CN216749905U - Display panel and display device - Google Patents

Abstract

The utility model discloses a display panel and display device, relates to and shows technical field for improve the encapsulation effect of encapsulation layer, improve display device's yield and life. The display panel comprises a substrate, a circuit structure layer, a fixing structure and an encapsulation layer. And the circuit structure layer is arranged on the substrate. And the fixed structure is arranged on one side of the circuit structure layer, which is far away from the substrate. The orthographic projection of the fixed structure on the substrate and the orthographic projection of the light emitting areas of the plurality of sub-pixels on the substrate are staggered. The fixed structure includes opposing first and second end surfaces, the first end surface being closer to the substrate than the second end surface. The size of the first end face in the set direction is smaller than that of the second end face in the set direction. The direction is set to be parallel to at least one direction of the substrate. And the packaging layer covers the fixed structure and is in contact with the side wall of the fixed structure. The display panel is applied to a display device so that the display device displays a picture.

Description

Display panel and display device

Technical Field

The present disclosure relates to the field of display technologies, and in particular, to a display panel and a display device.

Background

With the continuous development of Display technology, a Flexible Display device (Flexible Display) using Organic Light Emitting Diodes (OLEDs) as Light Emitting devices and using Thin Film Transistors (TFTs) for signal control has become one of the mainstream products in the Display field.

Since the organic light emitting material is corroded by water and oxygen due to the fact that the water and oxygen in the outside air invade the light emitting device, the performance of the light emitting device is degraded, the display effect and the service life of the display device are affected, and therefore the OLED display device has very high requirements for packaging.

How to improve the packaging effect of the packaging layer, thereby improving the yield and the service life of the display device, is a technical problem to be solved urgently in the field.

SUMMERY OF THE UTILITY MODEL

The present disclosure is directed to a display panel, a manufacturing method thereof, and a display device, which are used for improving a packaging effect of a packaging layer, so as to improve a yield and a service life of the display device.

In order to achieve the above object, the present disclosure provides the following technical solutions:

in one aspect, a display panel is provided, which includes a plurality of sub-pixels, each having a light emitting region. The display panel comprises a substrate, a circuit structure layer, a fixing structure and an encapsulation layer. A circuit structure layer disposed on the substrate; the fixing structure is arranged on one side, far away from the substrate, of the circuit structure layer; the orthographic projection of the fixed structure on the substrate and the orthographic projection of the light emitting areas of the plurality of sub-pixels on the substrate are mutually staggered; the fixed structure comprises a first end face and a second end face which are opposite, and the first end face is closer to the substrate than the second end face; the size of the first end face in a set direction is smaller than that of the second end face in the set direction; the set direction is at least one direction parallel to the substrate; and the packaging layer covers the fixed structure and is in contact with the side wall of the fixed structure.

In some embodiments, the display panel further comprises a light emitting functional layer and a cathode layer. The light-emitting functional layer is positioned between the circuit structure layer and the packaging layer; a cathode layer located between the light emitting functional layer and the encapsulation layer; wherein the light emitting functional layer and the cathode layer cover at least a part of the fixing structure, and of the light emitting functional layer and the cathode layer, a part covering the fixing structure is separated from a part covering a surrounding area of the fixing structure.

In some embodiments, the fixing structure comprises a first fixing portion and a second fixing portion which are superposed in a direction perpendicular to the substrate and away from the substrate; the surface of the first fixed part close to the substrate is the first end surface, and the surface of the second fixed part far away from the substrate is the second end surface; or the cross section of the fixed structure along the direction vertical to the substrate is in an inverted trapezoid shape.

In some embodiments, the display panel further comprises a pixel defining layer located between the circuit structure layer and the encapsulation layer; the fixed structure is located on a side of the pixel defining layer away from the substrate.

In some embodiments, the display panel further comprises an anode layer and a cathode layer, the anode layer being located between the pixel defining layer and the circuit structure layer, the anode layer comprising an auxiliary conductive pattern; the cathode layer is positioned on one side of the pixel defining layer far away from the circuit structure layer; wherein the pixel defining layer includes a first opening through which the cathode layer is in contact with the auxiliary conductive pattern.

In some embodiments, the display panel further includes a cathode layer and a conductive connection pattern. The cathode layer is positioned on one side of the pixel defining layer far away from the circuit structure layer; a conductive connection pattern located between the cathode layer and the pixel defining layer, and an orthographic projection of the conductive connection pattern on the substrate and an orthographic projection of the light emitting areas of the plurality of sub-pixels on the substrate are staggered with each other; wherein the pixel defining layer comprises a first opening, at least a portion of the conductive connection pattern being located within the first opening; the cathode layer is in contact with the conductive connection pattern at the first opening.

In some embodiments, the display panel further comprises a pixel defining layer located between the circuit structure layer and the encapsulation layer; wherein the pixel defining layer comprises a first opening, an orthographic projection of the fixed structure on the substrate being located inside an orthographic projection of the first opening on the substrate.

In some embodiments, the second end face is higher than a surface of the pixel defining layer away from the substrate in a direction perpendicular to the substrate.

In some embodiments, the display panel further comprises a planarization layer between the pixel defining layer and the circuit structure layer; wherein the planarization layer comprises a second opening, an orthographic projection of the second opening on the substrate at least partially overlaps with an orthographic projection of the first opening on the substrate, and an orthographic projection of the fixed structure on the substrate is located inside an orthographic projection of the second opening on the substrate.

In some embodiments, the display panel includes a display area and a peripheral area surrounding the display area, the display area being provided with the fixing structure; at least one fixing structure is arranged between the light emitting areas of the two adjacent sub-pixels.

In some embodiments, the display panel includes a display area and a peripheral area surrounding the display area. The peripheral area is provided with the fixed knot constructs. The display panel also includes a pixel defining layer between the circuit structure layer and the encapsulation layer. The display panel further includes a blocking dam located at the peripheral region, the blocking dam surrounding the display region. The blocking dam includes a first blocking portion at the pixel defining layer. Wherein, the fixing structure is arranged on one side of the first barrier part, which is far away from the substrate.

In some embodiments, the display panel further comprises a planarization layer between the circuit structure layer and the pixel defining layer; the display panel further comprises an anti-cracking structure positioned on the peripheral region, the anti-cracking structure is far away from the display region relative to the blocking dam, and a gap is formed between the anti-cracking structure and the blocking dam; the pixel defining layer and the planarization layer are disconnected at the gap to form a groove, and the fixing structure is arranged in the groove.

In some embodiments, the display panel also includes a pixel defining layer and a spacer. A pixel defining layer between the circuit structure layer and the encapsulation layer. And the spacer is positioned on one side of the pixel defining layer far away from the substrate. The spacer includes a first spacer portion and a second spacer portion that are stacked in a direction perpendicular to the substrate and away from the substrate; the first spacer part and the first fixing part are made of the same material and are arranged in the same layer, and the second spacer part and the second fixing part are made of the same material and are arranged in the same layer.

In some embodiments, the display panel also includes a pixel defining layer and a spacer. A pixel defining layer between the circuit structure layer and the encapsulation layer; the spacer is positioned on one side of the pixel defining layer far away from the substrate; the section of the spacer along the direction vertical to the substrate is in an inverted trapezoid shape or a rectangular shape.

In some embodiments, the orthographic projection of the spacer on the substrate is a strip shape, the spacer comprises a plurality of extension portions connected in sequence, and the extension directions of at least two extension portions in the same spacer are different.

In another aspect, a method for fabricating a display panel is provided. The manufacturing method comprises the following steps:

a circuit structure layer is formed on a substrate.

Forming a fixed structure on one side of the circuit structure layer far away from the substrate; the display panel comprises a plurality of sub-pixels, each sub-pixel is provided with a light emitting area, and the orthographic projection of the fixed structure on the substrate is staggered with the orthographic projection of the light emitting areas of the sub-pixels on the substrate; the fixed structure comprises a first end face and a second end face which are opposite, and the first end face is closer to the substrate than the second end face; the size of the first end face along a set direction is smaller than that of the second end face along the set direction; the set direction is at least one direction parallel to the substrate.

And forming an encapsulation layer covering the fixed structure, wherein the encapsulation layer is contacted with the side wall of the fixed structure.

In some embodiments, forming a fixed structure on a side of the circuit structure layer away from the substrate includes:

and forming a sacrificial layer on the circuit structure layer.

And forming a photoresist layer on one side of the sacrificial layer far away from the substrate.

And patterning the photoresist layer by using an exposure and development process to form a second fixed part.

And patterning the sacrificial layer by using a developing process to form a first fixed part.

In another aspect, a display device is provided. The display device comprises the display panel of any one of the above embodiments.

The display panel, the manufacturing method thereof and the display device have the following beneficial effects:

in the display panel that this disclosure provided, set up fixed knot on circuit structure layer for display panel's before forming the encapsulated layer surface unevenness, thereby increased the encapsulated layer of follow-up formation and the area of contact between the rete of below, increased the adhesive force between the rete. Moreover, since the dimension of the first end face of the fixing structure in the setting direction is smaller than the dimension of the second end face in the setting direction, a limited space can be formed between the part of the second end face of the fixing structure, which exceeds the first end face, and the circuit structure layer in the setting direction. The packaging layer covers the fixed structure and is in contact with the side wall of the fixed structure, so that part of the packaging layer can fall into the defined space and is defined by the fixed structure and the circuit structure layer in the direction perpendicular to the substrate. Therefore, the packaging effect of the packaging layer is effectively improved by utilizing the fixing structure, so that the yield and the service life of the display device adopting the display panel are improved.

The manufacturing method of the display panel and the display device provided by the present disclosure have the same advantages as those achieved by the display panel provided by the above technical scheme, and are not repeated herein.

Drawings

In order to more clearly illustrate the technical solutions in the present disclosure, the drawings needed to be used in some embodiments of the present disclosure will be briefly described below, and it is apparent that the drawings in the following description are only drawings of some embodiments of the present disclosure, and other drawings can be obtained by those skilled in the art according to the drawings. Furthermore, the drawings in the following description may be regarded as schematic diagrams, and do not limit the actual size of products, the actual flow of methods, the actual timing of signals, and the like, involved in the embodiments of the present disclosure.

FIG. 1 is a top view of a display panel according to some embodiments;

FIG. 2 is a cross-sectional view of the display panel provided in FIG. 1 at M-M';

FIG. 3 is a circuit block diagram of a display panel according to some embodiments;

FIG. 4 is another cross-sectional view of the display panel provided in FIG. 1 at M-M';

FIG. 5 is a block diagram of a luminescent functional layer according to some embodiments;

FIG. 6 is a block diagram of a fixation structure according to some embodiments;

FIG. 7 is a cross-sectional view of the display panel provided in FIG. 1 at M-M';

FIG. 8 is a block diagram of a display panel according to some embodiments;

FIG. 9 is a top view of another display panel according to some embodiments;

FIG. 10 is a cross-sectional view of the display panel provided in FIG. 9 at N-N';

FIG. 11 is a top view of yet another display panel according to some embodiments;

FIG. 12 is a top view of yet another display panel according to some embodiments;

FIG. 13 is a cross-sectional view of the display panel provided in FIG. 12 at U-U';

FIG. 14 is another cross-sectional view of the display panel provided in FIG. 12 at U-U';

FIG. 15 is a block diagram of another display panel according to some embodiments;

FIG. 16 is a top view of yet another display panel according to some embodiments;

FIG. 17 is a cross-sectional view of the display panel provided in FIG. 16 at C-C';

FIG. 18 is a diagram of a process for making a display panel according to some embodiments;

FIG. 19 is a top view of yet another display panel according to some embodiments;

FIG. 20 is a cross-sectional view of the display panel provided in FIG. 19 at D-D';

FIG. 21 is a diagram of another display panel fabrication process according to some embodiments;

FIG. 22 is a top view of yet another display panel according to some embodiments;

FIG. 23 is a top view of a display area according to some embodiments;

FIG. 24 is a top view of yet another display panel according to some embodiments;

FIG. 25A is a cross-sectional view of the display panel provided in FIG. 24 at E-E';

FIG. 25B is a cross-sectional view of the display panel provided in FIG. 24 at E-E';

FIG. 26 is a top view of yet another display panel according to some embodiments;

FIG. 27 is a cross-sectional view of the display panel provided in FIG. 26 at H-H';

FIG. 28 is another cross-sectional view of the display panel provided in FIG. 26 at H-H';

FIG. 29 is a further cross-sectional view of the display panel provided in FIG. 26 at H-H';

FIG. 30 is a top view of yet another display panel according to some embodiments;

FIG. 31 is a cross-sectional view of the display panel provided in FIG. 30 at J-J';

FIG. 32 is another cross-sectional view of the display panel provided in FIG. 30 at J-J';

FIG. 33 is a top view of yet another display panel according to some embodiments;

FIG. 34 is a flow chart of a method of fabricating a display panel according to some embodiments;

FIG. 35 is a flow chart of another method of fabricating a display panel according to some embodiments;

FIG. 36 is a block diagram of a display device according to some embodiments.

Detailed Description

Technical solutions in some embodiments of the present disclosure will be clearly and completely described below with reference to the accompanying drawings, and it is obvious that the described embodiments are only a part of the embodiments of the present disclosure, and not all of the embodiments. All other embodiments obtained by a person of ordinary skill in the art based on the embodiments provided by the present disclosure belong to the protection scope of the present disclosure.

Unless the context requires otherwise, throughout the specification and claims, the word "comprise", and other forms thereof, such as the third person's singular form "comprising" and the present participle form "comprising", are to be construed in an open, inclusive sense, i.e. as "including, but not limited to". In the description herein, the terms "one embodiment," "some embodiments," "example," "particular example" or "some examples" or the like are intended to indicate that a particular feature, structure, material, or characteristic described in connection with the embodiment or example is included in at least one embodiment or example of the disclosure. The schematic representations of the above terms are not necessarily referring to the same embodiment or example. Furthermore, the particular features, structures, materials, or characteristics may be included in any suitable manner in any one or more embodiments or examples.

In the following, the terms "first", "second" are used for descriptive purposes only and are not to be understood as indicating or implying relative importance or implicitly indicating the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of that feature. In the description of the embodiments of the present disclosure, "a plurality" means two or more unless otherwise specified.

In describing some embodiments, expressions of "coupled" and "connected," along with their derivatives, may be used. For example, the term "connected" may be used in describing some embodiments to indicate that two or more elements are in direct physical or electrical contact with each other. As another example, some embodiments may be described using the term "coupled" to indicate that two or more elements are in direct physical or electrical contact. The terms "coupled" or "communicatively coupled," however, may also mean that two or more elements are not in direct contact with each other, but yet still co-operate or interact with each other. The embodiments disclosed herein are not necessarily limited to the contents herein.

"at least one of A, B and C" has the same meaning as "A, B or at least one of C", both including the following combination of A, B and C: a alone, B alone, C alone, a and B in combination, a and C in combination, B and C in combination, and A, B and C in combination.

"A and/or B" includes the following three combinations: a alone, B alone, and a combination of A and B.

Additionally, the use of "based on" means open and inclusive, as a process, step, calculation, or other action that is "based on" one or more stated conditions or values may in practice be based on additional conditions or values beyond those stated.

As used herein, "about," "approximately," or "approximately" includes the stated values as well as average values that are within an acceptable range of deviation for the particular value, as determined by one of ordinary skill in the art in view of the measurement in question and the error associated with measurement of the particular quantity (i.e., the limitations of the measurement system).

As used herein, "parallel," "perpendicular," and "equal" include the stated case and cases that approximate the stated case to within an acceptable range of deviation as determined by one of ordinary skill in the art in view of the measurement in question and the error associated with the measurement of the particular quantity (i.e., the limitations of the measurement system). For example, "parallel" includes absolute parallel and approximately parallel, where an acceptable deviation from approximately parallel may be, for example, within 5 °; "perpendicular" includes absolute perpendicular and approximately perpendicular, where an acceptable deviation from approximately perpendicular may also be within 5 °, for example. "equal" includes absolute and approximate equality, where the difference between the two, which may be equal within an acceptable deviation of approximately equal, is less than or equal to 5% of either.

It will be understood that when a layer or element is referred to as being "on" another layer or substrate, it can be directly on the other layer or substrate, or intervening layers may also be present.

Example embodiments are described herein with reference to cross-sectional and/or plan views as idealized example figures. In the drawings, the thickness of layers and regions are exaggerated for clarity. Variations from the shapes of the illustrations as a result, for example, of manufacturing techniques and/or tolerances, are to be expected. Thus, the exemplary embodiments should not be construed as limited to the shapes of regions illustrated herein but are to include deviations in shapes that result, for example, from manufacturing. For example, an etched region shown as a rectangle will typically have curved features. Thus, the regions illustrated in the figures are schematic in nature and their shapes are not intended to illustrate the actual shape of a region of a device and are not intended to limit the scope of the exemplary embodiments.

As shown in fig. 1 and 2, some embodiments of the present disclosure provide a display panel 100 including a substrate 10, a circuit structure layer 20, a fixing structure 30, and an encapsulation layer 40.

Wherein the circuit structure layer 20 is disposed on the substrate 10. The fixing structure 30 is disposed on a side of the circuit structure layer 20 away from the substrate 10.

The display panel 100 includes a plurality of sub-pixels P each having a light emitting region P1.

The orthographic projection of the fixed structure 30 on the substrate 10 is offset from the orthographic projection of the light emitting regions P1 of the plurality of sub-pixels P on the substrate 10. The fixed structure 30 includes a first end face 31 and a second end face 32 opposite to each other, the first end face 31 is closer to the substrate 10 than the second end face 32, and a dimension of the first end face 31 in the set direction is smaller than a dimension of the second end face 32 in the set direction. The set direction is at least one direction parallel to the substrate 10. The encapsulation layer 40 covers the fixing structure 30 and contacts with the sidewall of the fixing structure 30.

Illustratively, the substrate 10 may be a flexible substrate. The material of the substrate 10 may include Polyimide (PI), for example.

Illustratively, the substrate 10 may be a rigid substrate. The material of the substrate 10 may include glass, for example.

For example, as shown in fig. 2, the display panel 100 may further include a buffer layer 11 between the substrate 10 and the circuit structure layer 20, and the material of the buffer layer 11 may be, for example, silicon oxide or silicon nitride, so as to facilitate the formation of the circuit structure layer 20 on the substrate 10.

For example, as shown in fig. 2, the circuit structure layer 20 may include a semiconductor layer 21, a first gate insulating layer 22, a first gate layer 23, a second gate insulating layer 24, a second gate layer 25, an interlayer dielectric layer 26, and a source/drain electrode layer 27, which are sequentially away from the substrate 10.

The material of the semiconductor layer 21 may include, for example, polysilicon. The material of the first gate insulating layer 22 may include silicon dioxide, for example. The material of the second gate insulating layer 24 may include, for example, silicon nitride. The material of the interlayer dielectric layer 26 may include silicon dioxide or silicon nitride, for example.

The materials of the first gate layer 23 and the second gate layer 25 may be the same or different. When the materials of the first gate layer 23 and the second gate layer 25 are the same, the materials of both may include molybdenum.

Illustratively, the first gate layer 23 and the second gate layer 25 may be formed by a Plasma Enhanced Chemical Vapor Deposition (PECVD) process.

The source/drain electrode layer 27 may have a single-layer structure or a multilayer structure. When the source-drain electrode layer 27 has a multilayer structure, the source-drain electrode layer 27 may include a titanium metal layer, an aluminum metal layer, and a titanium metal layer, which are sequentially stacked in a direction Z perpendicular to the substrate 10.

For example, referring to fig. 3, each of the sub-pixels P may include a pixel driving circuit 201 for implementing a light emitting display of the sub-pixel P. The pixel driving circuit 201 may include a plurality of thin film transistors 202 and at least one storage capacitor 203. For example, the pixel driving circuit 201 may have a 2T1C or 7T2C circuit configuration.

As shown in fig. 3, the display panel 100 may further include a plurality of data lines DL, a plurality of gate lines GL, and a plurality of power voltage lines VDD.

Illustratively, each scan line GL is electrically connected to a row of sub-pixels P for controlling the turn-on and turn-off of the corresponding row of sub-pixels P. Each data line DL is electrically connected to a column of the sub-pixels P for providing a data signal to the corresponding column of the sub-pixels P. Each of the power voltage lines VDD is electrically connected to at least one column of the subpixels P. The power voltage line VDD is used to supply a high level voltage to the sub-pixel P during display of the display panel.

As shown in fig. 2, each thin film transistor 202 may include a semiconductor pattern 204, a gate electrode 205, a source electrode 206, and a drain electrode 207. Wherein the semiconductor pattern 204 is located in the semiconductor layer 21, the gate electrode 205 is located in the first gate layer 23, and the source electrode 206 and the drain electrode 207 are located in the source-drain electrode layer 27. The source electrode 206 and the drain electrode 207 are electrically connected to the semiconductor pattern 204.

In the present disclosure, the number, shape, size and arrangement of the sub-pixels P are not limited as long as the image display requirement of the display panel 100 can be achieved.

For example, the sub-pixels P in the display panel 100 may be arranged in a plurality of rows along the first direction X and a plurality of columns along the second direction Y. The first direction X and the second direction Y are both parallel to the substrate 10.

Illustratively, the plurality of sub-pixels P may display a plurality of colors, respectively. Based on this, the display panel 100 may include at least a first color sub-pixel, a second color sub-pixel, and a third color sub-pixel, which may be three primary colors (e.g., red, green, and blue).

In some examples, as shown in fig. 1, an orthographic projection of the light emitting region P1 of the sub-pixel P on the substrate 10 may be a hexagon, or a pentagon. In other examples, the orthographic projection of the light emitting region P1 of the sub-pixel P on the substrate 10 may also be rectangular.

Some embodiments of the present disclosure provide the fixing structure 30 on a side of the circuit structure layer 20 away from the substrate 10, and an orthographic projection of the fixing structure 30 on the substrate 10 is staggered from an orthographic projection of the light emitting regions P1 of the plurality of sub-pixels P, so as to avoid a problem that the light emitting effect of the sub-pixels P is affected by disposing the fixing structure 30 in the light emitting regions P1.

Illustratively, as shown in fig. 1, the orthographic projection of the fixed structure 30 on the substrate 10 may be rectangular. Alternatively, the orthographic projection of the fixed structure 30 on the substrate 10 may be a six-deformation. The shape of the orthographic projection of the fixed structure 30 on the substrate 20 is not limited in this disclosure.

The number of the fixing structures 30 is not limited in the present disclosure, and one or more fixing structures 30 may be disposed in the display panel 100.

The fixed structure 30 includes a first end face 31 and a second end face 32 opposite to each other, the first end face 31 is closer to the substrate 10 than the second end face 32, and a dimension of the first end face 31 in the set direction is smaller than a dimension of the second end face 32 in the set direction. Wherein the set direction may be one direction parallel to the substrate 10. Alternatively, the set direction may be a plurality of directions parallel to the substrate 10. Still alternatively, the set direction may be all directions parallel to the substrate 10.

For example, the set direction may be the first direction X, or the set direction may be the second direction Y.

The inventor finds that, in the related art, the light emitting device is manufactured by a vacuum evaporation process, the interlayer adhesion between the light emitting device and the packaging layer is poor, the light emitting device and the packaging layer are easy to peel off from each other in the display process of the display panel, and a gap is formed, so that the packaging effect of the packaging layer is reduced, and the problems that the performance of the light emitting device is deteriorated, the display effect of the display device is poor, or the service life of the display device is shortened due to the fact that water and oxygen in the outside air invade into the light emitting device are solved. The interlayer adhesive force between the light-emitting device and the packaging layer is improved through process improvement, and the packaging effect of the packaging layer is further improved with higher difficulty.

Based on this, in some embodiments of the present disclosure, the fixing structure 30 is disposed on the circuit structure layer 20, so that the surface of the display panel before the encapsulation layer 40 is formed is uneven, thereby increasing the contact area between the subsequently formed encapsulation layer 40 and the underlying film layer, and increasing the adhesion between the film layers.

Also, since the dimension of the first end face 31 of the fixing structure 30 in the setting direction is smaller than the dimension of the second end face 32 in the setting direction, a defined space Q may be formed between a portion of the second end face 32 of the fixing structure 30 beyond the first end face 31 and the circuit structure layer 20 in the setting direction. The encapsulation layer 40 covers the fixing structure 30 and is in contact with the sidewall of the fixing structure 30, so that as shown in fig. 2 and 3, a portion of the encapsulation layer 40 can fall into the defined space Q, thereby being defined by the fixing structure 30 and the circuit structure layer 20 in a direction perpendicular to the substrate 10. Thus, the fixing structure 30 is used to fix the encapsulating layer 40 on the circuit structure layer 20 based on the mechanical locking principle, so as to effectively improve the encapsulating effect of the encapsulating layer 40, thereby improving the yield and the service life of the display device using the display panel 100.

In some examples, as shown in fig. 2, the encapsulation layer 40 may be a single layer structure, in which case the material of the encapsulation layer 40 may include silicon nitride or silicon oxide.

In other examples, as shown in fig. 4, the encapsulation layer 40 may have a multi-layer structure, and in this case, the encapsulation layer 40 may include a first inorganic layer 41, a second inorganic layer 42, and an organic layer 43 between the first inorganic layer 41 and the second inorganic layer 42. The first inorganic layer 41 is closer to the substrate 10 than the second inorganic layer.

Among them, the first inorganic layer 41 and the second inorganic layer 42 may serve to block water and oxygen. For example, the material of the first inorganic layer 41 and the second inorganic layer 42 may be silicon nitride, silicon oxide, silicon oxynitride, aluminum oxide, or titanium oxide. It is to be understood that the materials of the first inorganic layer 41 and the second inorganic layer 42 are not limited thereto.

For example, the first inorganic layer 41 and the second inorganic layer 42 can be prepared by Chemical Vapor Deposition (CVD) or Atomic Layer Deposition (ALD).

The organic layer 43 may be used for stress relief and planarization. Illustratively, the organic layer 43 may be prepared by ink-jet printing, screen printing, dispensing, and the like.

In some embodiments, as shown in fig. 4, the display panel 100 further includes a light emitting functional layer 50 and a cathode layer 60. The light emitting function layer 50 is located between the circuit structure layer 20 and the encapsulation layer 40. And a cathode layer 60 between the light emitting function layer 50 and the encapsulation layer 40.

In some examples, as shown in fig. 4, the light emitting function layer 50 may include a light emitting layer 51.

In other examples, as shown in fig. 5, the light-emitting function layer 50 may further include one or more of an electron transport layer 52 (ETL), an electron injection layer 53 (EIL), a hole transport layer 54 (HTL), and a hole injection layer 55 (HIL), in addition to the light-emitting layer 51. Fig. 5 illustrates an example in which the light-emitting functional layer 50 includes a light-emitting layer 51, an electron transport layer 52, an electron injection layer 53, a hole transport layer 54, and a hole injection layer 55.

Illustratively, the light emitting function layer 50 may be formed by an evaporation process.

As shown in fig. 4, the light-emitting functional layer 50 and the cathode layer 60 cover at least a part of the fixing structure 30, and in the light-emitting functional layer 50 and the cathode layer 60, a part covering the fixing structure 30 is separated from a part covering a peripheral region of the fixing structure 30.

"the light emitting function layer 50 and the cathode layer 60 cover at least part of the fixing structure 30", the light emitting function layer 50 and the cathode layer 60 may cover some of the fixing structures 30, or the light emitting function layer 50 and the cathode layer 60 may cover the whole fixing structures 30.

Thus, as shown in fig. 4, the encapsulation layer 40 is defined by the fixing structure 30, and the edges of the light emitting function layer 50 and the cathode layer 60 covering the area around the fixing structure 30 are covered by the encapsulation layer 40, so that the light emitting function layer 50 and the cathode layer 60 are also defined on the circuit structure layer 20 by the fixing structure 30. Thereby effectively improving the film adhesion between the light-emitting functional layer 50 and the cathode layer 60 and the anode layer 70, and the film adhesion between the encapsulation layer 40 and the light-emitting functional layer 50 and the cathode layer 60. When the light-emitting functional layer 50 has a multilayer structure, the film adhesion between the films in the light-emitting functional layer 50 can be effectively improved. Furthermore, the problems that the display effect and the service life of the display device are influenced due to failure of a light emitting device caused by interlayer stripping between the light emitting functional layer and the upper and lower adjacent film layers or between the cathode layer and the packaging layer due to poor adhesive force of the light emitting functional layer and the cathode layer are effectively solved.

In some embodiments, as shown in fig. 4, the display panel 100 may further include an anode layer 70. The anode layer 70 is positioned between the circuit structure layer 20 and the light emitting function layer 50.

Illustratively, as shown in fig. 4, the anode layer 70 includes a plurality of anode patterns 71, and one anode pattern 71 corresponds to one sub-pixel P. The anode pattern 71 and the cathode layer 60 are used to supply a voltage to the light-emitting function layer 50 and drive the light-emitting function layer 50 to emit light. The anode pattern 71, the light emitting functional layer 50, and the cathode layer 60 together constitute a light emitting device.

The anode layer 70 may have a single-layer structure or a multi-layer structure. When the anode layer 70 has a multi-layer structure, the anode layer 70 may include, for example, an Indium Tin Oxide (ITO) layer, a silver metal layer, and an ITO layer, which are sequentially disposed away from the substrate 10.

In some embodiments, as shown in fig. 6, the fixing structure 30 includes a first fixing portion 301 and a second fixing portion 302 stacked in a direction perpendicular to the substrate 10 and away from the substrate 10. The surface of the first fixing portion 301 close to the substrate 10 is a first end surface 31, and the surface of the second fixing portion 302 far from the substrate 10 is a second end surface 32.

It is understood that "the surface of the first fixing portion 301 close to the substrate 10 is the first end face 31, and the surface of the second fixing portion 302 far from the substrate 10 is the second end face 32", that is, the size of the first fixing portion 301 in the set direction is smaller than the size of the second fixing portion 302 in the set direction.

Based on this, the cross section of the fixing structure 30 in the direction perpendicular to the substrate 10 is T-shaped.

Note that "the cross section of the fixed structure 30 in the direction perpendicular to the substrate 10 is T-shaped" means that the cross-sectional shape of the fixed structure 30 in the direction perpendicular to the substrate 10 is T-shaped as a whole, but is not limited to a standard T-shape. That is, the "T-shape" herein includes not only the shape of the basic T-shape but also the shape similar to the T-shape in consideration of the process conditions.

Illustratively, the materials of the first fixing portion 301 and the second fixing portion 302 are different. For example, the material of the first fixing portion 301 may include a fluoroether material, and the material of the second fixing portion 302 may include a negative photoresist.

It should be noted that, since the material of the second fixing portion 302 is photoresist, the thickness of the second fixing portion 302 may be thicker in a direction perpendicular to the substrate 10. In this way, in the set direction, the portion of the second fixing portion 302 beyond the first fixing portion 301 can be substantially parallel to the substrate 10, so as to improve the situation that the packaging layer is not fully filled into the limited space and the packaging effect is weakened due to the bending of the second fixing portion 302 towards the substrate 10.

Illustratively, referring to fig. 6, the thickness d1 of the first fixing portion 301 and the thickness d2 of the second fixing portion 302 may each be 0.5 to 3.5 micrometers in a direction perpendicular to the substrate 10. For example, the thickness of the first fixing portion 301 may be 1 micrometer, 1.5 micrometers, 1.63 micrometers, 2 micrometers, 2.5 micrometers, 3 micrometers, 3.5 micrometers, and the like. The thickness of the second fixing portion 302 may be 0.7 micrometers, 1 micrometer, 1.5 micrometers, 2 micrometers, 2.5 micrometers, 3 micrometers, 3.5 micrometers, and the like.

For example, in the setting direction (the first direction X), the dimension d3 of the portion of the second fixing portion 302 beyond the first fixing portion 301 may be 0.5 to 1 micrometer, for example, 0.73 micrometer.

In some embodiments of the present disclosure, the fixing structure 30 includes a first fixing portion 301 and a second fixing portion 302, and a dimension of the second fixing portion 302 in the setting direction is greater than a dimension of the first fixing portion 301 in the setting direction, so that the second fixing portion 302 can be utilized to fix the encapsulation layer 40 on the circuit structure layer 20 based on a mechanical locking principle, thereby further improving a packaging effect of the encapsulation layer 40, and improving a yield and a service life of a display device using the display panel 100.

In other embodiments, as shown in fig. 7, the cross-section of the fixing structure 30 in the direction perpendicular to the substrate 10 is an inverted trapezoid.

Note that "the cross section of the fixed structure 30 in the direction perpendicular to the substrate 10 is an inverted trapezoid", which means that the cross-sectional shape of the fixed structure 30 in the direction perpendicular to the substrate 10 is an inverted trapezoid as a whole, but is not limited to a standard inverted trapezoid. That is, the "inverted trapezoid" herein includes not only a shape of a substantially inverted trapezoid but also a shape similar to an inverted trapezoid in consideration of process conditions.

In some embodiments of the present disclosure, a cross section of the fixing structure 30 along a direction perpendicular to the substrate 10 is an inverted trapezoid, so that the side wall connecting the first end surface 31 and the second end surface 32 can be used to fix the encapsulation layer 40 on the circuit structure layer 20, thereby further improving the encapsulation effect of the encapsulation layer 40, and improving the yield and the service life of a display device using the display panel 100.

In still other embodiments, as shown in fig. 8, a portion of the fixing structure 30 includes a first fixing portion 301 and a second fixing portion 302 stacked in a direction perpendicular to the substrate 10 and away from the substrate 10, and a cross section of another portion of the fixing structure 30 in the direction perpendicular to the substrate 10 has an inverted trapezoid shape.

In some embodiments, as shown in FIG. 8, the display panel 100 also includes a pixel defining layer 80. The pixel defining layer 80 is located between the circuit structure layer 20 and the encapsulation layer 40.

When the display panel 100 also includes the anode layer 70, the pixel defining layer 80 is located between the anode layer 70 and the encapsulation layer 40.

In some examples, as shown in fig. 2, 4, 7 and 8, the fixed structure 30 is located on a side of the pixel defining layer 80 away from the substrate 10.

In this way, in the set direction, a portion of the second end surface 32 of the fixed structure 30 beyond the first end surface 31 may form a defined space Q with the pixel defining layer 80, thereby defining a portion of the encapsulation layer 40 between the fixed structure 30 and the pixel defining layer 80. In this way, the fixing structure 30 is used to fix the encapsulating layer 40 on the pixel defining layer 80 based on the mechanical locking principle, so as to effectively improve the encapsulating effect of the encapsulating layer 40, thereby improving the yield and the service life of the display device using the display panel 100.

In other examples, as shown in fig. 9 and 10, the pixel defining layer 80 includes a first opening 81, and an orthogonal projection of the fixed structure 30 on the substrate 10 is located inside an orthogonal projection of the first opening 81 on the substrate 10.

When the orthographic projection of the fixed structure 30 on the substrate 10 is located inside the orthographic projection of the first opening 81 on the substrate 10, there may be a gap between the orthographic projection edge of the fixed structure 30 on the substrate 10 and the orthographic projection edge of the first opening 81 on the substrate 10, or there may be a partial overlap.

The number, shape, size and arrangement of the first openings 81 are not limited in this disclosure, as long as the orthographic projection of the fixed structure 30 on the substrate 10 can be located inside the orthographic projection of the first openings 81 on the substrate 10.

Illustratively, as shown in fig. 9, an orthographic projection of the first opening 81 on the substrate 10 may be substantially rectangular.

Illustratively, as shown in fig. 11, an orthographic projection of the first opening 81 on the substrate 10 may be substantially hexagonal.

Note that "substantially rectangular" means that the orthographic shape of the first opening 81 on the substrate 10 is rectangular as a whole, but is not limited to a standard rectangle. That is, the "rectangular shape" herein includes not only a substantially rectangular shape but also a shape similar to a rectangular shape in consideration of process conditions. Similarly, "hexagonal" includes not only a substantially hexagonal shape but also a shape similar to a hexagonal shape in consideration of process conditions,

some embodiments of the present disclosure provide the first opening 81 in the pixel defining layer 80, and the fixing structure 30 is located inside the first opening 81, so that the surface of the display panel before the formation of the encapsulating layer 40 is more uneven, thereby increasing the contact area between the subsequently formed encapsulating layer 40 and the film layer below, increasing the adhesive force between the film layers, further improving the encapsulating effect of the encapsulating layer 40, and improving the yield and the service life of the display device adopting the display panel 100.

Illustratively, as shown in fig. 9 and 11, the pixel defining layer 80 may further include a plurality of pixel openings 82, one pixel opening 82 corresponds to the light emitting region P1 of one sub-pixel P, and one pixel opening 82 also corresponds to one anode pattern 71, and exposes a partial region of the anode pattern 71.

The orthographic projection of the pixel openings 82 on the substrate 10 is staggered from the orthographic projection of the first opening 81 on the substrate 10.

In some embodiments, as shown in fig. 10, the second end face 32 is higher than a surface 83 of the pixel defining layer 80 away from the substrate 10 in a direction Z perpendicular to the substrate 10.

With such an arrangement, the fixing structure 30 not only can improve the packaging effect of the packaging layer 40, but also can support a Mask plate, for example, a Fine Metal Mask (FMM for short), in the process of forming the light emitting functional layer 50 by using an evaporation process.

In some embodiments, as shown in fig. 12 and 13, the display panel 100 further includes a planarization layer 90. The planarization layer 90 is located between the pixel defining layer 80 and the circuit structure layer 20.

Wherein the planarization layer 90 comprises a second opening 91, an orthographic projection of the second opening 91 on the substrate 10 at least partially overlaps with an orthographic projection of the first opening 81 on the substrate 10, and an orthographic projection of the fixed structure 30 on the substrate 10 is located inside an orthographic projection of the second opening 91 on the substrate 10.

It is to be understood that "an orthogonal projection of the second opening 91 on the substrate 10 at least partially overlaps an orthogonal projection of the first opening 81 on the substrate 10", for example, as shown in fig. 12, an orthogonal projection of the second opening 91 on the substrate 10 completely overlaps an orthogonal projection of the first opening 81 on the substrate 10. An orthogonal projection of the second opening 91 on the substrate 10 is located inside an orthogonal projection of the first opening 81 on the substrate 10, and a gap exists between an edge of the orthogonal projection of the second opening 91 on the substrate 10 and an edge of the orthogonal projection of the first opening 81 on the substrate 10.

"an orthographic projection of the second opening 91 on the substrate 10 at least partially overlaps an orthographic projection of the first opening 81 on the substrate 10", for example, an orthographic projection of the second opening 91 on the substrate 10 only partially overlaps an orthographic projection of the first opening 81 on the substrate 10.

"the orthographic projection of the fixed structure 30 on the substrate 10 is located inside the orthographic projection of the second opening 91 on the substrate 10", for example, as shown in fig. 12, the orthographic projection of the fixed structure 30 on the substrate 10 is located inside the orthographic projection of the second opening 91 on the substrate 10, and a gap exists between a boundary of the orthographic projection of the fixed structure 30 on the substrate 10 and a boundary of the orthographic projection of the second opening 91 on the substrate 10.

"the orthographic projection of the fixed structure 30 on the substrate 10 is located inside the orthographic projection of the second opening 91 on the substrate 10", for example, the orthographic projection of the fixed structure 30 on the substrate 10 is located inside the orthographic projection of the second opening 91 on the substrate 10, and the boundary of the orthographic projection of the fixed structure 30 on the substrate 10 partially overlaps the boundary of the orthographic projection of the second opening 91 on the substrate 10.

Some embodiments of the present disclosure set the first opening 81 in the pixel defining layer 80, set the second opening 91 in the planarization layer 90, and set the fixing structure 30 inside the second opening 91, so that the surface of the display panel before the formation of the encapsulation layer 40 is more uneven, thereby further increasing the contact area between the encapsulation layer 40 and the film layers below, increasing the adhesion between the film layers, improving the encapsulation effect of the encapsulation layer 40, and improving the yield and the service life of the display device adopting the display panel 100.

In some embodiments, as shown in FIG. 13, the display panel 100 includes a planarization layer 90.

In other embodiments, as shown in FIG. 14, the display panel 100 includes two planarization layers 90. Based on this, the display panel 100 may further include a transfer electrode layer 92, the transfer electrode layer 92 is located between the two planarization layers 90, and the transfer electrode layer 92 includes a plurality of transfer patterns 921. The via pattern 921 is used to connect the anode pattern 71 and the drain electrode 207 (or the source electrode 206).

In still other embodiments, as shown in FIG. 15, the display panel 100 includes three planarization layers 90.

Based on this, a landing electrode layer 92 is disposed between each two adjacent planarization layers 90, and each landing electrode layer 92 includes a plurality of landing patterns 921. The via pattern 921 is used to connect the anode pattern 71 and the drain electrode 207 (or the source electrode 206).

Referring to fig. 15, the display panel 100 may further include a plurality of insulating layers 12 and a light blocking pattern 13 between the substrate 10 and the circuit structure layer 20. Wherein, the orthographic projection of the semiconductor pattern 204 in the circuit structure layer 20 on the substrate 10 is positioned inside the orthographic projection of the light-shielding pattern 13 on the substrate 10.

In some embodiments, it may be that a portion of the fixed structure 30 is located on a side of the pixel defining layer 80 away from the substrate 10, and another portion of the fixed structure 30 is located in the first opening 81.

In other embodiments, a portion of the fixed structure 30 may be located on a side of the pixel defining layer 80 away from the substrate 10, and another portion of the fixed structure 30 may be located in the second opening 91.

The shape of the fixed structure 30 located in the first opening 81 or the second opening 91 may be the same as or different from the shape of the fixed structure 30 located on the side of the pixel defining layer 80 away from the substrate 10. For example, the fixed structure 30 located in the first opening 81 or the second opening 91 may include a first fixed portion 301 and a second fixed portion 302 which are overlapped in a direction perpendicular to the substrate 10 and away from the substrate 10, and a cross section of the fixed structure 30 located on a side of the pixel defining layer 80 away from the substrate 10 in the direction perpendicular to the substrate 10 is an inverted trapezoid.

Some embodiments of the present disclosure set the fixing structure 30 in the first opening 81 or the second opening 91, and simultaneously fix the structure 30 on the side of the pixel defining layer 80 away from the substrate 10, so that the surface of the display panel before the formation of the encapsulation layer 40 is more uneven, thereby further increasing the contact area between the encapsulation layer 40 and the film layer below the encapsulation layer 40, increasing the adhesion between the film layers, improving the encapsulation effect of the encapsulation layer 40, and improving the yield and the service life of the display device adopting the display panel 100.

In still other embodiments, as shown in fig. 16 and 17, the pixel defining layer 80 includes a first opening 81, and an orthographic projection of the fixed structure 30 on the substrate 10 is offset from an orthographic projection of the first opening 81 on the substrate 10. The anode layer 70 is located between the pixel defining layer 80 and the circuit structure layer 20, and the anode layer 70 further includes an auxiliary conductive pattern 72. The cathode layer 60 is located on a side of the pixel defining layer 80 away from the circuit structure layer 20, and the cathode layer 60 is in contact with the auxiliary conductive pattern 72 through the first opening 81.

It is understood that the cathode layer 60 is in contact with the auxiliary conductive pattern 72 through the first opening 81, i.e., the light emitting function layer 50 is not disposed between the cathode layer 60 and the auxiliary conductive pattern 72 at the first opening 81. That is, the light-emitting functional layer 50 includes the third opening 51 therein, and an orthogonal projection of the third opening 51 on the substrate 10 at least partially overlaps an orthogonal projection of the first opening 81 on the substrate 10.

With this arrangement, the auxiliary conductive patterns 72 in the anode layer 70 can supply a cathode voltage to the inside of the cathode layer 60, which is advantageous in achieving uniformity of the sheet resistance of the cathode layer 60 and reducing power consumption in the cathode layer 60, compared to supplying a voltage to the edge of the cathode layer 60. Meanwhile, the auxiliary conductive patterns 72 are located in the anode layer 70 and are made of the same material as the anode patterns 71, so that the same etching process can be used, the same mask plate is adopted for preparation, and the manufacturing cost of the display panel is not increased.

Illustratively, referring to fig. 18, in order to achieve that the cathode layer 60 is in contact with the auxiliary conductive pattern 72 through the first opening 81, after the pixel defining layer 80 is formed, in addition to forming the fixing structure 30 on the pixel defining layer 80, the fixing structure 30 may be formed in the first opening 81 of the pixel defining layer 80, the light emitting functional layer 50 may be formed after the fixing structure 30 is formed, and finally, the fixing structure 30 disposed in the first opening 81 is peeled off by using a peeling liquid, so that a portion of the light emitting functional layer 50, which is located inside an orthographic projection of the first opening 81 on the substrate 10, is removed, so that the cathode layer 60 may be directly electrically connected with the auxiliary conductive pattern 72 exposed by the first opening 81 when the cathode layer 60 is formed.

In still other embodiments, as shown in fig. 19 and 20, the cathode layer 60 is located on a side of the pixel defining layer 80 away from the circuit structure layer 20, and the display panel 100 may further include a conductive connection pattern 61 located between the cathode layer 60 and the pixel defining layer 80, and an orthographic projection of the conductive connection pattern 61 on the substrate 10 is offset from an orthographic projection of the light emitting regions P1 of the plurality of sub-pixels P on the substrate 10. The pixel defining layer 80 includes a first opening 81, and at least a portion of the conductive connection pattern 61 is positioned within the first opening 81. The cathode layer 60 is in contact with the conductive connection pattern 61 at the first opening 81.

It is understood that the cathode layer 60 is in contact with the conductive connection pattern 61 at the first opening 81, i.e., the light emitting function layer 50 is not disposed between the cathode layer 60 and the conductive connection pattern 61 at the first opening 81. That is, the light-emitting functional layer 50 includes the third opening 51 therein, and an orthogonal projection of the third opening 51 on the substrate 10 at least partially overlaps an orthogonal projection of the first opening 81 on the substrate 10.

With this arrangement, the cathode voltage can be supplied to the inside of cathode layer 60 by conductive connection pattern 61, and it is possible to achieve uniformity of the sheet resistance of cathode layer 60 and reduce power consumption in cathode layer 60, compared to supplying the voltage directly to the edge of cathode layer 60.

Illustratively, as shown in fig. 21, to achieve contact of the cathode layer 60 with the conductive connection pattern 61 at the first opening 81, after the conductive connection pattern 61 is formed on the pixel defining layer 80, in addition to forming the fixing structure 30 on the pixel defining layer 80, the fixing structure 30 may be formed in the first opening 81 of the pixel defining layer 80 (i.e., the fixing structure 30 is formed on a portion of the conductive connection pattern 61 located in the first opening 81), after the fixing structure 30 is formed, the light emitting function layer 50 is formed, and finally, the fixing structure 30 disposed in the first opening 81 is peeled off by using a peeling liquid, thereby removing a portion of the light-emitting functional layer 50 located inside the orthographic projection of the first opening 81 on the substrate 10 on the orthographic projection of the substrate 10, and thus, when forming the cathode layer 60, the cathode layer 60 may be directly electrically connected to the conductive connection pattern 61 in the first opening 81.

Illustratively, as shown in fig. 18 and 21, the fixing structure 30 formed in the first opening 81 may include a first fixing portion 301 and a second fixing portion 302 stacked in a direction perpendicular to the substrate 10 and away from the substrate 10. The above-described fixed structure 30 formed on the pixel defining layer 80 has an inverted trapezoidal cross section in a direction perpendicular to the substrate 10.

In this regard, in the case where the material of the first fixing portion 301 includes a fluoroether material, the material of the stripping liquid may include an organic solvent in which the fluoroether material is dissolved.

In some embodiments, as shown in fig. 22, the display panel 100 includes a display area AA and a peripheral area BB surrounding the display area.

Illustratively, as shown in fig. 22, the display area AA is provided with a fixing structure 30. Thus, by using the fixing structure 30, a part of the encapsulation layer 40 located in the display area AA can be fixed on the circuit structure layer 20 based on the mechanical locking principle, thereby facilitating the improvement of the encapsulation effect of the encapsulation layer 40 in the display area AA, and the improvement of the yield of the display panel and the service life of the display panel.

Illustratively, as shown in fig. 23, at least one fixed structure 30 is disposed between the light emitting regions P1 of two adjacent sub-pixels P.

It is understood that "at least one fixed structure 30 is disposed between the light emitting regions P1 of two adjacent sub-pixels P", for example, as shown in fig. 23, one fixed structure 30 may be disposed between the light emitting regions P1 of two adjacent sub-pixels P. For another example, a plurality of fixed structures 30 may be disposed between the light emitting regions P1 of two adjacent sub-pixels P.

By such an arrangement, on one hand, the fixing structure 30 can be used to define the encapsulation layer 40 partially located between the light emitting regions P1 of two adjacent sub-pixels P on the circuit structure layer 20 based on the mechanical locking principle, thereby further improving the encapsulation effect of the encapsulation layer 40.

On the other hand, the fixing structure 30 is located between two adjacent sub-pixels P, and since the portions of the light-emitting functional layer 50 and the cathode layer 60 covering the fixing structure 30 are separated from the portions of the light-emitting functional layer 50 and the cathode layer 60 covering the surrounding area of the fixing structure 30, when two adjacent sub-pixels P display different colors, or one sub-pixel P displays a color, and the other sub-pixel P does not display a color, the electrical signal in the light-emitting functional layer 50 in one sub-pixel P area is not easily transmitted to the light-emitting functional layer 50 in the other sub-pixel P area, thereby being beneficial to improving the problem of poor display effect caused by the fact that two adjacent sub-pixels P share the same light-emitting functional layer and signal crosstalk occurs between the two adjacent sub-pixels P.

In other embodiments, as shown in fig. 22, the peripheral region BB is provided with a fixing structure 30.

By such an arrangement, the fixing structure 30 is utilized to fix the part of the encapsulation layer 40 located in the peripheral region BB on the circuit structure layer 20 based on the mechanical locking principle, thereby facilitating the improvement of the encapsulation effect of the encapsulation layer 40 in the peripheral region BB, and the improvement of the yield of the display panel 100 and the service life of the display panel 100.

In some embodiments, as shown in fig. 24, fig. 25A and fig. 25B, the display panel 100 may further be located on the blocking dam 101 of the peripheral region BB, and the blocking dam 101 surrounds the display region AA. The blocking dam 101 includes a blocking portion 1011 located at the pixel defining layer 80. Wherein, a side of the blocking portion 1011 away from the substrate 10 is provided with a fixing structure 30.

Among them, the blocking dam 101 may be used to block the organic layer 43 from overflowing during the manufacturing process.

The number of the blocking dams 101 is not limited in the present disclosure, and for example, as shown in fig. 24, 25A, and 25B, the display panel 100 includes two blocking dams 101.

As shown in fig. 25A and 25B, when the display panel 100 includes two blocking dams 101, the blocking dam 101 relatively close to the display area AA may include a first blocking portion 1011 located at the pixel defining layer 80, and the blocking dam 101 relatively far from the display area AA may include not only the first blocking portion 1011 located at the pixel defining layer 80 but also a second blocking portion 1012 located at the planarization layer 90.

When the display panel 100 includes the plurality of blocking dams 101 located in the peripheral region BB, the fixing structure 30 may be located on one or more of the plurality of blocking dams 101. Illustratively, as shown in fig. 25A and 25B, each of the blocking dams 101 is provided with a fixing structure 30.

It is to be understood that when the blocking dam 101 is provided with the fixing structures 30, only one fixing structure 30 may be provided on the blocking dam 101, or a plurality of fixing structures 30 may be provided. The number of fixing structures 30 provided on different blocking dams 101 may be the same or different.

Illustratively, as shown in fig. 25A, one securing structure 30 may be provided on each of the blocking dams 101. As shown in fig. 25B, a plurality of fixing structures 30 may be provided on each of the blocking dams 101.

It is to be understood that when a plurality of fixing structures 30 may be provided on each of the blocking dams 101, not only may a plurality of fixing structures 30 be provided on each of the blocking dams 101 in a direction in which the display area AA is directed to the peripheral area BB as shown in fig. 25B, but also a plurality of fixing structures 30 may be provided on each of the blocking dams 101 in an extending direction of the blocking dams 101.

In some embodiments of the present disclosure, by disposing the fixing structure 30 on the blocking dam 101, on one hand, the blocking effect of the organic layer 43 in the encapsulation layer 40 can be improved, and on the other hand, a portion of the encapsulation layer located in the peripheral region BB can be fixed on the pixel defining layer 80 by using the fixing structure 30, so as to improve the encapsulation effect of the encapsulation layer 40, thereby improving the yield of the display panel 100 and the service life of the display panel 100.

In some embodiments, as shown in fig. 24, 25A and 25B, the display panel 100 further includes an anti-crack structure 102 located in the peripheral region BB, the anti-crack structure 102 is far away from the display region AA relative to the blocking dam 101, and a gap is formed between the anti-crack structure 102 and the blocking dam 101.

The pixel defining layer 80 and the planarizing layer 90 are disconnected at the gap to form a trench L in which the fixed structure 30 is disposed.

For example, the crack prevention structure 102 may include at least a filling part 1021 in the planarization layer 90. As shown in fig. 25A and 25B, a plurality of slits 261 are provided at positions of the anti-cracking structure 102 corresponding to the interlayer dielectric layer 26, and the filling portions 1021 are filled in the plurality of slits 261. Therefore, the anti-cracking structure 102 and the interlayer dielectric layer 26 are combined with each other, and cracks are prevented from extending into the display panel in the process of dividing the plurality of display panels.

Some embodiments of the present disclosure, by providing the fixing structure 30 between the anti-cracking structure 102 and the blocking dam 101, on one hand, the fixing structure 30 can be used to limit the encapsulation layer 40 partially located in the trench L on the circuit structure layer 20 based on the mechanical locking principle, thereby being beneficial to further improving the encapsulation effect of the encapsulation layer 40. On the other hand, the fixing structure 30 can be used to block water and oxygen from entering the display area AA, thereby being beneficial to shortening the length of the peripheral area BB of the display panel 100 and realizing a narrow frame design of the display panel 100.

In still other embodiments, as shown in fig. 22, 25A, and 25B, the fixing devices 30 are disposed in both the display area AA and the peripheral area BB.

Thus, by using the fixing structure 30, based on the mechanical locking principle, the part of the encapsulating layer 40 located in the display area AA can be fixed on the circuit structure layer 20, and the part of the encapsulating layer 40 located in the peripheral area BB can be fixed on the circuit structure layer 20, thereby facilitating the improvement of the encapsulating effect of the encapsulating layer 40, the improvement of the yield of the display panel 100, and the service life of the display panel 100.

In some embodiments, as shown in fig. 26-32, the display panel 100 further includes spacers 103. The spacer 103 is located on the side of the pixel defining layer 80 remote from the substrate 10.

The spacers 103 may be used to support a mask, such as a fine metal mask, during evaporation of the light-emitting functional layer 50.

In some examples, as shown in fig. 27 or 31, the spacer 103 includes a first spacer 1031 and a second spacer 1032 that are stacked in a direction perpendicular to the substrate 10 and away from the substrate 10.

In the case that the fixing structure 30 includes the first fixing portion 301 and the second fixing portion 302, the first pad portion 1031 and the first fixing portion 301 are made of the same material and are disposed in the same layer, and the second pad portion 1032 and the second fixing portion 302 are made of the same material and are disposed in the same layer.

It is understood that the "same layer" refers to a layer structure formed by forming a film layer for forming a specific pattern using the same film forming process and then forming a pattern by one patterning process using the same mask plate. Depending on the specific pattern, the single patterning process may include multiple exposure, development or etching processes, and the specific pattern in the formed layer structure may be continuous or discontinuous, and the specific patterns may be at different heights or have different thicknesses.

In some embodiments of the present disclosure, the first spacer portion 1031 and the first fixing portion 301 are made of the same material and are disposed on the same layer, and the second spacer portion 1032 and the second fixing portion 302 are made of the same material and are disposed on the same layer, i.e., the fixing structure 30 and the spacer 103 can be manufactured at the same time, and share a mask plate, so that the fixing structure 30 can be formed without increasing additional cost, thereby improving the packaging effect of the packaging layer 40, improving the yield of the display panel, and prolonging the service life of the display panel.

In some embodiments, as shown in fig. 31, the dimension of the first pad section 1031 in the setting direction is smaller than the dimension of the second pad section 1032 in the setting direction.

In this way, the second spacer portion 1032 in the spacer 103 may form a limited space Q with the pixel defining layer 80, so as to limit a portion of the encapsulation layer 40 on the pixel defining layer 80, further improve the encapsulation effect of the encapsulation layer 40, and improve the yield of the display panel and the service life of the display panel.

In other examples, as shown in fig. 28, 29, and 32, the cross-section of the spacer 103 in a direction perpendicular to the substrate 10 is an inverted trapezoid or a rectangle.

It should be noted that the "inverted trapezoid" herein includes not only a shape of a substantially inverted trapezoid but also a shape similar to an inverted trapezoid in consideration of process conditions. Likewise, "rectangular" includes not only a substantially rectangular shape but also a shape similar to a rectangle in consideration of process conditions.

When the cross section of the fixing structure 30 in the direction perpendicular to the substrate 10 is an inverted trapezoid, and the cross section of the spacer 103 in the direction perpendicular to the substrate 10 is also an inverted trapezoid, the fixing structure 30 and the spacer 103 can be simultaneously manufactured to share a mask, so that the fixing structure 30 can be formed without increasing additional cost, and the encapsulation effect of the encapsulation layer 40 is further improved.

In some embodiments of the present disclosure, when the cross section of the spacer 103 along the direction perpendicular to the substrate 10 is an inverted trapezoid, the side wall of the spacer 103 may be utilized to fix the encapsulation layer 40 on the pixel defining layer 80, so as to further improve the encapsulation effect of the encapsulation layer 40, and improve the yield and the service life of the display device using the display panel 100.

In some embodiments, as shown in fig. 33, the orthogonal projection of the spacer 103 on the substrate 10 is a strip shape, the spacer 103 includes a plurality of extension portions 1033 connected in sequence, and at least two extension portions 1033 in the same spacer 103 have different extension directions.

The number of the extending portions 1033 in the spacer 103 is not limited in the present disclosure, and for example, as shown in fig. 33, the spacer 103 may include three extending portions 1033 connected in sequence.

As shown in fig. 33, "at least two extending portions 1033 in the same spacer 103 extend in different directions", which may be different from each other in the extending directions of the extending portions 1033 in the same spacer 103.

Alternatively, "the extending directions of at least two extending portions 1033 in the same spacer 103 are different", or the extending directions of partial extending portions 1033 in the same spacer 103 may be different, and the extending directions of partial extending portions 1033 may be the same.

In some embodiments of the present disclosure, when the cross section of the spacer 103 in the direction perpendicular to the substrate 10 is an inverted trapezoid, or the spacer 103 includes the first and second spacer portions 1031 and 1032 that are overlapped in the direction perpendicular to the substrate 10 and away from the substrate 10, the spacer 103 includes the extension portions 1033 with different extension directions, and the encapsulation layer can be further fixed from different directions, thereby further improving the encapsulation effect of the encapsulation layer.

In some embodiments, as shown in fig. 33, the display panel 100 includes at least one set of spacers 103, each set of spacers includes at least two spacers 103, and orthographic projections of the at least two spacers 103 on the substrate 10 are parallel to each other.

Wherein, each group of the spacers comprises at least two spacers 103, as shown in fig. 33, each group of the spacers comprises two spacers 103. Alternatively, "each set of spacers comprises at least two spacers 103", it may be that each set of spacers 103 comprises three or more spacers 103.

In some embodiments of the present disclosure, by providing at least one set of spacers, not only the spacers 103 can be used to support the mask used in the evaporation process, but also at least one set of spacers can be used, so that the surface of the display panel before the formation of the encapsulation layer 40 is more uneven, thereby increasing the contact area between the encapsulation layer 40 formed subsequently and the film layer below, increasing the adhesive force between the film layers, and improving the encapsulation effect of the encapsulation layer.

Some embodiments of the present disclosure also provide a manufacturing method of the display panel 100. As shown in fig. 34, the manufacturing method includes:

s100, forming a circuit structure layer 20 on the substrate 10.

And S200, forming a fixed structure 30 on the side of the circuit structure layer 20 far away from the substrate 10. The display panel 100 includes a plurality of sub-pixels P each having a light emitting region P1, and an orthogonal projection of the fixed structure 30 on the substrate 10 is offset from an orthogonal projection of the light emitting region P1 of the plurality of sub-pixels P on the substrate 10. The fixed structure 30 comprises a first end face 31 and a second end face 32 opposite to each other, the first end face 31 being closer to the substrate 10 than the second end face 32. The dimension of the first end face 31 in the setting direction is smaller than the dimension of the second end face 32 in the setting direction. The set direction is at least one direction parallel to the substrate 10.

S300, forming an encapsulation layer 40 covering the fixed structure 30, wherein the encapsulation layer 40 contacts with the sidewall of the fixed structure 30.

In the display panel 100 manufactured by the manufacturing method provided by some embodiments of the present disclosure, the fixing structure 30 is disposed on the circuit structure layer 20, so that the surface of the display panel before the formation of the encapsulation layer 40 is uneven, the contact area between the subsequently formed encapsulation layer 40 and the film layer below the encapsulation layer is increased, and the adhesion between the film layers is increased. And since the dimension of the first end face 31 of the fixing structure 30 in the setting direction is smaller than the dimension of the second end face 32 in the setting direction, a defined space Q may be formed between the portion of the second end face 32 beyond the first end face 31 and the circuit structure layer 20 in the setting direction. The encapsulation layer 40 covers the fixing structure 30 and contacts with the sidewall of the fixing structure 30, so that a part of the encapsulation layer 40 can fall into the limited space Q, and is limited by the fixing structure 30 and the circuit structure layer 20 to form a mortise and tenon joint structure. Therefore, the encapsulation layer 40 is fixed on the circuit structure layer 20 by using the mechanical locking principle, and the encapsulation effect of the encapsulation layer 40 is effectively improved.

In some embodiments, as shown in fig. 35, the step S200 of forming the fixing structure 30 on the side of the circuit structure layer 20 away from the substrate 10 includes:

s210, forming a sacrificial layer 33 on the circuit structure layer 20.

For example, the forming of the sacrificial layer 33 on the circuit structure layer 20 may include a paste process and a pre-bake process. Wherein, the gluing speed in the gluing process can be 1100rpm, and the gluing time is 45 seconds. The temperature of the pre-baking process is 90 ℃ and the time is 300 seconds.

And S220, forming a photoresist layer 34 on one side of the sacrificial layer 33 far away from the substrate 10.

Illustratively, forming the photoresist layer 34 on the side of the sacrificial layer 33 away from the substrate 10 may also include a gumming process and a pre-baking process. Wherein, the gluing speed in the gluing process can be 2300rpm, and the gluing time is 60 seconds. The temperature of the pre-baking process is 90 ℃ and the time is 90 seconds.

S230, the photoresist layer 34 is patterned by an exposure and development process to form the second fixing portion 302.

Wherein, for example, the exposure energy in the exposure process may be 80mJ/cm². The development time may be 15 seconds.

Between the exposure process and the development process, a post-baking process may be further performed, and the post-baking process may be performed at 90 degrees celsius for 90 seconds.

S240, the sacrificial layer 33 is patterned by a developing process to form the first fixing portion 301.

Here, the time of the developing process may be 30 seconds, for example.

For example, before step S240, after step S230, a spin-drying process may be performed at a speed of 500rpm for 10 seconds.

After step S240, the display panel may be dried to avoid the influence of the water vapor on the subsequent light emitting devices.

It is to be noted that, when the fixing structure 30 is prepared and formed by the steps S210 to S240, the spacer 103 may also be prepared at the same time, and the spacer 103 includes the first spacer 1031 and the second spacer 1032 which are overlapped in the direction perpendicular to the substrate 10 and away from the substrate 10.

The first spacer 1031 is formed at the same time as the first fixing portion 301, and the second spacer 1032 is formed at the same time as the second fixing portion 302.

In this way, the fixing structure 30 and the spacer 103 are formed simultaneously, and share the mask plate, so that the fixing structure 30 can be formed without increasing additional cost, thereby improving the packaging effect of the packaging layer 40, and improving the yield of the display panel 100 and the service life of the display panel 100.

As shown in fig. 36, some embodiments of the present disclosure also provide a display device 200. The display device 200 includes the display panel 100 according to any of the above embodiments.

The display device 200 may be any component having a display function, such as a television, a digital camera, a mobile phone, a watch, a tablet computer, a notebook computer, and a navigator.

The display device 200 according to the present disclosure can achieve the same advantages as those achieved by the display panel 100 according to any of the embodiments described above.

The above description is only for the specific embodiments of the present disclosure, but the scope of the present disclosure is not limited thereto, and any person skilled in the art will appreciate that changes or substitutions within the technical scope of the present disclosure are included in the scope of the present disclosure. Therefore, the protection scope of the present disclosure shall be subject to the protection scope of the claims.

Claims (16)

1. A display panel including a plurality of sub-pixels each having a light emitting area, the display panel comprising:

a substrate;

a circuit structure layer disposed on the substrate;

the fixing structure is arranged on one side, far away from the substrate, of the circuit structure layer; the orthographic projection of the fixed structure on the substrate and the orthographic projection of the light emitting areas of the plurality of sub-pixels on the substrate are mutually staggered; the fixed structure comprises a first end face and a second end face which are opposite, and the first end face is closer to the substrate than the second end face; the size of the first end face in a set direction is smaller than that of the second end face in the set direction; the set direction is at least one direction parallel to the substrate;

and the packaging layer covers the fixed structure and is in contact with the side wall of the fixed structure.

2. The display panel according to claim 1, characterized by further comprising:

the light-emitting functional layer is positioned between the circuit structure layer and the packaging layer;

a cathode layer located between the light emitting functional layer and the encapsulation layer;

wherein the light emitting functional layer and the cathode layer cover at least a part of the fixing structure, and of the light emitting functional layer and the cathode layer, a part covering the fixing structure is separated from a part covering a surrounding area of the fixing structure.

3. The display panel according to claim 1, wherein the fixing structure includes a first fixing portion and a second fixing portion which are stacked in a direction perpendicular to and away from the substrate; the surface of the first fixed part close to the substrate is the first end surface, and the surface of the second fixed part far away from the substrate is the second end surface; alternatively, the first and second electrodes may be,

the cross section of the fixed structure along the direction vertical to the substrate is in an inverted trapezoid shape.

4. The display panel according to claim 1, further comprising:

a pixel defining layer between the circuit structure layer and the encapsulation layer; the fixed structure is located on a side of the pixel defining layer away from the substrate.

5. The display panel according to claim 4, further comprising:

an anode layer between the pixel defining layer and the circuit structure layer, the anode layer including an auxiliary conductive pattern;

a cathode layer positioned on one side of the pixel defining layer far away from the circuit structure layer;

wherein the pixel defining layer includes a first opening through which the cathode layer is in contact with the auxiliary conductive pattern.

6. The display panel according to claim 4, further comprising:

a cathode layer positioned on one side of the pixel defining layer far away from the circuit structure layer;

a conductive connection pattern located between the cathode layer and the pixel defining layer, and an orthographic projection of the conductive connection pattern on the substrate and an orthographic projection of the light emitting areas of the plurality of sub-pixels on the substrate are staggered with each other;

wherein the pixel defining layer comprises a first opening, at least a portion of the conductive connection pattern being located within the first opening; the cathode layer is in contact with the conductive connection pattern at the first opening.

7. The display panel according to claim 1, further comprising:

a pixel defining layer between the circuit structure layer and the encapsulation layer;

wherein the pixel defining layer comprises a first opening, an orthographic projection of the fixed structure on the substrate being located inside an orthographic projection of the first opening on the substrate.

8. The display panel according to claim 7, wherein the second end face is higher than a surface of the pixel defining layer away from the substrate in a direction perpendicular to the substrate.

9. The display panel according to claim 7, further comprising:

a planarization layer between the pixel defining layer and the circuit structure layer;

wherein the planarization layer comprises a second opening, an orthographic projection of the second opening on the substrate at least partially overlaps with an orthographic projection of the first opening on the substrate, and an orthographic projection of the fixed structure on the substrate is located inside an orthographic projection of the second opening on the substrate.

10. The display panel according to any one of claims 1 to 9, wherein the display panel includes a display area and a peripheral area surrounding the display area, the display area being provided with the fixing structure;

at least one fixing structure is arranged between the light emitting areas of the two adjacent sub-pixels.

11. The display panel according to any one of claims 1 to 9, wherein the display panel includes a display region and a peripheral region surrounding the display region; the peripheral area is provided with the fixing structure;

the display panel further comprises a pixel defining layer located between the circuit structure layer and the encapsulation layer;

the display panel further includes a blocking dam positioned at the peripheral region, the blocking dam surrounding the display region; the blocking dam includes a first blocking portion at the pixel defining layer;

wherein, one side of the first barrier part far away from the substrate is provided with the fixing structure.

12. The display panel according to claim 11,

the display panel further comprises a planarization layer between the circuit structure layer and the pixel defining layer;

the display panel further comprises an anti-cracking structure positioned on the peripheral region, the anti-cracking structure is far away from the display region relative to the blocking dam, and a gap is formed between the anti-cracking structure and the blocking dam;

the pixel defining layer and the planarization layer are disconnected at the gap to form a groove, and the fixing structure is arranged in the groove.

13. The display panel according to any one of claims 1 to 9, further comprising:

a pixel defining layer between the circuit structure layer and the encapsulation layer;

the spacer is positioned on one side of the pixel defining layer far away from the substrate; the spacer includes a first spacer portion and a second spacer portion that are stacked in a direction perpendicular to the substrate and away from the substrate;

the first spacer part and the first fixing part are made of the same material and are arranged in the same layer, and the second spacer part and the second fixing part are made of the same material and are arranged in the same layer.

14. The display panel according to any one of claims 1 to 9, further comprising:

a pixel defining layer between the circuit structure layer and the encapsulation layer;

the spacer is positioned on one side of the pixel defining layer far away from the substrate; the section of the spacer along the direction vertical to the substrate is in an inverted trapezoid shape or a rectangular shape.

15. The display panel according to claim 14, wherein an orthographic projection of the spacer on the substrate is a strip shape, the spacer comprises a plurality of extension portions connected in sequence, and at least two extension portions in the same spacer have different extension directions.

16. A display device, comprising:

the display panel according to any one of claims 1 to 15.

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