CN216744983U - Semiconductor refrigerator and semiconductor refrigerator with temperature probe - Google Patents
Semiconductor refrigerator and semiconductor refrigerator with temperature probe Download PDFInfo
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- CN216744983U CN216744983U CN202122827407.XU CN202122827407U CN216744983U CN 216744983 U CN216744983 U CN 216744983U CN 202122827407 U CN202122827407 U CN 202122827407U CN 216744983 U CN216744983 U CN 216744983U
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Abstract
The utility model discloses a semiconductor refrigerator, aiming at ensuring the detection precision of a temperature probe, and the technical scheme is as follows: a semiconductor refrigerator comprises a body, wherein the surface of the body is provided with a first metal pattern and a second metal pattern, and an external temperature probe and an external device for exchanging heat with the body are respectively arranged on the first metal pattern and the second metal pattern; still provide a semiconductor cooler with temperature probe, belong to semiconductor refrigeration technical field.
Description
Technical Field
The utility model belongs to the technical field of semiconductor refrigeration, and particularly relates to a semiconductor refrigerator and a semiconductor refrigerator with a temperature probe.
Background
A semiconductor cooler (Thermoelectric cooler) is a device for producing cold by using the thermo-electric effect of a semiconductor, which is also called a Thermoelectric cooler, abbreviated as TEC, and connects two different metals by a conductor, and when a direct current is applied, the temperature at one contact point is reduced and the temperature at the other contact point is increased.
The miniature semiconductor refrigerator is widely used for optical communication refrigerating devices because laser communication has high stability requirements on the working temperature of the devices, and the laser wavelength drift can be caused by temperature fluctuation exceeding 0.1 ℃, so that the optical output power and the conversion efficiency are influenced.
When the semiconductor refrigerator is used, the semiconductor refrigerator can be matched with a temperature detection circuit to realize accurate constant temperature control, and is used for constant temperature of a laser, and the temperature needs to be controlled within the error of +/-0.1 ℃. When the thermoelectric module is used, a user needs to additionally install a temperature probe, such as a platinum thermistor and an NTC (negative temperature coefficient) on the ceramic surface of the cold end of the TEC.
The temperature probe is mounted in a mode of gluing, welding, physical pressing and the like; the problems that the operation difficulty is high, the application operation is complex, the consistency is poor, signals are not easy to process by software at the later stage and the like exist when the temperature probe is added at the application end.
In the prior art, as shown in a device for emitting an optical signal disclosed in the utility model publication No. CN211456208U, the device includes a TEC, a thermistor, a laser, and a laser heat sink substrate, and as can be seen from the specification and the drawings, the thermistor is adhered to a metal pattern on the surface of the TEC through a conductive adhesive, the laser is adhered to the laser heat sink substrate, and the laser heat sink substrate is adhered to the metal pattern on the surface of the TEC.
The technical scheme has the defects that the laser heat sink substrate and the thermistor are both adhered to the metal pattern on the surface of the TEC, and if the thermistor is subjected to electrical interference from the laser heat sink substrate, the accuracy of temperature detection of the thermistor can be influenced, so that the temperature control precision is influenced.
SUMMERY OF THE UTILITY MODEL
The utility model mainly aims to provide a semiconductor refrigerator, aiming at ensuring the detection precision of a temperature probe; the utility model also provides a semiconductor refrigerator with the temperature probe.
According to a first aspect of the present invention, there is provided a semiconductor refrigerator, comprising a body, a first metal pattern and a second metal pattern are provided on a surface of the body, and a peripheral temperature probe and a peripheral device for exchanging heat with the body are respectively provided on the first metal pattern and the second metal pattern.
In a specific embodiment of the present invention, the number of the first metal patterns is set according to an installation manner of the external temperature probe.
In a specific embodiment of the present invention, the number of the first metal patterns is 1, and two opposite ends of the external temperature probe are terminals, wherein one of the terminals is disposed on the first metal pattern.
In a specific embodiment of the present invention, the number of the first metal patterns is 2, and two opposite ends of the external temperature probe are terminals, which are respectively connected to the 2 first metal patterns.
In a specific embodiment of the present invention, the first metal pattern and the second metal pattern are formed by electroplating, evaporation or sputtering.
In a specific embodiment of the present invention, the surfaces of the first metal pattern and the second metal pattern are provided with a metal plating layer.
The utility model also provides a semiconductor refrigerator with the temperature probe, which comprises the semiconductor refrigerator as described above, and further comprises a first temperature probe, wherein two opposite ends of the first temperature probe are terminals, and one of the terminals is arranged on the first metal pattern;
the first metal pattern is connected with the first gold wire, and the second metal pattern is connected with the other wiring end of the first temperature probe.
In a specific embodiment of the present invention, a third metal pattern is disposed on a terminal of the first temperature probe connected to the second gold wire, and the second gold wire is connected to the third metal pattern.
In a particular embodiment of the utility model, said first temperature probe is welded or glued to said first metal pattern.
The utility model also provides another semiconductor refrigerator with a temperature probe, which comprises the semiconductor refrigerator and a second temperature probe, wherein two opposite ends of the second temperature probe are terminals and are respectively connected with 2 first metal patterns;
the metal pattern structure further comprises a third gold wire and a fourth gold wire, wherein the third gold wire and the fourth gold wire are respectively connected with the 2 first metal patterns.
In a specific embodiment of the present invention, the terminals of the second temperature probe are welded or bonded to 2 of the first metal patterns, respectively.
One of the above technical solutions of the present invention has at least one of the following advantages or beneficial effects:
in the utility model, the first metal pattern and the second metal pattern are arranged on the surface of the body to respectively mount the external temperature probe and the external device, so that the external temperature probe and the external device are arranged in a partition manner, the electric interference between the external temperature probe and the external device is avoided, and the detection precision of the external temperature probe is ensured; meanwhile, the installation mode is used for installing the external temperature probe and the external device, so that the installation operation is simpler and the installation stability is higher on the basis of not influencing the heat conduction performance.
Drawings
The utility model is further described below with reference to the accompanying drawings and examples;
FIG. 1 is a structural view of embodiment 1 of the present invention;
FIG. 2 is a structural view of embodiment 2 of the present invention;
FIG. 3 is a structural view of embodiment 3 of the present invention;
fig. 4 is a structural diagram of embodiment 4 of the present invention.
Detailed Description
Reference will now be made in detail to embodiments of the present invention, examples of which are illustrated in the accompanying drawings, wherein like reference numerals refer to the same or similar elements or elements having the same or similar functions throughout. The embodiments described below with reference to the accompanying drawings are illustrative only for the purpose of explaining the present invention, and are not to be construed as limiting the present invention.
The following disclosure provides many different embodiments, or examples, for implementing different aspects of the utility model.
Example 1
Referring to fig. 1, the semiconductor refrigerator comprises a body 1, wherein a first metal pattern 2 and a second metal pattern 3 are arranged on the surface of the body 1, and an external temperature probe and an external device which exchanges heat with the body 1 are respectively arranged on the first metal pattern 2 and the second metal pattern 3.
In practical application, the first metal pattern 2 and the second metal pattern 3 are arranged on the surface of the body 1 to respectively mount an external temperature probe and an external device, so that the external temperature probe and the external device are arranged in a partition manner, electrical interference between the external temperature probe and the external device is avoided, and the detection precision of the external temperature probe is ensured; meanwhile, the installation mode is used for installing the external temperature probe and the external device, so that the installation operation is simpler and the installation stability is higher on the basis of not influencing the heat conduction performance.
The temperature probe, i.e., the temperature sensor, is externally arranged, but the embodiment is not limited thereto.
In this embodiment, the number of the first metal patterns 2 is set according to the mounting method of the external temperature probes, which is as follows: wire-bonding process, SMT process, etc.
The mounting modes of the peripheral temperature probes are different, the number of the required first metal patterns 2 is also different, as a specific implementation of the embodiment, the number of the first metal patterns 2 is 1, the two opposite ends of the peripheral temperature probes are terminals, one of the terminals is arranged on the first metal patterns 2, the mode is suitable for a wire-bonding process, and only one of the terminals of the peripheral temperature probes needs to be mounted on the body 1 by the process;
specifically, the first metal pattern 2 and the second metal pattern 3 are formed by plating, evaporation, or sputtering.
In practical application, when an external temperature probe and an external device are installed on the body 1 of the semiconductor refrigerator, the external temperature probe and the external device are generally installed in a welding or bonding mode;
preferably, the surfaces of the first metal pattern 2 and the second metal pattern 3 are provided with metal coatings, such as gold-plated layer, tin-plated layer or nickel-plated layer, etc., which is not limited in this embodiment, and can effectively improve the welding performance of the first metal pattern 2 and the second metal pattern 3, so as to facilitate the welding of an external temperature probe and an external device on the body 1; meanwhile, the heat-conducting performance of the first metal pattern 2 and the second metal pattern 3 can be improved, and the normal operation of the semiconductor refrigerator and the detection precision of an external temperature probe are ensured.
In this embodiment, the semiconductor refrigerator includes a cold end and a hot end, and the first metal pattern 2 and the second metal pattern 3 are disposed on a surface of the cold end or a surface of the hot end at the same time, which is not limited in this embodiment.
Example 2
Referring to fig. 2, the difference from embodiment 1 is: the number of the first metal patterns 2 is 2, the two opposite ends of the external temperature probe are wiring terminals which are respectively connected with the 2 first metal patterns 2, the method is suitable for an SMT process, the external temperature probe is installed in the process, and the wiring terminals of the external temperature probe are in contact with the body 1 when the external temperature probe is in a side-lying state.
Specifically, the first metal patterns 2 are provided with an extension part, and an external temperature probe is matched with the extension part.
Example 3
Referring to fig. 3, a semiconductor cooler with temperature probes comprises a semiconductor cooler a as described in embodiment 1, and further comprises a first temperature probe 4, wherein two opposite ends of the first temperature probe 4 are terminals, and one of the terminals is disposed on the first metal pattern 2;
the first metal pattern 2 is connected with the first gold wire a, and the second metal pattern 4 is connected with the second metal pattern;
specifically, the first gold wire a and the second gold wire b are connected with an external signal receiving circuit and used for outputting impedance signals of the first temperature probe 4;
the first temperature probe 4 is a temperature sensor, which is not limited in this embodiment.
Preferably, a third metal pattern 41 is arranged on a wiring end where the first temperature probe 4 is connected with the second gold wire b, and the second gold wire b is connected with the third metal pattern 41, so that the welding performance of the first temperature probe 4 is improved, and the normal operation of the welding operation of the second gold wire b is ensured.
Specifically, the first temperature probe 4 is welded or bonded to the first metal pattern 2;
preferably, the first temperature probe 4 is installed on the first metal pattern 2 in a welding manner, so that the heat transfer effect is more stable, and the detection precision of the first temperature sensor is ensured;
if the first temperature probe 4 is adhered to the first metal pattern 2, it is performed by curing the thermally conductive paste.
In practical application, the first temperature probe 4 can be pre-installed on the semiconductor refrigerator a to realize the same batch production, and the same first temperature probe 4 is adopted in the same batch, so that the temperature calibration method is the same, and the calibration operation is convenient to perform in the subsequent application.
Example 4
Referring to fig. 4, a semiconductor cooler with a temperature probe includes the semiconductor cooler a according to embodiment 2, and further includes a second temperature probe 5, where two opposite ends of the second temperature probe 5 are terminals, and are respectively connected to 2 first metal patterns 2;
the metal pattern structure further comprises a third gold wire c and a fourth gold wire d, wherein the third gold wire c and the fourth gold wire d are respectively connected with the 2 first metal patterns 2; the third gold wire c and the fourth gold wire d are connected with an external signal receiving circuit and used for outputting impedance signals of the first temperature probe 4;
the second temperature probe 5 is a temperature sensor, which is not limited in this embodiment.
In this embodiment, the terminals of the second temperature probe 5 are respectively welded or adhered to 2 first metal patterns 2;
specifically, the first metal patterns 2 are provided with extension parts, and external temperature probes are matched with the extension parts; the extending parts of the 2 first metal patterns 2 extend towards the space between the two extending parts, and two ends of the second temperature probe 5 are respectively arranged at the end parts of the extending parts; and the third gold thread c, fourth gold thread d is connected with 2 said first metal pattern 2 separately, facilitate the installation of the third gold thread c, fourth gold thread d.
In the present embodiment, the second temperature probe 5 is welded or bonded to the first metal pattern 2;
preferably, the second temperature probe 5 is installed on the first metal pattern 2 in a welding manner, so that the heat transfer effect is more stable, and the detection precision of the second temperature sensor is ensured;
if the second temperature probe 5 is adhered to the first metal pattern 2, it is performed by curing the thermally conductive paste.
In practical application, the second temperature probe 5 can be pre-installed on the semiconductor refrigerator a to realize the same batch production, and the same second temperature probe 5 is adopted in the same batch, so the temperature calibration method is the same, and the calibration operation is convenient to perform in the subsequent application.
While embodiments of the present invention have been shown and described, it will be understood by those of ordinary skill in the art that: various changes, modifications, substitutions and alterations can be made to the embodiments without departing from the principles and spirit of the utility model, the scope of which is defined by the claims and their equivalents.
Claims (11)
1. The semiconductor refrigerator comprises a body (1) and is characterized in that a first metal pattern (2) and a second metal pattern (3) are arranged on the surface of the body (1), and a peripheral temperature probe and peripheral devices for exchanging heat with the body (1) are respectively arranged on the first metal pattern (2) and the second metal pattern (3).
2. The semiconductor cooler according to claim 1, wherein the number of the first metal patterns (2) is set according to the installation manner of the external temperature probe.
3. The semiconductor cooler according to claim 2, characterized in that the number of the first metal patterns (2) is 1, and the two opposite ends of the external temperature probe are terminals, one of which is disposed on the first metal pattern (2).
4. The semiconductor refrigerator according to claim 2, wherein the number of the first metal patterns (2) is 2, and the two opposite ends of the external temperature probe are terminals, which are respectively connected to 2 of the first metal patterns (2).
5. A semiconductor cooler according to any one of claims 3 or 4, characterized in that the first metal pattern (2) and the second metal pattern (3) are formed by electroplating, evaporation or sputtering.
6. A semiconductor cooler according to claim 5, characterized in that the surfaces of the first and second metal patterns (2, 3) are provided with a metal plating.
7. A semiconductor refrigerator with a temperature probe, characterized by comprising a semiconductor refrigerator (a) according to claim 3; the metal pattern structure further comprises a first temperature probe (4), wherein two opposite ends of the first temperature probe (4) are terminals, and one terminal is arranged on the first metal pattern (2);
still include first gold thread (a), second gold thread (b), first gold thread (a) with first metal pattern (2) are connected, second gold thread (b) with another wiring end of first temperature probe (4) is connected.
8. The semiconductor cooler with temperature probe according to claim 7, characterized in that the terminal of the first temperature probe (4) connected to the second gold wire (b) is provided with a third metal pattern (41), and the second gold wire (b) is connected to the third metal pattern (41).
9. The semiconductor cooler with temperature probe according to claim 7, characterized in that the first temperature probe (4) is welded or bonded to the first metal pattern (2).
10. A semiconductor refrigerator with a temperature probe, characterized by comprising a semiconductor refrigerator (a) according to claim 4; the second temperature probe (5) is further included, two opposite ends of the second temperature probe (5) are wiring ends which are respectively connected with the 2 first metal patterns (2);
the metal pattern structure further comprises a third gold wire (c) and a fourth gold wire (d), wherein the third gold wire (c) and the fourth gold wire (d) are respectively connected with the 2 first metal patterns (2).
11. The semiconductor cooler with temperature probe according to claim 10, characterized in that the terminals of the second temperature probe (5) are soldered or bonded to 2 of the first metal patterns (2), respectively.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202122827407.XU CN216744983U (en) | 2021-11-16 | 2021-11-16 | Semiconductor refrigerator and semiconductor refrigerator with temperature probe |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202122827407.XU CN216744983U (en) | 2021-11-16 | 2021-11-16 | Semiconductor refrigerator and semiconductor refrigerator with temperature probe |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN216744983U true CN216744983U (en) | 2022-06-14 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202122827407.XU Active CN216744983U (en) | 2021-11-16 | 2021-11-16 | Semiconductor refrigerator and semiconductor refrigerator with temperature probe |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN216744983U (en) |
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2021
- 2021-11-16 CN CN202122827407.XU patent/CN216744983U/en active Active
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