CN216792836U - Radiator with heat-conducting pipes radiating at multiple positions - Google Patents

Abstract

The utility model discloses a radiator with heat conducting pipes radiating at multiple positions, which comprises a heat radiating assembly and a bottom plate assembly, wherein the middle of the bottom of the heat radiating assembly is concavely provided with a heat conducting section mounting groove and at least three heat radiating section accommodating grooves, the openings of the heat conducting section mounting groove and the heat radiating section accommodating grooves face a heat source, the heat conducting pipes are embedded in the heat conducting section mounting groove and the heat radiating section accommodating grooves, each heat conducting pipe is provided with a heat conducting section and at least three heat radiating sections, one side of each heat conducting section is abutted against the bottom part of the corresponding heat conducting section mounting groove, and each heat radiating section is arranged in the corresponding heat radiating section accommodating groove. The utility model adopts a heat conduction pipe structure which conducts heat at a single position and realizes high-efficiency heat dissipation through multiple heat transfers, so that the contact area of the heat conduction pipe and accessories such as a heat dissipation assembly, a bottom plate assembly and the like is maximized, the high-efficiency heat transfer and heat dissipation of the heat conduction pipe can be realized, and the heat dissipation efficiency of the whole radiator is improved; the heat transfer section of the heat conduction pipe is set to be a semi-flat section, so that the heat transfer section is in closer contact with the bottom plate, and the heat conduction efficiency is improved.

Description

Radiator with heat-conducting pipes radiating at multiple positions

The technical field is as follows:

the utility model relates to the technical field of radiator structures, in particular to a radiator with heat conducting pipes for radiating at multiple positions.

The background art comprises the following steps:

with the maturity and re-development of the electronic computer technology industry, with the further increase of the power demand of the computer display card and the main board by consumers, according to the principle of conservation of physical energy, high heat is generated behind the high output power of the display card and the main board.

Most radiators in the current market are simple aluminum extruded radiators and module radiators, the radiators are riveted and welded according to the processing technology, the radiators transmit heat of GPU and CPU to radiating fins through heat pipes, the radiating fins release the heat to the air, and finally the heat is taken away through a fan.

How to make the heat pipe conduct heat efficiently and realize better heat dissipation effect can be used as a breakthrough for improving heat dissipation efficiency of the heat sink or the heat dissipation module.

The utility model has the following contents:

the utility model aims to solve the problems in the prior art, and provides a radiator with heat conducting pipes for radiating heat at multiple positions, which is used on a riveted or welded radiator, can improve the close contact of the heat conducting pipes and accessories such as a heat radiating assembly, a bottom plate assembly and the like, and realizes high-efficiency heat radiation through high-efficiency and maximized-area contact, thereby improving the heat radiating efficiency of the whole radiator.

In order to achieve the purpose, the utility model provides a radiator with a heat conduction pipe capable of dissipating heat at multiple positions, which comprises a heat dissipation assembly and a bottom plate assembly, wherein the middle of the bottom of the heat dissipation assembly is concavely provided with a heat transfer section installation groove and at least three heat dissipation section accommodating grooves, the openings of the heat transfer section installation groove and the heat dissipation section accommodating grooves face a heat source, the heat conduction pipe is embedded in the heat transfer section installation groove and the heat dissipation section accommodating grooves and is provided with a heat transfer section and at least three heat dissipation sections, one side of the heat transfer section is abutted against the bottom connection part of the heat transfer section installation groove, the heat dissipation section is arranged in the heat dissipation section accommodating grooves, the bottom plate assembly comprises a bottom plate, and the bottom plate is fixedly connected to the bottom of the heat dissipation assembly through a plurality of bottom plate screws and covers the opening of the heat transfer section installation groove.

As an improvement of the heat sink having heat pipes with multiple heat dissipation positions, the heat pipes are arranged in a similar bow shape, and the top surfaces of the heat pipes are lower than the bottom surface of the heat dissipation component.

As an improvement of the heat sink with the heat conducting pipes dissipating heat at multiple positions, the heat conducting pipe is provided with a circular pipe section and a semi-flat section, the heat transfer section is a circular pipe section and penetrates through and extends out of the heat dissipation section accommodating groove, and the heat transfer section is a semi-flat section and penetrates through and extends out of the heat transfer section mounting groove and abuts against the heat dissipation assembly through the bottom plate.

The radiator component comprises a plurality of radiating fins arranged at intervals and three mounting pieces for fixing the radiating fins on the electronic element, wherein stud holes are respectively formed in two ends of each mounting piece, and the mounting pieces are fixed on the electronic element through screws.

As an improvement of the heat sink with heat conducting pipes dissipating heat at multiple locations, the heat dissipating assembly is a modular heat dissipating fin set or an aluminum extruded heat dissipating fin set.

As an improvement of the heat sink with heat conducting pipes dissipating heat at multiple locations, the bottom plate assembly further comprises a heat conducting block, the middle portion of the bottom plate is hollowed out and clamped with the heat conducting block, and the heat conducting block and the heat conducting section are assembled together by welding or riveting.

As described above, the present invention adopts the heat pipe structure that realizes high-efficiency heat dissipation by single heat conduction and multiple heat transfer, so that the contact area between the heat pipe and the components such as the heat dissipation component and the bottom plate component is maximized, and the high-efficiency heat transfer and heat dissipation of the heat pipe can be realized, so as to improve the heat dissipation efficiency of the whole heat sink; the heat transfer section of the heat conduction pipe is set to be a semi-flat section, so that the heat transfer section is in closer contact with the bottom plate, and the heat conduction efficiency is improved.

In addition, the structure of the heat conducting pipe is arranged in a bow shape and is embedded in the heat radiating assembly, the structure is favorable for better attaching the electronic element and the heat radiator, and meanwhile, the problem that the heat conducting pipe cannot be arranged due to different heights of the heat radiator of the electronic element can be avoided; and the heat dissipation section of the heat conduction pipe is connected with the heat conduction block, so that the contact area of the heat conduction pipe and a heat source is larger, and the heat transfer efficiency is higher.

Description of the drawings:

in order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings used in the description of the embodiments or the prior art will be briefly described below, it is obvious that the drawings in the following description are only some embodiments of the present invention, and for those skilled in the art, other drawings can be obtained according to the structures shown in the drawings without creative efforts.

Fig. 1 is a perspective view of a heat sink having a plurality of heat pipes for dissipating heat according to an embodiment of the present invention;

FIG. 2 is a perspective view of another angle of the heat sink with heat pipes for dissipating heat according to the present invention;

FIG. 3 is an exploded perspective view of a heat sink with multiple heat pipes according to the present invention;

fig. 4 is a perspective view of a heat conduction block and a heat conduction pipe assembly of a heat sink having heat conduction pipes dissipating heat from multiple locations according to the present invention.

The reference numerals include:

1-heat dissipation assembly 11-fin 13-mounting piece 2-bottom plate assembly 21-bottom plate 22-heat conduction block 3-stud hole 4-heat transfer section mounting groove 5-heat dissipation section accommodating groove 6-heat conduction pipe 61-heat transfer section 62-heat dissipation section 63-round pipe section 63-semi-flat section.

The implementation, functional features and advantages of the objects of the present invention will be further explained with reference to the accompanying drawings.

The specific implementation mode is as follows:

the technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.

Unless defined otherwise, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this invention belongs. The terminology used in the description of the utility model herein is for the purpose of describing particular embodiments only and is not intended to be limiting of the utility model.

The utility model provides a radiator with heat conducting pipes for radiating heat at multiple positions.

Referring to fig. 1-4, a heat sink with heat pipes for dissipating heat at multiple locations according to a part of embodiments of the present invention includes a heat dissipating assembly 1 and a bottom plate assembly 2, a heat transfer section mounting groove 4 and at least three heat dissipation section accommodating grooves 5 are concavely arranged in the middle of the bottom of the heat dissipation component 1, the openings of the heat transfer section installation groove 4 and the heat dissipation section accommodating groove 5 face a heat source, a heat conduction pipe 6 is embedded in the heat transfer section installation groove 4 and the heat dissipation section accommodating groove 5, the heat conduction pipe 6 is provided with a heat transfer section 61 and at least three heat dissipation sections 62, one side of the heat transfer section 61 abuts against the bottom part 41 of the heat transfer section installation groove 4, the heat dissipation section 62 is disposed in the heat dissipation section accommodating groove 5, the base plate assembly 2 includes a base plate 21, the bottom plate 21 is fixed at the bottom of the heat dissipation assembly 1 through a plurality of bottom plate screws and covers an opening in the heat transfer section mounting groove 4. The heat pipe 6 is provided with a plurality of heat dissipation sections 62, which can increase the heat dissipation area to enhance the heat dissipation effect of the heat sink.

Preferably, the heat conduction pipe 6 is provided in a similar "bow" shape, and the top surface of the heat conduction pipe 6 is lower than the bottom surface of the heat dissipation assembly 1.

Preferably, the heat pipe 6 is provided with a round pipe section 63 and a semi-flat section 64, the heat dissipation section 62 is the round pipe section 63 and penetrates and extends out of the heat dissipation section accommodating groove 5, the heat transfer section 61 is the semi-flat section 64 and penetrates and extends out of the heat transfer section mounting groove 4 and passes through the bottom plate 21 and the abutting joint is formed on the heat dissipation assembly 1. The heat transfer section 61 is a semi-flat section 64, which increases the contact area with the bottom plate 21, and reduces the gap between the heat transfer section 61 and the bottom plate 21 to increase the adhesion and the heat transfer effect.

Preferably, the heat dissipation assembly 1 includes a plurality of heat dissipation fins 11 arranged at intervals and three mounting pieces 12 for fixing the plurality of heat dissipation fins on the electronic component, two ends of the mounting pieces 12 are respectively provided with stud holes 3, and the mounting pieces 12 are fixed on the electronic component through screws.

Preferably, the heat dissipation assembly 1 is a module type heat dissipation plate set or an aluminum extruded type heat dissipation plate set. The heat conduction pipe 6 is similar to a bow shape, and can conduct heat more efficiently for various types of heat dissipation assemblies 1, so that a better heat dissipation effect is achieved.

Preferably, the bottom plate assembly 2 further includes a heat conducting block 22, the middle portion of the bottom plate 21 is hollowed out and the heat conducting block 22 is clamped, and the heat conducting block 22 and the heat conducting section 61 are assembled together by welding or riveting. The heat conduction block 22 is disposed on the heat conduction section 61 of the heat conduction pipe 6, so that the heat conduction area can be increased, and the heat conduction efficiency can be further improved.

The utility model adopts the heat conduction pipe 6 structure which conducts heat at a single position and realizes high-efficiency heat dissipation through heat transfer at multiple positions, so that the contact area of the heat conduction pipe 6 and accessories such as the heat dissipation component 1, the bottom plate component 2 and the like is maximized, the high-efficiency heat transfer and heat dissipation of the heat conduction pipe 6 can be realized, and the heat dissipation efficiency of the whole heat sink is improved; the heat transfer section 61 of the heat transfer pipe 6 is set to be the semi-flat section 64, so that the heat transfer section 61 is in closer contact with the bottom plate 21, thereby improving the heat transfer efficiency. According to the utility model, the heat conduction pipe 6 is arranged in a bow shape and embedded in the heat dissipation assembly 1, so that the structure is beneficial to better attaching the electronic element and the radiator, and meanwhile, the problem that the heat conduction pipe 6 cannot be arranged due to different heights of the radiator of the electronic element can be avoided; and the heat dissipation section 62 of the heat conduction pipe 6 is connected with the heat conduction block 22, so that the contact area of the heat conduction pipe 6 and a heat source is larger, and the heat transfer efficiency is higher.

The above-mentioned embodiments only express one of the embodiments of the present invention, and the description thereof is more specific and detailed, but not construed as limiting the scope of the present invention. It should be noted that, for a person skilled in the art, several variations and modifications can be made without departing from the inventive concept, which falls within the scope of the present invention. Therefore, the protection scope of the present patent shall be subject to the appended claims.

Claims (6)

1. The utility model provides a radiator with radiating heat pipe in many places, includes radiator unit and bottom plate subassembly, its characterized in that, the centre of radiator unit bottom is concave to be equipped with a heat transfer section mounting groove and at least three heat dissipation section storage tank, the opening of heat transfer section mounting groove and heat dissipation section storage tank all faces the heat source, the embedding is equipped with the heat pipe in heat transfer section mounting groove and the heat dissipation section storage tank, the heat pipe is equipped with a heat transfer section and at least three heat dissipation section, one side butt of heat transfer section is in the end portion of heat transfer section mounting groove, the heat dissipation section sets up in the heat dissipation section storage tank, the bottom plate subassembly includes the bottom plate, the bottom plate is fixed through a plurality of bottom plate screwed connection the radiator unit bottom is covered and is established the opening at heat transfer section mounting groove.

2. The heat sink with multiple heat dissipating heat pipes according to claim 1, wherein the heat pipes are arranged in a bow-like shape, and the top surfaces of the heat pipes are lower than the bottom surface of the heat dissipating component.

3. The heat sink with the heat conducting pipes dissipating heat from multiple locations as claimed in claim 2, wherein the heat conducting pipes are provided with a circular pipe section and a semi-flat section, the heat dissipating section is a circular pipe section and extends through the heat dissipating section accommodating groove, and the heat transferring section is a semi-flat section and extends through the heat transferring section mounting groove and abuts against the heat dissipating component through the bottom plate.

4. The heat sink with multiple heat pipes as claimed in claim 1, wherein the heat dissipating assembly comprises a plurality of heat dissipating fins spaced apart from each other and three mounting pieces for fixing the heat dissipating fins to the electronic component, the mounting pieces having stud holes at two ends thereof, respectively, and being fixed to the electronic component by screws.

5. The heat sink with heat pipes for dissipating heat according to claim 1, wherein the heat dissipating assembly is a modular fin assembly or an aluminum extruded fin assembly.

6. The heat sink with the heat conducting pipes for dissipating heat according to claim 1, wherein the bottom plate assembly further comprises a heat conducting block, the middle portion of the bottom plate is hollowed and clamped with the heat conducting block, and the heat conducting block and the heat conducting section are assembled together by welding or riveting.

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