounting groove in the upper surface of base plate, and the outer shell is enclosed and is located base plate and inner shell outsidely to laminate in the upper surface of inner shell, the shell is equipped with the lens in the top of inner shell, and the lens is sealed the mounting groove, and wherein, in ultraviolet LED located the mounting groove, the inner shell formed by ultraviolet reflection material with the shell. Cover in the base plate through inner shell and outer shell layer, form narrow and small mounting groove on the base plate to set up ultraviolet LED in this mounting groove, reduce dark ultraviolet light's absorption probability, reduce light loss, thereby improve the extraction efficiency of light.

Description

Ultraviolet packaging device

Technical Field

The utility model relates to the technical field of ultraviolet LED packaging, in particular to an ultraviolet packaging device.

Background

Ultraviolet (UV) radiation is a generic term for radiation in the electromagnetic spectrum with wavelengths from 100nm to 400 nm. The light extraction efficiency of Light Emitting Diodes (LEDs) is greatly limited by their packaging technology. Ultraviolet LEDs are used in the fields of curing, ink printing, medical treatment, sterilization, disinfection, and the like, and are increasingly used in daily life and industrial applications today.

Deep ultraviolet LEDs have attracted attention for potential applications in the fields of air disinfection, water purification, biochemical detection and optical communications. However, the low light extraction efficiency of deep ultraviolet LEDs still does not meet the current application requirements.

The above is only for the purpose of assisting understanding of the technical solutions of the present application, and does not represent an admission that the above is prior art.

SUMMERY OF THE UTILITY MODEL

The utility model mainly aims to provide an ultraviolet packaging device and aims to improve the light extraction efficiency of deep ultraviolet.

In order to achieve the above object, the present invention provides an ultraviolet packaging device, including: a substrate;

the inner shell is arranged around the substrate, the inner surface of the inner shell is attached to the upper surface of the substrate, and a mounting groove is formed in the upper surface of the substrate;

an outer shell surrounding the base plate and the inner shell and attached to the upper surface of the inner shell, an

The lens is arranged above the inner shell of the outer shell and seals the mounting groove;

the ultraviolet LED is arranged in the mounting groove, and the inner shell and the outer shell are made of ultraviolet reflecting materials.

Optionally, a first gap is formed between a groove wall of the mounting groove and the ultraviolet LED;

the groove walls of the mounting groove comprise a first groove wall close to the substrate and a second groove wall deviated from the substrate, and the second groove wall extends from the groove bottom of the mounting groove to the direction of the groove opening and inclines along the direction deviated from the ultraviolet LED;

and the surfaces of the first groove wall and the second groove wall are provided with reflecting layers.

Optionally, an included angle α formed by a plane where the second groove wall is located and a plane where the substrate is located is 30 to 75 degrees;

and/or the first groove wall extends from the groove bottom of the mounting groove to the direction of the groove opening and inclines along the direction departing from the ultraviolet LED, and the plane where the first groove wall is located and the plane where the substrate is located form an included angle beta of 75-90 degrees;

and/or the reflecting layer arranged on the second groove wall is a mirror reflecting layer or a scattering reflecting layer;

and/or the reflecting layer arranged on the first groove wall is a scattering reflecting layer;

and/or the ultraviolet LED is arranged on the substrate through a connecting layer, the height of the first groove wall is defined as H1, the height of the connecting layer is defined as H2, the height of the light-emitting layer of the ultraviolet LED is defined as H3, and H2 is more than or equal to H1 and is more than or equal to H3;

and/or the distance between the first groove wall and the ultraviolet LED is defined as D1, and 0um < D1<50um is satisfied;

and/or the height of the inner shell on the substrate is defined as H4, the height of the ultraviolet LED on the substrate is defined as H5, and H4> H5 are satisfied;

the height of the inner shell on the base plate is H4, and the requirement that H4 is more than or equal to 200um and less than or equal to 600um is met.

Optionally, the reflective layer is made of a BN nanoparticle material or SiO₂Nanoparticle material, ZrO nanoparticle material, AlN nanoparticle material, TiO₂A mixture of one or more of the nanoparticle materials;

or the ultraviolet reflecting material for forming the inner shell and the outer shell is made of polytetrafluoroethylene;

or the substrate is made of an inorganic insulating material, and the lens is made of a deep ultraviolet light-transmitting material;

or, another mounting groove is further formed in the upper surface of the base plate on the upper surface of the inner shell, the other mounting groove is covered by the outer shell attached to the upper surface of the inner shell, and a protection element is arranged in the other mounting groove.

Optionally, a through first insertion inlet is formed on one opposite side surface of the outer periphery of the inner shell, so that the substrate is contained in the inner cavity of the inner shell in a limiting manner through the first insertion inlet;

a second through-connection inlet is formed on one opposite side surface of the periphery of the outer shell, so that the substrate and the inner shell are contained in the inner cavity of the outer shell in a limiting manner through the second through-connection inlet; or the like, or, alternatively,

a first inserting inlet is formed in one side face of the periphery of the inner shell and used for enabling the substrate to be contained in the inner cavity of the inner shell in a limiting mode through the first inserting inlet;

and a second inserting inlet is formed in one side surface of the periphery of the outer shell, so that the substrate and the inner shell are contained in the inner cavity of the outer shell in a limiting mode through the second inserting inlet.

Optionally, a clamping groove is formed in the lateral periphery of the substrate, the outer periphery of the inner shell bends towards the lateral periphery of the substrate to form a first buckle, the outer periphery of the outer shell bends towards the lateral periphery of the substrate to form a second buckle, and the first buckle and the second buckle are clamped in the clamping groove.

Optionally, the card slots include a first card slot and a second card slot, and the first card slot and the second card slot are arranged on the lateral periphery of the substrate at an interval from top to bottom;

the first clamping groove is connected with the first buckle in a clamped mode, and the second clamping groove is connected with the second buckle in a clamped mode.

Optionally, the substrate is defined to have a left-right direction and a front-back direction perpendicular to the up-down direction, the first card slot is disposed in the left-right direction of the lateral surface of the substrate, and the second card slot is disposed in the front-back direction of the lateral surface of the substrate.

Optionally, the first buckle and the second buckle are clamped in the clamping groove, the first buckle is in limited abutting connection between the bottom of the clamping groove and the second buckle, and the sum of the thicknesses of the first buckle and the second buckle is equal to the depth of the clamping groove.

Optionally, a metal plating layer is disposed on the substrate, an inner surface of the inner shell is attached to the metal plating layer, the ultraviolet LED is electrically connected to the metal plating layer, and the metal plating layer is used for communicating a circuit;

the metal plating layer includes:

the anode plating layer is used for connecting the anode of the ultraviolet LED; and

the cathode coating is used for connecting the cathode of the ultraviolet LED;

an isolation area is arranged between the anode coating and the cathode coating;

the metal coating is composed of a plurality of layers of coatings, and the coatings at least comprise copper layers, nickel layers and gold layers, wherein the nickel layers and the gold layers are arranged on the surfaces of the copper layers;

the thickness of the copper layer is 50-100 um, the thickness of the nickel layer is 3-6 um, and the thickness of the gold layer is 0.05-1 um;

the substrate is provided with two through holes, conductive materials are filled in the two through holes, one sides of the two through holes are respectively and electrically communicated with the anode coating and the cathode coating, and the other sides of the two through holes are respectively and electrically communicated with the metal circuit on the outer side of the substrate.

According to the technical scheme, an inner shell and an outer shell are sequentially arranged on a base plate, the inner shell is arranged around the base plate, the inner surface of the inner shell is attached to the upper surface of the base plate, an installation groove is formed in the upper surface of the base plate by the inner shell, the outer shell is arranged around the base plate and the inner shell and is attached to the upper surface of the inner shell, the lens is arranged above the inner shell by the outer shell, and the installation groove is sealed by the lens; make inner shell and outer shell layer cladding in the base plate, the inner shell forms by ultraviolet reflecting material with the shell, and seal mounting groove through the lens, make to form narrow and small mounting groove on the base plate, and set up ultraviolet LED in this mounting groove, this narrow and small mounting groove helps reducing deep ultraviolet's absorption probability, and, because emission angle's reason at the light that launches through the lens, the total reflection can take place, make partial light can not see through the lens and launch away, setting through mounting groove, make light change angle pass through the lens, reduce the total reflection of light through the lens in-process of launching from this, reduce light loss, thereby improve the extraction efficiency of light. And the inner surfaces of the inner shell and the outer shell are provided with the reflecting layers, so that the light extraction efficiency can be better improved.

Drawings

In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings used in the description of the embodiments or the prior art will be briefly described below, it is obvious that the drawings in the following description are only some embodiments of the present invention, and for those skilled in the art, other drawings can be obtained according to the structures shown in the drawings without creative efforts.

FIG. 1 is a schematic structural diagram of an embodiment of an UV packaging device according to the present invention;

fig. 2 is an exploded view of the uv package device of fig. 1;

FIG. 3 is a schematic top view of an embodiment of a housing of the present invention;

FIG. 4 is a schematic top view of an embodiment of an inner shell bonded to a substrate;

FIG. 5 is a schematic top view of an embodiment of the outer shell and the inner shell coupled to the substrate;

FIG. 6 is a schematic structural diagram of another embodiment of an UV packaging device of the present invention;

FIG. 7 is a schematic structural diagram of an assembled state of an ultraviolet packaging device according to an embodiment of the utility model;

FIG. 8 is a schematic structural view of another embodiment of an ultraviolet packaging device of the present invention in an assembled state;

fig. 9 is a schematic structural diagram of another embodiment of an ultraviolet packaging device of the utility model.

The reference numbers indicate:

reference numerals	Name(s)	Reference numerals	Name (R)
				100	Ultraviolet packaging device	31	Mounting groove
10	Substrate	311	First groove wall
				11	Clamping groove	313	Second groove wall
111	First card slot	312	Step
				113	Second card slot	32	First gap
13	Metallic coating	33	First buckle
				130	Isolation region	34	First plug inlet
131	Positive electrode coating	35	Another mounting groove
				133	Coating of negative electrode	50	Outer casing
15	Through hole	51	Second buckle
				20	Reflective layer	54	Second plug inlet
21	A first reflective layer	70	Lens
				24	Second reflecting layer	90	Ultraviolet LED
25	Third reflective layer	91	Connecting layer
				27	A fourth reflective layer	93	Luminescent layer
30	Inner shell

The implementation, functional features and advantages of the objects of the present invention will be further explained with reference to the accompanying drawings.

Detailed Description

The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.

It should be noted that all the directional indicators (such as up, down, left, right, front, and rear … …) in the embodiment of the present invention are only used to explain the relative position relationship between the components, the movement situation, etc. in a specific posture (as shown in the drawing), and if the specific posture is changed, the directional indicator is changed accordingly.

In the present invention, unless otherwise expressly stated or limited, the terms "connected," "secured," and the like are to be construed broadly, and for example, "secured" may be a fixed connection, a removable connection, or an integral part; can be mechanically or electrically connected; they may be directly connected or indirectly connected through intervening media, or they may be connected internally or in any other suitable relationship, unless expressly stated otherwise. The specific meanings of the above terms in the present invention can be understood by those skilled in the art according to specific situations.

In addition, the descriptions related to "first", "second", etc. in the present invention are only for descriptive purposes and are not to be construed as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include at least one such feature. In addition, the meaning of "and/or" appearing throughout is to include three juxtapositions, exemplified by "A and/or B," including either the A or B arrangement, or both A and B satisfied arrangement. In addition, technical solutions between various embodiments may be combined with each other, but must be realized by a person skilled in the art, and when the technical solutions are contradictory or cannot be realized, such a combination should not be considered to exist, and is not within the protection scope of the present invention.

Fig. 1 and 8 are schematic structural diagrams of an ultraviolet packaging device 100 according to an embodiment of the utility model.

The ultraviolet LED90 has the characteristics of small light-emitting area, high light-emitting efficiency, low power consumption, high-intensity radiation intensity and the like, is widely applied to the fields of sterilization, disinfection, curing, printing ink printing, medical treatment and the like, obtains a large amount of market share, and has higher research and development values.

For example, deep ultraviolet LEDs have attracted attention for potential applications in the fields of air disinfection, water purification, biochemical detection and optical communications. However, the low light extraction efficiency of deep ultraviolet LEDs still does not meet the current application requirements.

To improve the light extraction efficiency of the ultraviolet, the present application provides an ultraviolet packaging device 100. The ultraviolet packaging device 100 includes a substrate 10, an inner casing 30, an outer casing 50, and a lens 70. The inner casing 30 surrounds the base plate 10, an inner surface of the inner casing 30 is attached to an upper surface of the base plate 10, and a mounting groove 31 is formed on the upper surface of the base plate 10. The outer shell 50 surrounds the base plate 10 and the inner shell 30 and is attached to the upper surface of the inner shell 30. The outer shell 50 is provided with a lens 70 above the inner shell 30, and the lens 70 seals the mounting groove 31. The ultraviolet LED90 is disposed in the mounting groove 31, and the inner surfaces of the inner casing 30 and the outer casing 50 are disposed with reflective layers.

As shown in fig. 1 and 2, in the technical solution of the present application, an inner shell 30 and an outer shell 50 are sequentially disposed on a substrate 10, the inner shell 30 is enclosed on the substrate 10, so that an inner surface of the inner shell 30 is attached to an upper surface of the substrate 10, an installation groove 31 is formed on the upper surface of the substrate 10 by the inner shell 30, the outer shell 50 is enclosed on the substrate 10 and the inner shell 30 and is attached to an upper surface of the inner shell 30, a lens 70 is disposed above the inner shell 30 by the outer shell 50, and the installation groove 31 is sealed by the lens 70; make inner shell 30 and shell 50 cladding in base plate 10 layer upon layer, inner shell 30 and shell 50 are formed by ultraviolet reflection material, and seal mounting groove 31 through lens 70, make to form narrow and small mounting groove 31 on base plate 10, and set up ultraviolet LED90 in this mounting groove 31, this narrow and small mounting groove 31 helps reducing deep ultraviolet's absorption probability, and, because the reason of emission angle, total reflection probably takes place at the light that launches through the lens, make partial light can not see through lens 70 and launch, through the setting of mounting groove 31, make light change the angle and pass through the lens, reduce the total reflection of light in-process of launching through lens 70 from this, reduce light loss, thereby improve the extraction efficiency of light. And the inner surfaces of the inner shell 30 and the outer shell 50 are provided with the reflecting layers, so that the light extraction efficiency can be better improved.

Because the larger the space that ultraviolet LED90 is located, the light path length of its light outgoing is long, and the probability that takes place to absorb also increases, and some light loses in this process, therefore, this application covers in base plate 10 layer by layer through inner shell 30 and shell 50, forms mounting groove 31 on base plate 10 surface through inner shell 30, is favorable to reducing the space of mounting groove 31, and directly adopts ultraviolet reflecting material as the casing, reduces ultraviolet LED 90's light loss, improves the extraction efficiency of light.

The inner casing 30 and the outer casing 50 are made of teflon. The polytetrafluoroethylene material has excellent light reflectivity, stable material property, UV aging resistance and outstanding advantages. The inner surface of the inner casing 30 is coated with a reflective layer to further enhance the light extraction efficiency. Wherein the reflecting layer is made of BN nano-particle material or SiO₂Nanoparticle material, ZrO nanoparticle material, AlN nanoparticle material, TiO₂The mixture of one or more of the nanoparticle materials is not particularly limited.

Traditional base plate 10 adopts the metal box dam usually, encloses to locate base plate 10 all around, and metal box dam reflectivity is not high, and because the polytetrafluoroethylene coating is coated to the base plate 10 on the technology hardly realize, consequently, this application sets up inner shell 30, and this inner shell 30 can be surface coating polytetrafluoroethylene, also can be that polytetrafluoroethylene material direct forming makes, and the suitable mould shaping of polytetrafluoroethylene can make the shape that wants, makes things convenient for the preparation technology. The inner casing 30 is tightly attached to the substrate 10, so that the inner casing 30 forms a mounting groove 31 on the upper surface of the substrate 10, the size of the mounting groove 31 is only used for accommodating and mounting the ultraviolet LED90, so as to reduce the light loss of the ultraviolet LED90, and the outer casing 50 is further arranged, and the outer casing 50 can tightly cover the substrate 10 and the inner casing 30, so as to reduce the light loss of the ultraviolet LED 90.

Further, in an embodiment, as shown in fig. 7 and 8, two opposite side surfaces of the outer periphery of the inner housing 30 are opened to form a first insertion inlet 34 therethrough, so that the substrate 10 is limitedly accommodated in the inner cavity of the inner housing 30 through the first insertion inlet 34, and further, as shown in fig. 7 and 8, the first buckle 33 can be inserted into the first engaging groove 111.

A through second insertion inlet 54 is formed on two opposite side surfaces of the outer periphery of the outer shell 50, so that the substrate 10 and the inner shell 30 are received in the inner cavity of the outer shell 50 in a limited manner through the second insertion inlet 54, and further, as shown in fig. 7 and 8, the second buckle 51 is inserted into the second slot 113.

As shown in fig. 7, the inner housing 30 and the outer housing 50 can be crossed to be inserted into the slot 11 of the substrate 10. As shown in fig. 8, the inner housing 30 and the outer housing 50 can be inserted into the card slot 11 of the substrate 10 on the same side of the substrate 10. The opposite two side surfaces are provided with a first inserting inlet 34 and a second inserting inlet 54 which are communicated, so that the assembly operation process is simplified. Meanwhile, during the process of assembling the substrate 10, the inner casing 30 and the outer casing 50, a sealing material may be applied between the outer circumferential surfaces of the adjacent two to seal the gap that may exist. The sealing material may be silicone, resin, or the like.

Further, in another embodiment, as shown in fig. 7 and 8, a first inserting inlet 34 is formed on one side surface of the outer periphery of the inner housing 30, so that the substrate 10 is limited and contained in the inner cavity of the inner housing 30 through the first inserting inlet 34, and further, the first buckle 33 can be inserted into the first locking groove 111; in this way, the inner case 30 is tightly wrapped around the base plate 10.

A second inserting inlet 54 is formed in one side surface of the outer periphery of the outer shell 50, so that the substrate 10 and the inner shell 30 are accommodated in the inner cavity of the outer shell 50 in a limiting manner through the second inserting inlet 54, and further, the second buckle 51 is inserted into the second clamping groove 113, so that the outer shell 50 tightly covers the inner shell 30 and the substrate 10, the three are tightly covered layer by layer, and the structural stability is improved.

Moreover, since the first inserting inlet 34 is formed in one side surface of the periphery of the inner casing 30 and the second inserting inlet 54 is formed in one side surface of the periphery of the outer casing 50, when the inner casing 30 is wrapped on the substrate 10, three side surfaces of the periphery of the substrate 10 can be wrapped, and when the outer casing 50 is wrapped on the inner casing 30, three side surfaces of the periphery of the inner casing 30 can be wrapped, which is more beneficial to achieving the sealing performance of the whole structure.

Further, when the inner shell 30 and the outer shell 50 are cross-clamped to the base plate 10, after the inner shell 30 is wrapped on the base plate 10, the outer shell 50 can wrap the first inserting inlet 34 of the inner shell 30, so as to further improve the sealing performance of the whole structure. Of course, the two can be clamped without crossing.

Further, as shown in fig. 1, 2 and 6, a clamping groove 11 is opened on a side circumferential surface of the base plate 10, a first buckle 33 is formed by bending an outer circumference of the inner housing 30 toward the side circumferential surface of the base plate 10, a second buckle 51 is formed by bending an outer circumference of the outer housing 50 toward the side circumferential surface of the base plate 10, and the first buckle 33 and the second buckle 51 are clamped in the clamping groove 11.

So that the inner shell 30 and the outer shell 50 are assembled on the substrate 10 layer by means of snap connection. In the assembling process, the inner shell 30 is firstly clamped on the substrate 10, so that the inner surface of the inner shell 30 is attached to the upper surface of the substrate 10, no gap is left between the inner shell and the substrate, the space size formed by the inner shell 30 on the substrate 10 is reduced, and the loss of ultraviolet light is reduced. Then, the outer shell 50 is assembled on the inner shell 30 and the substrate 10, and the outer shell 50 is attached to the upper surface of the inner shell 30, so that no gap is left between the inner shell and the outer shell, the size of the space formed by the outer shell 50 on the inner shell 30 is reduced, and the loss of ultraviolet light is reduced. Meanwhile, the outer shell 50 is wrapped on the inner shell 30 and the base plate 10, and the inner shell 30 is clamped between the outer shell 50 and the base plate 10, so that the connection tightness is enhanced, and the stability of the whole structure is improved.

Further, in an embodiment, as shown in fig. 1, fig. 2, fig. 7 and fig. 8, the card slot 11 includes a first card slot 111 and a second card slot 113, and the first card slot 111 and the second card slot 113 are disposed on a lateral periphery of the substrate 10 at an interval from top to bottom; the first engaging groove 111 engages with the first latch 33, and the second engaging groove 113 engages with the second latch 51. With the spacing joint of first buckle 33 in first draw-in groove 111 alone, with the spacing joint of second buckle 51 in second draw-in groove 113, improve the reliability of installing separately, avoid one of them buckle to go wrong, directly influence the joint stability of another buckle.

As shown in fig. 7 and 8, the inner shell 30 and the outer shell 50 may be inserted into the substrate 10 at the same side, or both may be inserted into the substrate 10 from different directions.

Further, in one embodiment, as shown in fig. 7, the substrate 10 is defined to have a left-right direction and a front-back direction perpendicular to the up-down direction, the first card slot 111 is disposed in the left-right direction of the side peripheral surface of the substrate 10, and the second card slot 113 is disposed in the front-back direction of the side peripheral surface of the substrate 10. That is, the substrate 10 is clamped and limited in the circumferential direction by adopting a crossed clamping manner, so that the clamping stability of the inner shell 30, the outer shell 50 and the substrate 10 is improved. The clamping limit of the lateral periphery of the substrate 10 in only one direction during clamping in the same direction is avoided.

Further, as shown in fig. 6, in an embodiment, the first buckle 33 and the second buckle 51 are clamped in the same clamping groove 11, the first buckle 33 is limited and abutted between the bottom of the clamping groove 11 and the second buckle 51, so that the inner shell 30 is tightly wrapped on the substrate 10, and the outer shell 50 is tightly wrapped on the inner shell 30, so that the overall structure is tightly connected, and the stability is improved. And the thickness sum of first buckle 33 and second buckle 51 equals the degree of depth of draw-in groove 11 to guarantee that first buckle 33 and second buckle 51 are spacing in draw-in groove 11, avoid deviating from, improve joint stability. Meanwhile, in the clamping of the clamping groove 11 with the first buckle 33 and the second buckle 51, sealing materials can be filled in gaps, and the sealing performance and the stability are further improved.

Further, as shown in fig. 1, a first gap 32 is provided between the groove wall of the mounting groove 31 and the ultraviolet LED 90; in this way, the ultraviolet LED90 is prevented from contacting the wall of the mounting groove 31, which makes the operation difficult when the ultraviolet LED90 is disposed on the substrate 10 in the mounting groove 31, for example, when the ultraviolet LED90 is soldered on the substrate 10, the soldering may be poor.

Further, as shown in fig. 1 and 2, the groove walls of the mounting groove 31 include a first groove wall 311 close to the substrate 10, and a second groove wall 313 away from the substrate 10, the second groove wall 313 extending from the groove bottom of the mounting groove 31 toward the direction of the notch and being inclined in a direction away from the ultraviolet LED 90; the inclined second groove wall 313 facilitates better reflection of light out. The surfaces of the first groove wall 311 and the second groove wall 313 may be provided with a reflective layer to further improve the reflection of light.

Further, as shown in fig. 2, the included angle α formed between the plane of the second groove wall 313 and the plane of the substrate 10 is 30 ° to 75 °, so that the light reflected from the second groove wall 313 can be transmitted through the lens 70, and the light extraction efficiency is easily reduced when the angle is too large or too small.

As shown in fig. 2, the first groove wall 311 extends from the bottom of the mounting groove 31 to the notch, and inclines in a direction away from the ultraviolet LED90, and an included angle β formed between a plane of the first groove wall 311 and a plane of the substrate 10 is 75 ° to 90 °, so that light reflected from the first groove wall 311 can be emitted through the lens 70.

The reflective layer provided on the second groove wall 313 is a specular reflective layer or a scattering reflective layer, and light irradiated to the second groove wall 313 can be extracted by specular reflection or diffuse reflection.

The reflective layer disposed on the first groove wall 311 is a scattering reflective layer, and can extract light irradiated to the first groove wall 311 through diffuse reflection.

The reflecting layer can be made of BN nano-particle material or SiO₂Nanoparticle material, ZrO nanoparticle material, AlN nanoparticle material, TiO₂A mixture of one or more of the nanoparticle materials.

Further, as shown in fig. 2, the ultraviolet LED90 is disposed on the substrate 10 through the connection layer 91, the connection layer 91 may be formed by soldering, the height of the first groove wall 311 is defined as H1, the height of the connection layer 91 is defined as H2, the height of the light emitting layer 93 of the ultraviolet LED90 is defined as H3, and H2 ≦ H1 ≦ H3 is satisfied; in this way, the height of the first groove wall 311 is higher than that of the connection layer 91, so that the light of the ultraviolet LED90 is prevented from being absorbed by the connection layer 91. Meanwhile, the height of the first groove wall 311 is lower than that of the light-emitting layer 93 of the ultraviolet LED90, so that the light-emitting layer 93 is prevented from being hidden by the first groove wall 311, which is not beneficial to the emission of light of the ultraviolet LED 90.

Further, as shown in fig. 1, the distance between the first groove wall 311 and the ultraviolet LED90 is defined as D1, which satisfies 0um < D1<50 um; the setting of first cell wall 311, the emission of light of being convenient for sets up the interval that first cell wall 311 is apart from ultraviolet LED90 at 0um < D1<50um for D1 simultaneously, avoids the distance too little and causes ultraviolet LED90 to weld badly easily, and the distance is too big then reduces the extraction efficiency of light.

Further, as shown in fig. 1 and fig. 2, the height of the inner casing 30 above the substrate 10 is defined as H4, and the height of the ultraviolet LED90 above the substrate 10 is defined as H5, which satisfies H4> H5; that is, the protrusion of the inner casing 30 from the substrate 10 cannot be too low and higher than the height of the ultraviolet LED90, but cannot be too high, which increases the space in the cavity too high and is not beneficial to the reliability of the whole structure, the height of the inner casing 30 above the substrate 10 is set to be H4, which satisfies that H4 is greater than or equal to 200um and less than or equal to 600 um.

Or, the ultraviolet reflecting material forming the inner shell 30 and the outer shell 50 is made of polytetrafluoroethylene; the polytetrafluoroethylene material has excellent light reflectivity, stable material property, UV aging resistance and outstanding advantages. The inner and

outer shells

30 and 50 are made of teflon to further enhance the light extraction efficiency.

The substrate 10 is made of an inorganic insulating material, such as a ceramic material, which may be aluminum nitride or aluminum oxide. The lens 70 is made of a deep ultraviolet transparent material, such as sapphire or quartz glass.

Further, as shown in fig. 3, 4 and 5, another mounting groove 35 is further formed on the upper surface of the inner casing 30 on the base plate 10, and a protection element is disposed in the other mounting groove 35; the installation groove 31 is separated from the other installation groove 35 to separate the protection element from the ultraviolet LED90, because the protection element may absorb some light, and the existence of the protection element may cause the light emitting field to be uneven, therefore, the installation groove 31 and the other installation groove 35 are separated to effectively improve the light extraction efficiency.

Also, as shown in fig. 4 and 5, the other mounting groove 35 is covered by the outer case 50 attached to the upper surface of the inner case 30, such that the protective member is covered by the outer case 50 to prevent the protective member from affecting the light extraction.

Further, as shown in fig. 2, a metal plating layer 13 is disposed on the substrate 10, the inner surface of the inner shell 30 is attached to the metal plating layer 13, the ultraviolet LED90 is electrically connected to the metal plating layer 13, and the metal plating layer 13 is used for connecting a circuit; the metal plating layer 13 includes: the anode plating layer 131 is used for connecting the anode of the ultraviolet LED 90; and a negative plating 133 for connecting the negative of the ultraviolet LED 90; an isolation area 130 is arranged between the positive electrode coating 131 and the negative electrode coating 133, and polytetrafluoroethylene is arranged in the isolation area 130, so that light reflection is improved.

Further, the metal plating layer 13 is composed of a plurality of plating layers, and the plating layers at least include a copper layer, and a nickel layer and a gold layer disposed on the surface of the copper layer. The thickness of copper layer is 50um ~ 100um, nickel layer thickness is 3um ~ 6um, gold layer thickness 0.05um ~ 1um to guarantee sufficient cladding material joint strength.

The substrate 10 is provided with two through holes 15, conductive materials are filled in the two through holes 15, one sides of the two through holes 15 are respectively and electrically communicated with the anode plating layer 131 and the cathode plating layer 133, and the other sides of the two through holes 13 are respectively and electrically communicated with the metal circuit outside the substrate 10. An external circuit is electrically connected to the ultraviolet LED90 in the mounting recess 31 and the protection element in the other mounting recess 35 through the two through holes 15.

Further, in an embodiment, as shown in fig. 9, a step 312 is formed between the first groove wall 311 and the second groove wall 313, the step 312 is used to prevent light from scattering on the substrate 10 to improve light extraction efficiency, and the width D2 of the step 312 is 0um to 100 um.

In an embodiment of the present application, an electronic appliance is related, the electronic appliance comprising an ultraviolet packaged device 100. Since the ultraviolet package device 100 adopts all technical solutions of all the embodiments described above, at least all the beneficial effects brought by the technical solutions of the embodiments described above are achieved, and are not described in detail herein. The electronic appliance may be a sterilizing electronic appliance for sterilization with the uv package device 100, a curing electronic appliance for curing, and is not particularly limited.

The above is only a preferred embodiment of the present invention, and not intended to limit the scope of the present invention, and all equivalent structural changes made by using the contents of the specification and the drawings, or any other related technical fields directly/indirectly using the inventive concept are included in the scope of the present invention.

Claims

1. An ultraviolet packaging device, comprising:

a substrate (10);

the inner shell (30) is arranged around the base plate (10), the inner surface of the inner shell (30) is attached to the upper surface of the base plate (10), and a mounting groove (31) is formed in the upper surface of the base plate (10);

an outer shell (50), the outer shell (50) is enclosed in the base plate (10) and the inner shell (30), and is attached to the upper surface of the inner shell (30), and

a lens (70), wherein the lens (70) is arranged on the outer shell (50) above the inner shell (30), and the lens (70) seals the mounting groove (31);

wherein, ultraviolet LED (90) is arranged in the mounting groove (31), and the inner shell (30) and the outer shell (50) are formed by ultraviolet reflecting materials.

2. The uv packaging device according to claim 1, wherein a first gap (32) is provided between a groove wall of the mounting groove (31) and the uv LED (90);

the groove walls of the mounting groove (31) comprise a first groove wall (311) close to the substrate (10) and a second groove wall (313) far away from the substrate (10), and the second groove wall (313) extends from the groove bottom of the mounting groove (31) to the direction of the groove opening and inclines along the direction far away from the ultraviolet LED (90);

and the surfaces of the first groove wall (311) and the second groove wall (313) are provided with reflecting layers.

3. The uv encapsulating device according to claim 2, characterized in that the plane of the second groove wall (313) forms an angle α of between 30 and 75 degrees with the plane of the substrate (10);

and/or the first groove wall (311) extends from the groove bottom of the mounting groove (31) to the direction of the groove opening and inclines along the direction departing from the ultraviolet LED (90), and the plane where the first groove wall (311) is located and the plane where the substrate (10) is located form an included angle beta of 75-90 degrees;

and/or the reflecting layer arranged on the second groove wall (313) is a specular reflecting layer or a scattering reflecting layer;

and/or the reflecting layer arranged on the first groove wall (311) is a scattering reflecting layer;

and/or the ultraviolet LED (90) is arranged on the substrate (10) through a connecting layer (91), the height of the first groove wall (311) is defined as H1, the height of the connecting layer (91) is defined as H2, the height of a light emitting layer (93) of the ultraviolet LED (90) is defined as H3, and H2 is more than or equal to H1 and more than or equal to H3;

and/or, defining the distance between the first groove wall (311) and the ultraviolet LED (90) as D1, and satisfying 0um < D1<50 um;

and/or, the height of the inner shell (30) on the substrate (10) is defined as H4, the height of the ultraviolet LED (90) on the substrate (10) is defined as H5, and H4> H5 is satisfied;

the height of the inner shell (30) on the base plate (10) is H4, and the height H4 is more than or equal to 200um and less than or equal to 600 um.

4. The ultraviolet-packaged device according to claim 3, wherein the material of the reflecting layer is BN nanoparticle material or SiO₂Nanoparticle material, ZrO nanoparticle material, AlN nanoparticle material, TiO₂One of the nanoparticle materials;

or the ultraviolet reflecting material forming the inner shell (30) and the outer shell (50) is made of polytetrafluoroethylene;

or the substrate (10) is made of an inorganic insulating material, and the lens (70) is made of a deep ultraviolet light-transmitting material;

or, another mounting groove (35) is further formed in the upper surface of the inner shell (30) on the upper surface of the base plate (10), the other mounting groove (35) is covered by the outer shell (50) attached to the upper surface of the inner shell (30), and a protection element is arranged in the other mounting groove (35).

5. The uv packaging device according to claim 1, wherein a first through-insertion inlet (34) is formed on one of two opposite side surfaces of the outer periphery of the inner casing (30) for allowing the substrate (10) to be received in the inner cavity of the inner casing (30) in a limited manner through the first insertion inlet (34);

a second through-connection inlet (54) is formed in one opposite side surface of the periphery of the outer shell (50) so that the base plate (10) and the inner shell (30) are limited and contained in the inner cavity of the outer shell (50) through the second through-connection inlet (54); or the like, or, alternatively,

a first inserting inlet (34) is formed in one side face of the periphery of the inner shell (30) and used for enabling the substrate (10) to be contained in an inner cavity of the inner shell (30) in a limiting mode through the first inserting inlet (34);

a second inserting inlet (54) is formed in one side face of the periphery of the outer shell (50) and used for enabling the base plate (10) and the inner shell (30) to be contained in an inner cavity of the outer shell (50) in a limiting mode through the second inserting inlet (54).

6. The ultraviolet packaging device of claim 5, wherein a clamping groove (11) is formed in the side periphery of the substrate (10), the outer periphery of the inner shell (30) is bent towards the side periphery of the substrate (10) to form a first buckle (33), the outer periphery of the outer shell (50) is bent towards the side periphery of the substrate (10) to form a second buckle (51), and the first buckle (33) and the second buckle (51) are clamped in the clamping groove (11).

7. The ultraviolet packaging device according to claim 6, wherein the card slot (11) comprises a first card slot (111) and a second card slot (113), and the first card slot (111) and the second card slot (113) are arranged on the side circumference of the substrate (10) at an interval from top to bottom;

the first clamping groove (111) is clamped with the first buckle (33), and the second clamping groove (113) is clamped with the second buckle (51).

8. The uv package device according to claim 7, wherein the substrate (10) is defined to have a left-right direction and a front-back direction perpendicular to a vertical direction, the first card slot (111) is provided in the left-right direction of a side peripheral surface of the substrate (10), and the second card slot (113) is provided in the front-back direction of the side peripheral surface of the substrate (10).

9. The ultraviolet packaging device according to claim 6, wherein the first buckle (33) and the second buckle (51) are clamped in the clamping groove (11), the first buckle (33) is in limit abutment between the groove bottom of the clamping groove (11) and the second buckle (51), and the sum of the thicknesses of the first buckle (33) and the second buckle (51) is equal to the depth of the clamping groove (11).

10. Uv-encapsulated device according to any of claims 1 to 9, wherein a metal plating (13) is provided on the substrate (10), the inner surface of the inner envelope (30) is attached to the metal plating (13), the uv LED (90) is electrically connected to the metal plating (13), and the metal plating (13) is used for connecting an electrical circuit;

the metal plating layer (13) includes:

a positive electrode plating layer (131) for connecting the positive electrode of the ultraviolet LED (90); and

a negative electrode plating layer (133) for connecting a negative electrode of the ultraviolet LED (90);

an isolation region (130) is arranged between the positive electrode plating layer (131) and the negative electrode plating layer (133);

the metal plating layer (13) is composed of a plurality of plating layers, and the plating layers at least comprise a copper layer, a nickel layer and a gold layer which are arranged on the surface of the copper layer;

the substrate (10) is provided with two through holes (15), conductive materials are filled in the two through holes (15), one sides of the two through holes (15) are respectively and electrically communicated with the anode plating layer (131) and the cathode plating layer (133), and the other sides of the two through holes (15) are respectively and electrically communicated with the metal circuit on the outer side of the substrate (10).