CN216721705U - Suction nozzle and chip mounting device - Google Patents
Suction nozzle and chip mounting device Download PDFInfo
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- CN216721705U CN216721705U CN202123427507.XU CN202123427507U CN216721705U CN 216721705 U CN216721705 U CN 216721705U CN 202123427507 U CN202123427507 U CN 202123427507U CN 216721705 U CN216721705 U CN 216721705U
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- suction nozzle
- adsorption
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- mounting
- hole
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Abstract
The utility model discloses a suction nozzle and a chip mounting device, wherein the suction nozzle comprises: the body comprises an adsorption end face and a mounting end face which are communicated by an adsorption cavity; the vacuum adsorption device is characterized in that an adsorption hole communicated with the adsorption cavity is formed in the middle of the adsorption end face, a vacuum hole is formed in the installation end face, the adsorption hole is a lower opening of the adsorption cavity, the vacuum hole is an upper opening of the adsorption cavity, and a through hole communicated with the adsorption cavity is further formed in the installation end face. The suction nozzle can ensure the material mounting quality.
Description
Technical Field
The utility model relates to the technical field of surface mounting equipment, in particular to a suction nozzle and a surface mounting device.
Background
The chip mounter is used for accurately mounting one object on another object in a production line, and the chip mounter is main equipment in the production line.
For an automatic mounting device, if the suction nozzle is assembled unevenly, the material mounting can be inclined. In the prior art, the flatness of the suction nozzle assembly mainly depends on the observation of human eyes, and the accuracy is poor; in addition, once the flatness of the suction nozzle is changed in the production process, the material mounting accuracy is also influenced.
SUMMERY OF THE UTILITY MODEL
On the one hand, the embodiment of the utility model provides the suction nozzle which can ensure the material mounting quality.
The embodiment of the utility model also provides a chip mounting device, which can automatically detect the flatness of the suction nozzle in the material mounting process so as to ensure the material mounting quality.
In one aspect, an embodiment of the present invention provides a suction nozzle, including: the body comprises an adsorption end face and a mounting end face which are communicated by an adsorption cavity; the vacuum adsorption device is characterized in that an adsorption hole communicated with the adsorption cavity is formed in the middle of the adsorption end face, a vacuum hole is formed in the installation end face, the adsorption hole is a lower opening of the adsorption cavity, the vacuum hole is an upper opening of the adsorption cavity, and a through hole communicated with the adsorption cavity is further formed in the installation end face.
Optionally, the through holes are multiple and distributed at the periphery of the vacuum hole.
Optionally, the plurality of through holes are symmetrically distributed.
Optionally, the adsorption end face is circular or square.
Optionally, a limiting structure is arranged on the end face.
Optionally, the limiting structure is a flange or a limiting column arranged at the edge of the mounting end face.
Optionally, the flanges or the limiting columns are multiple and are uniformly distributed.
Optionally, the upper mouth of the adsorption cavity is larger than the lower mouth.
Optionally, guide structures are further provided on both sides of the mounting end surface.
In another aspect, an embodiment of the present invention further provides a patch device, where the patch device includes: a mounting head, an air pump, and a suction nozzle as described above; the suction nozzle is installed below the mounting head, and the air pump is connected with the vacuum hole through an air pipe.
Optionally, the apparatus further comprises a pressure gauge for monitoring a pressure value of the adsorption chamber.
Optionally, the placement head is driven by a motor.
According to the suction nozzle provided by the embodiment of the utility model, the body is provided with the adsorption cavity, the adsorption cavity is communicated with the adsorption end face and the installation end face, the adsorption hole is arranged in the middle of the adsorption end face and is used as a lower opening of the adsorption cavity, the installation end face is provided with the vacuum hole connected with an upper opening of the adsorption cavity, and the periphery of the adsorption hole is provided with the through hole communicated with the adsorption cavity. When carrying out the material and pasting dress, because these through-holes are linked together with the absorption chamber, if the suction nozzle takes place the slope, then can't make the pressure of the air in the absorption chamber reach the pressure value of settlement, if the suction nozzle slope is serious, probably even can not adsorb the paster in the absorption terminal surface of suction nozzle to can indicate operating personnel to inspect equipment relevant part, adjust the suction nozzle, make its adsorption plane keep level and smooth. Furthermore, equipment can automatically judge the assembling flatness of the suction nozzle according to the pressure value, and the mounting quality and efficiency are further improved.
Drawings
FIG. 1 is a schematic perspective view of a nozzle provided in an embodiment of the present invention;
fig. 2 is a schematic view of an installation structure of the suction nozzle and the mounting head shown in fig. 1;
FIG. 3 is a schematic view of the suction nozzle of FIG. 1 in a tilted state;
fig. 4 is a schematic structural view of a patch device provided by an embodiment of the present invention;
fig. 5 is a flow chart of mounting by using the mounting device provided by the embodiment of the utility model;
fig. 6 is another flow chart of mounting of the chip mounter according to the embodiment of the present invention.
Detailed Description
In order to make the aforementioned objects, features and advantages of the present invention comprehensible, embodiments accompanied with figures are described in detail below.
The suction nozzle of the SMT chip mounter utilizes the principle of vacuum suction, namely, material grabbing and moving are realized by utilizing the force formed by the difference between a vacuum system and atmospheric pressure, and then components adsorbed on the suction nozzle are placed on the coordinate axis of a circuit board through blowing. Ideally, after the suction nozzle is installed, the component is in the center of the suction nozzle, and the adsorption surface is kept flat, so that the material is pasted and flat. However, sometimes, due to problems of installation operation or loosening of the suction nozzle caused by long-term use, the flatness of the suction nozzle may be changed, and the accuracy of material placement is affected. Therefore, the embodiment of the utility model provides the suction nozzle which can better ensure the material mounting quality.
Referring to fig. 1 and fig. 2, in which fig. 1 is a schematic perspective view of a suction nozzle provided in an embodiment of the present invention, and fig. 2 is a schematic view of an installation structure of the suction nozzle and a mounting head provided in the embodiment of the present invention.
As shown in fig. 2, in use, the suction nozzle 10 needs to be mounted on a mounting head 51, the mounting head 51 is used for fixing the suction nozzle 10, the suction nozzle 10 is used for adsorbing a material 70, and the material 70 can be, for example, a component, a chip, etc.
The mouthpiece 10 of this embodiment includes: the body comprises an adsorption end face 12 and a mounting end face which are communicated by an adsorption cavity 11; an adsorption hole 21 communicating with the adsorption chamber 11 is provided at a middle position of the adsorption end face 12, and a vacuum hole 23 is provided at the mounting end face. Wherein, the adsorption hole 21 is a lower port of the adsorption cavity 11, and the vacuum hole 23 is an upper port of the adsorption cavity 11. In addition, a through hole 22 communicating with the adsorption chamber 11 is provided in the mounting end surface.
In one non-limiting embodiment, the through-holes 22 may be provided in plurality and arranged at the periphery of the vacuum holes 23. The plurality of through holes 22 may be symmetrically distributed.
It should be noted that, in a specific application, the number and distribution of the through holes 22 may be determined according to the shape and size of the mounting end surface 12, for example, the mounting end surface may be circular or square or other shapes, if a circular mounting surface is adopted, as shown in fig. 1, the through holes 22 may be evenly distributed around the center of the circular mounting end surface, and if a square mounting end surface is adopted, the same number and interval of through holes may be arranged on four sides.
The suction end face 12 may be circular, square, or other shapes, and the embodiment of the present invention is not limited thereto.
Further, a limiting structure 40 may be further disposed on the mounting end surface, and the limiting structure 40 may be protruded or recessed from the mounting end surface, for example, the limiting structure 40 may be a flange or a limiting column disposed at an edge of the mounting end surface. Of course, the limiting structure 40 may have other shapes, and the embodiment of the present invention is not limited thereto. Further, the flanges or the limiting columns can be arranged in a plurality of numbers and are uniformly distributed.
Further, the upper opening of the suction chamber may be larger than the lower opening to facilitate mounting of the suction nozzle.
Further, guide mechanisms 50 may be provided on both sides of the mounting end surface to pre-position the suction nozzle during mounting.
According to the suction nozzle provided by the embodiment of the utility model, the body is provided with the adsorption cavity, the adsorption cavity is communicated with the adsorption end face and the installation end face, the adsorption hole is arranged in the middle of the adsorption end face and is used as a lower opening of the adsorption cavity, the installation end face is provided with the vacuum hole connected with the upper opening of the adsorption cavity, and the periphery of the vacuum hole is provided with the through hole communicated with the adsorption cavity. When the material is pasted and mounted, because the through holes are communicated with the adsorption cavity, if the suction nozzle inclines, as shown in fig. 3, the pressure of the air in the adsorption cavity cannot reach a set pressure value, and if the suction nozzle inclines seriously, even the patch cannot be adsorbed on the adsorption end face of the suction nozzle, so that an operator can be prompted to check related parts of equipment, and the suction nozzle can be adjusted to keep the adsorption face of the suction nozzle flat.
Correspondingly, the embodiment of the utility model also provides a chip mounting device comprising the suction nozzle, and as shown in fig. 4, the chip mounting device is a schematic structural diagram.
The patch device includes: a mounting head 51, an air pump 52, and the suction nozzle 10. Wherein the suction nozzle 10 is installed below the mounting head 51, and the air pump 52 is connected to the vacuum hole 23 on the installation end surface of the suction nozzle 10 through an air tube.
The mounting head 51 may be driven by a motor, and the embodiment of the present invention does not limit the specific structure of the mounting head 51, and only needs the mounting head 51 to be adapted to the mounting end surface of the suction nozzle 10.
Further, in order to improve the automation capability of the placement device, in another non-limiting embodiment of the placement device, the placement device may further include: and the pressure gauge is used for monitoring the pressure value of the adsorption cavity.
A flow chart of mounting by using the chip mounter provided by the embodiment of the present invention is shown in fig. 5. The mounting process mainly comprises the following steps:
and step 504, driving the mounting head to enable the suction nozzle to move downwards, and conveying air into the adsorption cavity through the air pump, the air pipe and the vacuum hole to pre-fix the patch and the chip.
As shown in fig. 6, another flow chart of mounting by using the chip mounting device provided by the embodiment of the utility model includes the following steps:
601, driving a mounting head to position a suction nozzle to be aligned with a patch;
specifically, a set value, i.e., a normal pressure value, can be determined by a preliminary test. If the monitored pressure value is greater than the set value, it is determined that the current pressure value is abnormal.
and 605, driving the mounting head to enable the suction nozzle to move downwards, and conveying air into the adsorption cavity through the air pump, the air pipe and the vacuum hole to pre-fix the patch and the chip.
And step 606, adjusting the nozzle assembly flatness, and then returning to step 601 to start again.
It should be noted that, the adjustment of the assembling flatness of the suction nozzle may be manually completed or may be automatically completed through a corresponding driving mechanism, which is not limited in the embodiment of the present invention.
The chip mounting method provided by the embodiment of the utility model can ensure the chip mounting quality, and can automatically find and timely adjust once the suction nozzle is inclined and the like to influence the assembling flatness, thereby effectively improving the mounting efficiency.
It should be understood that the term "and/or" herein is merely one type of association relationship that describes an associated object, meaning that three relationships may exist, e.g., a and/or B may mean: a exists alone, A and B exist simultaneously, and B exists alone. In addition, the character "/" herein indicates that the former and latter associated objects are in an "or" relationship.
"plurality" appearing in the embodiments of the present invention means two or more.
The descriptions of the first, second, etc. appearing in the embodiments of the present invention are only for illustrating and differentiating the objects, and do not have any order or represent any special limitation to the number of devices in the embodiments of the present application, and cannot constitute any limitation to the embodiments of the present application.
The term "connect" in the embodiments of the present invention refers to various connection manners, such as direct connection or indirect connection, to implement communication between devices, which is not limited in this application.
Although the present invention is disclosed above, the present invention is not limited thereto. Various changes and modifications may be effected therein by one skilled in the art without departing from the spirit and scope of the utility model as defined in the appended claims.
Claims (12)
1. A suction nozzle, characterized in that the suction nozzle comprises: the body comprises an adsorption end face and a mounting end face which are communicated by an adsorption cavity; the vacuum adsorption device is characterized in that an adsorption hole communicated with the adsorption cavity is formed in the middle of the adsorption end face, a vacuum hole is formed in the installation end face, the adsorption hole is a lower opening of the adsorption cavity, the vacuum hole is an upper opening of the adsorption cavity, and a through hole communicated with the adsorption cavity is further formed in the installation end face.
2. The suction nozzle as set forth in claim 1 wherein said plurality of through holes are arranged around the periphery of said vacuum hole.
3. The suction nozzle as set forth in claim 2 wherein said plurality of through holes are symmetrically disposed.
4. The suction nozzle as set forth in claim 1 wherein said suction end face is circular or square.
5. A nozzle according to claim 1, characterised in that said end surface is provided with a stop.
6. A nozzle according to claim 5, wherein said retaining structure is a flange or a retaining post provided at an edge of said mounting face.
7. A nozzle according to claim 6, wherein said ledge or peg is a plurality of and evenly distributed.
8. The suction nozzle as set forth in claim 1 wherein the suction cavity has an upper mouth that is larger than a lower mouth.
9. A nozzle according to any one of claims 1 to 8, wherein guide structures are further provided on both sides of said mounting face.
10. A patch device, the device comprising: a mounting head, an air pump, and a suction nozzle according to any one of claims 1 to 9; the suction nozzle is installed below the mounting head, and the air pump is connected with the vacuum hole through an air pipe.
11. A patch device as claimed in claim 10, wherein the device further comprises a pressure gauge for monitoring the pressure in the chamber.
12. A patch device as claimed in claim 10 or 11, wherein the mounting head is motor driven.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202123427507.XU CN216721705U (en) | 2021-12-31 | 2021-12-31 | Suction nozzle and chip mounting device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN202123427507.XU CN216721705U (en) | 2021-12-31 | 2021-12-31 | Suction nozzle and chip mounting device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| CN216721705U true CN216721705U (en) | 2022-06-10 |
Family
ID=81889872
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| CN202123427507.XU Active CN216721705U (en) | 2021-12-31 | 2021-12-31 | Suction nozzle and chip mounting device |
Country Status (1)
| Country | Link |
|---|---|
| CN (1) | CN216721705U (en) |
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2021
- 2021-12-31 CN CN202123427507.XU patent/CN216721705U/en active Active
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