CN216716425U - Radiator and air conditioner - Google Patents

Abstract

The application relates to the technical field of air conditioning, and discloses a radiator which comprises a base, a frequency conversion module and a heat dissipation module, wherein the base comprises a first surface and a second surface which are opposite, and the first surface is used for being in heat conduction connection with the frequency conversion module; the radiating pipe is provided with a first plane structure, and the first plane structure is attached to the second surface and is in heat conduction connection with the second surface; the fin group comprises a first heat conduction surface, and the first heat conduction surface is provided with an accommodating groove; the radiating pipe is embedded in the containing groove, and the plane of the first plane structure of the radiating pipe and the plane of the opening of the containing groove are the same plane, so that the base is in heat conduction connection with the fin group. The heat of the base can be directly transferred to the fin group, and the heat can be transferred to the fin group for heat dissipation through medium phase change in the heat dissipation pipe. Compared with the prior art, the phase change heat transfer of the medium in the radiating pipe can improve the radiating efficiency of the base and help to reduce the temperature of the frequency conversion module. The application also discloses an air conditioner.

Description

Radiator and air conditioner

Technical Field

The present application relates to the field of air conditioning technology, and for example, to a radiator and an air conditioner.

Background

With the development of air conditioning technology, air conditioners continuously break through the refrigeration and heating technology under the limit condition. When the air conditioner is used for high-temperature refrigeration, the temperature of power components of the outdoor unit of the air conditioner needs to be reduced so that the air conditioner can operate reliably. Therefore, the radiator is added to the power component of the outdoor unit of the air conditioner.

The related art heat sink includes a heat dissipation substrate and heat dissipation fins provided on the heat dissipation substrate. In order to adapt to high-temperature refrigeration, the heat dissipation efficiency of the heat sink needs to be improved, and at present, heat dissipation is enhanced mainly by changing the area and the shape of the heat dissipation fins. However, the space of the outdoor unit of the air conditioner is limited, and the space that the radiator can be optimized is very small, so that the radiating efficiency cannot be improved.

SUMMERY OF THE UTILITY MODEL

The following presents a simplified summary in order to provide a basic understanding of some aspects of the disclosed embodiments. This summary is not an extensive overview nor is intended to identify key/critical elements or to delineate the scope of such embodiments but rather as a prelude to the more detailed description that is presented later.

The embodiment of the disclosure provides a radiator and an air conditioner, so as to improve the radiating efficiency of the radiator.

In some embodiments, the heat sink comprises:

the base comprises a first surface and a second surface which are opposite, and the first surface is used for being in heat conduction connection with the frequency conversion module so as to absorb heat emitted by the frequency conversion module;

the radiating pipe is constructed with a first plane structure, and the first plane structure is attached to the second surface and is in heat conduction connection with the second surface so as to absorb heat on the base; and the combination of (a) and (b),

the fin group comprises a first heat conduction surface, and the first heat conduction surface is provided with an accommodating groove;

the radiating pipe is embedded in the containing groove, and the plane of the first plane structure of the radiating pipe and the plane of the opening of the containing groove are the same plane, so that the base is in heat conduction connection with the fin group.

In some embodiments, the heat pipe is configured with a second planar structure disposed opposite to the first planar structure, and the second planar structure is in heat conduction connection with the bottom wall of the containing groove to transfer heat to the fin group.

In some embodiments, the heat dissipation pipe is a sintered heat pipe to transfer heat from the base to the fin set.

In some embodiments, the fin set comprises a plurality of fins, and part or all of the fins are in heat conduction connection with the radiating pipe;

wherein a plurality of the fins are perpendicular to the second surface of the base.

In some embodiments, the fin comprises:

and the first bent part is bent and extended along a first direction from the first edge of the fin and is connected with the adjacent fin so as to form the first heat conduction surface.

In some embodiments, the surface area of the first thermally conductive surface is less than or equal to the surface area of the second surface.

In some embodiments, the fin further comprises:

the second bent part is bent and extended along the first direction from the second edge of the fin to be connected with the adjacent fin so as to form a heat dissipation surface;

wherein the second edge is disposed opposite the first edge.

In some embodiments, the base comprises:

the installation department, certainly the outside protruding structure of first surface forms, be used for with frequency conversion module heat conduction is connected.

In some embodiments, part or all of the radiating pipe is in heat conduction connection with the mounting part.

In some embodiments, the air conditioner comprises the radiator provided in the previous embodiments.

The radiator and the air conditioner provided by the embodiment of the disclosure can realize the following technical effects:

the radiating pipe is arranged in the containing groove of the fin group, and the plane of the first plane structure of the radiating pipe and the plane of the opening of the containing groove are the same plane, so that the base is in heat conduction connection with the fin group, and therefore heat of the base can be directly transferred to the fin group, and can also be transferred to the fin group for radiating through medium phase change in the radiating pipe; the phase change heat transfer efficiency of the medium in the heat dissipation pipe is higher than the direct heat transfer efficiency of the base and the fin group. Compared with the prior art, the phase change heat transfer of the medium in the radiating pipe can improve the radiating efficiency of the base and help to reduce the temperature of the frequency conversion module.

The foregoing general description and the following description are exemplary and explanatory only and are not restrictive of the application.

Drawings

One or more embodiments are illustrated by way of example in the accompanying drawings, which correspond to the accompanying drawings and not in limitation thereof, in which elements having the same reference numeral designations are shown as like elements and not in limitation thereof, and wherein:

fig. 1 is an exploded schematic view of the heat sink provided by the disclosed embodiment;

FIG. 2 is an enlarged partial schematic view at A of FIG. 1;

fig. 3 is a schematic structural diagram of the heat sink provided by the embodiment of the present disclosure;

FIG. 4 is an exploded view of another configuration of the heat sink provided by the disclosed embodiments;

fig. 5 is another schematic structural diagram of the heat sink provided in the embodiment of the present disclosure.

Reference numerals:

10: a base; 101: a first surface; 102: a second surface; 103: an installation part; 104: mounting holes; 20: a radiating pipe; 201: a first planar structure; 202: a second planar structure; 30: a fin set; 301: a first heat-conducting surface; 302: a containing groove; 303: a fin; 304: a first bent portion; 305: a second bending part.

Detailed Description

So that the manner in which the features and advantages of the embodiments of the present disclosure can be understood in detail, a more particular description of the embodiments of the disclosure, briefly summarized above, may be had by reference to the appended drawings, which are included to illustrate, but are not intended to limit the embodiments of the disclosure. In the following description of the technology, for purposes of explanation, numerous details are set forth in order to provide a thorough understanding of the disclosed embodiments. However, one or more embodiments may be practiced without these details. In other instances, well-known structures and devices may be shown in simplified form in order to simplify the drawing.

The terms "first," "second," and the like in the description and in the claims, and the above-described drawings of embodiments of the present disclosure, are used for distinguishing between similar elements and not necessarily for describing a particular sequential or chronological order. It should be understood that the data so used may be interchanged under appropriate circumstances such that embodiments of the present disclosure described herein may be made. Furthermore, the terms "comprising" and "having," as well as any variations thereof, are intended to cover non-exclusive inclusions.

In the embodiments of the present disclosure, the terms "upper", "lower", "inner", "middle", "outer", "front", "rear", and the like indicate orientations or positional relationships based on the orientations or positional relationships shown in the drawings. These terms are used primarily to better describe the disclosed embodiments and their examples and are not intended to limit the indicated devices, elements or components to a particular orientation or to be constructed and operated in a particular orientation. Moreover, some of the above terms may be used to indicate other meanings besides the orientation or positional relationship, for example, the term "on" may also be used to indicate some kind of attachment or connection relationship in some cases. The specific meanings of these terms in the embodiments of the present disclosure can be understood by those of ordinary skill in the art as appropriate.

In addition, the terms "disposed," "connected," and "secured" are to be construed broadly. For example, "connected" may be a fixed connection, a detachable connection, or a unitary construction; can be a mechanical connection, or an electrical connection; may be directly connected, or indirectly connected through intervening media, or may be in internal communication between two devices, elements or components. Specific meanings of the above terms in the embodiments of the present disclosure can be understood by those of ordinary skill in the art according to specific situations.

The term "plurality" means two or more unless otherwise specified.

In the embodiment of the present disclosure, the character "/" indicates that the preceding and following objects are in an or relationship. For example, A/B represents: a or B.

The term "and/or" is an associative relationship that describes objects, meaning that three relationships may exist. For example, a and/or B, represents: a or B, or A and B.

It should be noted that, in the case of no conflict, the embodiments and features in the embodiments of the present disclosure may be combined with each other.

Referring to fig. 1 to 5, an embodiment of the present disclosure provides an air conditioner including a radiator. The frequency conversion module of the air conditioner is cooled through the radiator to prevent the refrigeration effect of the air conditioner from being influenced. A heat sink, comprising: a base 10, a radiating pipe 20 and a fin group 30. The base 10 comprises a first surface 101 and a second surface 102 which are opposite, wherein the first surface 101 is used for being in heat conduction connection with the frequency conversion module so as to absorb heat emitted by the frequency conversion module; the heat dissipation tube 20 is configured with a first planar structure 201, and the first planar structure 201 is attached to and in heat conduction connection with the second surface 102 to absorb heat on the base; the fin assembly 30 includes a first heat-conducting surface 301, and the first heat-conducting surface 301 is configured with an accommodating groove 302. The heat dissipation tube 20 is embedded in the receiving cavity 302, and a plane of the first planar structure 201 of the heat dissipation tube 20 and a plane of the opening of the receiving cavity 302 are the same plane, so that the base 10 is thermally connected to the fin set 30.

The radiating pipe 20 is arranged in the accommodating groove 302 of the fin group 30, and the plane of the first planar structure 201 of the radiating pipe 20 and the plane of the opening of the accommodating groove 302 are the same plane, so that the base 10 is in heat conduction connection with the fin group 30, and therefore, the heat of the base 10 can be directly transferred to the fin group 30, and can also be transferred to the fin group 30 for radiating through the phase change of the medium in the radiating pipe 20; wherein, the phase-change heat transfer efficiency through the medium in the radiating pipe 20 is higher than the direct heat transfer efficiency between the base 10 and the fin group 30. Compared with the prior art, the phase-change heat transfer of the medium in the radiating pipe 20 can improve the radiating efficiency of the base 10 and help to reduce the temperature of the power component.

With reference to fig. 1 to 5, an embodiment of the present disclosure provides a heat sink, including: a base 10, a radiating pipe 20 and a fin group 30. The base 10 comprises a first surface 101 and a second surface 102 which are opposite, wherein the first surface 101 is used for being in heat conduction connection with the frequency conversion module so as to absorb heat emitted by the frequency conversion module; the heat dissipation tube 20 is configured with a first planar structure 201, and the first planar structure 201 is attached to and in heat conduction connection with the second surface 102 to absorb heat on the base; the fin assembly 30 includes a first heat-conducting surface 301, and the first heat-conducting surface 301 is configured with an accommodating groove 302. The heat dissipation tube 20 is embedded in the receiving cavity 302, and a plane of the first planar structure 201 of the heat dissipation tube 20 and a plane of the opening of the receiving cavity 302 are the same plane, so that the base 10 is thermally connected to the fin set 30.

By adopting the heat radiator provided by the embodiment of the present disclosure, the heat radiating pipe 20 is disposed in the receiving groove 302 of the fin group 30, and the plane of the first planar structure 201 of the heat radiating pipe 20 and the plane of the opening of the receiving groove 302 are the same plane, so that the base 10 is in heat conduction connection with the fin group 30, and thus the heat of the base 10 can be directly transferred to the fin group 30, and can also be transferred to the fin group 30 for heat radiation through the phase change of the medium in the heat radiating pipe 20; wherein, the phase-change heat transfer efficiency through the medium in the heat pipe 20 is higher than the direct heat transfer efficiency between the base 10 and the fin group 30. Compared with the prior art, the phase-change heat transfer of the medium in the radiating pipe 20 can improve the radiating efficiency of the base 10 and help to reduce the temperature of the power component.

The base 10 has a plate-like structure. The base 10 is not only connected in a heat-conducting manner to the frequency conversion module, but also detachably connected. Wherein, the base 10 and the frequency conversion module can be connected by a fastener, or the frequency conversion module can be adhered to the first surface 101 of the base 10 by a heat-conducting silica gel, or the base 10 and the frequency conversion module are welded. In the process of assembling the base 10 and the frequency conversion module, the frequency conversion module is attached to the first surface 101 of the base 10, especially, a region with a relatively large heat generation amount of the frequency conversion module is attached to the first surface 101 of the base 10, so that the heat generated by the frequency conversion module is transferred to the base 10. Optionally, a heat conducting fin may be further disposed between the frequency conversion module and the base 10 to improve heat transfer efficiency between the frequency conversion module and the base 10, and further improve heat dissipation and cooling efficiency of the frequency conversion module.

The heat dissipation pipe 20 is filled with a phase-changeable medium. In the case that the heat pipe 20 is thermally connected to the base 10, the heat of the base 10 is transferred to the heat pipe 20, the medium in the heat pipe 20 is thermally phase-changed, and then the heat is transferred to the fin group 30. The heat is transferred to the fin group 30, and the heat is dissipated and cooled by the fin group 30. The phase change of the medium has high heat transfer efficiency, so that the heat transfer efficiency of the base 10 can be improved through the phase change of the medium in the radiating pipe 20, and the heat dissipation and temperature reduction of the frequency conversion module are accelerated.

Optionally, the phase-changeable medium is a refrigerant.

The first plane structure 201 of the heat pipe 20 is attached to the second surface 102 of the base 10, which not only improves the connection stability between the heat pipe 20 and the base 10, but also enlarges the heat transfer area between the heat pipe 20 and the base 10 by attaching the heat pipe 20 and the base 10 through two planes, thereby improving the heat transfer efficiency between the heat pipe 20 and the base 10.

The first planar structure 201 of the heat pipe 20, which is a plane, is attached to the second surface 102 of the base 10 to enlarge the heat transfer area between the heat pipe 20 and the base 10.

The heat dissipation tube 20 is embedded in the receiving groove 302 of the first heat conduction surface 301 of the fin set 30, and under the condition that the heat dissipation tube 20 is connected with the fin set 30 in a heat conduction manner, the heat dissipation tube 20 can be wrapped by the receiving groove 302, so that the heat transfer area between the heat dissipation tube 20 and the fin set 30 is enlarged, and the heat transfer efficiency between the heat dissipation tube 20 and the fin set 30 is improved.

The heat of the base 10 is transferred to the area of the first plane structure 201 of the radiating pipe 20, and the medium inside the radiating pipe 20 close to the first plane structure 201 is heated to change phase, to become a gaseous medium, and moves to the low temperature area of the radiating pipe 20, i.e. to the area far away from the first plane structure 201. The heat pipe 20 is surrounded by the receiving groove 302 of the fin set 30 except for the first planar structure 201 in a wrapping manner. When the gaseous medium moves to a region far away from the first planar structure 201, heat exchange occurs between the gaseous medium and the side wall of the accommodating groove 302, heat is transferred to the fin group 30, and heat dissipation and temperature reduction are performed through the fin group 30. The medium completing the heat exchange moves to the area where the first plane structure 201 is located again, and the circulation is repeated in this way, so that the purpose of heat dissipation and cooling of the frequency conversion module is achieved.

Under the condition that the first planar structure 201 is attached to and thermally connected to the second surface 102 of the base 10, the plane of the first planar structure 201 of the heat dissipation tube 20 and the plane of the opening of the receiving groove 302 are the same plane, so that the second surface 102 of the base 10 and the first thermally conductive surface 301 of the fin set 30 are attached to and thermally connected to each other, and the heat of the base 10 can be transferred to the fin set 30 through the heat dissipation tube 20 and also directly transferred to the fin set 30 for heat dissipation and temperature reduction. Through the dual heat transfer mode, can improve the whole radiating efficiency of radiator, help reducing the temperature of frequency conversion module.

In the case that the heat dissipation tube 20 is embedded in the receiving groove 302, the gap between the heat dissipation tube 20 and the sidewall of the receiving groove 302 can be filled with a heat conductive silicone or a metal heat conductive material, so as to improve the heat conductive efficiency between the heat dissipation tube 20 and the fin set 30.

Optionally, the heat pipe 20 is configured with a second planar structure 202 disposed opposite to the first planar structure 201, and the second planar structure 202 is in heat conduction connection with the bottom wall of the receiving groove 302 to transfer heat to the fin group.

The plane of the first planar structure 201 and the plane of the opening of the receiving groove 302 are the same plane, and the second planar structure 202 disposed opposite to the first planar structure 201 is connected to the bottom wall of the receiving groove 302 in a heat conducting manner, so that on one hand, the stability of the heat dissipation tube 20 in the receiving groove 302 can be improved, and on the other hand, the heat transfer area between the heat dissipation tube 20 and the bottom wall of the receiving groove 302 can be enlarged.

The second planar structure 202 of the heat dissipating pipe 20 is also a plane.

In practical applications, the receiving groove 302 may be a general structure, wherein the shape of the receiving groove 302 is preferably a rectangular groove. Thus, the processing is convenient and the cost is reduced. However, the shape of the receiving groove 302 is not limited to a rectangular groove, and may be an arc-shaped groove, a U-shaped groove, a V-shaped groove, or the like.

Optionally, the width of the receiving groove 302 is greater than or equal to the diameter of the radiating pipe 20. Thus, the assembly of the radiating pipe 20 and the receiving groove 302 can be facilitated. Especially, in the case that the width of the receiving groove 302 is larger than the diameter of the radiating pipe 20, the heat conductive material is filled between the radiating pipe 20 and the gap of the receiving groove 302, which not only can fix the radiating pipe 20, but also can improve the heat conductive efficiency of the radiating pipe 20 and the fin group 30. In addition, different sizes of the radiating pipes 20 can be selected according to actual needs, thereby contributing to the enlargement of the applicable range of the fin group 30.

Alternatively, the heat pipe 20 is a sintered heat pipe to transfer heat of the base to the fin set.

The area where the first planar structure 201 of the radiating pipe 20 is located may be understood as the evaporation side of the radiating pipe 20, and the area where the second planar structure 202 is located may be understood as the condensation side of the radiating pipe 20. The heat pipe is a sintered heat pipe, which can reduce the resistance of the medium in the circulation process and improve the uniformity of the distribution of the medium in the heat pipe 20

Optionally, grooves, metal meshes or metal powder layers are arranged in the sintered heat pipe to improve the heat transfer efficiency. The specific structure of the sintered heat pipe is not limited to the above description, and other structures are also within the protection scope of the present embodiment.

The medium absorbs heat from the base 10 at the evaporation side of the radiating pipe 20, changes from a liquid state to a gas state, and then moves to the condensation side where the medium transfers heat to the fin group 30 and the environment, and changes from the gas state to the liquid state. The liquid medium flows back to the evaporation side in the sintering heat pipe against gravity, and the circulation is repeated, so that the heat of the base 10 can be effectively dissipated to the environment.

Alternatively, the radiating pipe 20 may have a straight line structure, a U-shaped structure, an S-shaped structure, or other structures capable of implementing the present embodiment.

Optionally, the fin set 30 includes a plurality of fins 303, and part or all of the fins 303 are in heat conduction connection with the radiating pipe 20; wherein the plurality of fins 303 are perpendicular to the second surface 102 of the base 10.

The plurality of fins 303 are configured at even intervals to form the fin group 30, wherein the edges of the plurality of fins 303 in the same direction collectively define the first heat conduction surface 301 of the fin group 30. The first heat-conducting surface 301 is configured with receiving grooves 302, it being understood that the receiving grooves 302 are configured to define the same notches at the edges of the fins 303 defining the first heat-conducting surface 301. The heat pipe 20 is embedded in the receiving groove 302.

In practical applications, the contact area of the heat dissipation pipe 20 and the fins 303 of the fin set 30 can be selected according to practical situations, i.e., it can be understood that the size of the heat dissipation pipe 20 is not limited to the size of the receiving grooves 302 formed by the configuration of the fin set 30.

The fins 303 are perpendicular to the second surface 102 of the base 10 and are in thermally conductive connection with the base 10. In the embodiment of the present disclosure, the fins 303 of the fin group 30 may be separately disposed on the second surface 102 of the base 10 and thermally connected to the base 10, or a plurality of fins 303 of the fin group 30 are sequentially connected and then thermally connected to the second surface 102 of the base 10.

Alternatively, the fin set 30 may be a folded fin, or an aluminum extruded fin, or a plurality of single fin configurations, or other configurations that may accomplish the present embodiment.

Optionally, the fins 303 comprise: a first bent portion 304 extending from a first edge of the fin 303 along a first direction; the first bent portions 304 of the plurality of fins 303 are connected in sequence to form the first heat conduction surface 301.

The first bent portion 304 extends from a first edge of the fin 303 along a first direction, and is connected to the adjacent fin 303. The first bent portions 304 of the adjacent fins 303 are located on the same plane, i.e., the first heat conduction surface 301.

The first bent portions 304 of the plurality of fins 303 are connected in sequence, and form the first heat conduction surface 301. Thus, not only the surface of the fin group 30 can be made flat, but also the connection stability of the fin group 30 can be improved.

In addition, the fin group 30 is connected by the first bent portions 304 of the plurality of fins 303, so that the pitch between the adjacent fins 303 is adjustable, that is, the pitch between the adjacent fins 303 is adjusted by adjusting the width of the first bent portions 304. Therefore, in the existing effective installation space, the space between the fins 303 can be reduced, the number of the fins 303 can be increased, and the heat dissipation area of the radiator can be further improved. Compare current crowded radiator of aluminium, this embodiment can improve the whole heat transfer efficiency of radiator and heat radiating area in effective space and under the condition that does not change the whole volume of radiator, and then improved the whole heat transfer performance of radiator, effectively solve base 10 and frequency conversion module's heat dissipation problem.

In the embodiment of the present disclosure, the plane of the first direction is parallel to the first heat conducting surface 301.

Optionally, the surface area of the first heat conducting surface 301 is smaller than or equal to the surface area of the second surface 102.

The surface area of the first heat conduction surface 301 is smaller than or equal to the surface area of the second surface 102, so that all the fins 303 of the fin group 30 are in heat conduction connection with the base 10, and the heat transfer efficiency of the fin group 30 and the base 10 is improved.

Optionally, the center of symmetry of the first heat conduction surface 301 corresponds to the center of symmetry of the second surface 102, such that the fin group 30 is disposed in alignment with the base 10. This contributes to the neat appearance of the heat sink.

Optionally, the fin 303 further comprises: a second bent portion 305 bent and extended from a second edge of the fin 303 along a first direction to connect with an adjacent fin 303 to form a heat dissipation surface; wherein the second edge is disposed opposite the first edge.

The second bent portions 305 of the plurality of fins 303 are connected in sequence. Thus, the surface of the fin group 30 can be smooth, and the appearance of the radiator is neat; but also improves the connection stability of the fin group 30.

Optionally, the width of the second bending portion 305 is consistent with the width of the first bending portion 304.

Alternatively, the second bent portions 305 of the adjacent fins 303 are detachably connected. For example: the adjacent second bending portions 305 are engaged or plugged.

Optionally, the base 10 comprises: and the mounting part 103 is formed by a structure protruding outwards from the first surface 101 and is used for being connected with the frequency conversion module in a heat conduction mode.

The mounting portion 103 is formed in a convex configuration from the first surface 101 such that the thickness of the region where the mounting portion 103 is located is greater than the thickness of the other regions of the base 10. The object of heat storage can be achieved by the thick mounting portion 103, thereby reducing the temperature of the inverter module.

Optionally, the mounting portion 103 is configured with mounting holes 104 for mounting the inverter module. Wherein the mounting holes 104 are disposed at the areas other than the areas directly connected with the heat pipe 20 in a heat-conducting manner.

Alternatively, the area of the mounting portion 103 is smaller than the area of the first surface 101 of the base 10. In this way, the mounting portion 103 is protruded from the region corresponding to the first surface 101 in the case of the overheating portion of the inverter module, and the base 10 can be effectively prevented from being too heavy.

Alternatively, part or all of the radiating pipe 20 is thermally connected to the mounting part 103.

The heat pipe 20 is connected to the mounting portion 103 in a heat conducting manner, and the heat stored in the mounting portion 103 is quickly transferred to the fin set 30 and the environment by utilizing the high heat transfer efficiency of the phase-changeable medium in the heat pipe 20, so as to dissipate heat and reduce temperature of the mounting portion 103. In the effective space and under the condition of not changing the whole volume of the radiator, the whole heat transfer efficiency and the heat dissipation area of the radiator are improved, the whole heat exchange performance of the radiator is further improved, and the heat dissipation problem of the base 10 and the frequency conversion module is effectively solved.

The above description and drawings sufficiently illustrate embodiments of the disclosure to enable those skilled in the art to practice them. Other embodiments may include structural and other changes. The examples merely typify possible variations. Individual components and functions are optional unless explicitly required, and the sequence of operations may vary. Portions and features of some embodiments may be included in or substituted for those of others. The embodiments of the present disclosure are not limited to the structures that have been described above and shown in the drawings, and various modifications and changes may be made without departing from the scope thereof. The scope of the present disclosure is limited only by the appended claims.

Claims (10)

1. A heat sink, comprising:

the base comprises a first surface and a second surface which are opposite, and the first surface is used for being in heat conduction connection with the frequency conversion module so as to absorb heat emitted by the frequency conversion module;

the radiating pipe is constructed with a first plane structure, and the first plane structure is attached to the second surface and is in heat conduction connection with the second surface so as to absorb heat on the base; and the combination of (a) and (b),

the fin group comprises a first heat conduction surface, and the first heat conduction surface is provided with an accommodating groove;

the radiating pipe is embedded in the containing groove, and the plane of the first plane structure of the radiating pipe and the plane of the opening of the containing groove are the same plane, so that the base is in heat conduction connection with the fin group.

2. The heat sink of claim 1,

the radiating pipe is provided with a second plane structure opposite to the first plane structure, and the second plane structure is in heat conduction connection with the bottom wall of the accommodating groove so as to transfer heat to the fin group.

3. The heat sink of claim 1,

the heat dissipation pipe is a sintered heat pipe to transfer heat of the base to the fin group.

4. The heat sink of claim 1,

the fin group comprises a plurality of fins, and part or all of the fins are in heat conduction connection with the radiating pipe;

wherein a plurality of the fins are perpendicular to the second surface of the base.

5. The heat sink of claim 4, wherein the fins comprise:

and the first bent part is bent and extended along a first direction from the first edge of the fin and is connected with the adjacent fin so as to form the first heat conduction surface.

6. The heat sink of claim 5,

the surface area of the first heat conduction surface is smaller than or equal to the surface area of the second surface.

7. The heat sink of claim 5, wherein the fins further comprise:

the second bent part is bent and extended along the first direction from the second edge of the fin to be connected with the adjacent fin so as to form a heat dissipation surface;

wherein the second edge is disposed opposite the first edge.

8. The heat sink according to any one of claims 1 to 7, wherein the base comprises:

the installation department, certainly the outside protruding structure of first surface forms, be used for with frequency conversion module heat conduction is connected.

9. The heat sink of claim 8,

and part or all of the radiating pipe is in heat conduction connection with the mounting part.

10. An air conditioner characterized by comprising the radiator according to any one of claims 1 to 9.

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