CN110504208B - Thimble system - Google Patents
Thimble system Download PDFInfo
- Publication number
- CN110504208B CN110504208B CN201910903490.9A CN201910903490A CN110504208B CN 110504208 B CN110504208 B CN 110504208B CN 201910903490 A CN201910903490 A CN 201910903490A CN 110504208 B CN110504208 B CN 110504208B
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- compression
- vacuum
- channel
- thimble
- hole
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/6838—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping with gripping and holding devices using a vacuum; Bernoulli devices
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
- H01L21/68742—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a lifting arrangement, e.g. lift pins
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- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Abstract
The invention discloses an ejector pin system which comprises an ejector pin base, an ejector pin cap and a connecting nut, wherein the ejector pin base is provided with a first compression channel and a first vacuum channel, the ejector pin cap is provided with a second compression channel and a second vacuum channel, the ejector pin cap is provided with a compression through hole and a vacuum through hole, the first compression channel is communicated with the compression through hole through the second compression channel, and the first vacuum channel is communicated with the vacuum through hole through the second vacuum channel. When the ejector pin system works, the external vacuumizing device enables the vacuum through hole to be in a negative pressure state by exhausting gas in the first vacuum channel and the second vacuum channel, so that the blue film of the wafer is smoothly adsorbed, when the chip needs to be released, an external compressed air source introduces compressed air into the first compression channel and the second compression channel, and the chip is jacked up from the blue film through the compression through hole. The thimble system of the invention adopts the methods of vacuum adsorption and air pressure ejection to complete the action, and is suitable for chips with various models.
Description
Technical Field
The invention relates to the technical field of chip packaging and peripheral corollary equipment, in particular to a thimble system.
Background
Chip packaging plays an important role in integrated circuits, and an ejector pin system is an indispensable mechanism in chip subsequent packaging and is used for separating a chip on a wafer from a film. The existing thimble system is a metal or plastic thimble structure, and adopts a single needle or a plurality of needles to correspondingly jack up chips with different specifications and sizes. The up-and-down movement of the thimble depends on the motor drive, and the thimble emits and needs vacuum to adsorb blue membrane of wafer etc..
In the existing thimble system, when a working object is an ultrathin chip (the thickness of the chip is less than 0.05mm), the thimble system has strict requirements on speed control during the jacking of a motor and control on the pressure of a chip pick-up head, and the chip is easy to crack and break due to poor control; when a working object is a larger chip (the length and the width of the chip are more than 10mm), a multi-thimble system is needed, the multi-thimble system is difficult to ensure that all thimbles are on the same plane when working, and all thimbles are concentric with the holes on the thimble caps, so that the requirements on design and installation accuracy are high, and the corresponding production cost is also high; in addition, the existing ejector pin system has complicated steps when the ejector pin is replaced, the ejector pin base is easily damaged due to repeated fixing of the ejector pin, the multi-ejector pin system is difficult to adjust the multi-ejector pin coplanar, the ejector pin and the ejector pin cap are repeatedly disassembled and assembled due to the need, the alignment adjustment of the ejector pin and the ejector pin cap needs to be confirmed every time, the working strength of operators is high, the ejector pin and the ejector pin cap can also influence the sealing of the ejector pin cap due to the reasons such as abrasion, and the vacuum air leakage is caused.
Therefore, how to change the current situation that the thimble system has a small application range and low production efficiency in the prior art is a problem to be solved urgently by those skilled in the art.
Disclosure of Invention
The invention aims to provide a thimble system to solve the problems in the prior art, so that the thimble system in the chip mounting and packaging process can adapt to various types of chips, and the production efficiency is improved.
In order to achieve the purpose, the invention provides the following scheme: the invention provides a thimble system which comprises a thimble seat, a thimble cap and a connecting nut, wherein the thimble cap is arranged at the top of the thimble seat, the connecting nut is sleeved outside the thimble seat and the thimble cap, and the connecting nut can fix the relative positions of the thimble seat and the thimble cap;
the thimble seat has first compression passageway and first vacuum passageway, first compression passageway is linked together with external compressed air source, first vacuum passageway links to each other with external evacuating device, the thimble cap has second compression passageway and second vacuum passageway, the thimble cap has the operation end, the operation end sets up compression through-hole and vacuum through-hole, first compression passageway passes through second compression passageway with the compression through-hole is linked together, first vacuum passageway passes through second vacuum passageway with the vacuum through-hole is linked together, first compression passageway with the department that is linked together of second compression passageway, first vacuum passageway with the department that is linked together of second vacuum passageway all sets up sealing element.
Preferably, the first compression channel and the second compression channel are both cylindrical channels, and the radial cross sections of the first vacuum channel and the second vacuum channel are both annular.
Preferably, the thimble cap with the thimble seat is pegged graft and is linked to each other, set up the boss on the thimble seat, first compression passageway set up in on the boss, the boss stretches into in the second compression passageway, set up the seal groove on the lateral wall of boss, set up the sealing washer in the seal groove.
Preferably, the thimble cap is provided with a retaining ring, the connecting nut penetrates through the thimble cap and is in threaded connection with the thimble seat, the retaining ring is abutted against the retaining ring, and the outer diameter of the retaining ring is larger than the inner diameter of the retaining ring.
Preferably, the thimble seat is provided with a positioning pin, the thimble cap is provided with a positioning groove matched with the positioning pin, and the positioning pin is inserted into the positioning groove when the thimble seat is connected with the thimble cap.
Preferably, the operation end is located at the top of the ejector pin cap.
Preferably, the compression through-hole with the quantity of vacuum through-hole is a plurality ofly, the top of operation end sets up the lug, the compression through-hole set up in on the lug, the quantity of lug with the quantity of compression through-hole is unanimous and the one-to-one, and is a plurality of the vacuum through-hole is the equidistant equipartition of annular.
Preferably, a compression inlet and a vacuum inlet are arranged on the side wall of the thimble seat, the compression inlet is communicated with the first compression channel, the vacuum inlet is communicated with the first vacuum channel, and the distance between the compression inlet and the bottom surface of the thimble seat is smaller than the distance between the vacuum inlet and the bottom surface of the thimble seat.
Compared with the prior art, the invention has the following technical effects: the thimble system comprises a thimble seat, a thimble cap and a connecting nut, wherein the thimble cap is arranged at the top of the thimble seat, the connecting nut is sleeved outside the thimble seat and the thimble cap, and the connecting nut can fix the relative positions of the thimble seat and the thimble cap; the thimble seat is provided with a first compression channel and a first vacuum channel, the first compression channel is communicated with an external compressed air source, the first vacuum channel is connected with an external vacuumizing device, the thimble cap is provided with a second compression channel and a second vacuum channel, the thimble cap is provided with an operation end, the operation end is provided with a compression through hole and a vacuum through hole, the first compression channel is communicated with the compression through hole through the second compression channel, the first vacuum channel is communicated with the vacuum through hole through the second vacuum channel, the communicated part of the first compression channel and the second compression channel and the communicated part of the first vacuum channel and the second vacuum channel are provided with sealing elements. When the ejector pin system works, the external vacuumizing device enables the vacuum through hole to be in a negative pressure state by exhausting gas in the first vacuum channel and the second vacuum channel, so that the blue film of the wafer is smoothly adsorbed, when the chip needs to be released, an external compressed air source introduces compressed air into the first compression channel and the second compression channel, and the chip is jacked up from the blue film through the compression through hole. The thimble system changes the structure of the motor-driven thimble in the prior art, adopts the vacuum adsorption and air pressure ejection methods to complete the actions, is suitable for chips of various types, avoids frequent replacement of the thimble, improves the working efficiency and saves the production cost.
Drawings
In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the drawings needed to be used in the embodiments will be briefly described below, and it is obvious that the drawings in the following description are only some embodiments of the present invention, and it is obvious for those skilled in the art to obtain other drawings without inventive exercise.
FIG. 1 is a schematic view of the overall structure of the thimble system of the present invention;
FIG. 2 is a schematic view of a disassembled structure of the thimble system of the present invention;
FIG. 3 is a schematic structural view of an ejector pin seat of the ejector pin system of the present invention;
FIG. 4 is a sectional view taken along A-A in FIG. 3;
FIG. 5 is an enlarged view of a portion of a top cap of the ejector pin system of the present invention;
FIG. 6 is a cross-sectional view of a thimble cap of the thimble system of the present invention;
wherein, 1 is the thimble seat, 2 is the thimble cap, 3 is connecting nut, 4 is first compression passageway, 5 is first vacuum channel, 6 is the second compression passageway, 7 is the second vacuum channel, 8 is the boss, 9 is the locating pin, 10 is the compression through-hole, 11 is the vacuum through-hole, 12 is the compression import, 13 is the vacuum inlet.
Detailed Description
The technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the drawings in the embodiments of the present invention, and it is obvious that the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. All other embodiments, which can be derived by a person skilled in the art from the embodiments given herein without making any creative effort, shall fall within the protection scope of the present invention.
The invention aims to provide a thimble system to solve the problems in the prior art, so that the thimble system in the chip mounting and packaging process can adapt to various types of chips, and the production efficiency is improved.
In order to make the aforementioned objects, features and advantages of the present invention comprehensible, embodiments accompanied with figures are described in further detail below.
Referring to fig. 1-6, fig. 1 is a schematic view of an overall structure of a thimble system of the present invention, fig. 2 is a schematic view of a disassembled structure of the thimble system of the present invention, fig. 3 is a schematic view of a thimble seat of the thimble system of the present invention, fig. 4 is a schematic view of a sectional structure along a-a direction in fig. 3, fig. 5 is an enlarged schematic view of a partial structure of a thimble cap of the thimble system of the present invention, and fig. 6 is a schematic view of a sectional structure of the thimble cap of the thimble system of the present invention.
The invention provides an ejector pin system which comprises an ejector pin base 1, an ejector pin cap 2 and a connecting nut 3, wherein the ejector pin cap 2 is arranged at the top of the ejector pin base 1, the connecting nut 3 is sleeved outside the ejector pin base 1 and the ejector pin cap 2, and the connecting nut 3 can fix the relative positions of the ejector pin base 1 and the ejector pin cap 2;
the thimble seat 1 is provided with a first compression channel 4 and a first vacuum channel 5, the first compression channel 4 is communicated with an external compressed air source, the first vacuum channel 5 is connected with an external vacuum pumping device, the thimble cap 2 is provided with a second compression channel 6 and a second vacuum channel 7, the thimble cap 2 is provided with an operation end, the operation end is provided with a vacuum through hole 11 and a vacuum through hole, the first compression channel 4 is communicated with the vacuum through hole 11 through the second compression channel 6, the first vacuum channel 5 is communicated with the vacuum through hole through the second vacuum channel 7, the communication part of the first compression channel 4 and the second compression channel 6 and the communication part of the first vacuum channel 5 and the second vacuum channel 7 are provided with sealing elements.
When the thimble system works, the external vacuumizing device pumps out the gas in the first vacuum channel 5 and the second vacuum channel 7, so that the vacuum through hole is in a negative pressure state, the blue film of the wafer is smoothly adsorbed, when the chip needs to be released, an external compressed gas source feeds compressed air into the first compressed channel 4 and the second compressed channel 6, and the chip is jacked up from the blue film through the vacuum through hole 11. The thimble system changes the structure of the motor-driven thimble in the prior art, adopts the vacuum adsorption and air pressure ejection methods to complete the actions, is suitable for chips of various types, avoids frequent replacement of the thimble, improves the working efficiency and saves the production cost.
Specifically, the first compression channel 4 and the second compression channel 6 are both cylindrical channels, the radial cross sections of the first vacuum channel 5 and the second vacuum channel 7 are both annular, in this embodiment, the first compression channel 4 and the first vacuum channel 5 are coaxially arranged, the second compression channel 6 and the second vacuum channel 7 are coaxially arranged, the first vacuum channel 5 is arranged at the periphery of the first compression channel 4, and the second vacuum channel 7 is arranged at the periphery of the second compression channel 6.
In addition, the thimble cap 2 is connected with the thimble seat 1 in an inserting mode, the inserting connection is convenient and fast, the boss 8 is arranged on the thimble seat 1, the first compression channel 4 is arranged on the boss 8, the boss 8 extends into the second compression channel 6, a sealing groove is formed in the side wall of the boss 8, a sealing ring is arranged in the sealing groove, the sealing performance of the communication position of the first compression channel 4 and the second compression channel 6 is ensured, similarly, the sealing ring is also arranged at the communication position of the first vacuum channel 5 and the second vacuum channel 7, air leakage is avoided, and the sealing performance is improved.
More specifically, thimble cap 2 has a retaining ring, and coupling nut 3 passes thimble cap 2 and thimble seat 1 threaded connection, and retaining ring looks butt, the external diameter of retaining ring is bigger than the internal diameter of retaining ring, and coupling nut 3 passes thimble cap 2 and screws up the back with thimble seat 1, has fixed the relative position between thimble seat 1 and the thimble cap 2, and coupling nut 3's setting has made things convenient for the dismouting of thimble seat 1 with thimble cap 2, has lightened operating personnel's work burden.
In order to prevent that thimble seat 1 and thimble from emitting 2 and taking place the relative rotation in the course of the work, set up locating pin 9 on the thimble seat 1, be provided with the constant head tank with locating pin 9 looks adaptation on the thimble emits 2, when thimble seat 1 and thimble emit 2 link to each other, locating pin 9 inserts in the constant head tank, avoid thimble seat 1 and thimble to emit 2 and take place the relative rotation, influence the whole gas tightness of device, and simultaneously, the setting of locating pin 9 and constant head tank has still played the effect of being connected the location for thimble seat 1 and thimble emits 2.
Furthermore, the operation end is located on the top of the ejector cap 2, and the operation end adsorbs the blue film and jacks up the chip during operation.
Furthermore, the number of the vacuum through holes 11 and the number of the vacuum through holes are multiple, the top of the operation end is provided with a bump, the vacuum through holes 11 are arranged on the bump, the number of the bumps is consistent with that of the vacuum through holes 11, the bumps correspond to the vacuum through holes one by one, the positions of the vacuum through holes 11 are higher than those of the vacuum through holes, the chip is conveniently jacked up, and the vacuum through holes are uniformly distributed in an annular shape at equal intervals, so that uneven adsorption is avoided.
In addition, the side wall of the thimble seat 1 is provided with a compression inlet 12 and a vacuum inlet 13, the compression inlet 12 is communicated with the first compression channel 4, the vacuum inlet 13 is communicated with the first vacuum channel 5, and the distance between the compression inlet 12 and the bottom surface of the thimble seat 1 is smaller than the distance between the vacuum inlet 13 and the bottom surface of the thimble seat 1, so that the vacuum inlet 13 and the compression inlet 12 are prevented from being interfered.
According to the thimble system, the external vacuumizing device is used for pumping out the gas in the first vacuum channel 5 and the second vacuum channel 7, so that the vacuum through hole is in a negative pressure state, the blue film of the wafer is smoothly adsorbed, when the chip needs to be released, compressed air is introduced into the first compression channel 4 and the second compression channel 6 by an external compressed air source, and the chip is jacked up from the blue film through the vacuum through hole 11, so that the structure that the existing thimble is driven by a motor is changed, the vacuum adsorption and the high-pressure gas ejection are adopted, the thimble system is suitable for chips of various specifications, the adaptability of the device is improved, the problem that the thimble is frequently replaced due to abrasion is solved, the production cost is saved, and the working efficiency is improved.
The principle and the implementation mode of the invention are explained by applying a specific example, and the description of the embodiment is only used for helping to understand the method and the core idea of the invention; meanwhile, for a person skilled in the art, according to the idea of the present invention, the specific embodiments and the application range may be changed. In view of the above, the present disclosure should not be construed as limiting the invention.
Claims (7)
1. A thimble system which is characterized in that: the ejector pin base is sleeved with the ejector pin cap, and the connecting nut can fix the relative positions of the ejector pin base and the ejector pin cap;
the ejector pin base is provided with a first compression channel and a first vacuum channel, the first compression channel is communicated with an external compressed air source, the first vacuum channel is connected with an external vacuum pumping device, the ejector pin cap is provided with a second compression channel and a second vacuum channel, the ejector pin cap is provided with an operation end, the operation end is provided with a compression through hole and a vacuum through hole, the first compression channel is communicated with the compression through hole through the second compression channel, the first vacuum channel is communicated with the vacuum through hole through the second vacuum channel, and sealing elements are arranged at the communication position of the first compression channel and the second compression channel and the communication position of the first vacuum channel and the second vacuum channel; the first compression channel and the second compression channel are cylindrical channels, and the radial sections of the first vacuum channel and the second vacuum channel are annular.
2. The ejector system of claim 1, wherein: the thimble cap with the thimble seat is pegged graft and is linked to each other, set up the boss on the thimble seat, first compression passageway set up in on the boss, the boss stretches into in the second compression passageway, set up the seal groove on the lateral wall of boss, set up the sealing washer in the seal groove.
3. The ejector system of claim 1, wherein: the thimble cap is provided with a retaining ring, the connecting nut penetrates through the thimble cap and is in threaded connection with the thimble seat, the retaining ring is in butt joint with the retaining ring, and the outer diameter of the retaining ring is larger than the inner diameter of the retaining ring.
4. The ejector system of claim 3, wherein: the thimble base is provided with a positioning pin, the thimble cap is provided with a positioning groove matched with the positioning pin, and the positioning pin is inserted into the positioning groove when the thimble base is connected with the thimble cap.
5. The ejector system of claim 1, wherein: the operation end is located the top of thimble cap.
6. The ejector system of claim 5, wherein: the compression through-hole with the quantity of vacuum through-hole is a plurality ofly, the top of operation end sets up the lug, the compression through-hole set up in on the lug, the quantity of lug with the quantity of compression through-hole is unanimous and the one-to-one, and is a plurality of the vacuum through-hole is the equidistant equipartition of annular.
7. An ejector pin system according to any one of claims 1 to 6, characterized in that: the side wall of the thimble seat is provided with a compression inlet and a vacuum inlet, the compression inlet is communicated with the first compression channel, the vacuum inlet is communicated with the first vacuum channel, and the distance between the compression inlet and the bottom surface of the thimble seat is smaller than the distance between the vacuum inlet and the bottom surface of the thimble seat.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910903490.9A CN110504208B (en) | 2019-09-24 | 2019-09-24 | Thimble system |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| CN201910903490.9A CN110504208B (en) | 2019-09-24 | 2019-09-24 | Thimble system |
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| CN110504208A CN110504208A (en) | 2019-11-26 |
| CN110504208B true CN110504208B (en) | 2021-11-16 |
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| CN201910903490.9A Active CN110504208B (en) | 2019-09-24 | 2019-09-24 | Thimble system |
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Citations (6)
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| JPH07335720A (en) * | 1994-06-10 | 1995-12-22 | Toshiba Corp | Semiconductor chip take-up device and its take-up method |
| CN103681406A (en) * | 2012-08-29 | 2014-03-26 | 株式会社日立高新技术仪器 | Die bonding apparatus, die picking up apparatus and die picking up method |
| CN103681411A (en) * | 2012-08-31 | 2014-03-26 | 细美事有限公司 | Bare die discharging device |
| CN204118050U (en) * | 2014-10-29 | 2015-01-21 | 苏州均华精密机械有限公司 | Film body and integrated circuit separator |
| CN104979242A (en) * | 2014-04-01 | 2015-10-14 | 普罗科技有限公司 | Apparatus and method for detaching chip |
| CN105789127A (en) * | 2015-01-14 | 2016-07-20 | 英飞凌科技奥地利有限公司 | Embrittlement device, pick-up system and method of picking up chips |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP4985513B2 (en) * | 2008-03-26 | 2012-07-25 | 富士通セミコンダクター株式会社 | Method and apparatus for peeling electronic parts |
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2019
- 2019-09-24 CN CN201910903490.9A patent/CN110504208B/en active Active
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH07335720A (en) * | 1994-06-10 | 1995-12-22 | Toshiba Corp | Semiconductor chip take-up device and its take-up method |
| CN103681406A (en) * | 2012-08-29 | 2014-03-26 | 株式会社日立高新技术仪器 | Die bonding apparatus, die picking up apparatus and die picking up method |
| CN103681411A (en) * | 2012-08-31 | 2014-03-26 | 细美事有限公司 | Bare die discharging device |
| CN104979242A (en) * | 2014-04-01 | 2015-10-14 | 普罗科技有限公司 | Apparatus and method for detaching chip |
| CN204118050U (en) * | 2014-10-29 | 2015-01-21 | 苏州均华精密机械有限公司 | Film body and integrated circuit separator |
| CN105789127A (en) * | 2015-01-14 | 2016-07-20 | 英飞凌科技奥地利有限公司 | Embrittlement device, pick-up system and method of picking up chips |
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| Publication number | Publication date |
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| CN110504208A (en) | 2019-11-26 |
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