CN216792125U

CN216792125U - Ultrasonic oblique probe

Info

Publication number: CN216792125U
Application number: CN202220183548.4U
Authority: CN
Inventors: 范军; 范欧阳; 杨兆林; 王东硕; 何泉涛; 隨鑫; 纪长龙; 张淼
Original assignee: Qinhuangdao Aike Electronic Technology Development Co ltd
Current assignee: Qinhuangdao Aike Electronic Technology Development Co ltd
Priority date: 2022-01-24
Filing date: 2022-01-24
Publication date: 2022-06-21
Anticipated expiration: 2032-01-24

Abstract

The utility model provides an ultrasonic oblique probe. The wafer I is arranged on the wedge block, the connecting wire socket is connected with the wafer I through the wafer connecting wire, and the rest space of the inner cavity of the shell is filled with sound-absorbing filler; and a chip II which is made of the same material as the chip I is arranged at the symmetrical position of the chip I on the wedge block, and the chip II is not connected with the chip I. The wedge has symmetrically inclined surfaces. The utility model adopts the mode that a wafer is added on the opposite side of the position of the original wafer, and an echo with a fixed position can be generated when a cylindrical or annular tested piece is detected, wherein the specific position of the echo is half of the propagation distance of an ultrasonic beam in the tested piece, and the echo height can effectively express the attenuation quantity of the ultrasonic beam emitted by the ultrasonic angle probe in the tested piece. The ultrasonic probe is suitable for being used as an ultrasonic oblique probe.

Description

Ultrasonic oblique probe

Technical Field

The utility model relates to an ultrasonic angle probe used in the technical field of ultrasonic flaw detection.

Background

An ultrasonic probe is a device that transmits and receives ultrasonic waves during ultrasonic testing. The performance of the probe directly affects the characteristics of the ultrasonic waves and the detection performance of the ultrasonic waves.

The probe used in ultrasonic detection is a transducer which realizes the conversion of electric energy and sound energy by utilizing the piezoelectric effect of materials. The key component of the probe is a wafer, which is a single crystal or polycrystalline wafer with piezoelectric effect, and functions to convert electric energy and acoustic energy into each other.

The working principle of the ultrasonic angle probe is shown in fig. 1, a wafer is made of piezoelectric material with a specific thickness, pulse-type voltage is applied to two sides of the wafer, and due to the piezoelectric effect, the wafer can generate a group of vibrations with a specific frequency, namely, a group of ultrasonic waves with a specific frequency and multiple cycles. The ultrasonic wave is vertically incident on the contact surface of the wafer and the wedge block, and enters the inside of the workpiece to be measured after being refracted at the contact surface of the wedge block and the workpiece to be measured. When the ultrasonic beam encounters internal defects of the reflected ultrasonic waves in the workpiece to be detected, a part of the ultrasonic waves return to the wafer, and the wafer generates an electric signal after being pressed and is transmitted to the detection equipment.

When the cylindrical or annular tested piece is detected on the outer surface by using the ultrasonic probe, the track of the ultrasonic beam is shown in fig. 2, the track of the ultrasonic beam surrounds the cylindrical or annular outer surface, and the wafer cannot directly receive the ultrasonic beam emitted by the wafer.

At present, the content of the ultrasonic nondestructive testing required by the ultrasonic nondestructive testing mode comprises the energy attenuation state of a quantitative ultrasonic beam on a tested piece, and the energy attenuation state of the material of the tested piece on the ultrasonic beam cannot be tested when the conventional ultrasonic angle probe is used for testing the cylindrical or annular tested piece.

Disclosure of Invention

The utility model provides an ultrasonic angle probe, which aims to solve the problem that when an ultrasonic angle probe is used for carrying out nondestructive testing on a cylindrical or annular tested piece, the attenuation of the tested piece to ultrasonic beams emitted by the ultrasonic angle probe can be measured. The inclined probe can receive ultrasonic signals generated by itself when detecting a cylindrical or annular tested piece by adding a wafer opposite to the original wafer position, so that the technical problem of attenuation during detection of the ultrasonic inclined probe is solved.

The technical scheme adopted for solving the technical problems is as follows:

the ultrasonic oblique probe comprises a shell, a connecting wire socket, a wedge block, a wafer I, a wafer II, a wafer connecting wire and filler, wherein the connecting wire socket is arranged on one side of the shell, the wedge block is arranged on the lower part of the shell, the wafer I is arranged on the wedge block, the connecting wire socket is connected with the wafer I through the wafer connecting wire, and the rest space in the inner cavity of the shell is filled with the filler for sound absorption; and a chip II which is made of the same material as the chip I is arranged at the symmetrical position of the chip I on the wedge block, and the chip II is not connected with the chip I.

In order to further solve the technical problem to be solved by the utility model, the wedge block provided by the utility model is provided with symmetrical inclined planes, the wafer I and the wafer II are fixed at mirror symmetry positions of the inclined planes, the inclined angle is 27.6-57.7 degrees, and the wedge block can be flexibly designed for cylindrical or annular workpieces to be measured with different diameters.

Furthermore, the wafer I and the wafer II are both made of piezoelectric materials, and the area of the wafer I4 is larger than that of the wafer II 7.

Furthermore, the wedge block is made of organic glass.

The utility model has the advantages that a wafer is added on the opposite side of the original wafer, the piezoelectric effect of the material is utilized to realize the conversion of electric energy and sound energy, ultrasonic waves with specific frequency are emitted and received, and nondestructive detection is carried out on the inner part and the surface of a tested piece by matching with detection equipment. The echo at a fixed position can be generated on a cylindrical or annular tested piece by matching with detection equipment, the specific position of the echo is half of the propagation distance of an ultrasonic beam in the tested piece, and the echo height can effectively express the attenuation of the ultrasonic beam emitted by the ultrasonic angle probe in the tested piece. And whether a flaw detection system consisting of the detection equipment, the ultrasonic angle probe and the tested piece works normally or not can be provided by observing whether the fixed echo exists. The ultrasonic probe is suitable for being used as an ultrasonic oblique probe.

Drawings

FIG. 1 is a schematic diagram of the working principle of an ultrasonic angle probe;

FIG. 2 is a trace diagram of ultrasonic beam during the detection of a cylindrical or annular workpiece to be detected;

FIG. 3 is a front sectional view of the utility model;

FIG. 4 is a front view of the wedge and wafer;

FIG. 5 is a top view of the wedge and the wafer;

fig. 6 is a graph of ultrasonic beam attenuation.

In the figure, 1, a shell. 2. Bond wire socket, 3 wedge, 4 die I, 5 die bond wire, 6 filler, 7 die II.

Detailed Description

The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. Although embodiments of the present invention have been shown and described, it will be appreciated by those skilled in the art that various changes, modifications, substitutions and alterations can be made in these embodiments without departing from the principles and spirit of the utility model, the scope of which is defined in the appended claims and their equivalents. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.

As shown in the figure, the ultrasonic angle probe of the present invention also includes the same as the prior art

The ultrasonic inspection system comprises a shell 1, a connecting wire socket 2, a wedge block 3, a wafer I4, a wafer connecting wire 5 and a filler 6, wherein the connecting wire socket 2 is arranged on one side of the shell 1, and the connecting wire socket 2 is connected with an inspection instrument through a connecting data wire to form the ultrasonic inspection system; the lower part of casing 1 is provided with voussoir 3, is equipped with wafer I4 on voussoir 3, and connecting wire socket 2 passes through wafer connecting wire 5 with wafer I4 to be connected, and the remaining space of casing 1 inner chamber is filled by filler 6 of sound absorption.

Different from the prior art, a wafer II 7 which is made of the same material as the wafer I4 is added on the wedge 3 at the position symmetrical to the wafer I4, and no connection is made. After the ultrasonic beam emitted by the wafer I4 propagates a circle in the cylindrical or annular tested piece, the ultrasonic beam is refracted at the contact surface of the ultrasonic angle probe and the tested piece and enters the wedge block 3 of the ultrasonic angle probe, the contact surface of the wedge block 3 and the wafer II 7 is reflected, the ultrasonic beam is reflected again at the contact surface of the wedge block 3 and the tested piece and then is transmitted to the wafer I4, and the wafer I4 receives the ultrasonic beam emitted by the wafer I4.

In order to optimize the structure of the utility model, the wedge 3 is provided with symmetrical inclined planes, and the wafer I4 and the wafer II 7 are fixed at the positions of the inclined planes in mirror symmetry; the inclination angle is 27.6-57.7 degrees.

In order to further optimize the structure of the present invention, the wafers i 4 and ii 7 are both made of the same piezoelectric material, preferably piezoelectric ceramic lead zirconate titanate, and the area of the wafer i 4 is larger than that of the wafer ii 7.

As a conventional technical option, the wedge 3 is made of organic glass.

Preferably, the wedge 3 is made of polysulfone.

The working principle of the utility model is as follows:

on the basis of the original ultrasonic oblique probe structure, a wafer is added on the opposite side of the original wafer position without any connection. The matching detection device can generate an echo wave at a specific position when detecting a cylindrical or annular tested piece. The position of the echo is half of the propagation distance of the ultrasonic beam in the tested piece, and the height of the echo can reflect the attenuation of the ultrasonic beam emitted by the ultrasonic angle probe in the tested piece.

Examples test results:

according to the specific embodiment shown in fig. 6, the scheme of the oblique probe with the bottom wave, which has a refraction angle of 70 degrees and a resonant frequency of 2.5MHz, is as follows: the wafer I4 is 20 mm-20 mm piezoelectric ceramic, the wafer II 7 is 8 mm-20 mm piezoelectric ceramic, the wafer I4 and the wafer II 7 are both piezoelectric ceramic with the resonant frequency of 2.5MHz, the included angle between the left inclined plane and the right inclined plane of the organic glass wedge block 3 and the bottom surface is 52.3 degrees, the wafer I4 and the wedge block adhesive are 502 glue, the connecting line between the wafer and the probe seat is an enameled wire, and the sound absorption material filled in the probe is a mixture of epoxy resin, rubber powder and tungsten powder.

Finally, it should be noted that: although the present invention has been described in detail with reference to the foregoing embodiments, it will be apparent to those skilled in the art that modifications may be made to the embodiments or portions thereof without departing from the spirit and scope of the utility model.

Claims

1. The ultrasonic oblique probe is characterized in that: the novel silicon wafer connector comprises a shell (1), a connecting wire socket (2), a wedge block (3), a wafer I (4), a wafer II (7), a wafer connecting wire (5) and a filler (6), wherein the connecting wire socket (2) is arranged on one side of the shell (1), the wedge block (3) is arranged on the lower portion of the shell (1), the wafer I (4) is arranged on the wedge block (3), the connecting wire socket (2) is connected with the wafer I (4) through the wafer connecting wire (5), and the rest of the space in the inner cavity of the shell (1) is filled with the filler (6) which absorbs sound; a wafer II (7) which is made of the same material as the wafer I (4) is arranged at the symmetrical position of the wafer I (4) on the wedge block (3), and the wafer II (7) is not connected.

2. The ultrasonic angle probe of claim 1, wherein:

the wedge block (3) is provided with symmetrical inclined planes, the wafer I (4) and the wafer II (7) are fixed at the mirror symmetry positions of the inclined planes, and the inclined angle is 27.6-57.7 degrees.

3. The ultrasonic angle probe of claim 1, wherein:

the wafer I (4) and the wafer II (7) are both made of piezoelectric materials, and the area of the wafer I (4) is larger than that of the wafer II (7).

4. The ultrasonic angle probe of claim 1, wherein:

the wedge block (3) is made of organic glass.