CN216747967U - Chip reliability testing system with automatic real-time monitoring function - Google Patents
Chip reliability testing system with automatic real-time monitoring function Download PDFInfo
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- CN216747967U CN216747967U CN202120878307.7U CN202120878307U CN216747967U CN 216747967 U CN216747967 U CN 216747967U CN 202120878307 U CN202120878307 U CN 202120878307U CN 216747967 U CN216747967 U CN 216747967U
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Abstract
The utility model belongs to the technical field of the electron, be a chip reliability test system of automatic real-time supervision function particularly, the system includes chip monitoring device, including a heating chamber, a heating chamber side is equipped with the punch hole, is equipped with partial placing plate in the heating chamber, and placing plate includes circuit board and control panel, and the control panel passes the punch hole and communicates with the external world, and the circuit board sets up in the heating chamber; the monitoring component is electrically connected with the control panel and used for monitoring the chip to be tested, the controller comprises a data processing module and a data analysis module, the data processing module is used for collecting and storing data from the circuit board, and the data analysis module is used for analyzing and calculating the data of the data processing module and comparing the data with the data of the data processing module. The utility model discloses an increase the real-time supervision in the experimentation, if can react out at once from the monitoring result unusually, can pause test this moment, intervene the analysis, and do not need to wait for reanalysis after the test finishes.
Description
Technical Field
The utility model belongs to the technical field of the electron, be an automatic change real-time supervision function's chip reliability test system particularly.
Background
After the chip is processed by a wafer factory and a seal test factory, a series of reliability tests must be performed on the chip to verify the reliability, the usability, the service life and the like of the chip, wherein the reliability tests include a common high temperature aging test (HTOL), a high temperature high humidity high pressure test (HAST) and the like, and the current reliability test scheme mainly comprises three parts: 1. a power supply for supplying power to the chip; 2. providing an environmental test chamber for reliability testing; 3. reliability test of loaded chips PCB board (generally for high temperature burn-in reliability test, at least 77 chips are made per batch). After the environment is built, the whole PCB can be put under the power supply of a power supply and work in a high-temperature environment until the reliability test is finished (generally, the initial examination is 168 hours, the complete examination is 1000 hours, the application scenes of the chips are different, and the examination time is also different), the chip for performing the reliability test is tested and verified after the test is finished, if the chip fails after the test and verification, the reliability test fails, the reason for the failure needs to be found, and then the reliability test is performed again.
It follows that the conventional solution has a significant drawback: in the reliability test process, there is no way to perform real-time online monitoring on each chip being tested, so that test verification and confirmation can be performed only after the test is finished, if the test fails, a large amount of time is wasted, and the time on the chip is seriously delayed. There is also a fatal disadvantage: without real-time monitoring, it is impossible to determine whether the chip is working, for example, in a high-temperature environment, the power supply pin of the chip is in poor contact or open circuit, so that the open-circuit chips are only subjected to a high-temperature storage test, but are not subjected to a high-temperature aging test, and even if the test certificate passes after the 1000-hour test is finished, the reliability of the chip cannot be guaranteed, and the process is not controlled, so that the test purpose of the chip cannot be achieved.
SUMMERY OF THE UTILITY MODEL
In order to overcome the not enough that exists among the prior art, the utility model provides an automatic change chip reliability testing system of real-time supervision function has solved and has not ensured that the chip is in normal work, consumes monitoring time's problem, has ensured reliability testing's quality and purpose.
The utility model provides an automatic change chip reliability test system of real-time supervision function, the system includes:
the chip monitoring device comprises a heating cavity, wherein a plurality of through hole holes are formed in one side surface of the heating cavity, a part of placing plate is arranged in the heating cavity, the placing plate comprises a circuit board and a control board, the control board penetrates through the through hole holes to be communicated with the outside, the circuit board is arranged in the heating cavity, and a placing groove for containing a chip to be detected is formed in the circuit board;
the monitoring component is electrically connected with the control board and is used for monitoring the chip to be detected; the monitoring assembly further comprises a controller, the controller comprises a data processing module and a data analysis module, the data processing module is used for collecting and storing data from the circuit board, and the data analysis module is used for analyzing and calculating the data of the data processing module and comparing the data with the data of the data processing module.
Preferably, the controller further comprises a data generating module for generating a plurality of groups of monitoring data arranged in sequence, the monitoring data sequentially corresponds to the data of the circuit board, and the data processing module collects and stores the monitoring data to obtain a processing result; and the data analysis module monitors the monitoring data of the peer group to obtain an analysis result, and the data analysis module compares the processing result with the analysis result.
Preferably, the data processing module is divided into a plurality of sub-data processing modules, each set of sub-data processing module generates a corresponding sub-processing result after the operation is finished, the sub-processing result is stored in a corresponding storage area of the sub-data processing module, and the storage area is matched with the number of the monitoring data;
the data analysis module is divided into a plurality of sub-data analysis modules, each sub-data analysis module generates a corresponding sub-analysis result after operation is finished, the sub-analysis results are stored in a corresponding storage area of the sub-data analysis module, and the storage area is matched with the number of the monitoring data;
the sub-data analysis module compares the sub-processing results with the sub-analysis results.
Preferably, if the sub-processing result is inconsistent with the sub-analysis result, the data analysis module stops processing and outputs the sub-processing result and the monitoring data corresponding to the sub-analysis result.
Preferably, the controller sets a first flag number to indicate whether the comparison is completed, and the controller determines whether the data generation module continues to generate the monitoring data by reading the first flag number.
Preferably, the controller indicates whether the processing result and the analysis result are consistent by setting the second flag number, and the controller determines whether the data analysis module continues to receive the monitoring data by reading the second flag number.
Preferably, the control panel electricity is connected with the monitoring subassembly, the monitoring subassembly includes monitoring terminal, monitoring terminal passes through the control panel, gathers the chip temperature of circuit board.
Preferably, the circuit board abuts against the side face of the heating cavity where the board penetrating hole is located, and the control board extends out of the abutting end of the circuit board through the board penetrating hole.
Preferably, the system further comprises a temperature control system, wherein the temperature control system comprises a temperature module, a humidity module and a control module; the temperature module receives a temperature adjusting instruction of the control module and adjusts the temperature of the heating cavity; the humidity module receives the humidity adjusting instruction of the control module and adjusts the humidity of the heating cavity.
The beneficial effects of the utility model are that at least:
(1) the utility model discloses an increase the real-time supervision among the experimentation, ensure that every chip in the experiment is all in normal work, if can follow the monitoring result and react out at once unusually, can pause test this moment, intervene the analysis, and need not wait for reanalysis after experimental completion to also can save a large amount of time and cost.
(2) The utility model discloses a data processing module and data analysis module produce the stage nature operation result behind the operation monitoring data, and the stage nature operation result is saved the storage area who corresponds respectively, contrasts storage area's processing result and analysis result one by one, carries out the contrast that more refines to different monitoring data (voltage, electric current, electric leakage, frequency, digital register etc.), is convenient for go on troubleshooting and pertinence modification to the problem.
(3) The utility model discloses a carry out the size to circuit board, control panel connection side with the design of wearing the board hole adaptation, specifically show for the side butt in the heating chamber at circuit board and wearing the board hole place, the control panel stretches out from the butt end of circuit board via wearing the board hole, the size of circuit board and heating chamber butt side is greater than the size that control panel and hot plate are connected the side, the control panel stretches out the back, the circuit board is in heating intracavity portion, has avoided the circuit board from the condition of wearing board hole roll-off.
Drawings
FIG. 1 is a schematic view of a chip detection device according to the present invention;
FIG. 2 is a structural diagram of the placing board of the present invention;
fig. 3 is a schematic view of the connection between the housing and the monitoring assembly according to the present invention;
fig. 4 is a schematic view of the temperature control system of the present invention;
fig. 5 is a schematic diagram of the controller of the present invention.
Description of reference numerals:
100-chip monitoring device; 20-placing a plate; 21-a circuit board; 22-placing the groove; 23-a control panel; 30-a monitoring component; 31-a monitoring terminal;
110-a heating chamber; 117-perforation holes;
120-a housing; 121-threading holes;
130-a temperature control system; 134-a control module; 135-temperature module; 136-a humidity module;
200. a controller; 210. a data processing module; 220. a data analysis module; 230. and a data generation module.
Detailed Description
In order to facilitate understanding of the invention, the invention will be described more fully hereinafter with reference to the accompanying drawings, in which several embodiments of the invention are shown, but which can be embodied in many different forms and are not limited to the embodiments described herein, but on the contrary are provided for the purpose of making the disclosure more thorough and complete.
Unless defined otherwise, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this invention belongs; the terminology used herein in the description of the invention is for the purpose of describing particular embodiments only and is not intended to be limiting of the invention; as used herein, the term "and/or" includes any and all combinations of one or more of the associated listed items.
It should be noted that the terms "first," "second," and the like in the description and claims of the present invention and in the drawings described above are used for distinguishing between similar elements and not necessarily for describing a particular sequential or chronological order. It is to be understood that the data so used is interchangeable under appropriate circumstances such that the embodiments of the invention described herein are capable of operation in sequences other than those illustrated or otherwise described herein. Furthermore, the terms "comprises," "comprising," and "having," and any variations thereof, are intended to cover a non-exclusive inclusion, such that a process, method, system, article, or apparatus that comprises a list of steps or elements is not necessarily limited to those steps or elements expressly listed, but may include other steps or elements not expressly listed or inherent to such process, method, article, or apparatus.
The utility model provides an automatic change chip real-time supervision system and application method, wherein, the monitoring system of chip is used for testing the performance of the chip that awaits measuring, and the application method of chip is used for testing test system, and test system and application method mutually cooperate, support each other. The chip to be tested is a common semiconductor chip.
Combine fig. 1, fig. 2, the utility model discloses an automatic change chip reliability test system of real-time supervision function, include: a chip monitoring device 100 and a monitoring assembly 30.
Specifically, the chip monitoring device 100 includes a heating cavity 110, a plurality of through holes 117 are formed in one side of the heating cavity 110, a partial placing plate 20 is disposed in the heating cavity 110, the placing plate 20 includes a circuit board 21 and a control board 23, the control board 23 passes through the through holes 117 and is communicated with the outside, the circuit board 21 is disposed in the heating cavity 110, and a placing groove 22 for accommodating a chip to be tested is formed in the circuit board 21. Preferably, the circuit board 21 abuts against the side of the heating cavity 110 where the through-board hole 117 is located, and the control board 23 protrudes from the abutting end of the circuit board 21 through the through-board hole 117. Through the design of carrying out the adaptation with wear plate hole 117 to the size of circuit board 21, control panel 23 connection side, specifically show that circuit board 21 and the side butt of the heating chamber 110 that wears plate hole 117 place, control panel 23 stretches out from the butt end of circuit board 21 via wearing plate hole 117, the size of circuit board 21 and heating chamber 110 butt side is greater than the size of control panel 23 and the heating plate connection side, control panel 23 stretches out the back, and circuit board 21 is in inside the heating chamber 110, has avoided the condition of circuit board 21 from wearing plate hole 117 roll-off. The present apparatus includes a heating chamber 110 and a housing 120. A gap is formed between the heating cavity 110 and the housing 120, the heating cavity 110 is fixedly arranged in the housing 120, and the gap enables an air passage to be formed between the heating cavity 110 and the housing 120, so that air flow can conveniently flow between the heating cavity 110 and the housing 120, and heat can be effectively dissipated. Preferably, the inner layer of the housing 120 is provided with a thermal insulation layer to prevent heat from being scattered when not necessary. Referring to fig. 3 and 4, the temperature control system 130 includes a temperature module 135, a humidity module 136, and a control module 134, and the control module 134 includes a console disposed opposite to the upper cover plate; the temperature module 135 receives a temperature adjustment instruction of the control module 134 to adjust the temperature of the heating cavity 110; the humidity module 136 receives the humidity adjustment instruction from the control module 134 and adjusts the humidity of the heating chamber 110. Specifically, one or more devices of a heating pipe, a temperature sensor, a humidity sensor, a water tank and a water pump are arranged between the gap between the housing 120 and the heating cavity 110, and are matched with each other to adjust the temperature and humidity in the heating cavity 110, so that the temperature and humidity in the heating cavity 110 are constant. Through temperature control system 130 control heating chamber 110's temperature, and then change the temperature environment who bears the weight of the circuit board of chip, can place the circuit board that will need the test in heating chamber 110 through putting the thing board inside, can place the control panel that need not the test and easily receive the temperature influence in heating chamber 110 through wearing the diaphragm orifice 117 again outside, avoided the influence of high temperature to the control panel among the test procedure. In addition, the chip monitoring device 100 includes a box door, and a transparent observation window is disposed in the middle area of the box door for observing the state of the chip to be detected in the heating cavity 110, so that when the constant temperature experiment box works, the user can clearly observe the chip in the experiment box (for example, an LED lamp matched with each chip to be detected is disposed on the circuit board 21, and the chip abnormality of the observer is prompted by the lighting of the LED lamp).
As shown in fig. 3, the control board 23 is electrically connected to the monitoring assembly 30, the monitoring assembly 30 includes a monitoring terminal 31, and the monitoring terminal 31 collects the chip temperature of the circuit board 21 through the control board 23. The monitoring component 30 is electrically connected with the control panel and is used for monitoring the chip to be detected; the monitoring assembly 30 further includes a controller 200, the controller 200 including a data processing module 210 and a data analysis module 220, the data processing module 210 for collecting and storing data from the circuit board, and the data analysis module 220 for analyzing and comparing data of the data processing module 210 with data of the data processing module 210. The data processing module 210 and the data analysis module 220 generate staged operation results after the monitoring data are operated, the staged operation results are respectively stored in the corresponding storage regions, the processing results and the analysis results of the storage regions are compared one by one, and more detailed comparison is performed on different monitoring data (voltage, current, electric leakage, frequency, digital registers and the like), so that problems can be conveniently checked and pertinently modified.
Preferably, as shown in fig. 5, the controller 200 further includes a data generating module 230, configured to generate multiple sets of monitoring data arranged in sequence, where the monitoring data sequentially corresponds to data of the circuit board, and the data processing module 210 collects and stores the monitoring data to obtain a processing result; the data analysis module 220 monitors the peer group monitoring data to obtain an analysis result, and the data analysis module 220 compares the processing result with the analysis result. The data generating module 230 generates a plurality of sets of monitoring data (voltage, current, leakage, frequency, digital registers, etc.) corresponding to the chip, provides the sets of monitoring data to the data processing module 210 and the data analyzing module 220, compares the processing result with the analyzing result, and automatically performs sequential testing and comparison on the monitoring data by the system without human intervention, thus being simple and efficient. Be different from among the prior art, the reliability test is to all chips do the overall monitoring, and the chip reliability test system of the automatic real-time supervision function of this patent can carry out real-time supervision to the reliability of every chip on circuit board 21, and one of them chip is unusual, through the LED lamp scintillation rather than matching, the suggestion observer this chip is unusual.
Preferably, the data processing module 210 is divided into a plurality of sub-data processing module 210, each set of sub-data processing module 210 generates a corresponding sub-processing result after the operation is finished, the sub-processing result is stored in a corresponding storage area of the sub-data processing module 210, and the storage area is matched with the number of the monitoring data;
the data analysis module 220 is divided into a plurality of sub-data analysis modules, each group of sub-data analysis modules generates corresponding sub-analysis results after operation is finished, the sub-analysis results are stored in corresponding storage areas of the sub-data analysis modules, and the storage areas are matched with the numbers of the monitoring data;
the sub data analysis module compares the sub processing result with the sub analysis result.
Preferably, if the sub-processing result is inconsistent with the sub-analysis result, the data analysis module 220 stops processing and outputs the monitoring data corresponding to the sub-processing result and the sub-analysis result.
Preferably, the controller 200 sets the first flag number to indicate whether the comparison is completed, and the controller 200 determines whether the data generation module 230 continues to generate the monitoring data by reading the first flag number.
Preferably, the controller 200 indicates whether the processing result and the analysis result are consistent by setting a second flag number, and the controller 200 determines whether the data analysis module 220 continues to receive the monitoring data by reading the second flag number.
The utility model discloses an increase the real-time supervision among the experimentation, ensure that every chip in the experiment is all in normal work, if can follow the monitoring result and react out at once unusually, can pause test this moment, intervene the analysis, and need not wait for reanalysis after experimental completion to also can save a large amount of time and cost.
The above-mentioned embodiments only express a certain implementation manner of the present invention, and the description thereof is specific and detailed, but not to be construed as limiting the scope of the present invention; it should be noted that, for those skilled in the art, without departing from the concept of the present invention, several variations and modifications can be made, which all fall within the protection scope of the present invention; therefore, the protection scope of the present invention should be subject to the appended claims.
Claims (9)
1. A chip reliability test system with automatic real-time monitoring function is characterized by comprising:
the chip monitoring device comprises a heating cavity, wherein a plurality of through hole holes are formed in one side surface of the heating cavity, a part of placing plate is arranged in the heating cavity, the placing plate comprises a circuit board and a control board, the control board penetrates through the through hole holes to be communicated with the outside, the circuit board is arranged in the heating cavity, and a placing groove for containing a chip to be detected is formed in the circuit board;
the monitoring assembly is electrically connected with the control board and is used for monitoring the chip to be detected; the monitoring assembly further comprises a controller, the controller comprises a data processing module and a data analysis module, the data processing module is used for collecting and storing data from the circuit board, and the data analysis module is used for analyzing and calculating the data of the data processing module and comparing the data with the data of the data processing module.
2. The system for testing the reliability of the chip with the automatic real-time monitoring function according to claim 1, wherein the controller further comprises a data generating module for generating a plurality of sets of monitoring data arranged in sequence, the monitoring data sequentially corresponds to the data of the circuit board, and the data processing module collects and stores the monitoring data to obtain a processing result; and the data analysis module monitors the monitoring data of the peer group to obtain an analysis result, and the data analysis module compares the processing result with the analysis result.
3. The system for testing the reliability of the chip with the automatic real-time monitoring function according to claim 2, wherein the data processing module is divided into a plurality of sub-data processing modules, each sub-data processing module generates a corresponding sub-processing result after operation is finished, the sub-processing result is stored in a corresponding storage area of the sub-data processing module, and the storage area is matched with the number of the monitoring data;
the data analysis module is divided into a plurality of sub-data analysis modules, each group of sub-data analysis modules generates corresponding sub-analysis results after operation is finished, the sub-analysis results are stored in corresponding storage areas of the sub-data analysis modules, and the storage areas are matched with the numbers of the monitoring data;
the sub data analysis module compares the sub processing result with the sub analysis result.
4. The system of claim 3, wherein if the sub-processing result is inconsistent with the sub-analysis result, the data analysis module stops processing and outputs the sub-processing result and the monitoring data corresponding to the sub-analysis result.
5. The system as claimed in claim 4, wherein the controller sets a first flag number to indicate whether the comparison is completed, and the controller determines whether the data generation module continues to generate the monitoring data by reading the first flag number.
6. The system as claimed in claim 5, wherein the controller indicates whether the processing result and the analysis result are consistent by setting a second flag number, and the controller determines whether the data analysis module continues to receive the monitoring data by reading the second flag number.
7. The system for testing the reliability of the chip with the automatic real-time monitoring function according to claim 6, wherein the control board is electrically connected with a monitoring component, the monitoring component comprises a monitoring terminal, and the monitoring terminal acquires the temperature of the chip of the circuit board through the control board.
8. The system according to claim 7, wherein the circuit board abuts against a side surface of the heating cavity where the through hole is located, and the control board extends out from an abutting end of the circuit board through the through hole.
9. The system according to claim 8, further comprising a temperature control system, wherein the temperature control system comprises a temperature module, a humidity module, and a control module; the temperature module receives a temperature adjusting instruction of the control module and adjusts the temperature of the heating cavity; the humidity module receives the humidity adjusting instruction of the control module and adjusts the humidity of the heating cavity.
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| CN202120878307.7U CN216747967U (en) | 2021-04-26 | 2021-04-26 | Chip reliability testing system with automatic real-time monitoring function |
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| CN202120878307.7U CN216747967U (en) | 2021-04-26 | 2021-04-26 | Chip reliability testing system with automatic real-time monitoring function |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN115128437A (en) * | 2022-08-29 | 2022-09-30 | 成都爱旗科技有限公司 | High-temperature aging test system and high-temperature aging test method |
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Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN115128437A (en) * | 2022-08-29 | 2022-09-30 | 成都爱旗科技有限公司 | High-temperature aging test system and high-temperature aging test method |
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