CN216792836U - Radiator with heat-conducting pipes radiating at multiple positions - Google Patents

Abstract

The utility model discloses a radiator with a plurality of heat-dissipating heat pipes, which comprises a heat-dissipating component and a bottom plate component. A heat-transfer section mounting groove and at least three heat-dissipating section accommodating grooves are recessed in the middle of the bottom of the heat-dissipating component. The openings of the installation slot and the accommodating slot of the heat dissipation section are both facing the heat source, and a heat conduction pipe is embedded in the installation slot of the heat transfer section and the accommodating groove of the heat dissipation section, and the heat conduction pipe is provided with a heat transfer section and at least three heat dissipation sections. One side of the heat-dissipating section abuts on the bottom connecting portion of the heat-transfer section installation groove, and the heat-dissipating section is arranged in the heat-dissipating section accommodating groove. The utility model adopts a heat conduction pipe structure that conducts heat in a single place and realizes efficient heat dissipation through multiple heat transfer, maximizes the contact area between the heat conduction pipe and the accessories such as the heat dissipation assembly and the base plate assembly, and can realize high-efficiency heat transfer and heat dissipation of the heat conduction pipe. In order to improve the heat dissipation efficiency of the entire radiator; the heat transfer section of the heat pipe is set as a semi-flat section, so that the heat transfer section and the bottom plate are in closer contact to improve the heat conduction efficiency.

Description

A radiator with multiple heat-dissipating heat pipes

Technical field:

The utility model relates to the technical field of radiator structures, in particular to a radiator with multiple heat-dissipating heat pipes.

Background technique:

With the maturity and further development of the electronic computer technology industry and the further improvement of consumers' demand for computer graphics cards and motherboard power, according to the principle of energy conservation in physics, high heat will inevitably be generated behind the high power output of graphics cards and motherboards.

At present, most of the radiators on the market are simple aluminum extrusion and modular radiators. According to the processing technology, they are divided into two types: riveted and welded. These radiators are used to conduct heat from GPU and CPU to heat dissipation through heat pipes. The heat sink releases the heat into the air, and finally takes it away through the fan.

How to make the heat pipe conduct heat efficiently and achieve better heat dissipation effect can be used as a breakthrough for the radiator or heat dissipation module to improve the heat dissipation efficiency.

Utility model content:

The purpose of this utility model is to solve the problems in the prior art, and proposes a radiator with multiple heat-dissipating heat-dissipating pipes, which can be used on riveted or welded radiators to enhance the heat-conducting pipe, the heat-dissipating assembly and the base plate assembly. High-efficiency heat dissipation through high-efficiency and maximized area contact, so as to improve the heat dissipation efficiency of the entire radiator.

In order to achieve the above purpose, the present utility model proposes a radiator with multiple heat-dissipating heat pipes, including a heat-dissipating assembly and a bottom plate assembly, and a heat-transfer section mounting groove and at least three heat-dissipating elements are recessed in the middle of the bottom of the heat-dissipating assembly. The openings of the heat transfer section installation slot and the heat dissipation section accommodation slot are both facing the heat source, and a heat conduction pipe is embedded in the heat transfer section installation slot and the heat dissipation section accommodation slot, and the heat conduction pipe is provided with a A heat transfer section and at least three heat dissipation sections, one side of the heat transfer section abuts on the bottom connecting portion of the heat transfer section installation groove, the heat dissipation section is arranged in the heat dissipation section accommodating groove, the heat dissipation section The base plate assembly includes a base plate, the base plate is fixed on the bottom of the heat dissipation assembly through a plurality of base plate screws and covers the opening of the installation groove of the heat transfer section.

As an improvement of the radiator with multiple heat-dissipating heat-dissipating pipes of the present invention, the heat-conducting pipes are arranged in a "bow"-like shape, and the top surface of the heat-conducting pipe is lower than the bottom surface of the heat-dissipating assembly.

As an improvement of the radiator with multiple heat-dissipating heat-dissipating pipes of the present invention, the heat-conducting pipe is provided with a circular pipe section and a semi-flat section, and the heat transfer section is a circular pipe section and extends through the The heat-dissipating section accommodating slot is a semi-flat section and extends through the heat-transfer section mounting slot, and abuts on the heat-dissipating component through the bottom plate.

As an improvement of the radiator with multiple heat-dissipating heat pipes of the present invention, the heat-dissipating assembly includes a plurality of radiating fins arranged at intervals and three mounting fins for fixing the plurality of radiating fins on the electronic components. Two ends of the sheet are respectively provided with stud holes, and the mounting sheet is fixed on the electronic component by screws.

As an improvement of the radiator with multiple heat-dissipating heat pipes of the present invention, the heat-dissipating component is a modular-type heat-dissipating fin group or an aluminum extrusion-type heat-dissipating fin group.

As an improvement of the radiator with multiple heat-dissipating heat pipes of the present invention, the base plate assembly further includes a heat-conducting block, the middle of the base plate is hollowed out and clamped with the heat-conducting block, and the heat-conducting block is connected to the heat-conducting block. The heat transfer sections are assembled by welding or riveting.

As mentioned above, the present invention adopts a heat conduction pipe structure that conducts heat in a single place and realizes efficient heat dissipation through multiple heat transfer, so as to maximize the contact area between the heat conduction pipe and the accessories such as the heat dissipation assembly and the base plate assembly, and can realize the high-efficiency transmission of the heat conduction pipe. Heat and heat dissipation to improve the heat dissipation efficiency of the entire radiator; the heat transfer section of the heat pipe is set as a semi-flat section, so that the heat transfer section is in closer contact with the bottom plate to improve the heat conduction efficiency.

In addition, the structure of the heat pipe is set in a "bow" shape and embedded in the heat dissipation component. This structure is conducive to better fit between the electronic components and the radiator, and at the same time, it can avoid the heat pipe caused by the inconsistency of the height of the heat sink due to the electronic components. However, the heat dissipation section of the heat pipe is connected with a heat block, so that the contact area between the heat pipe and the heat source is larger and the heat transfer efficiency is higher.

Description of drawings:

In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the following briefly introduces the accompanying drawings that need to be used in the description of the embodiments or the prior art. Obviously, the accompanying drawings in the following description These are just some embodiments of the present invention, and for those of ordinary skill in the art, other drawings can also be obtained based on the structures shown in these drawings without any creative effort.

1 is a perspective view showing the appearance of a radiator having multiple heat-dissipating heat pipes according to an embodiment of the present invention;

2 is a perspective view of the appearance of a radiator having multiple heat-dissipating heat pipes of the present invention from another angle;

3 is a schematic exploded perspective view of a radiator with multiple heat-dissipating heat pipes of the present invention;

FIG. 4 is a perspective view showing the combination of a heat-conducting block and a heat-conducting pipe of a radiator having multiple heat-dissipating heat-dissipating pipes of the present invention.

Reference numerals include:

1—Heat dissipation assembly 11—Heat dissipation fin 13—Mounting sheet 2—Bottom plate assembly 21—Bottom plate 22—Conductive block 3—Stud hole 4—Heat transfer section mounting slot 5 – Heat dissipation section accommodating slot 6 – Heat conduction pipe 61 – Heat transfer Section 62 - cooling section 63 - tubular section 63 - semi-flat section.

The realization, functional characteristics and advantages of the purpose of the present utility model will be further described with reference to the accompanying drawings in conjunction with the embodiments.

Detailed ways:

The technical solutions in the embodiments of the present utility model will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present utility model. Obviously, the described embodiments are only a part of the embodiments of the present utility model, not all of them. Example. Based on the embodiments of the present invention, all other embodiments obtained by those of ordinary skill in the art without creative work fall within the protection scope of the present invention.

Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the technical field to which the present invention belongs. The terms used in the description of the present invention herein are only for the purpose of describing specific embodiments, and are not intended to limit the present invention.

The utility model provides a radiator with multiple heat-dissipating heat pipes.

Please refer to FIGS. 1-4 , which is a radiator with multiple heat-dissipating heat pipes according to some embodiments of the present invention, including a heat-dissipating assembly 1 and a bottom plate assembly 2 . A segment installation slot 4 and at least three heat dissipation segment accommodation slots 5, the openings of the heat transfer segment installation slot 4 and the heat dissipation segment accommodation slot 5 are both facing the heat source, the heat transfer segment installation slot 4 and the heat dissipation segment accommodation slot 5. A heat transfer pipe 6 is embedded in the heat transfer pipe 6. The heat transfer pipe 6 is provided with a heat transfer section 61 and at least three heat dissipation sections 62. One side of the heat transfer section 61 abuts on the bottom of the heat transfer section installation slot 4. The connecting portion 41, the heat dissipation segment 62 is arranged in the heat dissipation segment accommodating slot 5, the base plate assembly 2 includes a base plate 21, and the base plate 21 is fixed to the bottom of the heat dissipation assembly 1 through a plurality of base plate screws and covers It is provided at the opening of the installation groove 4 of the heat transfer section. The heat pipe 6 is provided with a plurality of heat dissipation segments 62, which can increase the heat dissipation area and enhance the heat dissipation effect of the radiator.

Preferably, the heat transfer pipe 6 is arranged in a "bow"-like shape, and the top surface of the heat transfer pipe 6 is lower than the bottom surface of the heat dissipation assembly 1 .

Preferably, the heat transfer pipe 6 is provided with a circular tube section 63 and a semi-flat section 64, the heat dissipation section 62 is a circular tube section 63 and extends through the heat dissipation section accommodating groove 5, the heat transfer section 61 is a semi-flat section 64 and extends through the heat transfer section installation slot 4 and abuts on the heat dissipation component 1 through the bottom plate 21 . The heat transfer section 61 is a semi-flat section 64, which increases the contact area with the bottom plate 21 and reduces the gap between the heat transfer section 61 and the bottom plate 21 to increase the tightness and heat transfer effect.

Preferably, the heat dissipation assembly 1 includes a plurality of heat dissipation fins 11 arranged at intervals and three mounting fins 12 for fixing the plurality of radiating fins on the electronic components. The mounting piece 12 is fixed on the electronic component by screws.

Preferably, the heat dissipation assembly 1 is a modular type heat sink group or an aluminum extrusion type heat sink group. The heat pipe 6 is arranged in a "bow"-like shape, which can conduct heat more efficiently for various types of heat dissipation components 1 and achieve better heat dissipation effect.

Preferably, the base plate assembly 2 further includes a heat conduction block 22, the middle of the base plate 21 is hollowed out and clamped with the heat conduction block 22, and the heat conduction block 22 and the heat transfer section 61 are assembled on the heat transfer section 61 by welding or riveting. Together. The heat transfer block 22 is arranged on the heat transfer section 61 of the heat transfer pipe 6, which can increase the heat transfer area and further improve the efficiency of heat transfer.

The utility model adopts the structure of heat conduction pipe 6 which can conduct heat in a single place and realize efficient heat dissipation through multiple places of heat conduction, so as to maximize the contact area between the heat conduction pipe 6 and the accessories such as the heat dissipation component 1 and the bottom plate assembly 2, and realize the high efficiency of the heat conduction pipe 6. Heat transfer and heat dissipation to improve the heat dissipation efficiency of the entire radiator; the heat transfer section 61 of the heat pipe 6 is set as a semi-flat section 64, so that the heat transfer section 61 and the bottom plate 21 are in closer contact to improve the heat conduction efficiency. In the present invention, the structure of the heat-conducting pipe 6 is set in a "bow" shape and embedded in the heat-dissipating assembly 1. This structure is beneficial to better fit between the electronic components and the radiator, and at the same time, the electronic components can be prevented from being inconsistent due to the height of the radiator. The problem is that the heat pipe 6 cannot be arranged; and the heat dissipation section 62 of the heat pipe 6 is connected with the heat transfer block 22, so that the contact area between the heat pipe 6 and the heat source is larger and the heat transfer efficiency is higher.

The above-mentioned embodiment only expresses one of the embodiments of the present invention, and the description thereof is relatively specific and detailed, but it should not be construed as a limitation on the scope of the present invention. It should be pointed out that for those of ordinary skill in the art, some modifications and improvements can be made without departing from the concept of the present invention, which all belong to the protection scope of the present invention. Therefore, the protection scope of the patent for this utility model shall be subject to the appended claims.

Claims (6)

1. A radiator with multiple heat-dissipating heat pipes, comprising a heat-dissipating assembly and a base plate assembly, characterized in that a heat-transfer section mounting groove and at least three heat-dissipating section accommodating grooves are provided in the middle recess at the bottom of the heat-dissipating assembly , the openings of the heat transfer section installation groove and the heat dissipation section accommodation groove are all facing the heat source, and a heat transfer pipe is embedded in the heat transfer section installation groove and the heat dissipation section accommodation groove, and the heat transfer pipe is provided with a heat transfer section and At least three heat dissipation sections, one side of the heat transfer section abuts on the bottom connecting part of the heat transfer section installation groove, the heat dissipation section is arranged in the heat dissipation section accommodating groove, and the bottom plate assembly includes a bottom plate , the bottom plate is fixed on the bottom of the heat dissipation assembly through a plurality of bottom plate screws and covers the opening of the installation groove of the heat transfer section. 2 . The radiator with multiple heat-dissipating heat-dissipating pipes according to claim 1 , wherein the heat-dissipating pipes are arranged in a “bow”-like shape, and the top surface of the heat-dissipating pipes is lower than the heat-dissipating components. 3 . underside. 3. The radiator with multiple heat-dissipating heat-dissipating pipes according to claim 2, wherein the heat-dissipating pipe is provided with a round tube-shaped section and a semi-flat section, and the heat-dissipating section is a round tube-shaped section and penetrates through Extending out of the accommodating groove of the heat dissipation section, the heat transfer section is a semi-flat section and extends through the mounting groove of the heat transfer section, and abuts on the heat dissipation component through the bottom plate. 4 . The radiator with multiple heat-dissipating heat pipes according to claim 1 , wherein the heat-dissipating assembly comprises a plurality of heat-dissipating fins arranged at intervals and three mounting fins for fixing the plurality of heat-dissipating fins on the electronic components. 5 . , the two ends of the mounting piece are respectively provided with stud holes, and the mounting piece is fixed on the electronic component by screws. 5 . The heat sink with multiple heat-dissipating heat pipes according to claim 1 , wherein the heat-dissipating component is a modular type heat sink group or an aluminum extrusion type heat sink group. 6 . 6 . The heat sink with multiple heat-dissipating heat-dissipating pipes according to claim 1 , wherein the base plate assembly further comprises a heat-conducting block, the middle of the base plate is hollowed out and clamped with the heat-conducting block, and the The heat transfer block and the heat transfer section are assembled together by welding or riveting.

Images