CN210008053U - Semi-wrapped conductive gasket - Google Patents
Semi-wrapped conductive gasket Download PDFInfo
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- CN210008053U CN210008053U CN201920093065.3U CN201920093065U CN210008053U CN 210008053 U CN210008053 U CN 210008053U CN 201920093065 U CN201920093065 U CN 201920093065U CN 210008053 U CN210008053 U CN 210008053U
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Abstract
The utility model discloses an kind of half parcel conductive gasket, including elastomer and conducting layer, the upper and lower two surfaces of elastomer set up the adhesive layer, the left and right sides face of elastomer does not set up the adhesive layer and makes the left and right sides face of elastomer and corresponding conducting layer non-adhesion, the conducting layer passes through the partial surface of the adhesive layer parcel elastomer that the elastomer upper and lower two surfaces set up, because the utility model discloses break through the design thinking that conductive gasket wrapped up the conducting layer at the elastomer circumference entirely in the past, adopt the mode of conducting layer half parcel elastomer, make the conducting layer only wrap up in the partial surface of elastomer, so, the inflation of elastomer or resume can not receive the constraint of conducting layer like the current conductive gasket of cladding entirely, especially the conducting layer of partial surface of conducting layer parcel elastomer is that there is the opening, can not link up at this opening part conducting layer, can freely open, the elastomer can be free inflation or resume at the opening part, thereby furthest.
Description
Technical Field
The utility model relates to an electronic shielding components and parts technical field, concretely relates to kinds of half parcel conductive gasket.
Background
In the prior art, a grounding component on a rear cover of a mobile phone generally uses a conductive gasket (also called conductive foam or omni-directional conductive foam) to achieve a grounding effect. The common conductive foam or the conductive cloth adhered to the common conductive foam in all directions through conductive adhesive particles has the following conduction process: the conductive mode is along with the reduction of the area, the conductive particles are also randomly reduced, and in the coating process of the conductive adhesive, the uniformity of the particle distribution cannot be controlled, and the resistance value is larger or poor in conduction in practical application. In addition, when the common conductive foam is compressed and used, the hot melt adhesive in the structural layer is secondarily melted and solidified under the high-temperature working state, so that the recovery stress of the conductive foam is reduced, the impedance is increased, and the grounding performance is influenced; all-round electrically conductive bubble is cotton to be covered through the conducting resin bonding after the cell-phone, but all-round electrically conductive sponge is under different compressional capacities, the change in resistance value appears easily, and all-round electrically conductive bubble cotton loss rate is on a large scale, the occasional powder falling phenomenon, the vertical impedance increases, influence the ground connection effect, and simultaneously, all-round electrically conductive bubble cotton bounce also is very unstable, cell-phone fuselage design is more and more thin now, the material space is to the development of partial direction, the urgent need is more optimized, low stress, high resilience, the conducting pad of low loss ratio, thereby provide stable electric conductive property for electronic product.
SUMMERY OF THE UTILITY MODEL
The utility model provides kinds of semi-wrapped conductive gaskets to solve the above problems.
The utility model provides an kind of half parcel conductive gasket, including elastomer and conducting layer, the upper and lower two surfaces of elastomer set up the adhesive layer, and the left and right sides face of elastomer does not set up the adhesive layer and makes the left and right sides face of elastomer and correspond the non-adhesion of conducting layer, and the conducting layer passes through the partial surface of the adhesive layer parcel elastomer of two surface settings about the elastomer.
Preferably, the elastic body is provided with an opening formed without being covered with the conductive layer on the left side surface or the right side surface.
Preferably, the lower surface of the elastic body is fully covered by the adhesive layer, the conductive layer corresponding to the lower surface of the elastic body only covers a partial area of the lower surface of the elastic body, and the adhesive layer corresponding to the partial area of the lower surface of the elastic body is exposed to the outside.
Preferably, the conductive layer wraps part of the surface of the elastic body through adhesive layers arranged on the upper surface and the lower surface of the elastic body, the part of the surface is positioned on the lower surface of the elastic body, and the area of the part of the surface is smaller than that of the lower surface of the elastic body, so that the adhesive layer corresponding to the middle area of the lower surface of the elastic body is exposed.
Preferably, the conductive layer corresponding to the lower surface of the elastic body covers half the area of the lower surface of the elastic body, and an adhesive layer for adhering the conductive gasket to the working environment is arranged on the conductive layer of the lower surface of the elastic body.
Preferably, the area of the conductive layer corresponding to the lower surface of the elastic body is greater than halved than the area of the lower surface of the elastic body, the adhesive layer on the lower surface of the elastic body, which is not covered by the conductive layer, is covered by of an adhesive layer for adhering the conductive gasket in a working environment, and the adhesive layer extends to the conductive layer.
The utility model discloses kinds of half parcel conductive gasket in addition still are provided, including elastomer and conducting layer, the elastomer is expandable bubble cotton, and expandable bubble cotton supports the conducting layer through the inflation, the partial surface of conducting layer parcel elastomer.
Preferably, the elastic body is provided with an opening formed without being covered with the conductive layer on the left side surface or the right side surface.
Preferably, an adhesive layer for adhering the conductive gasket to a working environment is arranged on the conductive layer corresponding to the lower surface of the elastic body.
Preferably, the area covered by the conductive layer corresponding to the lower surface of the elastic body is greater than halved than the area of the lower surface of the elastic body, the area not covered by the conductive layer on the lower surface of the elastic body is bonded to the bonding layer for bonding the conductive gasket to the working environment, and a discontinuous area exists between the bonding layer and the conductive layer.
Above-mentioned technical scheme can see out, because the utility model discloses break through the design idea of conductive gasket at the elastomer circumference whole parcel conducting layer in the past, adopt the mode of conducting layer half parcel elastomer, make the conducting layer only wrap up in the partial surface of elastomer, so, the inflation of elastomer or resume can not receive the constraint of conducting layer like the current conductive gasket of full cladding, especially there is the opening in the conducting layer that the partial surface of conducting layer parcel elastomer is, can not link up at this opening part meeting conducting layer, can freely open, the elastomer can be free inflation or resume at the opening part, thereby furthest's its elasticity restoring capability of assurance.
Drawings
In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings used in the description of the embodiments or the prior art will be briefly described below, it is obvious that the drawings in the following description are only the embodiments of the present invention, and other drawings can be obtained by those skilled in the art without creative efforts.
Fig. 1 is a schematic cross-sectional view of a conductive gasket in embodiment 1 of the present invention;
fig. 2 is a schematic cross-sectional view of the conductive gasket of embodiment 1 of the present invention with an adhesive layer added;
fig. 3 is a schematic cross-sectional view of a conductive gasket according to embodiment 2 of the present invention;
fig. 4 is a schematic cross-sectional view of an improved structure of a conductive gasket according to embodiment 2 of the present invention;
fig. 5 is a schematic cross-sectional view of another improved structure of the conductive gasket according to embodiment 2 of the present invention;
fig. 6 is a schematic cross-sectional view of a conductive gasket according to embodiment 3 of the present invention;
fig. 7 is a schematic cross-sectional view of an improved structure of a conductive gasket according to embodiment 3 of the present invention.
Detailed Description
The technical solution in the embodiments of the present invention will be described clearly and completely with reference to the accompanying drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only some embodiments of , but not all embodiments.
Example 1:
the embodiment of the utility model provides kinds of half parcel conductive gasket, as shown in fig. 1, including elastomer 1 and conducting layer 2, the elastomer can adopt including but not limited to polyurethane foam, polyethylene foam, equal performance materials such as silica gel bubble cotton, the conducting layer includes but not limited to conductive cloth, copper foil, equal performance materials such as aluminium foil, the upper and lower two surfaces of elastomer 1 set up adhesive layer 3, adhesive layer includes but not limited to hot melt adhesive, performance materials such as pressure-sensitive adhesive are equal, the left and right sides face of elastomer 1 does not set up the adhesive layer makes the left and right sides face of elastomer not adhere with corresponding conducting layer, the conducting layer passes through the partial surface of the adhesive layer parcel elastomer of the upper and lower two surface settings of elastomer, this part surface that is not wrapped up of elastomer can be the surface down, namely the conducting layer passes through the partial surface of the adhesive layer parcel elastomer upper and lower two surface settings, partial surface is located the elastomer lower surface, the area of partial surface makes the adhesive layer that the middle zone 31 of elastomer lower surface corresponds to expose out because the conducting layer only sets up the upper and lower surface of elastomer sets up the adhesive layer, therefore the effective both sides of the conducting layer that the recovery of the conducting layer can all be reached the restriction of the effective use of the volume of the elastic body recovery, the volume of the recovery of the elastic body, the use of the effective use of the recovery of the volume of the joint of the left and right side of the elastic body, the recovery of the use of the restriction, the effective use of the whole flexible gasket of the volume of the elastic body.
The structural design that the area of the partial surface is smaller than that of the lower surface of the elastic body so that the adhesive layer corresponding to the middle area 31 of the lower surface of the elastic body is exposed out can firstly ensure that the conductive gasket is kept balanced when applied to a working environment, namely the working environment determined by the installation position of electronic components on a circuit board, a mobile phone shell or a chip and the like, and secondly, the adhesive layer in the area is exposed by the middle area 31 so that the exposed adhesive layer can be bonded on the electronic components, namely the adhesive layer is used as the adhesive layer of the conductive gasket and also used as the adhesive layer in the installation environment, matters are dual-purpose, thereby saving the cost and the processing technology for additionally increasing the adhesive layer.
As shown in fig. 2, the coverage area of the conductive layer 2 corresponding to the lower surface of the elastic body 1 is more than half of the area of the lower surface of the elastic body, so as to ensure the conductivity of the whole conductive gasket, and the adhesive layer 4 for adhering the conductive gasket to the working environment is arranged on the conductive layer of the lower surface of the elastic body, the adhesive layer is a conductive adhesive layer, but based on the structure of the embodiment of the utility model, the adhesive layer 4 can still adopt other non-conductive adhesives and is adhered to the side of the middle area, and the side of the middle area is contacted and conducted.
Example 2:
as shown in fig. 3, compared with embodiment 1, the part of the surface of the elastomer not covered in the embodiment is located on the side, that is, the elastomer is provided with the opening 21 formed by not being covered by the conductive layer on the left side surface or the right side surface, the formation of the opening is more advantageous than the structure of the embodiment 1 in which the left side and the right side of the elastomer are covered but not bonded, the opening can be freely opened and closed, the elastomer can freely stretch and contract at least on the opening side, and the recovery capability is further improved by .
As shown in FIG. 4, in modifications, the lower surface of the elastic body 1 is fully covered by the adhesive layer 3, the conductive layer 2 corresponding to the lower surface of the elastic body only covers the partial area 11 of the lower surface of the elastic body 1, and the adhesive layer corresponding to the remaining area 12 of the lower surface of the elastic body is exposed outside.
As shown in FIG. 5, the coverage area of the conductive layer 2 corresponding to the lower surface of the elastic body 1 is larger than of the area of the lower surface of the elastic body, so as to be more favorable for electrical connection and conduction, the adhesive layer 3 which is not covered by the conductive layer on the lower surface of the elastic body 1 is covered by the adhesive layer 4 which is used for adhering the conductive gasket in a working environment by , and the adhesive layer extends to the conductive layer 2. the adhesive layer 3 which is not covered by the conductive layer 2 in the structure is directly overlapped with the adhesive layer 4 and is adhered to , so that the stability of the conductive gasket after installation can be further increased by steps, the adhesive layer 4 protrudes at the position corresponding to the lower surface of the elastic body 1 at the end of the conductive layer 2, so as to be suitable for an extruded installation environment, and the adhesive layer is also located at the side close to the opening 21 on the lower.
Example 3:
as shown in fig. 6, another semi-wrapped conductive pads are provided, including an elastic body 1 and a conductive layer 2, where the elastic body 1 is an expandable foam, the expandable foam is expanded by heating, hot melting, etc., the expandable foam supports the conductive layer through expansion, the conductive layer wraps part of the surface of the elastic body, and the expandable foam can be a silica gel foam, so that the elastic body and the conductive layer are cooled after hot melting to form a -shaped conductive pad.
As a special design structure in the embodiment, the covering area of the conductive layer 2 corresponding to the lower surface of the elastic body 1 is greater than half of the area of the lower surface of the elastic body, so as to ensure the conductive performance, a bonding layer for bonding the conductive gasket to the bonding layer 4 in the working environment is bonded to the area of the lower surface of the elastic body 1 which is not covered by the conductive layer, a discontinuous area 41 exists between the bonding layer 4 and the conductive layer 2, the discontinuous area 41 can ensure the space for the transverse expansion and contraction of the elastic body, the bonding layer is positioned on the side of the lower side of the elastic body, which is close to the opening 21, and the bonding layer is flush with the lower surface of the conductive layer, so that the conductive gasket can be.
The kinds of half-wrapped conductive gaskets provided by the embodiment of the invention are introduced in detail, the specific individual example is applied in the text to explain the principle and the implementation mode of the invention, the explanation of the above embodiment is only used for helping to understand the core idea of the invention, and meanwhile, to technicians in the field, according to the idea and the method of the invention, there are changes on the specific implementation mode and the application range, in conclusion, the content of the description is not understood as the limitation of the invention.
Claims (10)
1. The semi-wrapped conductive gasket is characterized by comprising an elastic body and a conductive layer, wherein adhesive layers are arranged on the upper surface and the lower surface of the elastic body, the left side surface and the right side surface of the elastic body are not provided with the adhesive layers, so that the left side surface and the right side surface of the elastic body are not adhered to the corresponding conductive layer, and the conductive layer wraps part of the surface of the elastic body through the adhesive layers arranged on the upper surface and the lower surface of the.
2. The semi-wrapped conductive gasket of claim 1 wherein the elastomer is provided with openings on either the left or right side surface that are not covered by the conductive layer.
3. The semi-encapsulated conductive gasket as claimed in claim 1 or 2, wherein the lower surface of the elastic body is entirely covered by the adhesive layer, the conductive layer corresponding to the lower surface of the elastic body covers only a partial region of the lower surface of the elastic body, and the adhesive layer corresponding to the remaining region of the lower surface of the elastic body is exposed to the outside.
4. The semi-encapsulated conductive gasket as set forth in claim 1 wherein said portion of said surface is disposed on said lower surface of said elastomer, said portion of said surface having an area smaller than an area of said lower surface of said elastomer to expose said adhesive layer corresponding to said intermediate region of said lower surface of said elastomer.
5. The semi-wrapped conductive gasket of claim 1 wherein the corresponding conductive layer of the lower elastomeric surface covers greater than half the area of the lower elastomeric surface, and an adhesive layer is disposed on the conductive layer of the lower elastomeric surface for adhering the conductive gasket to a work environment.
6. The semi-encapsulated conductive gasket of claim 1 wherein the lower surface of the elastomer corresponds to a conductive layer covering greater than times the area of the lower surface of the elastomer, the adhesive layer on the lower surface of the elastomer not covered by the conductive layer being covered by of an adhesive layer for adhering the conductive gasket to a work environment, the adhesive layer extending over the conductive layer.
7. The semi-wrapped conductive gasket is characterized by comprising an elastic body and a conductive layer, wherein the elastic body is expandable foam, the expandable foam supports the conductive layer through expansion, and the conductive layer wraps part of the surface of the elastic body.
8. The semi-wrapped conductive gasket of claim 7 wherein the elastomer is provided with openings on either the left or right side surface that are not covered by the conductive layer.
9. The semi-wrapped conductive gasket of claim 7 or 8 wherein the conductive layer corresponding to the lower surface of the elastomer is provided with an adhesive layer for adhering the conductive gasket to a work environment.
10. The semi-encapsulated conductive patch as claimed in claim 7 or 8, wherein the conductive layer corresponding to the lower surface of the elastomer covers half the area of the lower surface of the elastomer, the bonding layer for bonding the conductive patch to a work environment is bonded at the area of the lower surface of the elastomer not covered by the conductive layer, and there is a discontinuity area between the bonding layer and the conductive layer.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201920093065.3U CN210008053U (en) | 2019-01-21 | 2019-01-21 | Semi-wrapped conductive gasket |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201920093065.3U CN210008053U (en) | 2019-01-21 | 2019-01-21 | Semi-wrapped conductive gasket |
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| Publication Number | Publication Date |
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| CN210008053U true CN210008053U (en) | 2020-01-31 |
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| Application Number | Title | Priority Date | Filing Date |
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| CN201920093065.3U Active CN210008053U (en) | 2019-01-21 | 2019-01-21 | Semi-wrapped conductive gasket |
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| CN (1) | CN210008053U (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114080145A (en) * | 2020-08-17 | 2022-02-22 | 华为技术有限公司 | Conductive foam and electronic equipment comprising same |
| WO2023138150A1 (en) * | 2022-01-18 | 2023-07-27 | 苏州旭创科技有限公司 | Electromagnetic interference shield and optical device |
-
2019
- 2019-01-21 CN CN201920093065.3U patent/CN210008053U/en active Active
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114080145A (en) * | 2020-08-17 | 2022-02-22 | 华为技术有限公司 | Conductive foam and electronic equipment comprising same |
| CN114080145B (en) * | 2020-08-17 | 2023-07-11 | 华为技术有限公司 | Conductive foam, electronic equipment comprising conductive foam and preparation method of conductive foam |
| WO2023138150A1 (en) * | 2022-01-18 | 2023-07-27 | 苏州旭创科技有限公司 | Electromagnetic interference shield and optical device |
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| Date | Code | Title | Description |
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| GR01 | Patent grant | ||
| GR01 | Patent grant | ||
| PE01 | Entry into force of the registration of the contract for pledge of patent right | ||
| PE01 | Entry into force of the registration of the contract for pledge of patent right |
Denomination of utility model: Semi wrapped conductive gasket Effective date of registration: 20210923 Granted publication date: 20200131 Pledgee: Shenzhen hi tech investment small loan Co.,Ltd. Pledgor: SHENZHEN HFC SHIELDING PRODUCTS Co.,Ltd. Registration number: Y2021440020102 |
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| CP03 | Change of name, title or address | ||
| CP03 | Change of name, title or address |
Address after: 518103 floor 1, 2 and 3, building C, No. 7, Fuyong East Avenue, Fenghuang community, Fuyong street, Bao'an District, Shenzhen, Guangdong Province Patentee after: Shenzhen hongfucheng New Material Co.,Ltd. Address before: 518103 south, first floor, second and third floor, building C, zone 0a-04, Fenghuang third industrial zone, Fuyong street, Bao'an District, Shenzhen, Guangdong Province Patentee before: SHENZHEN HFC SHIELDING PRODUCTS Co.,Ltd. |