CN216792519U

CN216792519U - Electromagnetic interference shield and optical device

Info

Publication number: CN216792519U
Application number: CN202220130792.4U
Authority: CN
Inventors: 陈鹏; 施沙美
Original assignee: Innolight Technology Suzhou Ltd
Current assignee: Innolight Technology Suzhou Ltd
Priority date: 2022-01-18
Filing date: 2022-01-18
Publication date: 2022-06-21
Anticipated expiration: 2032-01-18
Also published as: WO2023138150A1

Abstract

The utility model discloses an electromagnetic interference shielding piece and an optical device, wherein the shielding piece comprises a metal layer, an elastic conductive layer and a first adhesive layer, the metal layer is connected with the elastic conductive layer, the elastic conductive layer is pasted on a piece to be pasted through the first adhesive layer, after the electromagnetic interference shielding piece is pasted on the piece to be pasted, the first adhesive layer is pasted on the piece to be pasted, when part of the first adhesive layer is extruded or melted and tends to flow, because the area of the metal layer is larger than that of the first adhesive layer, and the metal layer completely covers the first adhesive layer, the first adhesive layer cannot overflow to the outer side of the metal layer, the first adhesive layer is prevented from being pasted with other structural components except the metal layer, and the normal movement of other structures is further protected.

Description

Electromagnetic interference shield and optical device

Technical Field

The utility model relates to the technical field of electromagnetic shielding, in particular to an electromagnetic interference shielding piece and an optical device.

Background

With the increase of the transmission rate of the metal-packaged optical transceiver module, Electromagnetic Interference EMI (hereinafter referred to as EMI) is increasingly involved, and even a fine structural gap can easily cause the Electromagnetic wave generated by the module to leak out from the gap to cause an EMI problem, which affects the normal operation of other electronic components.

In the process of solving the EMI problem, the inventors found that at least the following problems still exist in the prior art: if the shielding material is arranged at the joint, the adhesive overflows from the adhering position of the shielding material, and then the shielding material is adhered to other movable parts, so that the functions and the use of other elements are influenced. Especially, the optical transceiver module generates heat during operation, which accelerates softening and overflowing of glue, and thus a new shield member is urgently needed to solve the problem.

Disclosure of Invention

To solve at least one of the above problems, it is an object of the present invention to provide an electromagnetic interference shield and an optical device.

In order to achieve the above object of the present invention, an embodiment of the present invention provides an electromagnetic interference shield, including a metal layer, an elastic conductive layer and a first adhesive layer, wherein the metal layer is electrically connected to the elastic conductive layer, and the elastic conductive layer is adhered to an element to be adhered through the first adhesive layer;

the metal layer is flaky, and on a plane parallel to the metal layer:

the area of the metal layer is larger than that of the first adhesive layer, and the metal layer completely covers the first adhesive layer.

As a further improvement of the utility model, on a plane parallel to the metal layer: the area of the elastic conducting layer is equal to that of the first adhesive layer, and the elastic conducting layer completely covers the first adhesive layer.

As a further improvement of the utility model, the metal layer is adhered to the elastic conductive layer through the second adhesive layer;

on a plane parallel to the metal layer: the area of the metal layer is equal to that of the second adhesive layer, and the metal layer completely covers the second adhesive layer.

As a further improvement of the present invention, the materials of the first adhesive layer and the second adhesive layer are both provided as conductive adhesives.

As a further development of the utility model, the metal layer is provided as a copper foil, an aluminum foil or a silver foil.

As a further improvement of the utility model, the surface of the metal layer is provided with a conductive antirust coating.

As a further improvement of the present invention, the elastic conductive layer is provided as a material having sparse pores, and the thickness of the elastic conductive layer is reduced when pressure is applied to the surface of the metal layer.

As a further improvement of the utility model, the material of the elastic conducting layer is provided as a conducting cloth or a conducting foam.

In order to achieve one of the above objects, an embodiment of the present invention provides an optical device, including the above electromagnetic interference shield, wherein the electromagnetic interference shield is used to fill a gap of the optical device.

Compared with the prior art, the utility model has the following beneficial effects: this electromagnetic interference shielding part pastes in waiting to paste the piece after, and first glue film is pasted on waiting to paste the piece, and when the trend that flows appears in the extrusion or melting of part first glue film, because the metal level area is greater than first glue film, and the metal level covers first glue film completely, so first glue film can not spill over to the metal level outside, has avoided other structural component bonding outside first glue film and the metal level, has then protected the normal motion of other structures.

Drawings

FIG. 1 is a schematic structural view of an EMI shield in accordance with an embodiment of the present invention;

FIG. 2 is a side view of an EMI shield in accordance with an embodiment of the present invention;

FIG. 3 is a schematic view of the EMI shield as viewed from the direction of the second layer of adhesive, in accordance with one embodiment of the present invention;

FIG. 4 is a schematic structural diagram of an optical device according to an embodiment of the present invention;

FIG. 5 is an exploded view of a light module according to one embodiment of the present invention;

FIG. 6 is a diagram illustrating the mounting positions of the housing, EMI shield and tab spring in accordance with one embodiment of the present invention;

1000, an optical device; 100. an optical module; 10. an electromagnetic interference shield; 101. a void; 11. a metal layer; 12. a second adhesive layer; 13. an elastic conductive layer; 14. a first glue layer; 20. a housing; 21. a side wall; 22. a guide groove; 30. a pull ring assembly; 31. a pull ring spring plate; 200. a slot cage; 210. a conductive spring.

Detailed Description

The present invention will be described in detail below with reference to specific embodiments shown in the drawings. These embodiments are not intended to limit the present invention, and structural, methodological, or functional changes made by those skilled in the art according to these embodiments are included in the scope of the present invention.

It will be understood that terms used herein such as "upper," "above," "lower," "below," and the like, refer to relative positions in space and are used for convenience in description to describe one element or feature's relationship to another element or feature as illustrated in the figures. The spatially relative positional terms may be intended to encompass different orientations of the device in use or operation in addition to the orientation depicted in the figures.

An embodiment of the present invention provides an electromagnetic interference shield and an optical device, where the electromagnetic interference shield is shown in fig. 1 to 3, the optical device is shown in fig. 4, an installation position of the electromagnetic interference shield in the optical device is shown in fig. 5 and 6, and the electromagnetic interference shield is used to fill a gap of the optical device and prevent electromagnetic waves in the optical device from being radiated outward.

The optical device 1000 of the present embodiment includes a socket cage 200 and an optical module 100, the socket cage 200 has a socket, and the optical module 100 is connected to the socket cage 200 in a pluggable manner. In fig. 4, the optical module 100 is inserted into the socket cage 200 toward the socket, the optical device 1000 further includes a conductive elastic piece 210 connected to the socket cage 200, and the optical module 100 abuts against the conductive elastic piece 210 and is electrically connected thereto.

For convenience of understanding and explanation, hereinafter, the front-back direction is defined as the insertion and extraction direction of the optical module 100, the insertion direction of the optical module 100 is specifically defined as "front", the extraction direction of the optical module 100 is specifically defined as "back", the left-right direction is defined as the direction perpendicular to the insertion and extraction direction and the vertical direction, and the vertical direction is defined as the vertical direction.

Referring to fig. 5, the optical module 100 includes a housing 20, a tab assembly 30 and an electromagnetic interference shield 10.

Wherein the tab assembly 30 is movably connected to the housing 20 and the emi shield 10 is disposed between the housing 20 and the tab assembly 30.

More specifically, the tab assembly 30 includes a tab spring 31, the housing 20 includes a sidewall 21 and a guide slot 22 disposed on the sidewall 21, the tab spring 31 is disposed in the guide slot 22, and the emi shield 10 may be disposed between the sidewall 21 and the tab spring 31.

To more clearly illustrate the specific connection of the EMI shield 10, the detailed structure of the EMI shield 10 will be described.

Referring to fig. 1-3, the emi shield 10 includes a metal layer 11, an elastic conductive layer 13 and a first adhesive layer 14, wherein the metal layer 11 is electrically connected to the elastic conductive layer 13, and the elastic conductive layer 13 is adhered to the component to be adhered through the first adhesive layer 14. The electromagnetic interference shielding member 10 further includes a second adhesive layer 12, the metal layer 11 is adhered to the elastic conductive layer 13 through the second adhesive layer 12, the materials of the first adhesive layer 14 and the second adhesive layer 12 are both conductive adhesives, and the conductivity of the electromagnetic interference shielding member 10 and the conductivity of the elastic conductive layer 13 are combined, so that the electromagnetic interference shielding member 10 has a good electromagnetic shielding effect.

In addition, the metal layer 11 can also be connected to the elastic conductive layer 13 by welding, clamping or the like, so that the reliability and the conductivity of the connection between the metal layer 11 and the elastic conductive layer 13 are guaranteed.

The elastic conductive layer 13 is provided as a material having a sparse porosity, and the thickness of the elastic conductive layer 13 is reduced when pressure is applied to the surface of the metal layer 11. That is, the elastic conductive layer 13 can be compressed, and its thickness can be reduced when receiving an external force, and can be restored to its original thickness when the external force is removed.

Further, the distance between the tab assembly 30 and the housing 20 may vary, and when there is a tendency for the distance between the tab assembly 30 and the housing 20 to decrease, the elastic conductive layer 13 is compressed, and the elastic conductive layer 13 has a tendency to drive the tab assembly 30 away from the housing 20 under the action of the elastic force of the elastic conductive layer 13. When the force is removed, the elastic conductive layer 13 is deformed to return the tab assembly 30 to its original position.

The elastic conductive layer 13 is made of conductive cloth or conductive foam, has a fluffy texture, and meets the requirements of elastic deformation of the elastic conductive layer 13 and restoration to the original thickness after deformation.

And, the metal layer 11 can be set up as the material that has good conductivity such as copper foil, aluminium foil or silver foil, and the one side that the metal layer 11 keeps away from elastic conductive layer 13 can set up the electrically conductive antirust coating, on the one hand uses for a long time and also can prevent to rust, on the other hand can reduce coefficient of friction after setting up the coating, makes the relative sliding resistance between other parts of metal layer 11 and external world littleer.

The metal layer 11 is sheet-shaped, in a plane parallel to the metal layer 11: the area of the metal layer 11 is larger than that of the first adhesive layer 14, and the metal layer 11 completely covers the first adhesive layer 14, as shown in fig. 1 to 3. Due to the larger area of the metal layer 11, the first glue layer 14 is completely inside the orthographic projection of the metal layer 11 in the direction perpendicular to the plane of the metal layer 11. When the first glue layer 14 is squeezed or has a tendency to flow after being heated, the expanded first glue layer 14 is still inside the orthographic projection of the metal layer 11.

In addition, in a plane parallel to the metal layer 11: the area of the elastic conductive layer 13 is equal to that of the first adhesive layer 14, and the elastic conductive layer 13 completely covers the first adhesive layer 14. That is to say, the elastic conductive layer 13 and the first adhesive layer 14 are adhered at the same position, and the shape and the area of the elastic conductive layer 13 and the first adhesive layer are the same, so that the elastic conductive layer 13 can be adhered to the surface of the object to be adhered more firmly without loosening and without raising the edge. That is, the area of the metal layer 11 is larger than that of the elastic conductive layer 13, and the metal layer 11 completely covers the elastic conductive layer 13, as shown in fig. 1 to 3, so that a gap 101 can be reserved between the metal layer 11 and the elastic conductive layer 13, and the glue overflowing from the first glue layer 14 can be accommodated in the position of the gap 101.

And, in connection with the above-described embodiment in which the metal layer 11 and the elastic conductive layer 13 are connected by the second glue layer 12, on a plane parallel to the metal layer 11: the area of the metal layer 11 is equal to that of the second adhesive layer 12, and the metal layer 11 completely covers the second adhesive layer 12. After the elastic conductive layer 13 is adhered to the surface of the object to be adhered through the first adhesive layer 14, the metal layer 11 is adhered to the surface of the object to be adhered through the second adhesive layer 12 at the position of the gap 101, and a part of the first adhesive layer 14 which overflows can also participate in the adhesion of the metal layer 11 to the surface of the object to be adhered.

The distance from the edge of the metal layer 11 to the edge of the elastic conductive layer 13 adjacent to the metal layer is not more than 5 mm, in practice, the distance may be about 1mm, that is, the distance between the edge of the metal layer 11 and the edge of the elastic conductive layer 13 in fig. 1 to 3 is about 1mm, and the length of the gap 101 is enough to accommodate the overflowed glue, and the connection is not insecure due to the overlarge gap 101.

As shown in fig. 1 to 3, 5, and 6, the metal layer 11 and the elastic conductive layer 13 are both square, and the length and/or width of the elastic conductive layer 13 is smaller than those of the metal layer 11. And the central point of the elastic conductive layer 13 and the central point of the metal layer 11 are both on a first extension line, and the first extension line is perpendicular to the plane of the metal layer 11.

The metal layer 11 and the elastic conductive layer 13 have the same center position and symmetrical structure, that is, the upper and lower side gaps 101 of the elastic conductive layer 13 have the same width, and the front and rear side gaps 101 have the same width, so that the glue is not easy to overflow from the side with smaller distance to the outer side of the metal layer 11.

The following describes the installation of the emi shield 10 from the perspective of the optical module 100, and there are two embodiments for the installation of the emi shield 10:

in one embodiment, as shown in fig. 5, the elastic conductive layer 13 is adhered to the housing 20 by the first adhesive layer 14, and the tab assembly 30 abuts against the metal layer 11. Specifically, referring to the spatial position of the emi shield 10 in fig. 5 to illustrate the installation of this embodiment, the gap 101 in fig. 5 is facing the housing 20 and away from the tab assembly 30 to illustrate the emi shield 10 being affixed to the housing 20 with the metal layer 11 abutting the tab assembly 30.

In another embodiment, the elastic conductive layer 13 is adhered to the tab assembly 30 by the first adhesive layer 14, the shell 20 abuts against the metal layer 11, the gap 101 faces the tab assembly 30 and is away from the shell 20, the emi shield 10 is adhered to the tab assembly 30, and the metal layer 11 abuts against the shell 20.

As further illustrated with reference to the embodiment shown in fig. 5, the tab assembly 30 comprises a tab spring 31, the housing 20 comprises a sidewall 21, and the emi shield 10 is disposed between the sidewall 21 and the tab spring 31.

When the distance between the pull-ring spring 31 and the housing 20 tends to decrease, the elastic conductive layer 13 tends to drive the pull-ring spring 31 to be away from the housing 20, and the elastic conductive layer 13 increases the elasticity of the pull-ring spring 31, so that the pull-ring spring 31 can be in better contact with the conductive spring 210 on the slot cage 200, and the problem of disconnection caused by an excessively large gap between the optical module 100 and the slot cage 200 and the fact that the pull-ring spring 31 is not in contact with the conductive spring 210 is avoided.

Further, the tab spring 31 is slidably connected in the guide groove 22, and after the housing 20 and the tab assembly 30 are assembled in the housing structure of the optical module 100, the tab spring 31 can slide back and forth in the guide grooves 22 on both sides of the housing 20 when the tab assembly 30 is pulled. In addition, the optical module 100 can be locked and unlocked through a locking structure on the optical module 100, so that the functions of mounting and dismounting the optical module 100 and the slot cage 200 are realized.

And, the emi shield 10 is in relatively smooth contact with the sidewall 21 or the tab spring 31, so that during the sliding of the tab assembly 30 back and forth, on one hand, the emi shield 10 is kept always pressed between the sidewall 21 and the tab spring 31, and on the other hand, the sliding of the tab assembly 30 is ensured to be smooth. In this embodiment, the metal layer 31 is in contact with the side wall 21 or the tab spring 31, and the metal layer 11 has a smooth surface and low roughness, so that it can be in relatively smooth contact with other components.

Furthermore, the metal layer 11 is square, the width of the tab spring 31 is the same as the width of the metal layer 11, the width of the tab spring 31 and the width of the metal layer 11 are both the thicknesses in the vertical direction, and the leakage of the electromagnetic waves is diffused outwards through the gap between the optical module 100 and the housing 20 in a front-to-back manner, so that the gap can be completely filled by filling in the vertical direction, and the leakage of the electromagnetic waves is avoided.

As shown in fig. 5, the tab assembly 30 includes tab springs 31 respectively disposed on the left and right sides of the casing 20, and the emi shields 10 are disposed between the tab springs 31 on the left side and the casing 20, and between the tab springs 31 on the right side and the casing 20. All set up electromagnetic interference shield 10 in the left and right sides, make left pull ring shell fragment 31 have the trend of left movement, the pull ring shell fragment 31 on right side has the trend of right movement, and both sides all can fully be filled on the one hand, and on the other hand both sides atress is even.

In addition, generally, due to the requirement of assembly tolerance, a gap is reserved between the optical module 100 and the socket cage 200, so that after the electromagnetic interference shield 10 is directly disposed on the pull-ring assembly 30 and the housing 20, the pull-ring elastic sheet 31 is partially jacked up, and if the thickness of the electromagnetic interference shield 10 is relatively thin, the electromagnetic interference shield 10 can be added to the existing optical module 100 within the range of the gap, as shown in fig. 5.

If the thickness of the emi shield 10 is thick, a groove may be formed on the surface of the sidewall 21, and the emi shield 10 is partially embedded into the groove, thereby preventing the optical module 100 from being inserted into the slot cage 200 and causing interference.

Compared with the prior art, the embodiment has the following beneficial effects:

this electromagnetic interference shielding part 10 pastes in waiting to paste the back of the piece, and first glue film 14 pastes on waiting to paste the piece, and when part first glue film 14 received the extrusion or melt the trend that appears flowing, because the metal level 11 area is greater than first glue film 14, and the metal level 11 covers first glue film 14 completely, so first glue film 14 can not spill over to the metal level 11 outside, has avoided other structural component bonding outside first glue film 14 and the metal level 11, has then protected the normal motion of other structures.

It should be understood that although the present description refers to embodiments, not every embodiment contains only a single technical solution, and such description is for clarity only, and those skilled in the art should make the description as a whole, and the technical solutions in the embodiments can also be combined appropriately to form other embodiments understood by those skilled in the art.

The above-listed detailed description is only a specific description of a possible embodiment of the present invention, and they are not intended to limit the scope of the present invention, and equivalent embodiments or modifications made without departing from the technical spirit of the present invention should be included in the scope of the present invention.

Claims

1. An electromagnetic interference shielding piece is characterized by comprising a metal layer, an elastic conducting layer and a first adhesive layer which are sequentially connected in a laminated manner, wherein the elastic conducting layer is adhered to a piece to be adhered through the first adhesive layer;

the metal layer is flaky and is arranged on a plane parallel to the metal layer:

2. The EMI shield as set forth in claim 1, wherein, in a plane parallel to said metal layer: the area of the elastic conducting layer is equal to that of the first adhesive layer, and the elastic conducting layer completely covers the first adhesive layer.

3. The emi shield of claim 1 further comprising a second layer of adhesive, said metal layer being adhered to said elastic conductive layer by said second layer of adhesive;

4. The EMI shield as claimed in claim 3, wherein the material of both said first and second layers of glue is provided as a conductive glue.

5. The EMI shield as claimed in claim 1, wherein said metal layer is provided as a copper foil, an aluminum foil or a silver foil.

6. The EMI shield as set forth in claim 5, wherein said metal layer surface is provided with a conductive rust inhibiting coating.

7. The EMI shield as set forth in claim 1 wherein said resilient conductive layer is provided as a sparsely porous material, said resilient conductive layer decreasing in thickness when pressure is applied to said metal layer surface.

8. The EMI shield as claimed in claim 7, wherein the material of said resilient conductive layer is provided as a conductive cloth or a conductive foam.

9. An optical device comprising the EMI shield of any one of claims 1-8, wherein the EMI shield is configured to fill a gap of the optical device.