CN216738501U

CN216738501U - Thick calibrating device of coating by vaporization membrane

Info

Publication number: CN216738501U
Application number: CN202123176500.5U
Authority: CN
Inventors: 岳小非; 王煦; 蔡长生; 张悦; 戴雷; 蔡丽菲
Original assignee: Sichuan Agri New Materials Co ltd
Current assignee: Sichuan Agri New Materials Co ltd
Priority date: 2021-12-16
Filing date: 2021-12-16
Publication date: 2022-06-14
Anticipated expiration: 2031-12-16

Abstract

The utility model discloses a device for calibrating the thickness of an evaporation coating film, which comprises a crystal oscillating piece, an oscillator, a control system, a power supply, an evaporation source, a calibration mechanism and an evaporation coating chamber; the evaporation source and the crystal oscillator plate are both positioned in the evaporation chamber, and the crystal oscillator plate is positioned above the evaporation source; the crystal oscillation sheet is electrically connected with the oscillator, and the oscillator is electrically connected with the control system; the calibration mechanism is connected with the crystal oscillator plate, the calibration mechanism is electrically connected with the control system, and the control system and the evaporation source are electrically connected with the power supply. The utility model discloses a thick calibrating device of coating by vaporization can adjust the distance between crystal oscillator plate and the evaporation source, guarantees that the volume that the fixed frequency changes is unchangeable, and then guarantees that actual calculation's coating by vaporization speed is unchangeable, reduces the thick error of actual membrane that finally obtains.

Description

Thick calibrating device of coating by vaporization membrane

Technical Field

The utility model relates to a vacuum evaporation technical field, concretely relates to thick calibrating device of coating by vaporization membrane.

Background

Vacuum evaporation, or vapor deposition for short, is a process method in which a coating material (or called a coating material) is evaporated and gasified by heating and evaporation under vacuum conditions, and the gasified particles fly to the surface of a substrate to condense and form a film. The vapor deposition is a vapor deposition technology which is used earlier and has wider application, and has the advantages of simple film forming method, high film purity and compactness, unique film structure and performance and the like.

The key control of the evaporation process is controlling the film thickness, and the principle of controlling the film thickness by the evaporation equipment is as follows: the cumulative film thickness is equal to the evaporation rate × the adjustment factor × the evaporation time. Wherein the evaporation rate is monitored by a crystal oscillator plate. The crystal oscillation piece is a gold-plated crystal thin piece, can vibrate at a fixed frequency after being electrified, and when a material is evaporated on the surface of the crystal oscillation piece, the film thickness controller calculates the current evaporation rate according to the change of the natural frequency due to the change of the mass and the change of the natural frequency. The regulating factor is a correction parameter, the evaporation rate is actually a calculated value and can deviate from the actual rate, the regulating factor value is introduced to correct the deviation, and the regulating factor is calculated according to the accumulated film thickness of the evaporation and the actually measured film thickness. Along with the reduction of the natural frequency, the change of the natural frequency of the material with the same quality deposited changes, the calculated rate gradually increases, the evaporation rate is stabilized at a set value due to the adjustment of the PI D controller, so the actual rate gradually decreases, the accumulated film thickness does not change but the final actual film thickness decreases, the final actual film thickness does not reach the film thickness set by the process, and the deviation becomes larger and larger along with the time lapse, so that the number of defective products is increased.

The current method for calibrating the film thickness is to modify the value of the adjustment factor, and the specific method is to evaporate a single film layer by using white glass or a silicon wafer, measure the film thickness by using an ellipsometer or a step instrument, and calculate a new value of the adjustment factor according to the adjustment factor, so the process is time-consuming, in the OLED (organic light emitting device) display industry, more than 10 kinds of device materials are used, each material is confirmed to require 1-2 days once, the single film layer for measuring the film thickness cannot be used for a product, and only can be scrapped after the measurement is finished, thereby causing the waste of the materials and the substrate.

SUMMERY OF THE UTILITY MODEL

The utility model discloses a solve one or more technical problem that exist among the prior art, provide a thick calibrating device of coating by vaporization membrane.

The utility model provides a solution of its technical problem is:

a calibration device for the thickness of an evaporation coating film comprises a crystal oscillation piece, an oscillator, a control system, a power supply, an evaporation source, a calibration mechanism and an evaporation coating chamber; the evaporation source and the crystal oscillator plate are both positioned in the evaporation chamber, and the crystal oscillator plate is positioned above the evaporation source; the crystal oscillation piece is electrically connected with the oscillator, and the oscillator is electrically connected with the control system; the calibration mechanism is connected with the crystal oscillator plate, the calibration mechanism is electrically connected with the control system, and the control system and the evaporation source are electrically connected with the power supply.

The utility model discloses following beneficial effect has at least: along with the proceeding of the evaporation, the natural frequency of the crystal oscillator plate is reduced, the activity is reduced, and in order to ensure that the materials with the same quality can be deposited, the change of the natural frequency of the crystal oscillator plate needs to be ensured to be consistent, therefore, along with the increasing of the evaporation time, the control system can adjust the distance between the crystal oscillator plate and the evaporation source through the calibration mechanism, namely, a corresponding control command is sent to the calibration mechanism, the calibration mechanism works to reduce the distance between the crystal oscillator plate and the evaporation source, increase the material quantity deposited on the surface of the crystal oscillator plate, thereby ensuring that the quantity of the fixed frequency change is not changed, further ensuring that the actually calculated evaporation rate is not changed, and reducing the finally obtained error of the actual film thickness.

As a further improvement of the above technical solution, a through hole is provided above the evaporation chamber, both ends of the through hole extend in the vertical direction, a connecting shaft is provided on the through hole, a crystal oscillator piece support is provided inside the evaporation chamber, a calibration mechanism is provided above the evaporation chamber, the upper end of the connecting shaft is connected with the calibration mechanism, the lower end of the connecting shaft is connected with the crystal oscillator piece support, the crystal oscillator piece is provided on the crystal oscillator piece support, and the calibration mechanism controls the moving position of the crystal oscillator piece support through the connecting shaft, so that the distance between the crystal oscillator piece and the evaporation source can be better controlled.

As a further improvement of the above technical solution, the calibration mechanism includes a first adjustment assembly and a second adjustment assembly, the first adjustment assembly and the second adjustment assembly are both disposed above the evaporation chamber, the first adjustment assembly is connected to the second adjustment assembly, the second adjustment assembly is connected to the crystal oscillator plate support, the first adjustment assembly and the second adjustment assembly are electrically connected to the control system, the first adjustment assembly is used for adjusting the distance between the crystal oscillator plate and the evaporation source in the vertical direction, and when the first adjustment assembly cannot continue to drive the crystal oscillator plate support to move, the second adjustment assembly can control the crystal oscillator plate support to rotate, so that the crystal oscillator plate rotates by a certain angle, and the linear distance between the crystal oscillator plate and the evaporation source can also be adjusted to a certain extent.

As a further improvement of the above technical scheme, the first adjusting assembly includes a first motor, a first gear and a rack, the first motor is disposed above the evaporation chamber, the output end of the first motor is connected with the first gear, the first motor is used for driving the first gear to rotate, the rack is vertically disposed, the first gear is engaged with the rack, the first gear is used for driving the rack to move in the up-down direction, the lower end of the rack is connected with the second adjusting assembly, the first motor drives the first gear to rotate, the first gear drives the rack to move in the up-down direction, so as to drive the crystal oscillation piece to move in the up-down direction, and the distance between the crystal oscillation piece and the evaporation source can be better adjusted.

As a further improvement of the above technical solution, the second adjusting assembly comprises a second motor, a second gear and a third gear, the second motor is arranged above the evaporation chamber, the output end of the second motor is connected with the second gear, the second motor is used for driving the second gear to rotate around an axis extending up and down, the third gear is arranged below the rack, the third gear is connected with the rack and can rotate around an axis extending up and down relative to the rack, the second gear is meshed with the third gear, the third gear is fixedly connected with the connecting shaft, the second motor drives the second gear to rotate, the second gear rotates to drive the third gear to rotate, thereby driving the crystal oscillator plate bracket and the crystal oscillator plate to rotate by a certain angle, and adjusting the linear distance between the crystal oscillator plate and the evaporation source to a certain extent.

As a further improvement of the above technical solution, the first adjusting assembly further includes a first reduction gear set, an output end of the first motor is connected with the first reduction gear set, and the first reduction gear set is connected with the first gear; the second adjusting component further comprises a second reduction gear set, the output end of the second motor is connected with the second reduction gear set, the second reduction gear set is connected with the second gear, and the rotating speed of the gear can be better controlled by transmitting the power of the motor to the gear through the reduction gear set.

As a further improvement of the above technical solution, the calibration mechanism further includes a mounting bracket, the mounting bracket is disposed above the evaporation chamber, the mounting bracket is provided with a guide rail, and the rack is slidably connected to the guide rail and can move in the up-down direction, so that the rack can move up and down in the vertical direction better.

As a further improvement of the above technical solution, the control system includes a controller and a film thickness controller, the oscillator is electrically connected to the film thickness controller, the film thickness controller is electrically connected to the controller, the controller is electrically connected to the first motor and the second motor, the power supply is electrically connected to the controller and the film thickness controller, the film thickness controller is configured to read a frequency of the crystal oscillator and is responsible for calculating an evaporation rate and an accumulated film thickness, the controller reads data about the crystal oscillator in the film thickness controller, the controller calculates a distance to be moved and a rotation angle of the crystal oscillator according to an initial frequency and a current frequency, and the controller transmits a corresponding control command to the calibration mechanism in the form of an electrical signal.

As a further improvement of the technical scheme, an evaporation source bracket is arranged in the evaporation chamber, and the evaporation source is arranged on the evaporation source bracket, so that the evaporation source can be placed more stably.

As a further improvement of the technical scheme, the evaporation source is a temperature evaporation source, refractory materials can be evaporated, and the purity of the film layer is high.

Drawings

In order to more clearly illustrate the technical solution in the embodiments of the present invention, the drawings used in the description of the embodiments will be briefly described below. It is clear that the described figures represent only some embodiments of the invention, not all embodiments, and that a person skilled in the art can also derive other designs and figures from these figures without inventive effort.

Fig. 1 is a schematic structural diagram of an evaporation film thickness calibration apparatus according to an embodiment of the present invention;

fig. 2 is a front view of a calibration mechanism of an evaporation film thickness calibration apparatus according to an embodiment of the present invention;

fig. 3 is a plan view of a calibration mechanism of a vapor deposition film thickness calibration apparatus according to an embodiment of the present invention.

In the figure: 100. a crystal oscillating piece; 200. an oscillator; 300. a control system; 310. a controller; 320. a film thickness control instrument; 400. a power source; 500. an evaporation source; 600. an evaporation chamber; 700. a calibration mechanism; 710. a first adjustment assembly; 711. a first motor; 712. a first gear; 713. a first reduction gear set; 714. a rack; 720. a second adjustment assembly; 721. a second motor; 722. a second gear; 723. a third gear; 724. a second reduction gear set; 730. mounting a bracket; 800. a connecting shaft; 900. and a crystal oscillator plate bracket.

Detailed Description

This section will describe in detail the embodiments of the present invention, preferred embodiments of the present invention are shown in the attached drawings, which are used to supplement the description of the text part of the specification with figures, so that one can intuitively and vividly understand each technical feature and the whole technical solution of the present invention, but they cannot be understood as the limitation of the protection scope of the present invention.

In the description of the present invention, it should be understood that the orientation or positional relationship indicated with respect to the orientation description, such as up, down, front, rear, left, right, etc., is based on the orientation or positional relationship shown in the drawings, and is only for convenience of description and simplification of description, and does not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and thus, should not be construed as limiting the present invention.

In the description of the present invention, if words such as "a plurality" are used, the meaning is one or more, the meaning of a plurality of words is two or more, and the meaning of more than, less than, more than, etc. is understood as not including the number, and the meaning of more than, less than, more than, etc. is understood as including the number.

In the description of the present invention, unless there is an explicit limitation, the words such as setting, installation, connection, etc. should be understood in a broad sense, and those skilled in the art can reasonably determine the specific meanings of the above words in combination with the specific contents of the technical solution.

As shown in fig. 1, a calibration apparatus for a thickness of a deposited film includes a crystal oscillating plate 100, an oscillator 200, a control system 300, a power supply 400, an evaporation source 500, a calibration mechanism 700, and a deposition chamber 600. An evaporation chamber for evaporation is arranged in the evaporation chamber 600, the evaporation source 500 and the crystal oscillator 100 are both positioned in the evaporation chamber, the crystal oscillator 100 is positioned above the evaporation source 500, the crystal oscillator 100 is electrically connected with the oscillator 200, and the oscillator 200 is electrically connected with the control system 300; the control system 300 and the evaporation source 500 are both electrically connected to the power source 400, the calibration mechanism 700 is connected to the crystal oscillating piece 100, and the calibration mechanism 700 is electrically connected to the control system 300.

In the present embodiment, the control system 300 includes a controller 310 and a film thickness controller 320, the oscillator 200 is electrically connected to the film thickness controller 320, the film thickness controller 320 is electrically connected to the controller 310, the controller 310 is electrically connected to the calibration mechanism 700, the power supply 400 is electrically connected to the controller 310 and the film thickness controller 320, respectively, the film thickness controller 320 is used for reading the frequency of the crystal oscillator 100 and is responsible for calculating the evaporation rate and the accumulated film thickness, the controller 310 reads the data of the crystal oscillator 100 in the film thickness controller 320, the controller 310 calculates the distance and the rotation angle of the crystal oscillator 100 that need to be moved according to the initial frequency and the current frequency, and the controller 310 transmits the corresponding control command to the calibration mechanism 700 in the form of an electrical signal.

In this embodiment, an evaporation source holder is disposed inside the evaporation chamber 600, the evaporation source holder is fixedly connected to the evaporation chamber 600, for example, welded or bolted, and the evaporation source 500 is disposed on the evaporation source holder, so that the evaporation source 500 can be more stably placed.

In this embodiment, the evaporation source 500 is a temperature evaporation source, which enables deposition of refractory materials and high film purity.

In some other embodiments, the evaporation source 500 may also be an electron beam evaporation source.

As shown in fig. 2 and 3, a through hole is formed above the evaporation chamber 600, two ends of the through hole extend in the up-down direction, a connecting shaft 800 is disposed on the through hole, the connecting shaft 800 is vertically disposed, more specifically, a shaft sleeve is further disposed on the through hole, the shaft sleeve is fixedly connected with the evaporation chamber 600, for example, by bonding, and the connecting shaft 800 is movably connected to the shaft sleeve and can move in the up-down direction.

In this embodiment, still be equipped with the sealing washer on the through-hole, can promote the sealed effect of coating by vaporization room 600, can guarantee the vacuum of coating by vaporization room 600.

As shown in fig. 1, a crystal oscillator piece holder 900 is disposed in the evaporation chamber 600, the alignment mechanism 700 is disposed above the evaporation chamber 600, the upper end of the connection shaft 800 is connected to the alignment mechanism 700, the lower end of the connection shaft 800 is connected to the crystal oscillator piece holder 900, and the crystal oscillator piece 100 is disposed on the crystal oscillator piece holder 900.

As shown in fig. 2 and 3, the calibration mechanism 700 includes a first adjusting assembly 710 and a second adjusting assembly 720, the first adjusting assembly 710 and the second adjusting assembly 720 are both disposed above the evaporation chamber 600, the first adjusting assembly 710 is connected to the second adjusting assembly 720, the second adjusting assembly 720 is connected to the crystal oscillator plate holder 900, the first adjusting assembly 710 and the second adjusting assembly 720 are both electrically connected to the control system 300, the first adjusting assembly 710 is used for adjusting the vertical distance between the crystal oscillator plate 100 and the evaporation source 500, and when the first adjusting assembly 710 cannot continuously drive the crystal oscillator plate holder 900 to move, the second adjusting assembly 720 can control the crystal oscillator plate holder 900 to rotate, so that the crystal oscillator plate 100 rotates by a certain angle, and the linear distance between the

crystal oscillator plates

100 and 500 can also be adjusted to a certain extent.

As shown in fig. 2 and 3, the calibration mechanism 700 further includes a mounting bracket 730, the mounting bracket 730 is disposed above the evaporation chamber 600, the mounting bracket 730 is fixedly connected to the evaporation chamber 600, for example, welded, and the first adjustment assembly 710 and the second adjustment assembly 720 are disposed on the mounting bracket 730.

As shown in fig. 2 and 3, the first adjusting assembly 710 includes a first motor 711, a first gear 712, a first reduction gear set 713, and a rack 714, the first motor 711 is fixedly connected to the mounting bracket 730, for example, welded or bolted, an output end of the first motor 711 is connected to the first reduction gear set 713, the first reduction gear set 713 is connected to the first gear 712, the first gear 712 is engaged with the rack 714, the rack 714 is vertically disposed, the mounting bracket 730 is provided with a guide track, the rack 714 is slidably connected to the guide track and can move up and down, so that the rack 714 can better move up and down in the vertical direction, more specifically, the mounting bracket 730 is provided with a limit baffle, the limit baffle is fixedly connected to the mounting bracket 730, for example, welded, the limit baffle is disposed around the rack 714, an area surrounded by the limit baffle is the guide track, the first motor 711 drives the first gear 712 to rotate, the first gear 712 rotates to drive the rack 714 to move up and down, and the lower end of the rack 714 is connected to the crystal oscillator support 900, so that the crystal oscillator 100 can be driven to move up and down, and the distance between the crystal oscillator 100 and the evaporation source 500 can be better adjusted.

In the present embodiment, the first gear 712 rotates around an axis extending in the front-rear direction, the left side of the rack 714 is provided with a tooth, the first gear 712 is located on the left side of the rack 714, and the first gear 712 is engaged with the rack 714.

As shown in fig. 2 and 3, the second adjusting assembly 720 includes a second motor 721, a second gear 722, a second reduction gear set 724, and a third gear 723, the second motor 721 is fixedly connected to the mounting bracket 730, such as welded or bolted, an output end of the second motor 721 is connected to the second reduction gear set 724, the second reduction gear set 724 is connected to the second gear 722, and the second motor 721 is configured to drive the second gear 722 to rotate around an axis extending up and down.

In this embodiment, a rotating shaft is disposed at a lower end of the rack 714, the rotating shaft is vertically disposed, an upper end of the rotating shaft is fixedly connected, for example, welded, to the lower end of the rack 714, the third gear 723 is disposed below the rack 714, the third gear 723 is rotatably connected to the rotating shaft, that is, the third gear 723 can rotate around an axis extending up and down, the third gear 723 is fixedly connected, for example, welded, to the connecting shaft 800, an axis of the rotating shaft, an axis of the third gear 723, and an axis of the connecting shaft 800 are located on a same straight line, more specifically, the crystal oscillator support 900 is circular, an axis of the crystal oscillator support 900 is parallel to but not located on the same straight line, the second gear 722 is engaged with the third gear 723, the second motor 721 drives the second gear 722 to rotate, the second gear 722 rotates to drive the third gear 723 to rotate, so as to drive the crystal oscillator support 900 and the crystal oscillator plate 100 to rotate at a certain angle, the linear distance between the crystal oscillator piece 100 and the evaporation source 500 can be adjusted to some extent.

In the present embodiment, the axial length of the second gear 722 is greater than the axial length of the third gear 723, and even if the third gear 723 moves up and down, the second gear 722 can be surely meshed with the third gear 723.

In the present embodiment, the first motor 711, the first gear 712, and the first reduction gear set 713 are located on the left side of the rack 714, and the second motor 721, the second gear 722, and the second reduction gear set 724 are located on the right side of the rack 714, so that the layout is reasonable, and the stability of the alignment mechanism 700 is higher.

In this embodiment, the control mode of controller is fairly simple, and what the membrane thickness control appearance adopted is current membrane thickness control appearance commonly used, and the controller adopts siemens's 51 singlechip or PLC controller commonly used to carry out simple design just can realize corresponding function, consequently, the mode of controller control does not belong to the utility model discloses a protection range belongs to prior art, the utility model discloses what mainly protect is the connected mode between controller and the remaining part.

While the preferred embodiments of the present invention have been described in detail, it is to be understood that the invention is not limited thereto, and that various equivalent modifications and substitutions may be made by those skilled in the art without departing from the spirit of the present invention, and the equivalents thereof are intended to be encompassed by the scope of the appended claims.

Claims

1. The utility model provides a thick calibrating device of coating by vaporization membrane which characterized in that: the device comprises a crystal oscillation piece, an oscillator, a control system, a power supply, an evaporation source, a calibration mechanism and an evaporation chamber; the evaporation source and the crystal oscillator plate are both positioned in the evaporation chamber, and the crystal oscillator plate is positioned above the evaporation source; the crystal oscillation piece is electrically connected with the oscillator, and the oscillator is electrically connected with the control system; the calibration mechanism is connected with the crystal oscillator plate, the calibration mechanism is electrically connected with the control system, and the control system and the evaporation source are electrically connected with the power supply.

2. A vapor deposition film thickness calibration device according to claim 1, wherein: the crystal oscillator wafer coating device is characterized in that a through hole is formed in the upper portion of the evaporation chamber, two ends of the through hole extend in the vertical direction, a connecting shaft is arranged on the through hole, a crystal oscillator wafer support is arranged inside the evaporation chamber, the calibrating mechanism is arranged above the evaporation chamber, the upper end of the connecting shaft is connected with the calibrating mechanism, the lower end of the connecting shaft is connected with the crystal oscillator wafer support, and the crystal oscillator wafer is arranged on the crystal oscillator wafer support.

3. A vapor deposition film thickness calibration device according to claim 2, wherein: the calibration mechanism comprises a first adjusting component and a second adjusting component, the first adjusting component and the second adjusting component are both arranged above the evaporation chamber, the first adjusting component is connected with the second adjusting component, the second adjusting component is connected with the crystal oscillator piece support, and the first adjusting component and the second adjusting component are both electrically connected with the control system.

4. A vapor deposition film thickness calibration device according to claim 3, wherein: first adjusting part includes first motor, first gear and rack, first motor is established the top of coating by vaporization room, the output of first motor with first gear connection, first motor is used for ordering about first gear revolve, the rack is vertical setting, first gear with rack toothing, first gear is used for ordering about the rack removes along upper and lower direction, the lower extreme of rack with second adjusting part connects.

5. A vapor deposition film thickness calibration device according to claim 4, wherein: the second adjusting component comprises a second motor, a second gear and a third gear, the second motor is arranged above the evaporation chamber, the output end of the second motor is connected with the second gear, the second motor is used for driving the second gear to rotate around the axis extending from top to bottom, the third gear is arranged below the rack, the third gear is connected with the rack and can be opposite to the rack to rotate around the axis extending from top to bottom, the second gear is meshed with the third gear, and the third gear is fixedly connected with the connecting shaft.

6. A vapor deposition film thickness calibration device according to claim 5, wherein: the first adjusting assembly further comprises a first reduction gear set, the output end of the first motor is connected with the first reduction gear set, and the first reduction gear set is connected with the first gear; the second adjusting assembly further comprises a second reduction gear set, the output end of the second motor is connected with the second reduction gear set, and the second reduction gear set is connected with the second gear.

7. The vapor deposition film thickness calibration device according to claim 6, wherein: the calibration mechanism further comprises a mounting support, the mounting support is arranged above the evaporation chamber, a guide rail is arranged on the mounting support, and the rack is connected to the guide rail in a sliding mode and can move in the vertical direction.

8. The vapor deposition film thickness calibration device according to claim 7, wherein: the control system comprises a controller and a film thickness controller, the oscillator is electrically connected with the film thickness controller, the film thickness controller is electrically connected with the controller, the controller is electrically connected with the first motor and the second motor respectively, and the power supply is electrically connected with the controller and the film thickness controller respectively.

9. A vapor deposition film thickness calibration device according to claim 1, wherein: an evaporation source support is arranged in the evaporation chamber, and the evaporation source is arranged on the evaporation source support.

10. A vapor deposition film thickness calibration device according to claim 1, wherein: the evaporation source is a temperature evaporation source.