CN216757409U

CN216757409U - Wafer cleaning equipment

Info

Publication number: CN216757409U
Application number: CN202220255812.0U
Authority: CN
Inventors: 王晓龙; 蔡俊郎; 甄福强
Original assignee: Nexchip Semiconductor Corp
Current assignee: Nexchip Semiconductor Corp
Priority date: 2022-02-08
Filing date: 2022-02-08
Publication date: 2022-06-17
Anticipated expiration: 2032-02-08

Abstract

The utility model discloses a wafer cleaning device, which at least comprises: a cleaning device allowing the wafer to be put in; the drainage device is arranged on the cleaning device and allows the waste gas in the cleaning device to enter; and the fan filter screen device is communicated with the drainage device. The utility model provides a wafer cleaning device, which is used for improving the wafer cleaning quality.

Description

Wafer cleaning equipment

Technical Field

The utility model belongs to the field of wafer processing, and particularly relates to wafer cleaning equipment.

Background

The wet cleaning process is effective in removing the residual impurities such as micro-dust, metal ions, native oxide layer and organic matter on the wafer by using chemical solution without damaging the surface characteristics and electrical characteristics of the wafer. In the wet cleaning process of the semiconductor, the chemical solution on the surface of the wafer is evaporated due to the great heat release after the chemical solution is contacted with water. The evaporated chemical solution is easily liquefied and falls back onto the wafer, so that residual traces appear on the surface of the wafer, and the surface of the wafer is defective.

SUMMERY OF THE UTILITY MODEL

The utility model aims to provide a wafer cleaning device to improve the cleaning effect of a wafer in a wet cleaning process.

In order to solve the technical problems, the utility model is realized by the following technical scheme:

a wafer cleaning apparatus, comprising at least:

a cleaning device allowing the wafer to be put in;

the drainage device is arranged on the cleaning device and allows the waste gas in the cleaning device to enter; and

and the fan filter screen device is communicated with the drainage device.

In an embodiment of the utility model, the drainage device comprises a drainage box, and the drainage box is arranged on the cleaning device.

In an embodiment of the present invention, the drainage device includes an air exhaust pipe, and the air exhaust pipe communicates the drainage box and the fan strainer device.

In an embodiment of the utility model, one end of the air exhaust pipe is arranged in the flow guide box, and the other end of the air exhaust pipe is arranged outside the fan filter screen device and is positioned on one side of the fan filter screen device far away from the flow guide device.

In an embodiment of the present invention, the drainage device further includes an air pump, the air pump is disposed on a side of the fan filtering net device away from the drainage device, and one end of the air pump is connected to a side of the air pump.

In one embodiment of the utility model, the drainage box comprises an outer shell and an inner shell, and a heating plate is connected between the outer shell and the inner shell.

In an embodiment of the present invention, a plurality of vent holes are disposed on a side of the drainage box near the cleaning device, and the vent holes penetrate through the outer shell, the heating plate and the inner shell.

In an embodiment of the present invention, a plurality of suspension rods are connected to one side of the air inlet of the fan filter screen device, and the suspension rods are connected to the diversion box.

In an embodiment of the present invention, the length of the hanging rod is greater than the height of the drainage box.

In one embodiment of the utility model, there are four suspension rods, and one end of each suspension rod is connected to the fan filter screen device, and the other end of each suspension rod is connected to one side of the drainage box close to the cleaning device.

In an embodiment of the present invention, the cleaning device includes a water tank and a cleaning tank, the cleaning tank is communicated with the water tank, and the water tank is disposed in a coverage area of the drainage box.

As described above, the present invention provides a wafer cleaning apparatus, which is used in a wet cleaning process of a wafer, and can clean chemical solution, dust particles, contaminants, and the like remaining on the surface of the wafer after the wafer is cleaned by the chemical solution. The wafer cleaning equipment can guide acid gas and water vapor generated in the wafer cleaning process out of the fan filter screen device in a drainage mode, so that the acid gas and the water vapor are prevented from being liquefied and flowing back to the surface of a wafer, trace residues are formed on the surface of the wafer, and the wall surface of the fan filter screen device can be protected from being corroded and damaged. Therefore, the wafer cleaning equipment can improve the quality of the wet cleaning process of the wafer.

Of course, it is not necessary for any product in which the utility model is practiced to achieve all of the above-described advantages at the same time.

Drawings

In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the drawings used in the description of the embodiments will be briefly introduced below, and it is obvious that the drawings in the following description are only some embodiments of the present invention, and it is obvious for those skilled in the art that other drawings can be obtained according to the drawings without creative efforts.

FIG. 1 is a schematic structural diagram of a cleaning apparatus according to the present invention.

Fig. 2 is a schematic structural view of the water tank.

Fig. 3 is a top view of the drainage box.

Fig. 4 is a schematic view of a fixing structure of the drainage box.

Description of reference numerals: 10 water tanks, 20 wafers, 30 drainage boxes, 301 outer shells, 302 heating plates, 303 inner shells, 304 vent holes, 40 fans, 401 suspenders, 4011 fixing plates, 402 supporting plates, 403 connecting rods, 50 suction pumps, 501 suction pipes, 502 exhaust pipes, 60 cleaning tanks, 601 water outlets, 70 supporting seats, 80 suction pumps, 801 suction pipes, 802 spray pipes, 8021 spray heads and 90 fixing pieces.

Detailed Description

The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.

The devices and the connecting lines in the integrated circuit are very fine, so that the wet cleaning process is used for cleaning chips, wafers and the like, dust particles on the surfaces of the wafers and metal pollution can be cleaned, and the damage of the circuit functions in the chips can be avoided. After the integrated circuit is formed, the occurrence of short circuit, open circuit and the like can be reduced, the failure condition of the integrated circuit can be reduced, and the geometric characteristics of the wafer can be formed more accurately. Thus, the process quality of the wet cleaning process affects the formation of the wafer and the performance of the subsequently formed integrated circuits.

Referring to fig. 1, the present invention discloses a wafer cleaning apparatus, which includes a cleaning device, a flow guiding device and a fan filter device. The cleaning device allows the wafer 20 to be placed in, the drainage device is arranged on the cleaning device in a hanging mode, and the fan filter screen device is connected to the drainage device and located on one side far away from the cleaning device. The wafer cleaning equipment of the utility model can be applied to the wet cleaning process of the wafer 20. After the surface of the wafer 20 is cleaned with the chemical solution, the wafer 20 is placed in a cleaning apparatus to clean the chemical solution on the surface of the wafer 20. The chemical solution evaporates with a large exotherm upon contact with the wash water. The evaporated chemical solution is guided by the drainage device and transferred to the outside of the fan filter screen device from the groove opening part of the cleaning device, so that the chemical solution is prevented from gathering on the fan filter screen device and dripping on the wafer 20 in the cleaning device, and the surface structure of the wafer 20 is protected.

Referring to fig. 1 and 2, in one embodiment of the present invention, a cleaning apparatus includes a tank 10 and a cleaning tank 60 disposed in the tank 10. The cleaning solution is filled in the tank 10, the support 70 is provided in the cleaning tank 60, and the wafer 20 is mounted on the support 70. Wherein, the top of the supporting base 70 is provided with a clamping groove, and the wafer 20 is clamped in the clamping groove. In other embodiments, the wafer 20 may be fixed on the support stand 70 by, for example, suction. A water suction pump 80 is fixed on the outer wall of the cleaning tank 60, a water suction pipe 801 is connected to the water suction end of the water suction pump 80, and a spray pipe 802 is connected to the water discharge end of the water suction pump 80. The nozzle of the pumping pipe 801 is disposed in the water tank 10 and below the liquid level of the water tank 10. The spraying pipe 802 penetrates through the tank wall of the cleaning tank 60, and the pipe opening is located in the cleaning tank 60. The water pump 80 pumps the cleaning liquid in the water tank 10 through the water pumping pipe 801, and sprays the cleaning liquid onto the wafer 20 to be cleaned through the spraying pipe 802, so as to wash away the chemical solution, dust particles, pollutants, and the like attached to the surface of the wafer 20. The used washing water remains in the washing tank 60 and is subsequently discharged as waste water. The cleaning liquid may be set according to a cleaning requirement, and may be clear water, for example.

Referring to fig. 1 and 2, in an embodiment of the utility model, a nozzle of the shower nozzle 802 is connected to a nozzle 8021, and the support base 70 is located within a spraying range of the nozzle 8021, so that the wafer 20 is located in a water outlet direction of the shower nozzle 802, and the cleaning liquid sprayed by the nozzle 8021 can quickly clean the chemical solution adhered to the surface of the wafer 20. A drain port 601 is provided in the washing tub 60, and the drain port 601 is connected to the outside of the tub 10 through a pipe, and discharges washing water mixed with chemical components, impurities, pollutants, and the like as waste water. Most of the chemical solutions on the surface of the wafer 20 are acid solutions, such as concentrated sulfuric acid. When the chemical solution contacts with the cleaning solution, a large amount of heat is released and evaporated, and the generated acid gas is drained through a drainage device and is discharged.

Referring to fig. 1 and 3, in an embodiment of the present invention, the drainage device includes a drainage box 30 and an exhaust pipe 501, one end of the exhaust pipe 501 is disposed in the drainage box 30, and the other end is disposed outside the fan filter screen device and on a side away from the drainage device. Wherein, the box wall of the drainage box 30 near the water tank 10 is provided with a plurality of vent holes 304, and the plurality of vent holes 304 are distributed in a grid shape. The shape of the vent hole 304 is not limited in the present invention, and may be a circular hole or a square hole. After the acid gas is evaporated from the chemical solution, the chemical solution moves towards the direction of the vent 304, and the air pressure environment formed by the air exhaust pipe 501 enables the acid gas to quickly enter the drainage box 30 and enter the air exhaust pipe 501. The exhaust pipe 501 extracts the acid gas from the drainage box 30, and sends the acid gas to the outside of the fan filter screen device, and the acid gas can be prevented from being liquefied again and flowing back to drip on the drainage device and the cleaning device for one side far away from the drainage box 30. Wherein, the water tank 10 is located in the coverage of the drainage box 30 to ensure that the acid gas and the water vapor evaporated in the cleaning tank 60 can be guided to the waste through the drainage box 30. Wherein, the box body of the drainage box 30 adopts a corrosion-resistant plate.

Referring to fig. 1, in one embodiment of the present invention, the Fan Filter unit may be a Fan Filter Units (FFUs) distributed along a ceiling of a room, and includes a Fan 40. The air pump 50 is fixed on the fan 40, and the air pump 50 is positioned on one side of the fan 40 far away from the drainage box 30. The air inlet end of the air pump 50 is connected to an air exhaust pipe 501, and the air outlet end is connected to an air exhaust pipe 502. Wherein, the air suction pipe 501 penetrates the fan 40 and is connected with the air suction pump 50. The suction pump 50 sucks the acid gas through the suction pipe 501, and discharges the acid gas to the side opposite to the air outlet of the blower 40 through the exhaust pipe 502. Thereby avoiding the acid gas from being liquefied again, reflowed and dripped on the drainage device and the cleaning device.

Referring to fig. 1, in an embodiment of the present invention, the drainage box 30 is, for example, a square box, and the air exhaust pipe 501 penetrates through the box wall of the drainage box 30 and performs a sealing process at the penetrating position. The sealing process is, for example, a sealing structure such as a sealing gasket, a sealing ring, a sealing net, etc. to seal between the wall of the exhaust pipe 501 and the drainage box 30, so as to prevent acid gas from leaking and contacting the fan filter screen device. In the present embodiment, as shown in fig. 1, the air exhaust pipe 501 penetrates through the box wall of the drainage box 30 on the side close to the fan 40. In other embodiments, the suction tube 501 may also extend through other side walls of the drainage box 30.

Referring to fig. 1, in one embodiment of the present invention, the drainage cartridge 30 includes an outer housing 301 and an inner housing 303. A heating plate 302 is sandwiched between the outer shell 301 and the inner shell 303, and the heating plate 302 is connected to a power supply through a lead. Wherein, in the present embodiment, the heating plate 302 is distributed on each side wall of the drainage box 30. In other embodiments, the heating plate 302 may be distributed only on the side wall of the drain box 30 where the vent 304 is located, or may be distributed on the side wall and at least one other side surface of the drain box 30 where the vent 304 is located. The heating plate 302 is heated to maintain the temperature in the diversion box 30, so as to ensure that the acid gas does not liquefy and drip in the diversion box 30, and the acid gas is completely exhausted through the exhaust pipe 501.

Referring to fig. 1 and 4, in one embodiment of the present invention, a plurality of hangers 401 are connected to one side of the air inlet of the fan 40, and the plurality of hangers 401 are connected to both sides of the baffle box 30. In this embodiment, the number of the suspension rods 401 is, for example, 4, and in other embodiments, the number of the suspension rods may be, for example, 6, 8, and so on. The suspension rod 401 has a fixing plate 4011 provided at one end thereof and a support plate 402 provided at the other end thereof. In this embodiment, the suspension rod 401 and the fixing plate 4011 are perpendicular to each other, and the suspension rod 401 and the support plate 402 are connected, for example, in an L shape, the support plate 402 and the fixing plate 4011 are parallel to each other, and the drainage box 30 is fixed to the support plate 402. The fixed plate 4011 is fixedly connected to the blower 40, for example, a plurality of fixing members 90 are connected between the fixed plate 4011 and a wall plate of the blower 40. In this embodiment, the fixing member 90 is, for example, a bolt, and in other embodiments, the fixing member 90 may also be a rivet. The support plate 402 is fixedly attached to the drain box 30, for example, by welding, so that the side wall of the drain box 30 where the vent 304 is located is parallel to the bottom wall of the sink 60 to facilitate the entry of acid gas and water vapor into the drain box 30. Wherein, a connecting rod 403 is connected between the hanging rods 401 to improve the stability of the supporting plate 402 for fixing the drainage box 30.

Referring to fig. 1 and 4, in one embodiment of the utility model, the length of the hanger bar 401 is greater than the height of the drainage box 30. Through the difference of jib 401 length and drainage box 30 height, be provided with preset distance between drainage box 30 and fan 40 to guarantee that fan filter screen device's trades wind and can normally go on.

Referring to fig. 1-4, the present invention provides a wafer cleaning apparatus, which is used in a wet cleaning process of a wafer 20 to clean chemical solution, dust particles, and contaminants remaining on the surface of the wafer 20 after the wafer 20 is cleaned with the chemical solution. The wafer cleaning equipment can guide acid gas and water vapor generated in the cleaning process of the wafer 20 out of the fan filter screen device, so that the acid gas and the water vapor are prevented from being liquefied and flowing back to the surface of the wafer 20, trace residues are caused on the surface of the wafer 20, and the wall surface of the fan filter screen device can be protected from being corroded and damaged. Therefore, the wafer cleaning equipment can improve the quality of the wet cleaning process of the wafer 20.

In the description of the present specification, reference to the description of the terms "present embodiment," "example," "specific example," etc., means that a particular feature, structure, material, or characteristic described in connection with the embodiment or example is included in at least one embodiment or example of the utility model. In this specification, the schematic representations of the terms used above do not necessarily refer to the same embodiment or example. Furthermore, the particular features, structures, materials, or characteristics described may be combined in any suitable manner in any one or more embodiments or examples.

The embodiments of the utility model disclosed above are intended merely to aid in the explanation of the utility model. The examples are not intended to be exhaustive or to limit the utility model to the precise forms disclosed. Obviously, many modifications and variations are possible in light of the above teaching. The embodiments were chosen and described in order to best explain the principles of the utility model and the practical application, to thereby enable others skilled in the art to best utilize the utility model. The utility model is limited only by the claims and their full scope and equivalents.

Claims

1. A wafer cleaning apparatus, comprising at least:

a cleaning device allowing the wafer to be put in;

and the fan filter screen device is communicated with the drainage device.

2. The wafer cleaning apparatus according to claim 1, wherein the drain device includes a drain box, the drain box being provided on the cleaning device.

3. The wafer cleaning apparatus according to claim 2, wherein the flow guiding device comprises an air exhaust pipe, and the air exhaust pipe is communicated with the flow guiding box and the fan filter screen device.

4. The wafer cleaning device according to claim 3, wherein one end of the air exhaust pipe is disposed in the flow guide box, and the other end of the air exhaust pipe is disposed outside the fan strainer device and on a side of the fan strainer device away from the flow guide device.

5. The wafer cleaning apparatus according to claim 3, wherein the flow guiding device further comprises a suction pump, the suction pump is disposed on a side of the fan filtering device away from the flow guiding device, and one end of the suction pipe is connected to a side of the suction pump.

6. The wafer cleaning apparatus as recited in claim 2, wherein the baffle box includes an outer shell and an inner shell, and a heating plate is coupled between the outer shell and the inner shell.

7. The wafer cleaning apparatus according to claim 6, wherein a plurality of vent holes are provided at a side of the baffle box adjacent to the cleaning device, and the vent holes penetrate the outer casing, the heating plate and the inner casing.

8. The wafer cleaning apparatus as claimed in claim 2, wherein a plurality of hanger rods are connected to a side of the air outlet of the fan strainer device, and the hanger rods are connected to the diversion box.

9. The wafer cleaning apparatus of claim 8, wherein the length of the hanging rod is greater than the height of the diversion box.

10. The wafer cleaning apparatus as claimed in claim 8, wherein the number of the hanger rods is four, and one end of the hanger rod is connected to the fan screen device, and the other end of the hanger rod is connected to a side of the drain box adjacent to the cleaning device.

11. The wafer cleaning apparatus as recited in claim 2, wherein the cleaning device comprises a tank and a cleaning tank, the cleaning tank is connected to the tank, and the tank is disposed within a coverage area of the diversion box.