CN216700445U - Circuit board and electronic device - Google Patents
Circuit board and electronic device Download PDFInfo
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- CN216700445U CN216700445U CN202123323502.2U CN202123323502U CN216700445U CN 216700445 U CN216700445 U CN 216700445U CN 202123323502 U CN202123323502 U CN 202123323502U CN 216700445 U CN216700445 U CN 216700445U
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- line conductor
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Abstract
The utility model provides a circuit board and an electronic device. The circuit board includes: an insulating substrate having two main surfaces arranged in a 1 st direction; a 1 st electrode conductor layer and a 2 nd electrode conductor layer provided on the insulating substrate; a 1 st line conductor layer and a 2 nd line conductor layer provided on the insulating substrate, electrically connected to the 1 st electrode conductor layer and the 2 nd electrode conductor layer, respectively, and having a linear shape as viewed in a 1 st direction; and an electrode conductive member which overlaps the 1 st electrode conductor layer and the 2 nd electrode conductor layer, is electrically connected to the 1 st electrode conductor layer and the 2 nd electrode conductor layer, and is exposed to the outside from the insulating substrate, as viewed in the 1 st direction, wherein the 1 st electrode conductor layer and the 1 st line conductor layer are not in contact with the 2 nd electrode conductor layer and the 2 nd line conductor layer, respectively, and a signal is transmitted to the 1 st line conductor layer and a signal for feedback control is transmitted to the 2 nd line conductor layer.
Description
Technical Field
The present invention relates to a circuit board on which electronic components are mounted.
Background
As a conventional invention relating to a circuit board, for example, a speaker module described in patent document 1 is known. The speaker module includes a processor, a speaker element, and a printed wiring board. The processor and the speaker element are mounted on the printed wiring board.
Prior art documents
Patent literature
Patent document 1: japanese patent No. 6115696
In the speaker module described in patent document 1, the printed wiring board generally includes a mounting electrode, a signal line, and a feedback line. A speaker element is mounted on the mounting electrode. The signal line is a line for transmitting a sound signal from the processor to the speaker element. The feedback line is a line for transmitting a signal (hereinafter, referred to as a "feedback signal") for causing the processor to perform feedback control. The signal line and the feedback line are connected to the mounting electrode. Thus, when an audio signal is transmitted to the speaker element via the signal line and the mounting electrode, a part of the audio signal is transmitted as a feedback signal from the signal line to the feedback line via the mounting electrode. The processor can then use the feedback signal for feedback control.
However, in the speaker module described in patent document 1, it is difficult to detect a short circuit between the signal line and the feedback line. In more detail, there is a case where the signal line and the feedback line are short-circuited in the printed wiring substrate. When such a short circuit occurs, the feedback signal is transmitted from the signal line to the feedback line via the short-circuited portion. Therefore, the path of the feedback signal may be different from the original path. It is therefore possible that the appropriate feedback signal is no longer transmitted to the feedback line. Therefore, it is desirable to detect a short circuit between the signal line and the feedback line before assembling the speaker module.
However, the signal line and the feedback line are connected to the mounting electrode. Thus, the signal line and the feedback line are electrically connected. Therefore, in the speaker module described in patent document 1, it is difficult to detect a short circuit between the signal line and the feedback line.
SUMMERY OF THE UTILITY MODEL
Problem to be solved by utility model
Accordingly, an object of the present invention is to provide a circuit board and an electronic device capable of detecting a short circuit between a 1 st line conductor layer and a 2 nd line conductor layer.
Means for solving the problems
A circuit board according to an embodiment of the present invention includes:
an insulating substrate having two main surfaces arranged in a 1 st direction;
a 1 st electrode conductor layer provided on the insulating substrate;
a 2 nd electrode conductor layer provided on the insulating substrate;
a 1 st line conductor layer provided on the insulating substrate, electrically connected to the 1 st electrode conductor layer, and having a linear shape as viewed in the 1 st direction;
a 2 nd wiring conductor layer provided on the insulating substrate, electrically connected to the 2 nd electrode conductor layer, and having a linear shape as viewed in the 1 st direction; and
an electrode conductive member that overlaps the 1 st electrode conductor layer and the 2 nd electrode conductor layer, is electrically connected to the 1 st electrode conductor layer and the 2 nd electrode conductor layer, and is exposed to the outside from the insulating substrate, as viewed in the 1 st direction,
the 1 st electrode conductor layer and the 1 st line conductor layer are not in contact with the 2 nd electrode conductor layer and the 2 nd line conductor layer, respectively,
transmitting a signal at the 1 st line conductor layer,
transmitting the signal for feedback control at the 2 nd line conductor layer.
Effect of the utility model
According to the circuit board of the present invention, a short circuit between the 1 st line conductor layer and the 2 nd line conductor layer can be detected.
Drawings
Fig. 1 is a sectional view of an electronic apparatus 1.
Fig. 2 is a top view of the electronic apparatus 1.
Fig. 3 is a plan view of the circuit board 10.
Fig. 4 is a plan view of the circuit board 10.
Fig. 5 is an enlarged view of the vicinity of the electrode conductive members 50a and 50 b.
Fig. 6 is a sectional view of the circuit board 10 a.
Fig. 7 is a sectional view of the circuit board 10 b.
Fig. 8 is a plan view and a sectional view of the circuit board 10 c.
Fig. 9 is a sectional view of the circuit board 10 d.
Fig. 10 is a plan view and a sectional view of the circuit board 10 e.
Description of the reference numerals
1: an electronic device;
10. 10a to 10 e: a circuit substrate;
12: an insulating substrate;
14a, 14 b: an insulator layer;
16: a protective layer;
20a, 24 a: 1 st electrode conductor layer;
20b, 24 b: a 3 rd electrode conductor layer;
22 a: a 1 st line conductor layer;
22 b: a 3 rd line conductor layer;
30a, 34 a: a 2 nd electrode conductor layer;
30b, 34 b: a 4 th electrode conductor layer;
32 a: a 2 nd line conductor layer;
32 b: a 4 th line conductor layer;
50a, 50 b: an electrode conductive member;
60a, 70 a: 1 st conductive bonding material;
80a, 80 b: a 2 nd conductive bonding material;
100: a speaker;
102: a speaker main body;
104: a coil;
106a, 106 b: connecting the electrodes;
108a, 108 b: a plate spring;
120a, 130 a: a dummy electrode conductor layer.
Detailed Description
(embodiment mode)
Hereinafter, the structure of the circuit board 10 according to the embodiment of the present invention will be described with reference to the drawings. Fig. 1 is a sectional view of an electronic apparatus 1. Fig. 2 is a top view of the electronic apparatus 1. Fig. 3 and 4 are plan views of the circuit board 10. In fig. 4, the protective layer 16 and the electrode conductive members 50a and 50b are omitted. Fig. 5 is an enlarged view of the vicinity of the electrode conductive members 50a and 50 b.
In the present specification, the direction is defined as follows. The direction in which the 1 st main surface S1 and the 2 nd main surface S2 of the insulating substrate 12 are aligned is the vertical direction (1 st direction). The direction in which the 1 st line conductor layer 22a extends is the front-rear direction. The direction orthogonal to the vertical direction and the front-rear direction is the horizontal direction. The vertical direction, the front-rear direction, and the left-right direction are orthogonal to each other. The vertical direction, the front-rear direction, and the left-right direction in the present specification may not coincide with the vertical direction, the front-rear direction, and the left-right direction in actual use of the circuit board 10.
Hereinafter, X and Y are components or members of the circuit board 10. In the present specification, the phrase "X and Y are electrically connected" means that electrical conduction is established between X and Y. Thus, X and Y may or may not be in contact. When X and Y are not in contact with each other, Z having conductivity is arranged between X and Y. On the other hand, in the present specification, the phrase "X and Y are connected" means that X and Y are connected in a state of contact.
In the present specification, unless otherwise specified, each part of X is defined as follows. The front part of X means the front half of X. The rear part of X means the rear half of X. The left part of X means the left half of X. The right part of X means the right half of X. The upper part of X means the upper half of X. The lower part of X means the lower half of X. The tip of X means one end in front of X. The rear end of X means the end behind X. The left end of X means the end to the left of X. The right end of X means the right end of X. The upper end of X means the end above X. The lower end of X means one end below X. The tip of X means the tip of X and its vicinity. The rear end of X means the rear end of X and its vicinity. The left end of X means the left end of X and its vicinity. The right end of X means the right end of X and its vicinity. The upper end of X means the upper end of X and its vicinity. The lower end of X means the lower end of X and its vicinity.
In the present specification, "X is fixed to Y" means that X is directly fixed to Y and X is fixed to Y via Z.
First, the structure of the electronic apparatus 1 will be explained. The electronic device 1 is a speaker device. As shown in fig. 1 and 2, the electronic apparatus 1 includes a Circuit board 10, a speaker 100, and an IC (Integrated Circuit) 200.
The circuit board 10 includes a transmission line for transmitting an audio signal and a feedback signal. The circuit board 10 is a flexible printed board having flexibility. Therefore, the circuit board 10 can be bent in the vertical direction. The "circuit board 10 is bent" means that the circuit board 10 is deformed and bent by applying an external force to the circuit board 10. The circuit board 10 can be bent by elastic deformation. The circuit board 10 may be bent by plastic deformation. The circuit board 10 may be bent by elastic deformation and plastic deformation.
As shown in fig. 1, 3, and 4, the circuit board 10 includes an insulating substrate 12, 1 st electrode conductor layers 20a and 24a, a 1 st line conductor layer 22a, 2 nd electrode conductor layers 30a and 34a, a 2 nd line conductor layer 32a, 3 rd electrode conductor layers 20b and 24b, a 3 rd line conductor layer 22b, 4 th electrode conductor layers 30b and 34b, a 4 th line conductor layer 32b, and electrode conductive members 50a and 50 b.
The insulating substrate 12 has a plate shape. The insulating substrate 12 has a rectangular shape when viewed in the vertical direction. Therefore, as shown in fig. 1, the insulating substrate 12 has two main surfaces arranged in the vertical direction (1 st direction). The two main surfaces are the 1 st main surface S1 and the 2 nd main surface S2. The 1 st main surface S1 is the upper main surface of the insulating substrate 12. The 2 nd main surface S2 is the lower main surface of the insulating substrate 12. The insulating substrate 12 includes an insulator layer 14a and a protective layer 16.
The insulator layer 14a has a rectangular shape similar to the insulating substrate 12 when viewed in the vertical direction. The insulator layer 14a is a flexible dielectric sheet. The material of the insulator layer 14a contains a thermoplastic resin. The thermoplastic resin is, for example, a liquid crystal polymer, PTFE (polytetrafluoroethylene), or the like. The material of the insulator layer 14a may be polyimide. Thus, the insulating substrate 12 has flexibility. The protective layer 16 will be described later.
As shown in fig. 4, the 1 st electrode conductor layers 20a, 24a, the 1 st line conductor layer 22a, the 2 nd electrode conductor layers 30a, 34a, the 2 nd line conductor layer 32a, the 3 rd electrode conductor layers 20b, 24b, the 3 rd line conductor layer 22b, the 4 th electrode conductor layers 30b, 34b, and the 4 th line conductor layer 32b are provided on the insulating substrate 12. In the present embodiment, the 1 st electrode conductor layers 20a, 24a, the 1 st line conductor layer 22a, the 2 nd electrode conductor layers 30a, 34a, the 2 nd line conductor layer 32a, the 3 rd electrode conductor layers 20b, 24b, the 3 rd line conductor layer 22b, the 4 th electrode conductor layers 30b, 34b, and the 4 th line conductor layer 32b are provided on the upper main surface of the insulator layer 14 a.
The 1 st electrode conductor layers 20a and 24a have a rectangular shape when viewed in the vertical direction. The 1 st electrode conductor layer 20a is located before the 1 st electrode conductor layer 24 a.
The 1 st line conductor layer 22a is electrically connected to the 1 st electrode conductor layers 20a and 24 a. In more detail, the 1 st line conductor layer 22a has a linear shape as viewed in the up-down direction. The 1 st line conductor layer 22a extends in the front-rear direction. The line width w1 in the left-right direction of the 1 st line conductor layer 22a is smaller than the width wa in the left-right direction of the 1 st electrode conductor layers 20a, 24 a. The 1 st line conductor layer 22a has its tip connected to the 1 st electrode conductor layer 20 a. The rear end of the 1 st line conductor layer 22a is connected to the 1 st electrode conductor layer 24 a.
The 2 nd electrode conductor layers 30a and 34a have a rectangular shape when viewed in the vertical direction. The 2 nd electrode conductor layer 30a is located before the 2 nd electrode conductor layer 34 a. The 2 nd electrode conductor layers 30a and 34a are located on the right side of the 1 st electrode conductor layers 20a and 24a, respectively.
The 2 nd wiring conductor layer 32a is electrically connected to the 2 nd electrode conductor layers 30a and 34 a. In more detail, the 2 nd line conductor layer 32a has a linear shape as viewed in the up-down direction. The 2 nd line conductor layer 32a extends in the front-rear direction. Therefore, the 2 nd line conductor layer 32a is parallel to the 1 st line conductor layer 22 a. The line width w2 in the left-right direction (orthogonal direction orthogonal to the up-down direction (1 st direction)) of the 2 nd line conductor layer 32a is smaller than the line width w1 in the left-right direction (orthogonal direction orthogonal to the up-down direction (1 st direction)) of the 1 st line conductor layer 22 a. Further, the line width w2 in the left-right direction of the 2 nd wiring conductor layer 32a is smaller than the width wb in the left-right direction of the 2 nd electrode conductor layers 30a, 34 a. The 2 nd wiring conductor layer 32a has its tip connected to the 2 nd electrode conductor layer 30 a. The rear end of the 2 nd wiring conductor layer 32a is connected to the 2 nd electrode conductor layer 34 a. Such a 2 nd line conductor layer 32a is located on the right side of the 1 st line conductor layer 22 a.
The 1 st electrode conductor layers 20a, 24a and the 1 st line conductor layer 22a are not in contact with the 2 nd electrode conductor layers 30a, 34a and the 2 nd line conductor layer 32a, respectively. Therefore, the current cannot directly flow from the 1 st electrode conductor layers 20a, 24a and the 1 st line conductor layer 22a to the 2 nd electrode conductor layers 30a, 34a and the 2 nd line conductor layer 32a without passing through other members. The other members are members other than the 1 st electrode conductor layers 20a and 24a and the 1 st line conductor layer 22 a. The 2 nd electrode conductor layers 30a, 34a and the 2 nd line conductor layer 32a are not in contact with the 1 st electrode conductor layers 20a, 24a and the 1 st line conductor layer 22a, respectively. Therefore, the current cannot flow directly from the 2 nd electrode conductor layers 30a, 34a and the 2 nd line conductor layer 32a to the 1 st electrode conductor layers 20a, 24a and the 1 st line conductor layer 22a without passing through other members. The other members are members other than the 2 nd electrode conductor layers 30a and 34a and the 2 nd line conductor layer 32 a.
As shown in fig. 4, the 1 st line conductor layer 22a is located closer to the outer edge of the insulating substrate 12 than the 2 nd line conductor layer 32a is, as viewed in the vertical direction. That is, in a cross section orthogonal to the front-rear direction (the direction in which the 1 st line conductor layer 22a and the 2 nd line conductor layer 32a extend), the shortest distance L1 from the 1 st line conductor layer 22a to the outer edge of the insulating substrate 12 is shorter than the shortest distance L2 from the 2 nd line conductor layer 32a to the outer edge of the insulating substrate 12.
The electrode conductive member 50a is a metal plate. Therefore, as shown in fig. 1, the thickness d1 in the vertical direction (1 st direction) of the electrode conductive member 50a is larger than the thickness d2 in the vertical direction (1 st direction) of the 1 st electrode conductor layer 20a and the thickness d2 in the vertical direction (1 st direction) of the 2 nd electrode conductor layer 30 a. The material of the electrode conductive member 50a is, for example, SUS (Stainless Steel). The electrode conductive member 50a is harder than the 1 st line conductor layer 22a and the 2 nd line conductor layer 32 a. The vickers hardness of the electrode conductive member 50a is higher than the vickers hardness of the 1 st line conductor layer 22a and the vickers hardness of the 2 nd line conductor layer 32 a.
The electrode conductive member 50a has a rectangular shape as viewed in the vertical direction. As shown in fig. 3, the electrode conductive member 50a is exposed to the outside from the insulating substrate 12. As shown in fig. 1, the electrode conductive member 50a overlaps the 1 st electrode conductor layer 20a and the 2 nd electrode conductor layer 30a when viewed in the vertical direction (1 st direction). The electrode conductive member 50a is fixed to the 1 st electrode conductor layer 20a and the 2 nd electrode conductor layer 30a via the 1 st conductive bonding materials 60a and 70 a. Thereby, the electrode conductive member 50a is electrically connected to the 1 st electrode conductor layer 20a and the 2 nd electrode conductor layer 30 a. The 1 st conductive bonding materials 60a and 70a are solder. The 1 st conductive bonding material 60a is located on the 1 st electrode conductor layer 20a and is not located on the 2 nd electrode conductor layer 30 a. The 1 st conductive bonding material 70a is located on the 2 nd electrode conductor layer 30a, not on the 1 st electrode conductor layer 20 a. Therefore, the 1 st conductive bonding material 60a and the 1 st conductive bonding material 70a do not contact each other.
The 3 rd electrode conductor layers 20b and 24b, the 3 rd wiring conductor layer 22b, the 4 th electrode conductor layers 30b and 34b, the 4 th wiring conductor layer 32b, and the electrode conductive member 50b have a structure which is bilaterally symmetrical to the 1 st electrode conductor layers 20a and 24a, the 1 st wiring conductor layer 22a, the 2 nd electrode conductor layers 30a and 34a, the 2 nd wiring conductor layer 32a, and the electrode conductive member 50a, and therefore, the description thereof is omitted.
The 1 st electrode conductor layers 20a and 24a, the 1 st line conductor layer 22a, the 2 nd electrode conductor layers 30a and 34a, the 2 nd line conductor layer 32a, the 3 rd electrode conductor layers 20b and 24b, the 3 rd line conductor layer 22b, the 4 th electrode conductor layers 30b and 34b, and the 4 th line conductor layer 32b are formed by patterning a metal foil adhered to the upper main surface of the insulator layer 14 a. The metal foil is, for example, a copper foil. However, the 1 st electrode conductor layers 20a and 24a, the 1 st line conductor layer 22a, the 2 nd electrode conductor layers 30a and 34a, the 2 nd line conductor layer 32a, the 3 rd electrode conductor layers 20b and 24b, the 3 rd line conductor layer 22b, the 4 th electrode conductor layers 30b and 34b, and the 4 th line conductor layer 32b may be formed by printing a conductive paste.
The protective layer 16 is an insulator layer. However, the material of the protective layer 16 is different from the material of the insulator layer 14 a. The protective layer 16 is a barrier layer. Therefore, the protective layer 16 may be formed by adhering a resin sheet to the upper main surface of the insulator layer 14a, or may be formed by applying a liquid resin to the upper main surface of the insulator layer 14 a. As shown in fig. 3, the protective layer 16 covers the 1 st line conductor layer 22a, the 2 nd line conductor layer 32a, the 3 rd line conductor layer 22b, and the 4 th line conductor layer 32 b. However, the protective layer 16 is provided with openings ha to hd. The opening ha overlaps the 1 st electrode conductor layer 20a, the 2 nd electrode conductor layer 30a, and the electrode conductive member 50a when viewed in the vertical direction. The opening hb overlaps the 1 st electrode conductor layer 24a and the 2 nd electrode conductor layer 34a when viewed in the vertical direction. The opening hc overlaps the 3 rd electrode conductor layer 20b, the 4 th electrode conductor layer 30b, and the electrode conductive member 50b when viewed in the vertical direction. The opening hd overlaps the 3 rd electrode conductor layer 24b and the 4 th electrode conductor layer 34b when viewed in the vertical direction. The 1 st electrode conductor layers 20a, 24a, the 2 nd electrode conductor layers 30a, 34a, the 3 rd electrode conductor layers 20b, 24b, the 4 th electrode conductor layers 30b, 34b, and the electrode conductive members 50a, 50b are exposed to the outside from the circuit board 10 through the openings ha to hd.
The IC200 controls the speaker 100 described later. The IC200 generates a sound signal. As shown in fig. 2, the IC200 is mounted on the upper main surface of the insulating substrate 12. The IC200 includes terminals 201a, 201b, 202a, 202 b. Terminals 201a, 202a, 201b, and 202b of the IC200 are connected to the 1 st electrode conductor layer 24a, the 2 nd electrode conductor layer 34a, the 3 rd electrode conductor layer 24b, and the 4 th electrode conductor layer 34b, respectively, by solder.
As shown in fig. 1, the speaker 100 includes a speaker main body 102, a coil 104, connection electrodes 106a and 106b, and leaf springs 108a and 108b (see fig. 5). The speaker 100 generates sound by the sound signal generated by the IC 200. The speaker 100 is an example of an electronic component.
As shown in fig. 1, the speaker main body 102 supports the coil 104, the connection electrodes 106a and 106b, and the leaf springs 108a and 108b (see fig. 5). The connection electrode 106a is electrically connected to the electrode conductive member 50 a. Therefore, the connection electrode 106a is fixed to the electrode conductive member 50a by the 2 nd conductive bonding material 80 a. The 2 nd conductive bonding material 80a is solder. The plate spring 108a is an elastic body. The plate spring 108a applies a force to the electrode conductive member 50a via the connection electrode 106 a.
The connection electrode 106b is electrically connected to the electrode conductive member 50 b. Therefore, the connection electrode 106b is fixed to the electrode conductive member 50b by the 2 nd conductive bonding material 80 b. The 2 nd conductive bonding material 80b is solder. The plate spring 108b is an elastic body. The plate spring 108b applies a force to the electrode conductive member 50b via the connection electrode 106 b.
As shown in fig. 1, the coil 104 has a configuration in which a wire is rolled into a spiral shape. The coil 104 has a 1 st end and a 2 nd end. The 1 st end of the coil 104 is electrically connected to the connection electrode 106a via a wiring not shown. The 2 nd end of the coil 104 is electrically connected to the connection electrode 106b via a wiring not shown.
Next, the operation of the electronic device 1 will be described. The IC200 generates an acoustic signal and outputs the acoustic signal to the 1 st electrode conductor layer 24 a. Thereby, the 1 st line conductor layer 22a transmits an audio signal (signal). When an acoustic signal flows through the coil 104, the coil 104 generates a force with a magnet, not shown. This causes the coil 104 to vibrate, thereby generating sound. The audio signal having passed through the coil 104 is input to the IC200 via the 3 rd line conductor layer 22b and the 3 rd electrode conductor layer 24 b.
Here, the 1 st electrode conductor layer 20a and the 2 nd electrode conductor layer 30a are electrically connected via the electrode conductive member 50 a. Therefore, a part of the sound signal is transmitted through the 2 nd line conductor layer 32 a. A part of the sound signal is a 1 st feedback signal for feedback control. The 1 st feedback signal is input to the IC200 via the 2 nd electrode conductor layer 34 a. Thereby, the IC200 can perform feedback control on the speaker 100 using the 1 st feedback signal.
The 3 rd electrode conductor layer 20b and the 4 th electrode conductor layer 30b are electrically connected to each other via the electrode conductive member 50 b. Therefore, a part of the sound signal is transmitted through the 4 th line conductor layer 32 b. A part of the sound signal is a 2 nd feedback signal for feedback control. The 2 nd feedback signal is input to the IC200 via the 4 th electrode conductor layer 34 b. Thereby, the IC200 can perform feedback control on the speaker 100 using the 2 nd feedback signal.
[ Effect ]
According to the circuit board 10, a short circuit between the 1 st line conductor layer 22a and the 2 nd line conductor layer 32a can be detected. In more detail, the 1 st electrode conductor layers 20a, 24a and the 1 st line conductor layer 22a are not in contact with the 2 nd electrode conductor layers 30a, 34a and the 2 nd line conductor layer 32a, respectively. Therefore, before the electrode conductive member 50a is mounted on the 1 st electrode conductor layer 20a and the 2 nd electrode conductor layer 30a, if a short circuit does not occur between the 1 st line conductor layer 22a and the 2 nd line conductor layer 32a, a current cannot flow between the 1 st line conductor layer 22a and the 2 nd line conductor layer 32 a. On the other hand, before the electrode conductive member 50a is mounted on the 1 st electrode conductor layer 20a and the 2 nd electrode conductor layer 30a, if a short circuit occurs between the 1 st line conductor layer 22a and the 2 nd line conductor layer 32a, a current can flow between the 1 st line conductor layer 22a and the 2 nd line conductor layer 32 a. Therefore, the voltage may be applied to the 1 st line conductor layer 22a before the electrode conductive member 50a is mounted on the 1 st electrode conductor layer 20a and the 2 nd electrode conductor layer 30 a. When a current flows between the 1 st line conductor layer 22a and the 2 nd line conductor layer 32a, it can be determined that a short circuit has occurred between the 1 st line conductor layer 22a and the 2 nd line conductor layer 32 a. When no current flows between the 1 st line conductor layer 22a and the 2 nd line conductor layer 32a, it can be determined that no short circuit has occurred between the 1 st line conductor layer 22a and the 2 nd line conductor layer 32 a. As described above, according to the circuit board 10, a short circuit between the 1 st line conductor layer 22a and the 2 nd line conductor layer 32a can be detected.
On the other hand, the electrode conductive member 50a is electrically connected to the 1 st electrode conductor layer 20a and the 2 nd electrode conductor layer 30 a. Thus, a part of the audio signal is transmitted as a feedback signal to the 1 st line conductor layer 22 a. Therefore, the IC200 can perform feedback control of the speaker 100 using the feedback signal.
Further, the line width w2 in the left-right direction of the 2 nd line conductor layer 32a is smaller than the line width w1 in the left-right direction of the 1 st line conductor layer 22 a. This makes it possible to reduce the size of the circuit board 10.
Further, the current flowing through the 1 st line conductor layer 22a is larger than the current flowing through the 2 nd line conductor layer 32 a. Therefore, the line width w1 in the left-right direction of the 1 st line conductor layer 22a is larger than the line width w2 in the left-right direction of the 2 nd line conductor layer 32 a. That is, the resistance value per unit length of the 1 st line conductor layer 22a is smaller than the resistance value per unit length of the 2 nd line conductor layer 32 a. This reduces the loss of the sound signal generated in the 1 st line conductor layer 22 a.
Further, the line width w2 in the left-right direction of the 2 nd line conductor layer 32a is smaller than the line width w1 in the left-right direction of the 1 st line conductor layer 22 a. Therefore, the adhesion of the 2 nd wire conductor layer 32a to the insulating substrate 12 is lower than the adhesion of the 1 st wire conductor layer 22a to the insulating substrate 12. Therefore, in a cross section orthogonal to the front-rear direction, the shortest distance L1 from the 1 st line conductor layer 22a to the outer edge of the insulating substrate 12 is shorter than the shortest distance L2 from the 2 nd line conductor layer 32a to the outer edge of the insulating substrate 12. Thus, the 2 nd wiring conductor layer 32a is farther from the outer edge of the insulating substrate 12 than the 1 st wiring conductor layer 22 a. That is, when the circuit board 10 receives an impact, the second-line conductor layer 2a having low adhesion is less likely to receive the impact. This can prevent the 2 nd wiring conductor layer 32a from peeling off from the insulating substrate 12.
(modification 1)
Next, the circuit board 10a according to modification 1 will be described with reference to the drawings. Fig. 6 is a sectional view of the circuit board 10 a.
The circuit board 10a is different from the circuit board 10 in the following two points.
The positions of the 1 st electrode conductor layers 20a and 24a, the 1 st line conductor layer 22a, and the 2 nd electrode conductor layers 30a and 34a, and the 2 nd line conductor layer 32a are switched.
The positions of the 3 rd electrode conductor layers 20b and 24b, the 3 rd line conductor layer 22b, and the 4 th electrode conductor layers 30b and 34b, and the 4 th line conductor layer 32b are switched.
Thus, the 2 nd wiring conductor layer 32a is located closer to the outer edge of the insulating substrate 12 than the 1 st wiring conductor layer 22a is, as viewed in the vertical direction. That is, in a cross section orthogonal to the front-rear direction (the direction in which the 1 st line conductor layer 22a and the 2 nd line conductor layer 32a extend), the shortest distance from the 2 nd line conductor layer 32a to the outer edge of the insulating substrate 12 is shorter than the shortest distance from the 1 st line conductor layer 22a to the outer edge of the insulating substrate 12. Thus, when the circuit board 10 receives an impact, the 1 st line conductor layer 22a becomes less likely to deform. As a result, the electrical characteristics generated in the 1 st line conductor layer 22a are less likely to change, and the acoustic signal is less likely to be distorted.
Further, the 4 th wiring conductor layer 32b is located closer to the outer edge of the insulating substrate 12 than the 3 rd wiring conductor layer 22b is, as viewed in the vertical direction. That is, in a cross section orthogonal to the front-rear direction, the shortest distance from the 4 th wiring conductor layer 32b to the outer edge of the insulating substrate 12 is shorter than the shortest distance from the 3 rd wiring conductor layer 22b to the outer edge of the insulating substrate 12. Thus, when the circuit board 10 receives an impact, the 3 rd line conductor layer 22b becomes less likely to deform. As a result, the electrical characteristics generated in the 3 rd line conductor layer 22b are less likely to change, and the audio signal is less likely to be distorted. The other structures of the circuit board 10a are the same as those of the circuit board 10, and therefore, the description thereof is omitted. The circuit board 10a has the same operational effects as the circuit board 10.
(modification 2)
Next, the circuit board 10b according to modification 2 will be described with reference to the drawings. Fig. 7 is a sectional view of the circuit board 10 b.
The circuit board 10b is different from the circuit board 10 in the following three points.
The insulating substrate 12 further includes an insulator layer 14 b.
The circuit board 10b includes via conductors va to vd and via conductors not shown.
The 1 st line conductor layer 22a, the 2 nd line conductor layer 32a, the 3 rd line conductor layer 22b, and the 4 th line conductor layer 32b are located on the upper main surface of the insulator layer 14 b.
The insulator layer 14a is laminated on the insulator layer 14 b. The via conductors va to vd are interlayer connection conductors that penetrate the insulator layer 14a in the vertical direction. The 1 st line conductor layer 22a has its distal end connected to the 1 st electrode conductor layer 20a via the via hole conductor va. The distal end portion of the 2 nd line conductor layer 32a is connected to the 2 nd electrode conductor layer 30a via the via hole conductor vb. The 3 rd line conductor layer 22b has its tip connected to the 3 rd electrode conductor layer 20b via the via hole conductor vd. The 4 th line conductor layer 32b has a tip connected to the 4 th electrode conductor layer 30b via the via hole conductor vc.
The rear end portion of the 1 st line conductor layer 22a is connected to the 1 st electrode conductor layer 24a via conductor not shown. The rear end portion of the 2 nd line conductor layer 32a is connected to the 2 nd electrode conductor layer 34a via conductor not shown. The rear end portion of the 3 rd line conductor layer 22b is connected to the 3 rd electrode conductor layer 24b via a via conductor not shown. The rear end portion of the 4 th line conductor layer 32b is connected to the 4 th electrode conductor layer 34b via a via conductor not shown.
As described above, the 1 st, 2 nd, 3 rd and 4 th line conductor layers 22a, 32a, 22b and 32b are protected by positioning the 1 st, 2 nd, 3 rd and 4 th line conductor layers 22a, 32a, 22b and 32b inside the insulating substrate 12. The other structures of the circuit board 10b are the same as those of the circuit board 10, and therefore, the description thereof is omitted. The circuit board 10b has the same operational effects as the circuit board 10.
(modification 3)
Next, a circuit board 10c according to modification 3 will be described with reference to the drawings. Fig. 8 is a plan view and a sectional view of the circuit board 10 c.
The circuit board 10c is different from the circuit board 10 in that dummy electrode conductor layers 120a and 130a are further provided. The dummy electrode conductor layers 120a and 130a have a rectangular shape when viewed in the vertical direction. The dummy electrode conductor layer 120a is positioned before the 1 st electrode conductor layer 20 a. The dummy electrode conductor layer 130a is positioned before the 2 nd electrode conductor layer 30 a. The 1 st electrode conductor layer 20a is connected to the electrode conductive member 50a via the 1 st conductive bonding material 60 a. The 2 nd electrode conductor layer 30a is connected to the electrode conductive member 50a via the 1 st conductive bonding material 70 a. The dummy electrode conductor layer 120a is connected to the electrode conductive member 50a via a conductive bonding material not shown. The dummy electrode conductor layer 130a is connected to the electrode conductive member 50a via a conductive bonding material not shown. Here, the 1 st conductive bonding materials 60a and 70a and two conductive bonding materials not shown are not in contact with each other. The other structures of the circuit board 10c are the same as those of the circuit board 10, and therefore, the description thereof is omitted. The circuit board 10c has the same operational effects as the circuit board 10.
(modification 4)
Next, a circuit board 10d according to a modification example 4 will be described with reference to the drawings. Fig. 9 is a sectional view of the circuit board 10 d.
The circuit board 10d is different from the circuit board 10c in that the 1 st conductive bonding materials 60a and 70a and two conductive bonding materials, not shown, are in contact with each other. The other structures of the circuit board 10d are the same as those of the circuit board 10c, and therefore, the description thereof is omitted. The circuit board 10d has the same operational effects as the circuit board 10 c.
In the circuit board 10d, the 1 st conductive bonding materials 60a and 70a and the two conductive bonding materials, not shown, are in contact with each other, and therefore, the dc resistance value between the 1 st electrode conductor layer 20a and the electrode conductive member 50a and the dc resistance value between the 2 nd electrode conductor layer 30a and the electrode conductive member 50a can be reduced.
(modification 5)
Next, a circuit board 10e according to a modification example 5 will be described with reference to the drawings. Fig. 10 is a plan view and a sectional view of the circuit board 10 e.
The circuit board 10e is different from the circuit board 10c in that a protective layer 16 is provided between the 1 st electrode conductor layer 20a, the 2 nd electrode conductor layer 30a, and the dummy electrode conductor layers 120a and 130a, respectively, as viewed in the vertical direction. The other structures of the circuit board 10e are the same as those of the circuit board 10c, and therefore, the description thereof is omitted. The circuit board 10e has the same operational effects as the circuit board 10 c.
(other embodiments)
The circuit board according to the present invention is not limited to the circuit boards 10 and 10a to 10e, and can be modified within the scope of the present invention. The structures of the circuit boards 10 and 10a to 10e may be arbitrarily combined.
In the circuit boards 10 and 10a to 10e, the protective layer 16, the 3 rd electrode conductor layers 20b and 24b, the 3 rd line conductor layer 22b, the 4 th electrode conductor layers 30b and 34b, the 4 th line conductor layer 32b, and the electrode conductive member 50b are not necessarily required. The circuit boards 10 and 10a to 10e may include at least one of the protective layer 16, the 3 rd electrode conductor layers 20b and 24b, the 3 rd wiring conductor layer 22b, the 4 th electrode conductor layers 30b and 34b, the 4 th wiring conductor layer 32b, and the electrode conductive member 50 b.
The 1 st conductive bonding materials 60a and 70a may be conductive bonding materials other than solder. The 1 st conductive bonding materials 60a and 70a may be, for example, conductive adhesives.
The thickness d1 in the vertical direction of the electrode conductive member 50a may be equal to or less than the thickness d2 in the vertical direction of the 1 st electrode conductor layer 20a and the thickness d2 in the vertical direction of the 2 nd electrode conductor layer 30 a.
Signals other than the audio signal may be transmitted through the 1 st line conductor layer 22 a. The signal other than the audio signal may be, for example, a high-frequency signal for communication, a signal having a power supply potential, or a signal having a ground potential. A signal other than the signal for feedback control may be transmitted to the 2 nd line conductor layer 32 a.
The line width w2 of the 2 nd line conductor layer 32a may be equal to or greater than the line width w1 of the 1 st line conductor layer 22 a.
Instead of the speaker 100, electronic components other than the speaker 100 may be mounted on the circuit boards 10, 10a to 10 e. The electronic component is, for example, a connector.
The 2 nd conductive bonding materials 80a and 80b may be conductive bonding materials other than solder. The 2 nd conductive bonding materials 80a and 80b may be, for example, conductive adhesives. In the case where the speaker 100 includes the plate springs 108a and 108b, the 2 nd conductive bonding materials 80a and 80b are not necessarily required. Instead of the plate springs 108a and 108b, a coil-shaped spring or the like may be used as the elastic body.
The speaker 100 may not include the leaf springs 108a and 108 b.
In the circuit board 10b, a part of the 1 st line conductor layer 22a, the 2 nd line conductor layer 32a, the 3 rd line conductor layer 22b, and the 4 th line conductor layer 32b may be located on the upper main surface of the insulator layer 14a, and the remaining part of the 1 st line conductor layer 22a, the 2 nd line conductor layer 32a, the 3 rd line conductor layer 22b, and the 4 th line conductor layer 32b may be located on the upper main surface of the insulator layer 14 b.
The 1 st line conductor layer 22a and the 2 nd line conductor layer 32a may not be parallel.
The insulating substrate 12 may not have flexibility.
Instead of the via hole conductors va to vd, via hole conductors may be used. The through-hole conductor is an interlayer connection conductor having a structure in which the inner peripheral surface of a through-hole penetrating the insulator layer 14a in the up-down direction is plated.
The IC200 is mounted on the circuit board 10 via terminals 201a, 202a, 201b, and 202 b. The terminals 201a, 202a, 201b, 202b protrude forward from the main body of the IC 200. However, the terminals 201a, 202a, 201b, 202b may also be provided on the bottom surface of the IC 200.
Claims (13)
1. A circuit board is characterized by comprising:
an insulating substrate having two main surfaces arranged in a 1 st direction;
a 1 st electrode conductor layer provided on the insulating substrate;
a 2 nd electrode conductor layer provided on the insulating substrate;
a 1 st line conductor layer provided on the insulating substrate, electrically connected to the 1 st electrode conductor layer, and having a linear shape as viewed in the 1 st direction;
a 2 nd wiring conductor layer provided on the insulating substrate, electrically connected to the 2 nd electrode conductor layer, and having a linear shape as viewed in the 1 st direction; and
an electrode conductive member that overlaps the 1 st electrode conductor layer and the 2 nd electrode conductor layer, is electrically connected to the 1 st electrode conductor layer and the 2 nd electrode conductor layer, and is exposed to the outside from the insulating substrate, as viewed in the 1 st direction,
the 1 st electrode conductor layer and the 1 st line conductor layer are not in contact with the 2 nd electrode conductor layer and the 2 nd line conductor layer, respectively,
transmitting a signal at the 1 st line conductor layer,
transmitting the signal for feedback control at the 2 nd line conductor layer.
2. The circuit substrate of claim 1,
the electrode conductive member is fixed to the 1 st electrode conductor layer and the 2 nd electrode conductor layer via a 1 st conductive bonding material.
3. The circuit substrate of claim 2,
the 1 st conductive bonding material is solder.
4. The circuit substrate according to any one of claims 1 to 3,
the thickness of the electrode conductive member in the 1 st direction is larger than the thickness of the 1 st electrode conductor layer in the 1 st direction and the thickness of the 2 nd electrode conductor layer in the 1 st direction.
5. The circuit substrate according to any one of claims 1 to 3,
the electrode conductive member is harder than the 1 st line conductor layer and the 2 nd line conductor layer.
6. The circuit substrate according to any one of claims 1 to 3,
the conductive member for an electrode is a metal plate.
7. The circuit substrate according to any one of claims 1 to 3,
a line width in an orthogonal direction orthogonal to the 1 st direction of the 2 nd line conductor layer is smaller than a line width in the orthogonal direction orthogonal to the 1 st direction of the 1 st line conductor layer.
8. The circuit substrate according to any one of claims 1 to 3,
in a cross section orthogonal to a direction in which the 1 st line conductor layer and the 2 nd line conductor layer extend, a shortest distance from the 1 st line conductor layer to an outer edge of the insulating substrate is shorter than a shortest distance from the 2 nd line conductor layer to an outer edge of the insulating substrate.
9. The circuit substrate according to any one of claims 1 to 3,
in a cross section orthogonal to a direction in which the 1 st line conductor layer and the 2 nd line conductor layer extend, a shortest distance from the 2 nd line conductor layer to an outer edge of the insulating substrate is shorter than a shortest distance from the 1 st line conductor layer to an outer edge of the insulating substrate.
10. An electronic device, characterized in that,
the circuit board and the electronic component according to claim 1 are provided,
the electronic component further includes:
and a connection electrode electrically connected to the electrode conductive member and fixed to the electrode conductive member by a 2 nd conductive bonding material.
11. The electronic device of claim 10,
the 2 nd conductive bonding material is solder.
12. The electronic device of claim 10 or claim 11,
the electronic component further includes:
and an elastic body that applies a force to the electrode conductive member via the connection electrode.
13. The electronic device of claim 10 or claim 11,
the electronic component is a speaker.
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
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JP2021067045A JP2022162293A (en) | 2021-04-12 | 2021-04-12 | Circuit board and electronic device |
JP2021-067045 | 2021-04-12 |
Publications (1)
Publication Number | Publication Date |
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CN216700445U true CN216700445U (en) | 2022-06-07 |
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Family Applications (1)
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CN202123323502.2U Active CN216700445U (en) | 2021-04-12 | 2021-12-27 | Circuit board and electronic device |
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JP (1) | JP2022162293A (en) |
CN (1) | CN216700445U (en) |
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2021
- 2021-04-12 JP JP2021067045A patent/JP2022162293A/en active Pending
- 2021-12-27 CN CN202123323502.2U patent/CN216700445U/en active Active
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